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NASA NTRS2021

A High Dynamic-Range Photon-Counting Receiver for Deep Space Optical Communication

The Deep Space Optical Communication (DSOC) project will demonstrate free-space optical communication at almost 3 AU, or 3 orders of magnitude further than any previous attempt. DSOC will utilize the 5m Palomar Hale Telescope to receive the downlink signal, which will couple the downlink light onto an optical table and into a superconducting nanowire single photon detector (SNSPD). The output of the SNSPD is digitized by the Ground Laser Receiver Signal Processing Assembly (GSPA) using a high throughput streaming time to digital converter (TDC). The GSPA is a scalable FPGA-based receiver which demodulates and decodes the DSOC downlink signal through novel signal processing algorithms implemented on Xilinx UltraScale+ FPGAs, as well as Python-based software monitor and control routines. Exploiting the unique TDC-based architecture, the GSPA supports over four orders of magnitude of downlink data rates across multiple orders of magnitude of signal and background powers. In this paper we present an overview of the hardware, firmware and software architectures to implement this system, as well as performance analysis for links ranging from near-Earth to 2.8 AU.

Srinivasan, Meera↗

NASA NTRS2021

Sample Return Container Opening Process Concept for Potential Mars Sample Return

Proposed Mars Sample Return (MSR) missions would require a pristine and secure opening method to ensure sample Contamination Control and backward Planetary Protection. In order to reach the samples, a series of five containers would need to be opened inside of a Mars Returned Sample Handling (MRSH) facility. The process would include opening the Containment Assurance Module (CAM) aboard the Earth Entry Vehicle (EEV), the Secondary Containment Vessel (SCV), Primary Containment Vessel (PCV), and the Orbiting Sample (OS) container, and finally removing and opening the Returned Sample Tube Assemblies (RSTA). Some of these containers can be opened by reversing the mechanical assembly process while others would require destructive means. Several containers are still in a conceptual design phase while others are en route to Mars aboard the M2020 rover. In order to inform the design of the containers that are still in the conceptual stages, a study was performed at each level of the containment assembly. The studies were used to determine the least destructive and most robust methods to disassemble and open the containers while minimizing risk to the samples or the personnel. In addition to the envisioned disassembly and breaching method, contingency plans were made for completing the disassembly if damage to the vehicle and containment system occurred.

Liu, Yang↗

NASA NTRS1992

Materials technology for Stirling space power converters

This program was conducted in support of the NASA LeRC development of the Stirling power converter (SPC) for space power applications. The objectives of this contract were: (1) to perform a technology review and analyses to support the evaluation of materials issues for the SPC; (2) to evaluate liquid metal compatibility issues of the SPC; (3) to evaluate and define a transient liquid phase diffusion bonding (TLPDB) process for the SPC joints to the Udimet 720 heater head; and (4) to evaluate alternative (to the TLPDB) joining techniques. In the technology review, several aspects of the current Stirling design were examined including the power converter assembly process, materials joining, gas bearings, and heat exchangers. The supporting analyses included GLIMPS power converter simulation in support of the materials studies, and system level analysis in support of the technology review. The liquid metal compatibility study evaluated process parameters for use in the Stirling power converter. The alternative joining techniques study looked at the applicability of various joining techniques to the Stirling power converter requirements.

Baggenstoss, William↗

NASA NTRS1991

Representations of mechanical assembly sequences

Five types of representations for assembly sequences are reviewed: the directed graph of feasible assembly sequences, the AND/OR graph of feasible assembly sequences, the set of establishment conditions, and two types of sets of precedence relationships. (precedence relationships between the establishment of one connection between parts and the establishment of another connection, and precedence relationships between the establishment of one connection and states of the assembly process). The mappings of one representation into the others are established. The correctness and completeness of these representations are established. The results presented are needed in the proof of correctness and completeness of algorithms for the generation of mechanical assembly sequences.

Homem De Mello, Luiz S.↗

NASA NTRS1989

Precedence relationship representations of mechanical assembly sequences

Two types of precedence relationship representations for mechanical assembly sequences are presented: precedence relationships between the establishment of one connection between two parts and the establishment of another connection, and precedence relationships between the establishment of one connection and states of the assembly process. Precedence relationship representations have the advantage of being very compact. The problem with these representations was how to guarantee their correctness and completeness. Two theorems are presented each of which leads to the generation of one type of precedence relationship representation guaranteeing its correctness and completeness for a class of assemblies.

