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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5

Effect of timed secondary-air injection on automotive emissions

A single cylinder of an automotive V-8 engine was fitted with an electronically timed system for the pulsed injection of secondary air. A straight-tube exhaust minimized any mixing other than that produced by secondary-air pulsing. The device was operated over a range of engine loads and speeds. Effects attributable to secondary-air pulsing were found, but emission levels were generally no better than using the engine's own injection system. Under nontypical fast-idle, no-load conditions, emission levels were reduced by roughly a factor of 2.

Coffin, K. P.↗

Architecture for Survivable System Processing (ASSP)

The Architecture for Survivable System Processing (ASSP) Program is a multi-phase effort to implement Department of Defense (DOD) and commercially developed high-tech hardware, software, and architectures for reliable space avionics and ground based systems. System configuration options provide processing capabilities to address Time Dependent Processing (TDP), Object Dependent Processing (ODP), and Mission Dependent Processing (MDP) requirements through Open System Architecture (OSA) alternatives that allow for the enhancement, incorporation, and capitalization of a broad range of development assets. High technology developments in hardware, software, and networking models, address technology challenges of long processor life times, fault tolerance, reliability, throughput, memories, radiation hardening, size, weight, power (SWAP) and security. Hardware and software design, development, and implementation focus on the interconnectivity/interoperability of an open system architecture and is being developed to apply new technology into practical OSA components. To insure for widely acceptable architecture capable of interfacing with various commercial and military components, this program provides for regular interactions with standardization working groups (e.g.) the International Standards Organization (ISO), American National Standards Institute (ANSI), Society of Automotive Engineers (SAE), and Institute of Electrical and Electronic Engineers (IEEE). Selection of a viable open architecture is based on the widely accepted standards that implement the ISO/OSI Reference Model.

Wood, Richard J.↗

Aromatic Diamines and Polyimides Based on 4,4'-Bis-(4-Aminophenoxy)-2,2' or 2,2',6,6'- Substituted Biphenyl

This invention relates the novel diamines. the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature. good mechanical properties and improved processability in the manufacture of adhesives. electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2.2',6.6substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides. while retaining a relatively high glass transition temperature and improved mechanical properties at useful temperature ranges.

Chuang, Chun-Hua K.↗

Aromatic Diamines and Polyimides Based on 4,4'-Bis-(4-Aminophenoxy)-2,2' or 2,2',6,6'- Substituted Biphenyl

This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a relatively high glass transition temperature and improved mechanical properties at useful temperature ranges.

Chun-Hua K Chuang↗

Polyimides based on 4,4'-bis (4-aminophenoxy)-2,2'or 2,2', 6,6'-substituted biphenyl

This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a realatively high glass transition temperature and improved mechanical properties at useful temperature ranges.

Chuang, Chun-Hua K.↗

Advanced Gas Turbine (AGT) powertrain system development for automotive applications

Progress in the development of a gas turbine engine to improve fuel economy, reduce gaseous emissions and particulate levels, and compatible with a variety of alternate fuels is reported. The powertrain is designated AGT101 and consists of a regenerated single shaft gas turbine engine, a split differential gearbox and a Ford Automatic Overdrive production transmission. The powertrain is controlled by an electronic digital microprocessor and associated actuators, instrumentation, and sensors. Standard automotive accessories are driven by engine power provided by an accessory pad on the gearbox. Component/subsystem development progress is reported in the following areas: compressor, turbine, combustion system, regenerator, gearbox/transmission, structures, ceramic components, foil gas bearing, bearings and seals, rotor dynamics, and controls and accessories.

Source record↗

Towards the Formal Verification of a Distributed Real-Time Automotive System

We present the status of a project which aims at building, formally and pervasively verifying a distributed automotive system. The target system is a gate-level model which consists of several interconnected electronic control units with independent clocks. This model is verified against the specification as seen by a system programmer. The automotive system is implemented on several FPGA boards. The pervasive verification is carried out using combination of interactive theorem proving (Isabelle/HOL) and model checking (LTL).

Endres, Erik↗

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.

printed electronics↗

Improved Silicon Carbide Crystals Grown From Atomically Flat Surfaces

The NASA Glenn Research Center is demonstrating that atomically flat (i.e., step-free) silicon carbide (SiC) surfaces are ideal for realizing greatly improved wide bandgap semiconductor films with lower crystal defect densities. Further development of these improved films could eventually enable harsh-environment electronics beneficial to jet engine and other aerospace and automotive applications, as well as much more efficient and compact power distribution and control. The technique demonstrated could also improve blue-light lasers and light-emitting-diode displays.

Neudeck, Philip G.↗

Silicon carbide, an emerging high temperature semiconductor

In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

Matus, Lawrence G.↗

High-Temperature Electronics: A Role for Wide Bandgap Semiconductors?

