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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

Creep behavior of copper at intermediate temperatures. II - Surface microstructural observations. III - A comparison with theory

Three different types of microstructural slip features are noted to occur during the creep of Cu at 0.46-0.72 of absolute melting point. While single slip is associated with higher temperatures and lower stresses, complex wavy slip features are observed at higher temperatures and higher stresses as well as with increasing strains: suggesting the importance of cross-slip mechanisms. At lower temperatures and higher stresses the multiple-slip morphologies observed indicate that cross-slip mechanisms may control the creep of polycrystalline Cu only over a limited stress and temperature range. A phenomenological model is proposed which assumes that (1) cell boundaries within subgrains act as both sources of, and obstacles to, gliding dislocations, and (2) dislocation annihilation occurs at the cell boundaries by climb and cross-slip.

Raj, S. V.↗
NASA NTRS1992

Lightweight bipolar storage battery

An apparatus [10] is disclosed for a lightweight bipolar battery of the end-plate cell stack design. Current flow through a bipolar cell stack [12] is collected by a pair of copper end-plates [16a,16b] and transferred edgewise out of the battery by a pair of lightweight, low resistance copper terminals [28a,28b]. The copper terminals parallel the surface of a corresponding copper end-plate [16a,16b] to maximize battery throughput. The bipolar cell stack [12], copper end-plates [16a,16b] and copper terminals [28a,28b] are rigidly sandwiched between a pair of nonconductive rigid end-plates [20] having a lightweight fiber honeycomb core which eliminates distortion of individual plates within the bipolar cell stack due to internal pressures. Insulating foam [30] is injected into the fiber honeycomb core to reduce heat transfer into and out of the bipolar cell stack and to maintain uniform cell performance. A sealed battery enclosure [ 22] exposes a pair of terminal ends [26a,26b] for connection with an external circuit.

Rowlette, John J.↗
NASA NTRS2010

Improved Cloud Condensation Nucleus Spectrometer

An improved thermal-gradient cloud condensation nucleus spectrometer (CCNS) has been designed to provide several enhancements over prior thermal- gradient counters, including fast response and high-sensitivity detection covering a wide range of supersaturations. CCNSs are used in laboratory research on the relationships among aerosols, supersaturation of air, and the formation of clouds. The operational characteristics of prior counters are such that it takes long times to determine aerosol critical supersaturations. Hence, there is a need for a CCNS capable of rapid scanning through a wide range of supersaturations. The present improved CCNS satisfies this need. The improved thermal-gradient CCNS (see Figure 1) incorporates the following notable features: a) The main chamber is bounded on the top and bottom by parallel thick copper plates, which are joined by a thermally conductive vertical wall on one side and a thermally nonconductive wall on the opposite side. b) To establish a temperature gradient needed to establish a supersaturation gradient, water at two different regulated temperatures is pumped through tubes along the edges of the copper plates at the thermally-nonconductive-wall side. Figure 2 presents an example of temperature and supersaturation gradients for one combination of regulated temperatures at the thermally-nonconductive-wall edges of the copper plates. c) To enable measurement of the temperature gradient, ten thermocouples are cemented to the external surfaces of the copper plates (five on the top plate and five on the bottom plate), spaced at equal intervals along the width axis of the main chamber near the outlet end. d) Pieces of filter paper or cotton felt are cemented onto the interior surfaces of the copper plates and, prior to each experimental run, are saturated with water to establish a supersaturation field inside the main chamber. e) A flow of monodisperse aerosol and a dilution flow of humid air are introduced into the main chamber at the inlet end. The inlet assembly is designed to offer improved (relative to prior such assemblies) laminar-flow performance within the main chamber. Dry aerosols are subjected to activation and growth in the supersaturation field. f) After aerosol activation, at the outlet end of the main chamber, a polished stainless-steel probe is used to sample droplets into a laser particle counter. The probe features an improved design for efficient sampling. The counter has six channels with size bins in the range of 0.5- to 5.0-micron diameter. g) To enable efficient sampling, the probe is scanned along the width axis of the main chamber (thereby effecting scanning along the temperature gradient and thereby, further, effecting scanning along the supersaturation gradient) by means of a computer-controlled translation stage.

Leu, Ming-Taun↗
NASA NTRS1978

Energy distributions of sputtered copper neutrals and ions

Direct quantitative analysis of surfaces by secondary ion mass spectrometry will depend on an understanding of the yield ratio of ions to neutrals. This ratio as a function of the energy of the sputtered particles has been obtained for a clean polycrystalline copper surface sputtered by 1000-3000 eV Ar(+). The energy distributions of both neutral and ionized copper were measured with a retarding potential analyzer using potential modulation differentiation and signal averaging. The maximum for both distributions is identical and occurs near 2.5 eV. The energy distributions of neutrals is more sharply peaked than that of the ions, presumably as a consequence of more efficient nutralization of slow escaping ions by the mobile electrons of copper. The ion-neutral ratio is compared with results from various ionization models.