Homendemello, L. S.↗

NASA NTRS1999

Manufacturing Robustness of CSP in SMT Line

In this paper, the assembly process flow, solder paste for different stencil design, manufacturing defects, X-ray inspection results, and ultrasonic characterizations are reported.

electronic assembly SMT CSP fine pitch microvia te↗

NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗

NASA NTRS1990

Dynamic Characteristics of Space Station Freedom Mars and Lunar Evolution Reference Configurations

One concept for a manned mission to Mars uses an evolutionary version of Space Station Freedom (SSF) as a transportation node. The station is modified by the addition of dual keels, an upper and lower boom, additional laboratory and habitation modules, increased power and an assembly platform. With these modifications the station is called the Mars Evolution Reference Configuration (MERC). The mass of the station is 65 percent greater than the mass of SSF and its moments of inertia through the mass center are greater by approximately a factor of four. Over a period of months, several flights from Earth to low-Earth-orbit carry the components of a manned Mars piloted vehicle (MPV) to the MERC where the vehicle is constructed on the assembly platform. After each flight the station is reboosted to an appropriate altitude, such that the orbit decay due to atmospheric drag forces lowers the spacecraft to the proper altitude at the appropriate time for rendezvous with the next assembly flight. When the assembly process is completed, the MPV, which has a mass of approximately 200,000 lbm, is situated on the evolutionary station. The mass increase of the MERC with MPV system over SSF is 112 percent and the moments of inertia about axes through the mass center increase by up to a factor of 12. When the MPV is assembled, inspected and verified, the mission is ready to proceed and the MPV is moved from the station to a staging area and mated with fueled trans-Mars injection stages for the flight to Mars. This presentation describes a finite element model of the MERC formulated to investigate the expected low frequency modes and its variation with the addition of a large payload. A basic reboost procedure using near-continuous firing of reaction control system jets is proposed with off-modulation of the jets used to control flight attitude. The reboost procedure is described with the closed-loop attitude control dictating jet on/off cycling based on feedback signals which contain both the rigid body rotation information and the elastic rotations local to the attitude sensor. The presentation contains a description of the dynamic response at critical points of the station during the reboost and concludes with results of a brief study of the dynamic characteristics of a Lunar transportation node configuration.

Ayers, J. Kirk↗

NASA NTRS2017

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Additive Manufacturing↗

NASA NTRS2018

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing↗

NASA NTRS2012

Analyzers Provide Water Security in Space and on Earth

Resourcefulness is a key quality for living in space, and on the International Space Station (ISS), that means making the most of water supplies. In 2008, the installation of the Water Processing Assembly (WPA) onboard the ISS allowed the space station s crew to do just that. The WPA purifies moisture from nearly every possible source - sweat, water vapor, wastewater, and even urine - for drinking and oxygen generation. Capable of producing 35 gallons of potable, recycled water a day, the system has reduced the need for water delivered to the ISS by over 1,000 gallons a year, saving significant payload costs in the process. As with any drinking water, quality is a concern, particularly when that water has been recycled. This is an issue of particular interest in space, where ISS crewmembers would have to deal with any illness far from the nearest medical personnel and facilities. The WPA employs sensors that monitor water quality by measuring its conductivity, and rounding out the system s quality assurance methods is a device developed for NASA by a private industry partner. That company has now made the technology available for ensuring the purity of water for consumption and industrial uses on Earth.

Source record↗

NASA NTRS1983

Hermetic edge sealing of photovoltaic modules

The feasibility of using an electrostatic bonding (ESB) and ultrasonic welding process to produce hermetic edge seals on terrestrial solar cell modules was investigated. The fabrication sequence is to attach an aluminum foil "gasket' to the perimeter of a glass sheet. A cell circuit is next encapsulated inside the gasket, and its aluminum foil back cover is seam welded ultrasonically to the gasket. An ESB process for sealing aluminum to glass was developed in an ambient air atmosphere, which eliminates the requirement for a vacuum or pressure vessel. An ultrasonic seam welding process was also developed which did not degrade the quality of the ESB seal. Good quality welds with minimal deformation were produced. The effectiveness of the above described sealing techniques was tested by constructing 400 sq cm (8 x 8 s64 sq in) sample modules, and then subjecting them to nondestructive fine and gross leak tests. The gross leak tests identified several different causes of leaks which were then eliminated by modifying the assembly process.

Nowlan, M. J.↗

NASA NTRS2012

Hardy Bacterium Isolated From Two Geographically Distinct Spacecraft Assembly Cleanroom Facilities

Earlier studies have confirmed that a tenacious hardy bacterial population manages to persist and survive throughout a spacecraft assembly process. The widespread detection of these organisms underscores the challenges in eliminating them completely. Only comprehensive and repetitive microbial diversity studies of geographically distinct cleanroom facilities will bolster the understanding of planetary protection relevant microbes. Extensive characterizations of the physiological traits demonstrated by cleanroom microbes will aid NASA in gauging the forward contamination risk that hardy bacteria (such as Tersicoccus phoenicis) pose to spacecraft. This study reports on the isolation and identification of two gram-positive, non-motile, non-spore-forming bacterial strains from the spacecraft assembly facilities at Kennedy Space Center, Florida, USA and Centre Spatial Guyanais, Kourou, French Guiana. DNA-DNA relatedness values between the novel strains indicates that these novel strains were indeed members of a same species. Phylogenetic evidence derived from a 16S ribosomal DNA analysis indicated that both the novel strains are less closely related to all other Arthrobacter species.

