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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Passive Thermal Management Systems Employing Shape Memory Alloys

A thermal management system includes a first substrate having a first conductive inner surface. A second substrate has a second conductive inner surface. A connecting structure is attached to the first and second substrates to space apart the first and second inner surfaces defining an insulating space for a single architecture. One or more passively-acting elements are attached to the inner surface of at least one substrate and including a shape memory material such as a shape memory alloy (SMA). The SMA passively reacts to the temperature of the first substrate by thermally contacting or separating from the second inner surface of the second substrate for the control of the conduction of heat energy in either direction.

Trigwell, Steven↗
DOE OSTI2020

Thermal Management for FPGA Nodes in HPC Systems

The integration of FPGAs into large-scale computing systems is gaining attention. In these systems, real-time data handling for networking, tasks for scientific computing, and machine learning can be executed with customized datapaths on reconfigurable fabric within heterogeneous compute nodes. At the same time, thermal management, particularly battling the cooling cost and guaranteeing the reliability, is a continuing concern. The introduction of new heterogeneous components into HPC nodes only adds further complexities to thermal modeling and management. The thermal behavior of multi-FPGA systems deployed within large compute clusters is less explored. Here, we first show that the thermal behaviors of different FPGAs of the same generation can vary due to their physical locations in a rack and process variation, even though they are running the same tasks. We present a machine learning–based model to capture the thermal behavior of each individual FPGA in the cluster. We then propose two thermal management strategies guided by our thermal model. First, we mitigate thermal variation and hotspots across the cluster by proactive thermal-aware task placement. Under the tested system and benchmarks, we achieve up to 26.4° C and on average 13.3° C system temperature reduction with no performance penalty. Second, we utilize this thermal model to guide HLS parameter tuning at the task design stage to achieve improved thermal response after deployment.

97 MATHEMATICS AND COMPUTING↗
NASA NTRS2016

Micro- and Nano-Scale Electrically Driven Two-Phase Thermal Management

This presentation discusses ground based proof of concept hardware under development at NASA GSFC to address high heat flux thermal management in silicon substrates. The goal is to develop proof of concept hardware for space flight validation. The space flight hardware will provide gravity insensitive thermal management for electronics applications such as transmit receive modules that are severely limited by thermal concerns.

Electrohudryodynamics↗
DOE OSTI2020

Power Electronics Thermal Management

This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (250°C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers that will present reliability challenges and require higher-temperature substrates and bonding materials.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

Power Electronics Thermal Management

This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers, which will present reliability challenges and require higher-temperature substrates and bonding materials.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2020

The Role of Interfacial Thermal Resistance in Li-Ion Battery Thermal Management: Preprint

Temperature critically affects the performance, life and safety of lithium-ion batteries. Therefore, it is essential to understand heat generation and dissipation within individual battery cells and battery packs to plan a proper thermal management strategy. One of the key challenges is that interfacial heat transfer of a battery unit is difficult to quantify. The steady-state absolute method and the transient laser-flash-diffusivity method were employed to measure heat conductivities of battery layer stacks and individual battery layer separately. Results show flash diffusivity method gives higher thermal conductivity at both cross-plane and in-plane directions. The difference is primarily caused by interfacial thermal resistance so that it can be estimated by steady-state and transient measurements. To investigate the effects of interfacial thermal transport beyond individual cell level, a multiphysics battery model is used. The model is built upon a multi-scale multi-domain modeling framework for battery packs that accounts for the interplay across multiple physical phenomena. Benefits of a battery module using thermal management materials are quantified through numerical experiments. During a thermal runaway event, it is found interfacial thermal resistance can mitigate thermal runaway in a battery module by significantly reducing heat transfer between cells.

