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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
DOE OSTI2014

Shielding design for a chip irradiation test facility at SNS - Paper 119

As digital and analog circuits are more and more sophisticatedly integrated, they become increasingly susceptible to single event upsets (SEU), a cause of electronic equipment malfunction induced by cosmic rays with particular hazard potential for aviation equipment. Electronic chips sensitive to SEU have to be tested in a simulated comic ray environment to ensure their reliability. It is found that the spallation induced fast neutron spectrum is very close to the neutron spectrum of the cosmic ray. Hence, a conceptual design study of a chip irradiation test facility is funded by FAA to be carried out at SNS, the world's most powerful accelerator driven facility for neutron scattering studies on materials. Compared to existing/being construct chip irradiation test facilities at LANL and ISIS, SNS can provide wider neutron energy range and much higher fluxes. This study focuses on the aspect of shielding design for such a chip irradiation facility. A number of medium-weighted and heavy materials were examined for efficiency in reducing radiation dose rate. In general, the smaller the target monolith is while satisfying the personnel-protection-driven radiation dose rate limit at its outside, the closer to the target chips could be placed and thus less beam power it demands to satisfy a given irradiation flux requirement. Before proceed to the shielding design, the neutron source coming off the target has to be determined for selecting a best spot for chip irradiation test, in which the incoming fast neutron spectrum approximate most to the atmospheric radiation condition. It also provides a source term for the following shielding design of the irradiation enclosure. (authors)

36 MATERIALS SCIENCE↗
DOE OSTI2022

An optimized ChIP-Seq framework for profiling histone modifications in Chromochloris zofingiensis

The eukaryotic green alga Chromochloris zofingiensis is a reference organism for studying carbon partitioning and a promising candidate for the production of biofuel precursors. Recent transcriptome profiling transformed our understanding of its biology and generally algal biology, but epigenetic regulation remains understudied and represents a fundamental gap in our understanding of algal gene expression. Chromatin immunoprecipitation followed by deep sequencing (ChIP-Seq) is a powerful tool for the discovery of such mechanisms, by identifying genome-wide histone modification patterns and transcription factor-binding sites alike. Here, we established a ChIP-Seq framework for Chr. zofingiensis yielding over 20 million high-quality reads per sample. The most critical steps in a ChIP experiment were optimized, including DNA shearing to obtain an average DNA fragment size of 250 bp and assessment of the recommended formaldehyde concentration for optimal DNA-protein cross-linking. We used this ChIP-Seq framework to generate a genome-wide map of the H3K4me3 distribution pattern and to integrate these data with matching RNA-Seq data. In line with observations from other organisms, H3K4me3 marks predominantly transcription start sites of genes. Our H3K4me3 ChIP-Seq data will pave the way for improved genome structural annotation in the emerging reference alga Chr. zofingiensis.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2018

Test results and prospects for RD53A, a large scale 65 nm CMOS chip for pixel readout at the HL-LHC

The CERN RD53 collaboration was founded to tackle the extraordinary challenges associated with the design of pixel readout chips for the innermost layers of particle trackers at future high energy physics experiments. Around 20 institutions are involved in the collaboration, which has the support of both ATLAS and CMS experiments. The goals of the collaboration include the comprehensive understanding of radiation effects in the 65 nm technology, the development of tools and methodology to efficiently design large complex mixed signal chips and, ultimately, the development of a full size readout chip featuring a 400 × 400 pixel array with 50μm pitch. In August 2017, the collaboration submitted the large scale chip RD53A, integrating a matrix of 400 × 192 pixels and embodying three different analog front-end designs. Here, this work discusses the characteristic of the RD53A chip, with some emphasis on the analog processors, and presents the first test results on the pixel array.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2021

