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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

plastic ball grid array (PBGA)↗
NASA NTRS1995

(abstract) Designing for Small Volume Assembly of Advanced Electronics Packages

There is a need for high reliability surface mount assembly processes for aerospace, military, and medical applications. This approach for improving design for producibility and reliability of electronic system assembly processes can be utilized as a starting framework. Described herein is a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs.

assembly processes↗
NASA NTRS2021

An Autonomous Vault-Building Robot System for Creating Spanning Structures

Research in autonomous robots for construction has largely focused on ground-based robots whose reach constrains the size of what they can build, or on climbing or aerial robots that build solid or unroofed structures. Autonomous construction of larger, multistory buildings, or bridges spanning unsupported distances, would require robots that build sturdy structures supporting their own weight. In this paper, we present VaultBot, a system of autonomous robots that build a load-bearing spanning vault using identical modular blocks. The custom blocks employ mechanical and other features to facilitate robotic manipulation and locomotion, and can be removed from and replaced in an assembled structure as a way of repairing damage. We characterize the system's performance and failure modes, and demonstrate reliable autonomous assembly for a structure composed of 46 blocks. Blocks can be made collapsible and deployable as a way of reducing mass and volume that must be transported to a construction site. Such a system could be used to help enable construction of protective shelters in challenging environments, such as disaster relief scenarios, arctic settings, or extraterrestrial habitats.

Nathan Melenbrink↗
NASA NTRS1967

Reliable cabling for space vehicles.

Cabling material problems associated with military standard connectors for space vehicles, discussing reliability, fabrication, assembly and design

SPACECRAFT ELECTRONIC EQUIPMENT↗
NASA NTRS2000

Different Approaches for Ensuring Performance/Reliability of Plastic Encapsulated Microcircuits (PEMs) in Space Applications

Engineers within the commercial and aerospace industries are using trade-off and risk analysis to aid in reducing spacecraft system cost while increasing performance and maintaining high reliability. In many cases, Commercial Off-The-Shelf (COTS) components, which include Plastic Encapsulated Microcircuits (PEMs), are candidate packaging technologies for spacecrafts due to their lower cost, lower weight and enhanced functionality. Establishing and implementing a parts program that effectively and reliably makes use of these potentially less reliable, but state-of-the-art devices, has become a significant portion of the job for the parts engineer. Assembling a reliable high performance electronic system, which includes COTS components, requires that the end user assume a risk. To minimize the risk involved, companies have developed methodologies by which they use accelerated stress testing to assess the product and reduce the risk involved to the total system. Currently, there are no industry standard procedures for accomplishing this risk mitigation. This paper will present the approaches for reducing the risk of using PEMs devices in space flight systems as developed by two independent Laboratories. The JPL procedure involves primarily a tailored screening with accelerated stress philosophy while the APL procedure is primarily, a lot qualification procedure. Both Laboratories successfully have reduced the risk of using the particular devices for their respective systems and mission requirements.

Gerke, R. David↗
NASA NTRS2003

Visual and x-ray inspection characteristics of eutectic and lead free assemblies

For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

x-ray↗
NASA NTRS2010

Constellation Program (CxP) Crew Exploration Vehicle (CEV) Parachute Assembly System (CPAS) Independent Design Reliability Assessment

This report documents the activities, findings, and NASA Engineering and Safety Center (NESC) recommendations of a multidiscipline team to independently assess the Constellation Program (CxP) Crew Exploration Vehicle (CEV) Parachute Assembly System (CPAS). This assessment occurred during a period of 15 noncontiguous months between December 2008 and April 2010, prior to the CPAS Project's Preliminary Design Review (PDR) in August 2010.

Kelly, Michael J.↗
NASA NTRS2010

Constellation Program (CxP) Crew Exploration Vehicle (CEV) Parachute Assembly System (CPAS) Independent Design Reliability Assessment: Appendices - Volume 2

This document contains the Appendices to the report documenting the activities, findings, and NASA Engineering and Safety Center (NESC) recommendations of a multidiscipline team to independently assess the Constellation Program (CxP) Crew Exploration Vehicle (CEV) Parachute Assembly System (CPAS). The assessment occurred during a period of 15 noncontiguous months between December 2008 and April 2010, prior to the CPAS Project's Preliminary Design Review (PDR) in August 2010.

