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NASA NTRS1985

Chemoviscosity modeling for thermosetting resins, 2

A new analytical model for simulating chemoviscosity of thermosetting resin was formulated. The model is developed by modifying the Williams-Landel-Ferry (WLF) theory in polymer rheology for thermoplastic materials. By assuming a linear relationship between the glass transition temperature and the degree of cure of the resin system under cure, the WLF theory can be modified to account for the factor of reaction time. Temperature dependent functions of the modified WLF theory constants were determined from the isothermal cure data of Lee, Loos, and Springer for the Hercules 3501-6 resin system. Theoretical predictions of the model for the resin under dynamic heating cure cycles were shown to compare favorably with the experimental data reported by Carpenter. A chemoviscosity model which is capable of not only describing viscosity profiles accurately under various cure cycles, but also correlating viscosity data to the changes of physical properties associated with the structural transformations of the thermosetting resin systems during cure was established.

Hou, T. H.↗

NASA NTRS1985

Characterization of the relationship of the cure cycle chemistry to cure cycle processing properties

Dynamic dielectric analysis (DDA) is used to study curing polymer systems and thermoplastics. Measurements are made over a frequency range of six decades. This wide range of frequencies increases the amount of information which can be obtained. The data is analyzed in terms of the frequency dependence of the complex permittivity epsilon sup *, specific conductivity sigma (ohm/cm) and the relaxation time tau, parameters which are characteristic of the cure state of the material and independent of the size of the sample.

Kranbuehl, D. E.↗

NASA NTRS1985

Correlation of dynamic dielectric measurements with viscosity in polymeric resin systems

Dynamic dielectric analysis has been used to study curing polymer systems and thermoplastics. Measurements have been made over a frequency range of six decades. This wide range of frequencies increases the amount of information which can be obtained. The data are analyzed in terms of the frequency dependence of the specific conductivity sigma and the relaxation time tau, parameters which are characteristic of the cure state of the material and independent of size of the sample. Dynamic dielectric measurements have been correlated with viscosity for the polysulfone thermoplastic UDEL-P1700 and with viscosity and ultrasonic measurements on the DGEBA-type epoxy Epon 828 cured with Agent U. The experimental results suggest that when ionic processes dominate the dielectric response, the intensive property sigma is a good monitor of the resin's viscosity. The results show that the dielectric relaxation time tau can be used to monitor the state of the system and the extent and rate of the reaction.

Kranbuehl, D.↗

NASA NTRS1987

Studies on chemoviscosity modeling for thermosetting resins

A new analytical model for simulating chemoviscosity of thermosetting resins has been formulated. The model is developed by modifying the well-established Williams-Landel-Ferry (WLF) theory in polymer rheology for thermoplastic materials. By introducing a relationship between the glass transition temperature Tg(t) and the degree of cure alpha(t) of the resin system under cure, the WLF theory can be modified to account for the factor of reaction time. Temperature dependent functions of the modified WLF theory constants C sub 1 (t) and C sub 2 (t) were determined from the isothermal cure data. Theoretical predictions of the model for the resin under dynamic heating cure cycles were shown to compare favorably with the experimental data. This work represents progress toward establishing a chemoviscosity model which is capable of not only describing viscosity profiles accurately under various cure cycles, but also correlating viscosity data to the changes of physical properties associated with the structural transformation of the thermosetting resin systems during cure.

Bai, J. M.↗

NASA NTRS1988

Chemoviscosity modeling for thermosetting resin systems, part 3

A new analytical model for simulating chemoviscosity resin has been formulated. The model is developed by modifying the well established Williams-Landel-Ferry (WLF) theory in polymer rheology for thermoplastic materials. By introducing a relationship between the glass transition temperature (T sub g (t)) and the degree of cure alpha(t) of the resin system under cure, the WLF theory can be modified to account for the factor of reaction time. Temperature-dependent functions of the modified WLF theory parameters C sub 1 (T) and C sub 2 (T) were determined from the isothermal cure data. Theoretical predictions of the model for the resin under dynamic heating cure cycles were shown to compare favorably with the experimental data. This work represents a progress toward establishing a chemoviscosity model which is capable of not only describing viscosity profiles accurately under various cure cycles, but also correlating viscosity data to the changes of physical properties associated with the structural transformations of the thermosetting resin systems during cure.

