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At least 91 records · Page 5

Solid film lubricants and thermal control coatings flown aboard the EOIM-3 MDA sub-experiment

Additional experimental data were desired to support the selection of candidate thermal control coatings and solid film lubricants for the McDonnell Douglas Aerospace (MDA) Space Station hardware. The third Evaluation of Oxygen Interactions With Materials Mission (EOIM-3) flight experiment presented an opportunity to study the effects of the low Earth orbit environment on thermal control coatings and solid film lubricants. MDA provided five solid film lubricants and two anodic thermal control coatings for EOIM-3. The lubricant sample set consisted of three solid film lubricants with organic binders one solid film lubricant with an inorganic binder, and one solid film lubricant with no binder. The anodize coating sample set consisted of undyed sulfuric acid anodize and cobalt sulfide dyed sulfuric acid anodize, each on two different substrate aluminum alloys. The organic and inorganic binders in the solid film lubricants experienced erosion, and the lubricating pigments experienced oxidation. MDA is continuing to assess the effect of exposure to the low Earth orbit environment on the life and friction properties of the lubricants. Results to date support the design practice of shielding solid film lubricants from the low Earth orbit environment. Post-flight optical property analysis of the anodized specimens indicated that there were limited contamination effects and some atomic oxygen and ultraviolet radiation effects. These effects appeared to be within the values predicted by simulated ground testing and analysis of these materials, and they were different for each coating and substrate.

Murphy, Taylor J.↗

Wide-angle astrometry with the Mark III stellar interferometer

Astrometric measurements made with the Mark III stellar interferometer on five nights in August-September 1988 yielded average formal 1-sigma errors for 12 FK5 stars of 6 mas in declination and 10 mas in right ascension. This improvement in precision over previously reported measurements with this instrument made in 1986 is attributable to several factors: a second 12 m baseline; oriented E-S, was added to the instrument to improve the determination of right ascension; two-color analysis was included in the data-reduction process, along with a new central-fringe identification algorithm using three spectral channels, in order to reduce atmospheric errors; thermal control was greatly improved; and changes were made to observational procedures and hardware to monitor variations in the delay offset due to residual thermal drifts. Approximately half of the new positions are within 50 mas of their FK5 positions. However, an extended series of measurements are needed to ascertain the accuracy that can be achieved by interferometry.

Shao, M.↗

The thermal control challenge of the Mars observer spacecraft

The thermal control subsystem for the Mars Observer spacecraft has been synthesized from hardware currently in use on earth-orbiting satellites. Heat input to the spacecraft from environmental and internal sources varies widely throughout the mission, and system requirements, such as accommodation of payload instrument fields-of-view and minimization of weight and power, limit the sizes and locations of thermal control elements. Subsystem components are primarily passive, although heaters and louvers provide augmented control where required. Spacecraft-level finite difference thermal models have shown that all component temperature requirements are met with margin.

Braun, C. E.↗

Independent Orbiter Assessment (IOA): Analysis of the electrical power generation/fuel cell powerplant subsystem

Results of the Independent Orbiter Assessment (IOA) of the Failure Modes and Effects Analysis (FMEA) and Critical Items List (CIL) are presented. The IOA approach features a top-down analysis of the hardware to determine failure modes, criticality, and potential critical items. To preserve independence, this analysis was accomplished without reliance upon the results contained within the NASA FMEA/CIL documentation. This report documents the independent analysis results corresponding to the Orbiter Electrical Power Generation (EPG)/Fuel Cell Powerplant (FCP) hardware. The EPG/FCP hardware is required for performing functions of electrical power generation and product water distribution in the Orbiter. Specifically, the EPG/FCP hardware consists of the following divisions: (1) Power Section Assembly (PSA); (2) Reactant Control Subsystem (RCS); (3) Thermal Control Subsystem (TCS); and (4) Water Removal Subsystem (WRS). The IOA analysis process utilized available EPG/FCP hardware drawings and schematics for defining hardware assemblies, components, and hardware items. Each level of hardware was evaluated and analyzed for possible failure modes and effects. Criticality was assigned based upon the severity of the effect for each failure mode.