Kelly, Michael J.↗
NASA NTRS2014

Reliability Growth in Space Life Support Systems

A hardware system's failure rate often increases over time due to wear and aging, but not always. Some systems instead show reliability growth, a decreasing failure rate with time, due to effective failure analysis and remedial hardware upgrades. Reliability grows when failure causes are removed by improved design. A mathematical reliability growth model allows the reliability growth rate to be computed from the failure data. The space shuttle was extensively maintained, refurbished, and upgraded after each flight and it experienced significant reliability growth during its operational life. In contrast, the International Space Station (ISS) is much more difficult to maintain and upgrade and its failure rate has been constant over time. The ISS Carbon Dioxide Removal Assembly (CDRA) reliability has slightly decreased. Failures on ISS and with the ISS CDRA continue to be a challenge.

life support↗
NASA NTRS2005

Reliability of CCGA and PBGA assemblies

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

stakes↗
NASA NTRS1974

Hot ion plasma heating experiments in SUMMA

A new superconducting magnetic mirror apparatus (SUMMA) is described using photographs, diagrams, characteristics graphs, and block diagrams. The apparatus consists of a magnet facility, a plasma test section, the electrode assembly, a charge-exchange neutral particle analyzer, and apparatus for emission spectroscopy. Initial results of hot ion plasma heating experiments conducted in this facility are reported. The purpose of these experiments was twofold: (1) to make a reliable electrode assembly for steady-state operation in the new SUMMA magnetic field configuration and test-section geometry; and (2) to see how ion heating scales as the midplane magnetic field is varied up to 3.5 tesla.

Reinmann, J. J.↗
NASA NTRS1985

V-band IMPATT power amplifier

This program is the result of the continuing demand and future requirement for a high data rate 60-GHz communications link. A reliable solid-state transmitter which delivers the necessary power over a wide bandwidth using the present IMPATT diode technology required the development of combining techniques. The development of a 60-GHz IMPATT power combiner amplifier is detailed. The results form a basis from which future wideband, high-power IMPATT amplifiers may be developed. As a result, several state-of-the-art advancements in millimeter-wave components technology were achieved. Specific achievements for the amplifier integration were: development of a nonresonant divider/combiner circuit; reproducible multiple junction circulator assemblies; and reliable high power 60-GHz IMPATT diodes. The various design approaches and tradeoffs which lead to the final amplifier configuration are discussed. A detailed circuit design is presented for the various amplifier components, and the conical line combiner, radial line combiner, and circulator development are discussed. The performance of the amplifier, the overall achievement of the program, the implications of the results, and an assessment of future development needs and recommendations are examined.

Schell, S. W.↗
NASA NTRS2004

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗
NASA NTRS1987

Heat pipe radiators for solar dynamic space power system heat rejection

The paper presents the results of a concept development study of heat rejection systems for Space Station solar dynamic power systems. The thermal performance and weights of each of the heat rejection subsystems have been addressed in detail, and critical technologies which require development tests and evaluation for successful demonstration were assessed and identified. Baseline and several alternate heat rejection system configurations and optimum designs were developed for both Brayton and Rankine cycles. The thermal performance, mass properties, assembly requirements, reliability, maintenance requirements, and life cycle costs were determined for each of the system configurations. Trade studies were performed on each configuration with respect to the heat pipe wall thickness and the amount of redundancy to determine the effects on system reliability, maintenance requirements, and life cycle costs. An optimum design was then selected for each configuration.

Gustafson, Eric↗
NASA NTRS1987

Solar dynamic heat rejection technology. Task 1: System concept development

The results are presented of a concept development study of heat rejection systems for Space Station solar dynamic power systems. The heat rejection concepts are based on recent developments in high thermal transport capacity heat pipe radiators. The thermal performance and weights of each of the heat rejection subsystems is addressed in detail, and critical technologies which require development tests and evaluation for successful demonstration are assessed and identified. Baseline and several alternate heat rejection system configurations and optimum designs are developed for both Brayton and Rankine cycles. The thermal performance, mass properties, assembly requirements, reliability, maintenance requirements and life cycle cost are determined for each configuration. A specific design was then selected for each configuration which represents an optimum design for that configuration. The final recommendations of heat rejection system configuration for either the Brayton or Rankine cycles depend on the priorities established for the evaluation criteria.

Gustafson, Eric↗