Hou, T. H.↗

NASA NTRS1990

Tough, Microcracking-Resistant, High-Temperature Polymer

Simultaneous synthesis from thermosetting and thermoplastic components yields polyimide with outstanding properties. Involves process in which one polymer cross-linked in immediate presence of other, undergoing simultaneous linear chain extension. New material, LaRC-RP40 synthesized from high-temperature thermosetting imide prepolymer and from thermoplastic monomer. Three significantly improved properties: toughness, resistance to microcracking, and glass-transition temperature. Shows promise as high-temperature matrix resin for variety of components of aircraft engines and for use in other aerospace structures.

Pater, Ruth H.↗

NASA NTRS1967

Polymer Research

Network density of filled composites, nitroso compound reactions with hydrocarbons, cryogenic bladder bag materials, thermoplastic rubbers as binders, and other polymer research studies

COMPOSITE MATERIAL↗

NASA NTRS2026

Beyond Melting: Amorphous Bonding for Joining and Consolidation

Crystallization may be the hidden constraint in thermoplastic composite manufacturing. It requires tightly controlled cooling, induces residual stresses through shrinkage, and introduces path-dependent behavior that complicates predictive modeling yet remains essential for structural performance. This work asks: can bonding be achieved without relying on melt-driven crystallization? To address this, thin (5–20 μm) polyetherimide (PEI) interlayers are pre-healed to slow-cooled polyaryletherketone (PAEK) in two contexts. The first, Thermabond®, is sub-melt joining of low melt-PAEK laminates. Results show that bond quality is governed primarily by processing (i.e., adequate healing and film handling) rather than modest changes in interlayer thickness. This concept is then extended to laminate-scale manufacturing through an architecture known as OATMEAL (Out-of-autoclave Amorphous/semicrystalline Thermoplastic Material for Energy-efficient Aerospace-grade Laminates). PEI is healed to carbon fiber reinforced polyetheretherketone (PEEK) at the prepreg and excess PEI is then ablated from the surface. Crystallinity is developed off-line during prepreg fabrication, while subsequent consolidation occurs below the melt temperature to preserve it. Cross-ply warpage experiments show that, contrary to intuition, repeated amorphous interfaces reduce global curvature by lowering the effective stress lock-in temperature and eliminating crystallization shrinkage from the lamina response. Correspondingly, laminate behavior is accurately predicted using classical laminate theory (CLT) with a single effective stress-free temperature, whereas conventional CF/PEEK requires accounting for crystallization-driven effects. By decoupling interfacial healing from crystallization, OATMEAL enables sub-melt consolidation, reduces energy consumption by up to 75%, and increases manufacturing throughput by fivefold. These results demonstrate that amorphous bonding is not only a joining strategy, but a pathway to more predictable and scalable thermoplastic composite manufacturing.

solidification↗

NASA NTRS1992

New materials drive high-performance aircraft

This report shows how advanced composite materials and new processing methods are enabling lighter, lower cost aircraft structures. High-temperature polymers research will focus on systems capable of 50,000 to 100,000 hours of operation in the 212-400 F temperature range. Prospective materials being evaluated include high-temperature epoxies, toughened bismaleimides, cyanates, thermoplastics, polyimides and other polymers.

Ruhmann, Douglas C.↗

NASA NTRS1989

Low dielectric thermoplastic polyimide resin

NASA-Langley studies of polymer structure-property relationships have led to the development of a method for the reduction of dielectric constants in polyimides through chemical alterations of polymer backbone composition to reduce chain-chain electronic interactions, as well as through the incorporation of fluorine atoms into the polymer molecular structure. Still-greater dielectric constant reductions are obtainable by means of a physical incorporation of diamic acid additives into these low-dielectric polyimide systems; the resulting thermoplastic resins are applicable to polymer matrices for composite structural materials.

Stoakley, D. M.↗

NASA NTRS1996

Microstructural Characterization of Semi-Interpenetrating Polymer Networks by Positron Lifetime Spectroscopy

Thermoset and thermoplastic polyimides have complementary physical and mechanical properties. Whereas thermoset polyimides are brittle and generally easier to process, thermoplastic polyimides are tough but harder to process. A combination of these two types of polyimides may help produce polymers more suitable for aerospace applications. Semi-Interpenetrating Polymer Networks (S-IPN) of thermoset LaRC(TM)-RP46 and thermoplastic LaRC(TM)-IA polyimides were prepared in weight percent ratios ranging from 100:0 to 0:100. Positron lifetime measurements were made in these samples to correlate their free volume features with physical and mechanical properties. As expected, positronium atoms are not formed in these samples. The second lifetime component has been used to infer the positron trap dimensions. The 'free volume' goes through a minimum at a ratio of about 50:50, and this suggests that S-IPN samples are not merely solid solutions of the two polymers. These data and related structural properties of the S-IPN samples are discussed.