System-on-Chip approach microwave diagnostics development for burning plasma

System-on-chip (SoC) millimeter wave integrated circuit technology has been developed and employed in chip heterodyne radiometers in Electron Cyclotron Emission Imaging (ECEI) and Microwave Imaging Reflectometer (MIR) on the DIII-D tokamak for 2D electron temperature and density fluctuation diagnostics. The W-band (75-110 GHz) ECEI system has been employed with 20 poloidal horn receiver modules with customized monolithic integrated circuit chips and internal local oscillator coupling path. The new SoC approach demonstrates > 30 dB additional gain on the receiver and 95% electronics noise suppression compared to the previous Schottky diode mixer array . An F-band (110-140 GHz) receiver chip has been developed to measure MHD and turbulence behavior on the DIII-D high-field side, such as Alfven eigenmodes. Furthermore, it can image pedestal structure evolution on fusion facilities with stronger magnetic fields, such as ASDEX-U, EAST, HL-2M, and LHD. The F-band chip performance has been tested in the laboratory. Also, V-band (55-75 GHz) transmitter and receiver modules (55-75 GHz) have been developed for DIII-D and NSTX-U Furthermore, microwave Imaging Reflectometer (MIR) application suitability for 2D density fluctuation imaging on the pedestal region.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2013

Integrated Power Chip Converter for Solid State Lighting (Final Report)

The overall goal of the project was to develop an integrated power converter chip for solid-state lighting. We developed a low component count circuit topology, fast and low loss switching devices, compact and low loss passive components, and integration methodology to enable an integrated LED driver, where cost, size and efficiency are paramount. The converter was designed to operate directly from ac line voltage, nominally providing 24 V output at 25 W with features of dimming and control for light uniformity. We developed a power circuit and control suitable for chip-scale integration, low loss and high frequency GaN power devices with a new vertical architecture that reduces parasitics and lowers cost by decreasing the chip real estate, and high-density passives, including a chip-scale flyback transformer that integrates inductor and transformer action into a single component.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2012

Control of a Bose-Einstein condensate on a chip by external optical and magnetic potentials

In this paper we explore the possibilities of control of a Bose-Einstein condensate on an atom chip by the use of potentials generated by photonic and magnetic components. We show that the fields produced by both types of components can be modelled by a generic exponential potential and derive analytic expressions that allow for an easy assessment of their impact on a trapped condensate. Using dynamical numerical simulations we study the transport of the condensate between the control structures on a chip. We study in detail different regimes of the condensate behaviour in an evanescent light potential generated by a photonic structure in the vicinity of the condensate and in magnetic potentials generated by a wire or a coil. The calculations are based on the reported parameters of atom chip setups and available photonic and magnetic components. Finally, the model is verified by an experiment with a condensate on an atom chip and a coil. - Highlights: Black-Right-Pointing-Pointer Generic potential used to describe both the optical evanescent and magnetic fields. Black-Right-Pointing-Pointer An analytic closed form solution found for the impact of a generic potential on a BEC. Black-Right-Pointing-Pointer BEC dynamics calculated for potential time sequences attainable in experiments. Black-Right-Pointing-Pointer Conditions for BEC transfer by an external field identified. Black-Right-Pointing-Pointer Exponential-potential model validated by a BEC-on-chip experiment.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2016

Changes in feedstock quality in willow chip piles created in winter from a commercial scale harvest

Storage and handling are important facets of biomass logistics because there are associated costs and biomass properties can change significantly as material proceeds through the supply chain. Thus, this aspect of biomass supply systems requires continued study. Shrub willow chips were harvested, and used to create six piles that each contained between 10 and 22 Mg (fresh biomass). Material was monitored for several months in temporary storage to assess changes in biomass quality (moisture, ash and energy content). Internal pile temperatures increased due to biological activity and conditions within a pile quickly differentiated based on location (shell, core, top, and side). Mean moisture content increased from 42 to 47% (mass fraction) between harvest and delivery of the chips, but ranged between 37 and over 60% over the next three months depending on pile location with the shell generally drier than the core. Mean ash content increased 1 to 2% points (mass fraction) between harvesting, reloading and delivery to the trial location, but became more variable during storage. Higher heating values (HHV) were stable between 18.6 and 19.0 MJ kg –1 over the six months, but lower heating values (LHV) ranged between 8.6 and 11.7 MJ kg –1 and mirrored changes in moisture content. There was minimal change in chip quality over two months, but quality became more variable over longer time periods. In conclusion, this period could be extended, and negative effects on chip quality could be mitigated, by improving storage methods, blending different types of chips, or employing pretreatments.

