Search NASA⌕ Search

SEARCH · Search NASA

Results for “adherend”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 91 records · Page 5

Non-classical adhesive-bonded joints in practical aerospace construction

Solutions are derived for adhesive-bonded joints of non-classical geometries. Particular attention is given to bonded doublers and to selective reinforcement by unidirectional composites. Non-dimensionalized charts are presented for the efficiency limit imposed on the skin as the result of the eccentricity in the load path through the doubler. It is desirable to employ a relativly large doubler to minimize the effective eccentricity in the load path. The transfer stresses associated with selective reinforcement of metal structures by advanced composites are analyzed. Reinforcement of bolt holes in composites by bonded metal doublers is covered quantitatively. Also included is the adhesive joint analysis for shear flow in a multi-cell torque box, in which the bond on one angle becomes more critical sooner than those on the others, thereby restricting the strength to less than the total of each maximum strength when acting alone. Adhesive plasticity and adherend stiffness and thermal imbalances are included. A simple analysis/design technique of solution in terms of upper and lower bounds on an all-plastic adhesive analysis is introduced.

Hart-Smith, L. J.↗

Analysis of bonded joints

A refined elastic analysis of bonded joints which accounts for transverse shear deformation and transverse normal stress was developed to obtain the stresses and displacements in the adherends and in the bond. The displacements were expanded in terms of polynomials in the thicknesswise coordinate; the coefficients of these polynomials were functions of the axial coordinate. The stress distribution was obtained in terms of these coefficients by using strain-displacement and stress-strain relations. The governing differential equations were obtained by integrating the equations of equilibrium, and were solved. The boundary conditions (interface or support) were satisfied to complete the analysis. Single-lap, flush, and double-lap joints were analyzed, along with the effects of adhesive properties, plate thicknesses, material properties, and plate taper on maximum peel and shear stresses in the bond. The results obtained by using the thin-beam analysis available in the literature were compared with the results obtained by using the refined analysis. In general, thin-beam analysis yielded reasonably accurate results, but in certain cases the errors were high. Numerical investigations showed that the maximum peel and shear stresses in the bond can be reduced by (1) using a combination of flexible and stiff bonds, (2) using stiffer lap plates, and (3) tapering the plates.

Srinivas, S.↗

Mixed mode stress field effect in adhesive fracture

Numerical or analytical analyses were performed on seven different test specimens including blister test, 90-degree peel test, torsion test, and various cone tests. These specimens are in general subjected to complex stress fields having various amounts of Mode I, Mode II, and Mode III loads. The specimens were then constructed using polymethyl methacrylate for the adherends and a transparent polyurethane elastomer (Solithane 113) for the adhesive. This combination permitted direct observation of the bondline as load was applied. Although initial debonds as well as bond end termination singularities were present in all specimens, in some cases the debond did not initiate at the singularity points as would normally have been expected. An explanation for this behavior is presented, as well as a comparison of loading mode effect on those specimens for which the debond did propagate from a bond terminus singular point.

Anderson, G. P.↗

Effect of high temperature aging on bonded and weld bonded joints

Development of adhesives for applications requiring long-term service at temperatures up to 600 F is discussed. This development work utilizes polyimide (PI) and polyphenylquinoxaline (PPQ) resin technology worked out previously. The resultant adhesives are evaluated in structural joints of titanium, steel and composite adherends and in honeycomb sandwich panels. Suitable adhesives also are evaluated in weld bonded titanium alloy joints. Testing includes determination of long-term aging of stressed and unstressed specimens at temperatures from about 450 F to 600 F as well as under dynamic fatigue conditions.

Vaughan, R. W.↗

Nonlinear analysis of bonded joints with thermal effects

Nonlinear results are presented for adhesive bonded joints. It is shown that adhesive nonlinearities are only significant in the predicted adhesive shear stresses. Adherend nonlinearities and temperature dependent properties are shown to have little effect upon the adhesive stress predictions under mechanical and thermal loadings.

Humphreys, E. A.↗

A fundamental approach to adhesion: Synthesis, surface analysis, thermodynamics and mechanics

The ability of SEM/EDAX to determine the physical and chemical composition of very small areas was used to study several diverse types of samples representative of NASA-LaRC technology. More systematic investigation was carried out on differences in the results of grit-blasting Ti 6-4 adherends and the presence of extraneous elements, primarily silicon, in some polymer/HT-S fiber composites. Initial results were obtained from a fractured (ILS) short-beam shear specimen, and from Ti 6-4 alloy, before and after a proprietary Boeing anodizing surface preparation for adhesive bonding. Photomicrographs and EDAX spectra were also obtained from new, fractured lap shear strength specimens that employed PPQ and LARC-13 adhesives.

Dwight, D. W.↗

High Temperature Adhesives for Bonding Kapton

Experimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575K (575 F) in vacuum. Glass transition temperatures of the polyimide/Kapton bondlines were monitored by thermomechanical analysis.

Stclair, A. K.↗

A fundamental approach to adhesion: Synthesis, surface analysis, thermodynamics and mechanics

Various surface preparations for titanium 6-4 alloy were studied. An anodizing method was investigated, and compared with the results of other chemical treatments, namely, phosphate/fluoride, Pasa-Jell and Turco. The relative durability of the different surface treatments was assessed by monitoring changes in surface chemistry and morphology occasioned by aging at 505 K (450 F). Basic electron spectroscopic data were collected for polyimide and polyphenylquinoxaline adhesives and synthetic precursors. Fractographic studies were completed for several combinations of adherend, adhesive, and testing conditions.