Singh, Jag J.↗

NASA NTRS1983

A Solvent-Resistant, Thermoplastic Poly(imidesulfone)

Process for preparing thermoplastic poly(imidesulfone) results in material having excellent thermoplastic properties generally associated with polysulfones and excellent solvent resistance generally associated with polyimides. New thermoplastic, solvent-resistant polymer is used as molding resin, as adhesive, and as matrix resin for fiber reinforced composites.

St. Clair, T. L.↗

NASA NTRSDate not supplied

Evaluating Crystallinity in Thermoplastic Composites

Explore the source record for details and available documents.

Thermoplastic composites↗

NASA NTRS1977

Assessment of relative flammability and thermochemical properties of some thermoplastic materials

Thermomechanical properties, flammability, oxygen index, relative toxicity of pyrolysis effluents, and char yields were studied for 12 advanced polymers which are candidates for use in aircraft interiors as decorative films, compression- and injection-molded parts and thermoplastic parts. Polymers sampled included polyphenylene sulfide, 9,9 bis (4-hydroxyphenol) fluorene polycarbonate-poly (dimethylsiloxane), polyether sulfone, polyvinyl fluoride and polyvinylidene fluoride. Availability of these samples, whether in commercial form or in test quantities, is specified. An estimate of relative fire resistance for the materials was obtained; the five polymers listed above were found to be the most fire resistant of the 12 sampled.

Kourtides, D. A.↗

NASA NTRS1986

Spacecraft dielectric material properties and spacecraft charging

The physics of spacecraft charging is reviewed, and criteria for selecting and testing semiinsulating polymers (SIPs) to avoid charging are discussed and illustrated. Chapters are devoted to the required properties of dielectric materials, the charging process, discharge-pulse phenomena, design for minimum pulse size, design to prevent pulses, conduction in polymers, evaluation of SIPs that might prevent spacecraft charging, and the general response of dielectrics to space radiation. SIPs characterized include polyimides, fluorocarbons, thermoplastic polyesters, poly(alkanes), vinyl polymers and acrylates, polymers containing phthalocyanine, polyacene quinones, coordination polymers containing metal ions, conjugated-backbone polymers, and 'metallic' conducting polymers. Tables summarizing the results of SIP radiation tests (such as those performed for the NASA Galileo Project) are included.

Frederickson, A. R.↗

NASA NTRS1996

Microstructural Characterization of Polymers by Positron Lifetime Spectroscopy

Positrons provide a versatile probe for monitoring microstructural features of molecular solids. In this paper, we report on positron lifetime measurements in two different types of polymers. The first group comprises polyacrylates processed on earth and in space. The second group includes fully-compatible and totally-incompatible Semi-Interpenetrating polymer networks of thermosetting and thermoplastic polyimides. On the basis of lifetime measurements, it is concluded that free volumes are a direct reflection of physical/electromagnetic properties of the host polymers.

Singh, Jag J.↗

NASA NTRS1997

Microstructural Characterization of Polymers with Positrons

Singh, Jag J.↗

NASA NTRS1998

Nuclear Instruments and Methods in Physics Research: Microstructural Characterization of Semi-Interpenetrating Polymer Networks by Positron Lifetime Spectroscopy - Section B

Thermoset and thermoplastic polyimides have complementary physical/mechanical properties. Whereas thermoset polyimides are brittle and generally easier to process, thermoplastic polyimides are tough but harder to process. It is expected that a combination of these two types of polyimides may help produce polymers more suitable for aerospace applications. Semi-Interpenetrating Polymer Networks (S-IPNs) of thermoset LaRC(Trademark)-RP46 and thermoplastic LARC(Trademark)-IA polyimides were prepared in weight percent ratios ranging from 100:0 to 0: 100. Positron lifetime measurements were made in these samples to correlate their free volume features with physical/mechanical properties. As expected, positronium atoms are not formed in these samples. The second life time component has been used to infer the positron trap dimensions. The "free volume" goes through a minimum at about 50:50 ratio, suggesting that S-IPN samples are not merely solid solutions of the two polymers. These data and related structural properties of the S-IPN samples have been discussed in this paper.

Singh, Jag J.↗