09 BIOMASS FUELS↗
DOE OSTI2020

RD53A: A large-scale prototype chip for the phase II upgrade in the serially powered HL-LHC pixel detectors

The phase II upgrade of the HL-LHC experiments within the LHC intends to deepen the studies of the Higgs boson and to allow the discovery of further particles by adding an integrated luminosity of about 4000 fb -1 over 10 years of operation. This upgrade would overwhelm the installed pixel detector readout chips with higher hit rates and radiation levels than ever before. To match these extreme requirements the RD53 collaboration, a joint effort between ATLAS and CMS, developed RD53A, a new generation pixel detector readout chip prototype manufactured in a 65 nm CMOS technology. It is half the size of the final pixel chips and designed to meet requirements in the face of 3 GHz/cm 2 hit rate after irradiation to 500 Mrad. The detector is able to use 50×50 μm 2 or 25×100 μm 2 pixels with high readout speed of up to 4 links per chip with 1.28 Gbit/s each. Shunt–LDO regulators integrated on the bottom of the chip provide the required voltages to the two power domains, analog and digital. These regulators enable serial powering of the pixel modules, which is the only feasible, radiation hard scheme to ensure acceptable power cable losses and to stay within the material budget for the future pixel detectors. Finally, an overview of the status and challenges of serial powering and the Shunt–LDO regulator development will be given.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2021

Plug-and-play polymer microfluidic chips for hydrated, room temperature, fixed-target serial crystallography

The practice of serial X-ray crystallography (SX) depends on efficient, continuous delivery of hydrated protein crystals while minimizing background scattering. Of the two major types of sample delivery devices, fixed-target devices offer several advantages over widely adopted jet injectors, including: lower sample consumption, clog-free delivery, and the ability to control on-chip crystal density to improve hit rates. In this study we present our development of versatile, inexpensive, and robust polymer microfluidic chips for routine and reliable room temperature serial measurements at both synchrotrons and X-ray free electron lasers (XFELs). Our design includes highly X-ray-transparent enclosing thin film layers tuned to minimize scatter background, adaptable sample flow layers tuned to match crystal size, and a large sample area compatible with both raster scanning and rotation based serial data collection. The optically transparent chips can be used both for in situ protein crystallization (to eliminate crystal handling) or crystal slurry loading, with prepared samples stable for weeks in a humidified environment and for several hours in ambient conditions. Serial oscillation crystallography, using a multi-crystal rotational data collection approach, at a microfocus synchrotron beamline (SSRL, beamline 12-1) was used to benchmark the performance of the chips. Furthermore, high-resolution structures (1.3–2.7 Å) were collected from five different proteins – hen egg white lysozyme, thaumatin, bovine liver catalase, concanavalin-A (type VI), and SARS-CoV-2 nonstructural protein NSP5. Overall, our modular fabrication approach enables precise control over the cross-section of materials in the X-ray beam path and facilitates chip adaption to different sample and beamline requirements for user-friendly, straightforward diffraction measurements at room temperature.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2014

Atom chip apparatus for experiments with ultracold rubidium and potassium gases

We present a dual chamber atom chip apparatus for generating ultracold {sup 87}Rb and {sup 39}K atomic gases. The apparatus produces quasi-pure Bose-Einstein condensates of 10{sup 4} {sup 87}Rb atoms in an atom chip trap that features a dimple and good optical access. We have also demonstrated production of ultracold {sup 39}K and subsequent loading into the chip trap. We describe the details of the dual chamber vacuum system, the cooling lasers, the magnetic trap, the multicoil magnetic transport system, the atom chip, and two optical dipole traps. Due in part to the use of light-induced atom desorption, the laser cooling chamber features a sufficiently good vacuum to also support optical dipole trap-based experiments. The apparatus is well suited for studies of atom-surface forces, quantum pumping and transport experiments, atom interferometry, novel chip-based traps, and studies of one-dimensional many-body systems.