Chen, W.↗

A fundamental approach to adhesion: Synthesis, surface analysis, thermodynamics and mechanics

Adherend surfaces and fractography were studied using electron spectroscopy for chemical analysis and scanning electron microscopy/energy dispersive analysis of X-rays. In addition, Auger Electron Spectroscopy with depth profiling capability was used. It is shown that contamination of adhesion systems plays an important role not only in determining initial bond strengths but also in the durability of adhesive bonds. It is concluded that the analytical techniques used to characterize and monitor such contamination.

Chen, W.↗

Design fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

Graphite/polyimide (Gr/PI) bolted and bonded joints were investigated. Possible failure modes and the design loads for the four generic joint types are discussed. Preliminary sizing of a type 1 joint, bonded and bolted configuration is described, including assumptions regarding material properties and sizing methodology. A general purpose finite element computer code is described that was formulated to analyze single and double lap joints, with and without tapered adherends, and with user-controlled variable element size arrangements. An initial order of Celion 6000/PMR-15 prepreg was received and characterized.

Source record↗

A critical examination of stresses in an elastic single lap joint

The results of an approximate nonlinear finite-element analysis of a single lap joint are presented and compared with the results of a linear finite-element analysis, and the geometric nonlinear effects caused by the load-path eccentricity on the adhesive stress distributions are determined. The results from finite-element, Goland-Reissner, and photoelastic analyses show that for a single lap joint the effect of the geometric nonlinear behavior of the joint has a sizable effect on the stresses in the adhesive. The Goland-Reissner analysis is sufficiently accurate in the prediction of stresses along the midsurface of the adhesive bond to be used for qualitative evaluation of the influence of geometric or material parametric variations. Detailed stress distributions in both the adherend and adhesive obtained from the finite-element analysis are presented to provide a basis for comparison with other solution techniques.

Cooper, P. A.↗

High temperature adhesives for bonding Kapton

Experimental polyimide resins have been developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of 'Kapton'/'Kapton' bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575K (575 F) in vacuum. Glass transition temperatures of the polyimide/'Kapton' bondlines were monitored by thermomechanical analysis.

Saint Clair, A. K.↗

High-temperature adhesives for bonding polyimide film

Experimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575 K (575 F) in vacuum. Glass transition temperatures of the polyimide/"Kapton" bondlines were monitored by thermomechanical analysis.

St.clair, A. K.↗

Thermal stability and aging of some new anaerobic adhesives for structural binding

Polyurethane-modified high impact anaerobic adhesives have been chosen for a bonding application where impact cushion is critical. These adhesives meet all the requirements for high rate production and automatic assembly techniques. With aluminum adherends, one selected adhesive cured at room temperature with the recommended activator retained sixty percent of its original impact strength after twenty-six week aging at 100 C. The impact strength aging, the thermogravimetric analysis results, the outgassing data, and other observations made in this work indicate that the adhesives cured by simple heating give a more durable bond than that cured with an activator at room temperature.

Lee, S. Y.↗

Addition polyimide end cap study

The characterization of addition polyimides with various end caps for adhesive applications at 120-250 C environments is discussed. Oligometric polyimides were prepared from 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 3,3'-methylenedianiline which were end-capped with functionally reactive moities which cause crosslinking when the oligomers are heated to 200-400 C. The syntheses of the oligomers are outlined. The thermolysis of the oligomers was studied by differential scanning calorimetry and the resulting polymers were characterized by differential thermal analysis and adhesive performance. The adhesive data include lap shear strengths on titanium 6-4 adherends both before and after aging for 1000 hours at 121 C and/or 232 C.

St.clair, T. L.↗

An investigation of adhesive/adherend and fiber matrix interactions

Research during the report period focused on continued scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) of lap shear samples and flatwise tensile specimens and on the surface characterization of TiO2, Ti 6-4, and Ti powders with particular emphasis on their interaction with primer solutions of both polyphenylquinoxaline and LaRC-13 polyimide. The use of SEM and XPS in the analysis of Ti 6-4 adherend surfaces is described as well as differences in Ti 6-4 surface composition after different chemical pretreatments. Analysis of fractured surfaces is used to established the failure mode. The surface acidity of Ti 6-4 coupons can be established by reflectance visible spectroscopy using indicator dyes.

Beck, B.↗

Time-temperature effect in adhesively bonded joints

The viscoelastic analysis of an adhesively bonded lap joint was reconsidered. The adherends are approximated by essentially Reissner plates and the adhesive is linearly viscoelastic. The hereditary integrals are used to model the adhesive. A linear integral differential equations system for the shear and the tensile stress in the adhesive is applied. The equations have constant coefficients and are solved by using Laplace transforms. It is shown that if the temperature variation in time can be approximated by a piecewise constant function, then the method of Laplace transforms can be used to solve the problem. A numerical example is given for a single lap joint under various loading conditions.

Delale, F.↗

Analysis of interface cracks in adhesively bonded lap shear joints, part 4

Conservation laws of elasticity for nonhomogeneous materials were developed and were used to study the crack behavior in adhesively bonded lap shear joints. By using these laws and the fundamental relationships in fracture mechanics of interface cracks, the problem is reduced to a pair of linear algebraic equations, and stress intensity solutions can be determined directly by information extracted from the far field. The numerical results obtained show that: (1) in the lap-shear joint with a given adherend, the opening-mode stress intensity factor, (K sub 1) is always larger than that of the shearing-mode (K sub 2); (2) (K sub 1) is not sensitive to adherent thickness abut (K sub 2) increases rapidly with increasing thickness; and (3) (K sub 1) and (K sub 2) increase simultaneously as the interfacial crack length increases.

Wang, S. S.↗