Vaisham-payan, Parag A.↗

NASA NTRS2021

Machine Learning to Predict Joint Performance in Epoxy Composites Based on Process Parameters

Polymer matrix composites are gaining popularity in the aerospace industry due to their high specific strength, fatigue properties, and processability. However, based on current FAA certification guidelines, manufacturers utilizing current state-of-the-art composites made with adhesive bonds commonly install redundant fasteners to guarantee the strength of these adhesively bonded composite parts. The number of fasteners in a single-aisle commercial transport aircraft is typically on the order of 105, which reduces manufacturing rate, increases cost tremendously, and reduces the advantage of the specific strength composites provide. Due to this, the Adhesive Free Bonding of Composites (AERoBOND) project at NASA Langley Research Center has developed a novel assembly process to manufacture complex composite parts without the use of adhesives and fasteners. However, optimization of the process is currently challenging due to the complex and interdependent process parameters. To assist with the optimization, four machine learning algorithms utilizing gradient boosting decision trees were created to provide predictions for the mechanical and characterization properties of the composite parts. Approximately 200 random states from each algorithm were tested, and the models from each state were isolated and analyzed based on their accuracy, a validation process, and their feature importance. This analysis concluded that the models created from the machine learning algorithms could accelerate a parametric study for the AERoBOND process by rapidly optimizing process parameters to achieve desired performance characteristics.

Brennen Michael Middleton↗

NASA NTRSDate not supplied

Machine Learning to Predict Joint Performance in Epoxy Composites Based on Process Parameters

Polymer matrix composites are gaining popularity in the aerospace industry due to their high specific strength, fatigue properties, and processability. However, based on current FAA certification guidelines, manufacturers utilizing current state-of-the art composites made with adhesive bonds commonly install redundant fasteners to guarantee the strength of these adhesively bonded composite parts.1,2 The number of fasteners in a single-aisle commercial transport aircraft is typically on the order of 105, which reduces manufacturing rate, increases cost tremendously, and reduces the advantage of the specific strength composites provide. Due to this, the Adhesive Free Bonding of Composites (AERoBOND) project at NASA Langley Research Center has developed a novel assembly process to manufacture complex composite parts without the use of adhesives and fasteners.1 However, optimization of the process is currently challenging due to the complex and interdependent process parameters. To assist with the optimization, four machine learning algorithms utilizing gradient boosting decision trees were created to provide predictions for the mechanical and characterization properties of the composite parts. Approximately 200 random states from each algorithm were tested, and the models from each state were isolated and analyzed based on their accuracy, a validation process, and their feature importance. This analysis concluded that the models created from the machine learning algorithms could accelerate a parametric study for the AERoBOND process by rapidly optimizing process parameters to achieve desired performance characteristics.

Brennen M Middleton↗

NASA NTRS1975

Development of beam lead RF integrated circuits

This paper describes the design and development of a set of multifunction VHF/UHF integrated circuits aimed at providing a major improvement in spacecraft radio reliability through low stress operation and the processing of these circuits in beam-lead form. The methods evolved for the high frequency characterization of the devices are discussed together with the design of suitable test fixtures. Typical test results and the distribution of test parameters are presented. A unique carrier for beam-lead devices is described, and the need for such a device is discussed. The application of the carrier to device screening, burn-in and drift measurements is discussed together with the incentives for providing these capabilities. An overview of the integration of the devices into the spacecraft radio is given and candidate assembly processes are discussed. The technology impact of this approach upon future spacecraft radio systems is qualitatively examined.

Kline, A. J.↗

NASA NTRS2017

The Universal Space Transponder: A Next Generation Software Defined Radio

The Universal Space Transponder (UST) is a next generation transponder developed at the Jet Propulsion Laboratory to meet a large variety of telecom, navigation, and radio science needs for future deep-space and near-Earth missions. This paper details the UST software defined radio design and describes how the combination of a modular hardware architecture and in-flight reprogrammability enables a new level of flexibility and expandability for a space transponder. The UST uses common power and digital processing assemblies that can be integrated with a variety of RF modules and is capable of simultaneous, multiband operations with data rates up to 37.5 Mbps RX and 300 Mbps TX. This allows a single radio to support all the direct-to-Earth and relay communication requirements for even complex mission scenarios, reducing the total cost, mass, and power. The discussion includes a description of the current UST engineering models that have been built and tested, as well as details about the next generation capabilities supported by UST, including advanced link coding and modulation, radiometric techniques, and in-radio protocol handling. Details are also presented on RF modules and digital processing in development for radio science and astronomy purposes, including a bistatic radar receiver and broadband planetary emissions receiver. These will demonstrate the ability to integrate low-cost science instruments into the UST architecture, further expanding the versatility of the UST.

Jedrey, Thomas↗

NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