Brown, K. L.↗

Thermal control surfaces experiment (SOO69) flight systems performance

The thermal control surfaces experiment (TCSE) was the most complex hardware system aboard the Long Duration Exposure Facility (LDEF). The TCSE system consists of a scanning spectroreflectometer that measured test samples mounted on a rotatable carousel assembly. A microprocessor based data system controlled all aspects of TCSE system operation. Power was provided by four primary batteries. Flight measurement and housekeeping data were stored on a tape recorder for postflight analysis. The TCSE is a microcosm of complex electro-optical payloads being developed by NASA, DoD, and the aerospace community. The TCSE provides valuable data on the performance of these systems in space. The TCSE flight system and its excellent performance on the LDEF mission are described. A few operational anomalies were encountered and are discussed. Initial post-flight tests show that the TCSE system remains functional although some degradation in the optical measurements were observed. The results of these tests are also presented.

Wilkes, Donald R.↗

SUBSA and PFMI Transparent Furnace Systems Currently in use in the International Space Station Microgravity Science Glovebox

The Solidification Using a Baffle in Sealed Ampoules (SUBSA) and Pore Formation and Mobility Investigation (PFMI) furnaces were developed for operation in the International Space Station (ISS) Microgravity Science Glovebox (MSG). Both furnaces were launched to the ISS on STS-111, June 4, 2002, and are currently in use on orbit. The SUBSA furnace provides a maximum temperature of 850 C and can accommodate a metal sample as large as 30 cm long and 12mm in diameter. SUBSA utilizes a gradient freeze process with a minimum cooldown rate of 0.5C per min, and a stability of +/- 0.15C. An 8 cm long transparent gradient zone coupled with a Cohu 3812 camera and quartz ampoule allows for observation and video recording of the solidification process. PFMI is a Bridgman type furnace that operates at a maximum temperature of 130C and can accommodate a sample 23cm long and 10mm in diameter. Two Cohu 3812 cameras mounted 90 deg apart move on a separate translation system which allows for viewing of the sample in the transparent hot zone and gradient zone independent of the furnace translation rate and direction. Translation rates for both the cameras and furnace can be specified from 0.5micrometers/sec to 100 micrometers/sec with a stability of +/-5%. The two furnaces share a Process Control Module (PCM) which controls the furnace hardware, a Data Acquisition Pad (DaqPad) which provides signal condition of thermal couple data, and two Cohu 3812 cameras. The hardware and software allow for real time monitoring and commanding of critical process control parameters. This paper will provide a detailed explanation of the SUBSA and PFMI systems along with performance data and some preliminary results from completed on-orbit processing runs.

Spivey, Reggie A.↗

Solar maximum thermal surface assessment

The inflight repair of the Solar Maximum Spacecraft provided the first opportunity to make actual measurements of thermal control surfaces after 4 years exposure in low Earth orbit. Defective hardware was replaced by astronauts and returned to Earth while protected from reentry damage in the Shuttle Payload bay. A preliminary thermal surface assessment was made soon after retrieval in support of Space Telescope and other current spacecraft programs. This included visual examination and measurement of Kapton and Teflon film to determine change in thermal radiative properties after 4 years exposure to solar radiation and reaction with atomic oxygen. Comparative measurements were made with a portable solar reflectometer used for inspection of spacecraft hardware. Post flight measurements and observations reveal significant surface changes that further confirm Kapton mass loss predictions made prior to Solar Maximum repair. Details of thermal surface application, measurements and experimental results are presented and discussed.

Rhoads, G. D.↗

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗

Universal Controller for Spacecraft Mechanisms

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Levanas, Greg↗

Independent Orbiter Assessment (IOA): Analysis of the electrical power distribution and control/electrical power generation subsystem

The results of the Independent Orbiter Assessment (IOA) of the Failure Modes and Effects Analysis (FMEA) and Critical Items List (CIL) are presented. The IOA approach features a top-down analysis of the hardware to determine failure modes, criticality, and potential critical items. To preserve independence, this analysis was accomplished without reliance upon the results contained within the NASA FMEA/CIL documentation. This report documents the independent analysis results corresponding to the Orbiter Electrical Power Distribution and Control (EPD and C)/Electrical Power Generation (EPG) hardware. The EPD and C/EPG hardware is required for performing critical functions of cryogenic reactant storage, electrical power generation and product water distribution in the Orbiter. Specifically, the EPD and C/EPG hardware consists of the following components: Power Section Assembly (PSA); Reactant Control Subsystem (RCS); Thermal Control Subsystem (TCS); Water Removal Subsystem (WRS); and Power Reactant Storage and Distribution System (PRSDS). The IOA analysis process utilized available EPD and C/EPG hardware drawings and schematics for defining hardware assemblies, components, and hardware items. Each level of hardware was evaluated and analyzed for possible failure modes and effects. Criticality was assigned based upon the severity of the effect for each failure mode.