33 ADVANCED PROPULSION SYSTEMS↗
NASA NTRS2006

Thermal Management Techniques for Oil-Free Turbomachinery Systems

Tests were performed to evaluate three different methods of utilizing air to provide thermal management control for compliant journal foil air bearings. The effectiveness of the methods was based on bearing bulk temperature and axial thermal gradient reductions during air delivery. The first method utilized direct impingement of air on the inner surface of a hollow test journal during operation. The second, less indirect method achieved heat removal by blowing air inside the test journal to simulate air flowing axially through a hollow, rotating shaft. The third method emulated the most common approach to removing heat by forcing air axially through the bearing s support structure. Internal bearing temperatures were measured with three, type K thermocouples embedded in the bearing that measured general internal temperatures and axial thermal gradients. Testing was performed in a 1 atm, 260 C ambient environment with the bearing operating at 60 krpm and supporting a load of 222 N. Air volumetric flows of 0.06, 0.11, and 0.17 cubic meters per minute at approximately 150 to 200 C were used. The tests indicate that all three methods provide thermal management but at different levels of effectiveness. Axial cooling of the bearing support structure had a greater effect on bulk temperature for each air flow and demonstrated that the thermal gradients could be influenced by the directionality of the air flow. Direct air impingement on the journal's inside surface provided uniform reductions in both bulk temperature and thermal gradients. Similar to the direct method, indirect journal cooling had a uniform cooling effect on both bulk temperatures and thermal gradients but was the least effective of the three methods.

Radil, Kevin↗
NASA NTRS1983

Thermal management system technology development for space station applications

A short discussion of the history to date of the NASA thermal management system technology development program is presented, and the current status of several ongoing studies and hardware demonstration tasks is reported. One element of technology that is required for long-life, high-power orbital platforms/stations that is being developed is heat rejection and a space-constructable radiator system. Aspects of this project include high-efficiency fin concepts, a heat pipe quick-disconnect device, high-capacity heat pipes, and an alternate interface heat exchanger design. In the area of heat acquisition and transport, developments in a pumped two-phase transport loop, a capillary pumped transport loop using the concept of thermal utility are reported. An example of a thermal management system concept is provided.

Rankin, J. G.↗
NASA NTRS2021

Instrument Thermal Management for Lunar Night Survival without Radioisotopes

This paper summarizes the technology development progress on two JPL projects focused on developing thermal designs/technologies that enable lunar instrument overnight survival without radioisotopes. Through an internal project known as ARTEMIS, JPL has developed lunar night survivable designs for magnetometer, seismometer, and IR spectrometer science payloads (SPs). These designs incorporate four hyper-isolative thermal management features under development on the NASA GCD-funded PALETTE project: (a) a dual enclosure system with high strength, low k tension cable (TC) supports and a variable conductance thermal link (VCTL) composed of a reverse-operation DTE thermal switch (ROD-TSW) in series with a miniaturized loop heat pipe (mini-LHP); (b) a parabolic reflector radiator (PRR) for low-to-mid latitude lunar sites; (c) ultra-low e* “spacerless” MLI, in which individual layers are hung from the TC supports; and (d) ultra-low G thermal isolators made with polymeric material or polymer/TC assemblies. Each instrument design incorporates solar panels, batteries, telecom, C&DH, and other features necessary for self-sufficient, extended-duration operation on the lunar surface. This paper will provide an overview of the ARTEMIS and PALETTE projects and provide a top-level description of the instrument thermal management approach.

Lin, Ying↗
NASA NTRS2021

Phase Change Processes for Thermal Management Systems and Science Investigations

This white paper focuses on the scientific rationale and motivation for deploying phase change processes-based spacecraft thermal management systems for space missions [1,2]. Phase change processes need to be implemented in the design of various life support systems, sub-critical cryogenic and thermal control systems, taking advantage of the latent heat of phase change so as to significantly increase the heat transfer rate per unit fluid mass. Experimental data are critical to understanding gravitational effects on complex phase change processes using novel materials and working fluids. Experimental data can be acquired by either designing new testing platforms or performing experiments with simulant fluids on existing microgravity platforms. With the acquired data, theoretical flow physics models and numerical simulations can then be validated for use under long-duration microgravity conditions. The acquired data and validated models will enable the deployment of game-changing thermal management systems with remarkably improved efficiency and stability in heat acquisition, transport, and rejection for long-duration space missions.