It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

Neudeck, Philip G.↗

Super Clean, Super Safe

The Supersonic Gas/Liquid Cleaning System (SS-GLCS) has applications ranging from cleaning circuit boards to scouring building exteriors. The system does not abrade the surface of the hardware being cleaned, and it requires much lower levels of pressure while using very little water. An alternative to CFC-based solvents, the system mixes air and water from separate pressurized tanks, ejecting the gas- liquid mixture at supersonic speeds from a series of nozzles at the end of a hand-held wand. The water droplets have the kinetic energy to forcibly remove the contaminant material. The system leaves very little fluid that must be handled as contaminated waste. It can be applied in the aerospace, automotive, and medical industries, as well as to circuit boards, electronics, machinery, metals, plastics, and optics. With a nozzle that can be oriented in any direction, the system is adjustable to allow all sides of a part to be cleaned without reorientation. It requires minimal training and is easily moved on built-in casters

Source record↗

Commercial Parts Technology Qualification Processes

Many high-reliability systems, including space systems, use selected commercial parts (including Plastic Encapsulated Microelectronics or PEMs) for unique functionality, small size, low weight, high mechanical shock resistance, and other factors. Predominantly this usage is subjected to certain 100% tests (typically called screens) and certain destructive tests usually (but not always) performed on the flight lot (typically called qualification tests). Frequently used approaches include those documented in EEE-INST-002 and JPL DocID62212 (which are sometimes modified by the particular aerospace space systems manufacturer). In this study, approaches from these documents and several space systems manufacturers are compared to approaches from a launch systems manufacturer (SpaceX), an implantable medical electronics manufacturer (Medtronics), and a high-reliability transport system process (automotive systems). In the conclusions section, these processes are outlined for all of these cases and presented in tabular form. Then some simple comparisons are made. In this introduction section, the PEM technology qualification process is described, as documented in EEE-INST-002 (written by the Goddard Space Flight Center, GSFC), as well as the somewhat modified approach employed at the Jet Propulsion Laboratory (JPL). Approaches used at several major NASA contractors are also described

Cooper, Mark S.↗

Electronics Manufacturer Provided With Testing and Evaluation Data Necessary to Obtain Additional Orders

A local electronics manufacturer, the Sterling Manufacturing Company, was presented with the opportunity to supply 30,000 automotive cellular antennas to a European subsidiary of a large U.S. auto manufacturer. Although the company built an antenna that they believed would meet the auto manufacturer's specifications, they were unable to conduct the necessary validation tests in-house. They decided to work with NASA Lewis Research Center's Space Electronics Division, which, as part of its technology development program, evaluates the performance of antennas in its Microwave Systems Lab to assess their capabilities for space communications applications. Data measured in Lewis' Microwave Systems Lab proved that Sterling's antenna performed better than specified by the auto manufacturer.

Source record↗

Advanced Gas Turbine (AGT) technology development

A 74.5 kW (100 hp) automotive gas turbine was evaluated. The engine structure, bearings, oil system, and electronics were demonstrated and no shaft dynamics or other vibration problem were encountered. Areas identified during the five tests are the scroll retention features, and transient thermal deflection of turbine backplates. Modifications were designed. Seroll retention is addressed by modifying the seal arrangement in front of the gasifier turbine assembly, which will increase the pressure load on the scroll in the forward direction and thereby increase the retention forces. the backplate thermal deflection is addressed by geometric changes and thermal insulation to reduce heat input. Combustor rig proof testing of two ceramic combustor assemblies was completed. The combustor was modified to incorporate slots and reduce sharp edges, which should reduce thermal stresses. The development work focused on techniques to sinter these barrier materials onto the ceramic rotors with successes for both material systems. Silicon carbide structural parts, including engine configuration gasifier rotors (ECRs), preliminary gasifier scroll parts, and gasifier and power turbine vanes are fabricated.

Source record↗

Self-correcting electronically scanned pressure sensor

A multiple channel high data rate pressure sensing device is disclosed for use in wind tunnels, spacecraft, airborne, process control, automotive, etc., pressure measurements. Data rates in excess of 100,000 measurements per second are offered with inaccuracies from temperature shifts less than 0.25% (nominal) of full scale over a temperature span of 55 C. The device consists of thirty-two solid state sensors, signal multiplexing electronics to electronically address each sensor, and digital electronic circuitry to automatically correct the inherent thermal shift errors of the pressure sensors and their associated electronics.

Gross, C.↗

GATE Center of Excellence in Innovative Drivetrains in Electric Automotive Technology Education (IDEATE) (Final Report)

The IDEATE project recognized that this is a critical point in history where advanced engineering solutions are required to propel the U.S. automotive industry irrevocably to the next level: the electrified drivetrain. The existing workforce is not sufficient to this task. It is imperative that automotive engineers with traditional backgrounds focused on internal-combustion and mechanical-drivetrain technologies be retrained with the most current advanced solutions in battery controls and vehicle power electronics. For the long-term success of the U.S. automakers, it is even more important that a future workforce be developed that has both broad and deep comprehension of the issues involved and the most advanced solutions known to these problems. Two campuses of the University of Colorado system joined forces to establish the GATE Center of Excellence in Innovative Drivetrains in Electric Automotive Technology Education (IDEATE). The University of Colorado Boulder (CU-Boulder) is widely regarded as having one of the top graduate programs in power electronics in the country; the University of Colorado Colorado Springs (UCCS) has unrivaled expertise in algorithms for automotive battery control. By collaborating, IDEATE built on our team’s proven strengths to develop innovative curricula and to initiate courses and programs that have provided (and continue to provide) students with a unique opportunity for holistic and specialty education in electric drivetrain technology (part-way through the project, we invited Utah State University to join the project, adding to our strength in power electronics for battery application).

42 ENGINEERING↗

Performance Evaluation of an Automotive-Grade, High Speed Gate Driver for SiC FETs, Type UCC27531, Over a Wide Temperature Range

Silicon carbide (SiC) devices are becoming widely used in electronic power circuits as replacement for conventional silicon parts due to their attractive properties that include low on-state resistance, high temperature tolerance, and high frequency operation. These attributes have a significant impact by reducing system weight, saving board space, and conserving power. In this work, the performance of an automotive-grade high speed gate driver with potential use in controlling SiC FETs (field-Effect Transistors) in converters or motor control applications was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Transistor Gate Drive↗