74 ATOMIC AND MOLECULAR PHYSICS↗
DOE OSTI2014

Magnetic-film atom chip with 10 μm period lattices of microtraps for quantum information science with Rydberg atoms

We describe the fabrication and construction of a setup for creating lattices of magnetic microtraps for ultracold atoms on an atom chip. The lattice is defined by lithographic patterning of a permanent magnetic film. Patterned magnetic-film atom chips enable a large variety of trapping geometries over a wide range of length scales. We demonstrate an atom chip with a lattice constant of 10 μm, suitable for experiments in quantum information science employing the interaction between atoms in highly excited Rydberg energy levels. The active trapping region contains lattice regions with square and hexagonal symmetry, with the two regions joined at an interface. A structure of macroscopic wires, cutout of a silver foil, was mounted under the atom chip in order to load ultracold {sup 87}Rb atoms into the microtraps. We demonstrate loading of atoms into the square and hexagonal lattice sections simultaneously and show resolved imaging of individual lattice sites. Magnetic-film lattices on atom chips provide a versatile platform for experiments with ultracold atoms, in particular for quantum information science and quantum simulation.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2022

A radiation tolerant clock generator for the CMS endcap timing layer readout chip

Here, we present the test results of a low jitter Phase Locked Loop (PLL) prototype chip for the CMS Endcap Timing Layer readout chip (ETROC). This chip is based on the improved version of a clock synthesis circuit named ljCDR from the Low Power Gigabit Transceiver (lpGBT) project. The ljCDR is tested in its PLL mode. An automatic frequency calibration (AFC) block with the Triple Modular Redundancy (TMR) register is developed for the LC-oscillator calibration. The chip was manufactured in a 65 nm CMOS process with 10 metal layers. The chip has been extensively tested, including Total Ionizing Dose (TID) testing up to 300 Mrad and Single Event Upset (SEU) testing with heavy ions possessing a Linear Energy Transfer (LET) from 1.3 to 62.5 MeV × cm 2 /mg.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2025

Testing the limits of ITkPixV2: the ATLAS inner tracker pixel detector readout chip

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of 5 × 1034 cm-1 s-1, ITkPixV2 must meet significant increases in nearly all design requirements compared to the current ATLAS Inner Detector (ID), including a 10× increase in trigger rate, a 7.5× increase in hit rate, a 3× increase in radiation tolerance, and a 12.5× decrease in pixel current draw per unit area, all while maintaining a similar power per unit area as present pixel detectors. Here we present the first measurements of the ITkPixV2 chip operated at the limits of the full chip design requirements, including in particular a measurement of the activity-induced current of the chip as a function of increasing hit rate.

Le Pottier, L↗
DOE OSTI2023

A user-friendly plug-and-play cyclic olefin copolymer-based microfluidic chip for room-temperature, fixed-target serial crystallography

Over the past two decades, serial X-ray crystallography has enabled the structure determination of a wide range of proteins. With the advent of X-ray free-electron lasers (XFELs), ever-smaller crystals have yielded high-resolution diffraction and structure determination. A crucial need to continue advancement is the efficient delivery of fragile and micrometre-sized crystals to the X-ray beam intersection. This paper presents an improved design of an all-polymer microfluidic `chip' for room-temperature fixed-target serial crystallography that can be tailored to broadly meet the needs of users at either synchrotron or XFEL light sources. The chips are designed to be customized around different types of crystals and offer users a friendly, quick, convenient, ultra-low-cost and robust sample-delivery platform. Compared with the previous iteration of the chip [Gilbile et al. (2021), Lab Chip , 21 , 4831–4845], the new design eliminates cleanroom fabrication. It has a larger imaging area to volume, while maintaining crystal hydration stability for both in situ crystallization or direct crystal slurry loading. Crystals of two model proteins, lysozyme and thaumatin, were used to validate the effectiveness of the design at both synchrotron (lysozyme and thaumatin) and XFEL (lysozyme only) facilities, yielding complete data sets with resolutions of 1.42, 1.48 and 1.70 Å, respectively. Overall, the improved chip design, ease of fabrication and high modifiability create a powerful, all-around sample-delivery tool that structural biologists can quickly adopt, especially in cases of limited sample volume and small, fragile crystals.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2014

SU-E-T-108: Development of a Novel Clinical Neutron Dose Monitor for Proton Therapy Based On Twin TLD500 Chips in a Small PE Moderator