Patton, Jeff A.↗

Contamination Control and Hardware Processing Solutions at Marshall Space Flight Center

The Contamination Control Team of Marshall Space Flight Center's Materials and Processes Laboratory supports many Programs/ Projects that design, manufacture, and test a wide range of hardware types that are sensitive to contamination and foreign object damage (FOD). Examples where contamination/FOD concerns arise include sensitive structural bondline failure, critical orifice blockage, seal leakage, and reactive fluid compatibility (liquid oxygen, hydrazine) as well as performance degradation of sensitive instruments or spacecraft surfaces such as optical elements and thermal control systems. During the design phase, determination of the sensitivity of a hardware system to different types or levels of contamination/FOD is essential. A contamination control and FOD control plan must then be developed and implemented through all phases of ground processing, and, sometimes, on-orbit use, recovery, and refurbishment. Implementation of proper controls prevents cost and schedule impacts due to hardware damage or rework and helps assure mission success. Current capabilities are being used to support recent and on-going activities for multiple Mission Directorates / Programs such as International Space Station (ISS), James Webb Space Telescope (JWST), Space Launch System (SLS) elements (tanks, engines, booster), etc. The team also advances Green Technology initiatives and addresses materials obsolescence issues for NASA and external customers, most notably in the area of solvent replacement (e.g. aqueous cleaners containing hexavalent chrome, ozone depleting chemicals (CFC s and HCFC's), suspect carcinogens). The team evaluates new surface cleanliness inspection and cleaning technologies (e.g. plasma cleaning), and maintains databases for processing support materials as well as outgassing and optical compatibility test results for spaceflight environments.

Burns, DeWitt H.↗

Integrated Modeling of Advanced Opto-Mechanical Systems

The design of optical hardware for space applications is particularly challenging when developing high performance, novel systems that have no precedent. Integrated modeling and analysis of such opto-mechanical systems seeks to describe the end-to-end performance of the hardware using mission-relevant metrics. This multidisciplinary analysis might start with thermal disturbances from observation maneuvers, compute the system temperatures, compute the distorted positions and shapes of the hardware and compute the resulting optical performance. Dynamic disturbances such as reaction wheel imbalance or inertia imbalance of optical delay lines might be applied to a structural dynamic model and used in a guidance and control analysis. Mission-relevant science metrics might include wavefront quality, pointing error or imaging stability. Assembling a tool chain that can be both nimble and effective when scaled to the high fidelity models of detail design has been challenging. An integrated thermal, mechanical and optical analysis capability suitable for detail design has been developed and verified through experimental measurement. This capability was used in the design of flight-like breadboard hardware and development of a test apparatus that established both the level of performance of the hardware and the validity of the analysis. The analysis includes prediction of the thermal environment of the test chamber, detailed temperature distributions on the breadboard hardware, fine scale deformations of the optical elements, and computation of the wavefront quality using geometric optics. A battery of tests were conducted to assess the experiment data acquisition, measurement and control system and to establish the performance of the hardware design and accuracy of the integrated modeling. Thermal loads that represent operational observing maneuvers were imposed and the hardware optical performance was measured and compared to analytical predictions.

optomechanical analysis↗

Solid-state Distributed Temperature Control for International Space Station

A newly developed solid-state temperature controller will offer greater flexibility in the thermal control of aerospace vehicle structures. A status of the hardware development along with its implementation on the Multi- Purpose Logistics Module will be provided. Numerous advantages of the device will also be discussed with regards to current and future flight vehicle implementations.