Fluid mechanics↗
NASA NTRS1985

Thermal management system options for high power space platforms

Thermal Management System (TMS) design options for a high power (75kWe), low earth orbit, multimodule space platform were investigated. The approach taken was to establish a baseline TMS representative of current technology, and to make incremental improvements through successive subsystem trades that lead to a candidate TMS. The TMS trades included centralized and decentralized transport, single-phase and two-phase transport, alternate working fluids, liquid loop and heat pipe radiators, deployed fixed, body mounted and steerable radiators, and thermal storage. The subsystem options were evaluated against criteria such as weight, TMS power requirement, reliability, system isothermality penalty, and growth potential.

Sadunas, J. A.↗
DOE OSTI2021

Oscillating heat pipe integrated thermal management system for power electronics

Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

Wang, Jim↗
DOE OSTI2023

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. The performance (e.g., thermal resistance, pumping power) of the power electronics cooling technologies developed in this project are compared to the performance of current, on-road technology. One of the main challenges to achieving high power densities is associated with packaging high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors).

ADVANCED PROPULSION SYSTEMS↗
NASA NTRS2016

NASA's New Thermal Management Systems Roadmap; Whats in it, What it Means

In July of 2015 NASA publically released a new set of Technology Area Roadmaps that will be used to help guide future NASA-funded technology development efforts. One of these was the Thermal Management Systems Roadmap, often identified as TA14. This Roadmap identifies the time sequencing and interdependencies of high priority, advanced thermal control technology for the next 5 to 20 years. Available funding limits the development of new technology. The Roadmaps are the first step in the process of prioritizing HQ-supported technology funding. The 2015 Roadmaps are focused on planned mission architectures and needs, as identified in the NRC-led science Decadals and HEOMD's Design Reference Missions. Additionally, the 2015 Roadmaps focus on "applied " R&D as opposed to more basic research. The NASA Mission Directorates were all closely involved in development of 2015 Roadmaps, and an extensive external review was also conducted. This talk will discuss the Technology Roadmaps in general, and then focus on the specific technologies identified for TA 14, Thermal Management Systems.

Technology Roadmap↗
DOE OSTI2024

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [11] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project evaluates, designs, and develops thermal management strategies that use dielectric fluid (single-phase heat transfer) as coolants.

ADVANCED PROPULSION SYSTEMS↗
NASA NTRS2008

Joining and Integration of Advanced Carbon-Carbon Composites to Metallic Systems for Thermal Management Applications

Recent research and development activities in joining and integration of carbon-carbon (C/C) composites to metals such as Ti and Cu-clad-Mo for thermal management applications are presented with focus on advanced brazing techniques. A wide variety of carbon-carbon composites with CVI and resin-derived matrices were joined to Ti and Cu-clad Mo using a number of active braze alloys. The brazed joints revealed good interfacial bonding, preferential precipitation of active elements (e.g., Ti) at the composite/braze interface. Extensive braze penetration of the inter-fiber channels in the CVI C/C composites was observed. The chemical and thermomechanical compatibility between C/C and metals at elevated temperatures is assessed. The role of residual stresses and thermal conduction in brazed C/C joints is discussed. Theoretical predictions of the effective thermal resistance suggest that composite-to-metal brazed joints may be promising for lightweight thermal management applications.

Singh, M.↗
DOE OSTI2020

Holistic Thermal Management

This presentation, part of the 2019 Applied Power Electronics Conference (APEC), discusses holistic thermal management.

28 EE - Advanced Manufacturing Office (EE-5A)↗
NASA NTRS2015

Passive Thermal Management of Foil Bearings

Systems and methods for passive thermal management of foil bearing systems are disclosed herein. The flow of the hydrodynamic film across the surface of bearing compliant foils may be disrupted to provide passive cooling and to improve the performance and reliability of the foil bearing system.

Bruckner, Robert J.↗