Purpose: In proton therapy, it could be desirable to measure out-of-field fast neutron doses at critical locations near and outside the patient body. Methods: The working principle of a novel clinical neutron dose monitor is verified by MCNPX simulation. The device is based on a small PE moderator of just 5.5cm side length for easy handling covered with a thermal neutron suppression layer. In the simulation, a polystyrene phantom is bombarded with a standard proton beam. The secondary thermal neutron flux produced inside the moderator by the impinging fast neutrons from the treatment volume is estimated by pairs of α-Al2O3:C (TLD500) chips which are evaluated offline after the treatment either by TL or OSL methods. The first chip is wrapped with 0.5mm natural Gadolinium foil converting the thermal neutrons to gammas via (n,γ) reaction. The second chip is wrapped with a dummy material. The chip centers have a distance of 2cm from each other. Results: The simulation shows that the difference of gamma doses in the TLD500 chips is correlated to the mean fast neutron dose delivered to the moderator material. Different outer shielding materials have been studied. 0.5mm Cadmium shielding is preferred for cost reasons and convenience. Replacement of PE moderator material by other materials like lead or iron at any place is unfavorable. The spatial orientation of the moderator cube is uncritical. Using variance reduction techniques like splitting/Russian roulette, the TLD500 gamma dose simulation give positive differences up to distances of 0.5m from the treatment volume. Conclusion: Applicability and basic layout of a novel clinical neutron dose monitor are demonstrated. The monitor measures PE neutron doses at locations outside the patient body up to distances of 0.5m from the treatment volume. Tissue neutron doses may be calculated using neutron kerma factors.

07 ISOTOPE AND RADIATION SOURCES↗
DOE OSTI2019

High-Voltage AlInGaN LED Chips

A high-voltage light-emitting diode (LED) flip chip based on an AlInGaN heterostructure is developed and fabricated. The LED flip chip consists of 16 elements connected in series, each of which is a convential LED. The chip with a total area of 1.25 × 1.25 mm is intended for a working current of 20 mA and a forward voltage of 48 V. To improve the current-distribution uniformity over the active region of the chip elements and to minimize the losses of the element area occupied by the n-type contact, the n-type contact pads in them are arranged inside the p-type contact region due to the two-level metallization layout with an intermediate insulating layer of dielectric. The arrangement topology of the contact pads is developed using numerical simulation. An increase in the quantum efficiency of the chip is provided by the application of combinations of metals with a high reflectance at the LED emission wavelength, which are used when fabricating n- and p-type contacts as well as current-carrying strips.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2025

Simultaneous on-chip generation of violet, blue, cyan, green, yellow, orange, and red light from an octave-spanning infrared frequency comb

An integrated, multi-spectral visible-light source could significantly benefit technologies such as displays, medical imaging, spectroscopy, visible-light communications, and astrophysics. However, despite recent advances in chip-scale visible lasers, simultaneously generating light of all colors in a single chip has been challenging. Existing solutions are either not suitable for full chip-scale integration, or are fundamentally difficult to scale. Here we demonstrate the simultaneous on-chip generation of infrared, red, orange, yellow, green, cyan, blue, and violet light. Leveraging the low loss, low dispersion, and high density of modes of an adiabatic multimode silicon nitride (SiN) microresonator, we use a single infrared pump of moderate power (~130 mW) to produce an octave-spanning infrared frequency comb that is then converted to different portions of the visible spectrum. We measure non-mode-locked combs and soliton steps corresponding to mode-locked states, making our comb generator suitable for applications that demand either low or high coherence. Since the required pump power is compatible with high-power lasers demonstrated in the same SiN platform, our multi-octave light generator can be fully integrated in a chip-scale form factor. We envision that such a light source will be a catalyst for the development and deployment of miniaturized multi-spectral technologies for quantum systems, medical imaging, displays, and spectroscopy.

47 OTHER INSTRUMENTATION↗
DOE OSTI2018

Dynamic Aspects of Chip Formation

A multimass chain model of chip formation in the secondary deformation zone is proposed. The influence of the frictional conditions and cutting conditions on the group motion of the chip elements over the cutter’s front surface is shown. The dynamics of the motion of the chip’s free end has a significant influence on its fracture. In particular, the mass ratio of the last elements involved in the group motion (and positioned on the contact line at the cutter’s front surface) and the free end of the chip gives rise to considerable dynamic splitting forces between the elements. The proposed approach offers broad scope for analysis of the conditions of chip formation, including conditions with intensification of the cutting process by electrical pulses.

36 MATERIALS SCIENCE↗