Holladay, Jon B.↗

Intelligent fault management for the Space Station active thermal control system

The Thermal Advanced Automation Project (TAAP) approach and architecture is described for automating the Space Station Freedom (SSF) Active Thermal Control System (ATCS). The baseline functionally and advanced automation techniques for Fault Detection, Isolation, and Recovery (FDIR) will be compared and contrasted. Advanced automation techniques such as rule-based systems and model-based reasoning should be utilized to efficiently control, monitor, and diagnose this extremely complex physical system. TAAP is developing advanced FDIR software for use on the SSF thermal control system. The goal of TAAP is to join Knowledge-Based System (KBS) technology, using a combination of rules and model-based reasoning, with conventional monitoring and control software in order to maximize autonomy of the ATCS. TAAP's predecessor was NASA's Thermal Expert System (TEXSYS) project which was the first large real-time expert system to use both extensive rules and model-based reasoning to control and perform FDIR on a large, complex physical system. TEXSYS showed that a method is needed for safely and inexpensively testing all possible faults of the ATCS, particularly those potentially damaging to the hardware, in order to develop a fully capable FDIR system. TAAP therefore includes the development of a high-fidelity simulation of the thermal control system. The simulation provides realistic, dynamic ATCS behavior and fault insertion capability for software testing without hardware related risks or expense. In addition, thermal engineers will gain greater confidence in the KBS FDIR software than was possible prior to this kind of simulation testing. The TAAP KBS will initially be a ground-based extension of the baseline ATCS monitoring and control software and could be migrated on-board as additional computation resources are made available.

Hill, Tim↗

ATLAS LTCS Vertically Challenged System Lessons Learned

Re-planning of LTCS TVAC testing and supporting RTA (Receiver Telescope Assembly) Test Plan and Procedure document preparation. The Laser Thermal Control System (LTCS) is designed to maintain the lasers onboard Advanced Topographic Laser Altimeter System (ATLAS) at their operational temperatures. In order to verify the functionality of the LTCS, a thermal balance test of the thermal hardware was performed. During the first cold start of the LTCS, the Loop Heat Pipe (LHP) was unable to control the laser mass simulators temperature. The control heaters were fully on and the loop temperature remained well below the desired setpoint. Thermal analysis of the loop did not show these results. This unpredicted behavior of the LTCS was brought up to a panel of LHP experts. Based on the testing and a review of all the data, there were multiple diagnostic performed in order to narrow down the cause. The prevailing theory is that gravity is causing oscillating flow within the loop, which artificially increased the control power needs. This resulted in a replan of the LTCS test flow and the addition of a GSE heater to allow vertical operation.

Loop Heat Pipe↗

Atmospheric Cloud Physics Laboratory thermal control

The paper presents the development background and the present status of the Atmospheric Cloud Physics Laboratory (ACPL) thermal control capability. The ACPL, a Spacelab payload, is currently in the initial flight hardware development phase for a first flight scheduled in June 1981. The ACPL is intended as a facility for conducting a wide variety of cloud microphysics experimentation under zero gravity conditions. The cloud chambers, which are key elements of the ACPL, have stringent thermal requirements. Thus the expansion chamber inner walls must be uniform to within + or - 0.1 C during both steady-state and transient operation over a temperature range of +30 to -25 C. Design progression of the expansion chamber, from early in-house NASA-MSFC concepts (including test results of a prototype chamber) to a thermal control concept currently under development, is discussed.

Moses, J. L.↗

Independent Orbiter Assessment (IOA): Analysis of the active thermal control subsystem

The results of the Independent Orbiter Assessment (IOA) of the Failure Modes and Effects Analysis (FMEA) and Critical Items List (CIL) are presented. The IOA approach features a top-down analysis of the hardware to determine failure modes, criticality, and potential critical (PCIs) items. To preserve independence, this analysis was accomplished without reliance upon the results contained within the NASA FMEA/CIL documentation. The independent analysis results corresponding to the Orbiter Active Thermal Control Subsystem (ATCS) are documented. The major purpose of the ATCS is to remove the heat, generated during normal Shuttle operations from the Orbiter systems and subsystems. The four major components of the ATCS contributing to the heat removal are: Freon Coolant Loops; Radiator and Flow Control Assembly; Flash Evaporator System; and Ammonia Boiler System. In order to perform the analysis, the IOA process utilized available ATCS hardware drawings and schematics for defining hardware assemblies, components, and hardware items. Each level of hardware was evaluated and analyzed for possible failure modes and effects. Criticality was assigned based upon the severity of the effect for each failure mode. Of the 310 failure modes analyzed, 101 were determined to be PCIs.

Sinclair, S. K.↗