Lundquist, T. R.↗
NASA NTRS2005

Spray Cooling Trajectory Angle Impact Upon Heat Flux Using a Straight Finned Enhanced Surface

Experiments were conducted to study the effects of spray trajectory angles upon heat flux for flat and enhanced surface spray cooling. The surface enhancement consisted of straight fins machined on the top surface of a copper heater block. Spray cooling curves were obtained with the straight fin surface aligned both parallel (axial) and perpendicular (transverse) to the spray axis. Measurements were also obtained on a flat surface heater block for comparison purposes. Each copper block had a cross-sectional area of 2.0 sq cm. A 2x2 nozzle array was used with PF-5060 as the working fluid. Thermal performance data was obtained under nominally degassed (chamber pressure of 41.4 kPa) conditions. Results show that the maximum CHF in all cases was attained for a trajectory angle of 30' from the surface normal. Furthermore, trajectory angles applied to straight finned surfaces can have a critical heat flux (CHF) enhancement as much as 75% (heat flux value of 140 W/sq cm) relative to the vertical spray orientation for the analogous flat surface case under nominally degassed conditions.

Silk, Eric A.↗
NASA NTRS1978

Shear strength of metal - SiO2 contacts

The strength of the bond between metals and SiO2 was studied by measuring the static coefficient of friction of metals contacting alpha-quartz in ultrahigh vacuum. It was found that copper with either chemisorbed oxygen, nitrogen, or sulphur exhibited higher contact strength on stoichiometric SiO2 than did clean copper. Since the surface density of states induced by these species on copper is similar, it appears that the strength of the interfacial bond can be related to the density of states on the metal surface.

Pepper, S. V.↗
NASA NTRS1978

Shear strength of metal - SiO2 contacts

The strength of the bond between metals and SiO2 is studied by measuring the static coefficient of friction of metals contacting alpha-quartz in ultrahigh vacuum. It was found that copper with either chemisorbed oxygen, nitrogen or sulphur exhibited higher contact strength on stoichiometric SiO2 than did clean copper. Since the surface density of states induced by these species on copper is similar, it appears that the strength of the interfacial bond can be related to the density of states on the metal surface.

Pepper, S. V.↗
NASA NTRS1967

High-strength braze joints between copper and steel

High-strength braze joints between copper and steel are produced by plating the faying surface of the copper with a layer of gold. This reduces porosity in the braze area and strengthens the resultant joint.

Kuhn, R. F.↗
NASA NTRS1961

Effect of Surface Preparation and Gas Flow on Nitrogen Atom Surface Recombination

The effects of surface preparation and gas flow on the recombination of nitrogen atoms at copper and platinum surfaces were determined. Atoms were generated by an electrodeless 2450-megacycle-per-second discharge, and their concentration was measured by gas-phase titration with nitric oxide. Test surfaces were either vacuum-evaporated films or spheres machined from bulk metal and cemented around small glass-bead thermistors. Heat released by recombination was measured as the difference in electrical energy required to maintain a given thermistor temperature with and without a catalytic surface exposed. Recombination coefficients measured at flow velocities of 1120, 1790, 2250, and 3460 centimeters per second and at pressures of 0.42 and 0.59 millimeter of mercury showed that flow conditions had no effect. The results were also independent of atom concentration. A rough indication of the temperature dependence was obtained; it was greater for copper than for platinum. Platinum films deposited on platinum or on glass had the same activity - about 3 percent of the atoms impinging recombined. With copper, however, the glass substrate greatly reduced the percent of atoms recombining over that of a bulk copper substrate where 4 percent of the impinging atoms recombined. This effect could be overcome by depositing a second film on top of the first. Bulk metal samples were subjected to various surface treatments including polishing, degreasing with a chlorinated hydrocarbon, washing with nitric acid, and rinsing with water. Polished, degreased platinum had low activity compared to an evaporated film, but nitric acid treatment made it equivalent. Polished, degreased copper was only slightly less active than a copper film; nitric acid etching decreased the activity still further, probably by preferentially exposing facets of low catalytic efficiency.

Prok, George M.↗
NASA NTRS1984

Effect of barrier height on friction behavior of the semiconductors silicon and gallium arsenide in contact with pure metals

Friction experiments were conducted for the semiconductors silicon and gallium arsenide in contact with pure metals. Polycrystalline titanium, tantalum, nickel, palladium, and platinum were made to contact a single crystal silicon (111) surface. Indium, nickel, copper, and silver were made to contact a single crystal gallium arsenide (100) surface. Sliding was conducted both in room air and in a vacuum of 10 to the minus 9th power torr. The friction of semiconductors in contact with metals depended on a Schottky barrier height formed at the metal semiconductor interface. Metals with a higher barrier height on semiconductors gave lower friction. The effect of the barrier height on friction behavior for argon sputtered cleaned surfaces in vacuum was more specific than that for the surfaces containing films in room air. With a silicon surface sliding on titanium, many silicon particles back transferred. In contrast, a large quantity of indium transferred to the gallium arsenide surface.

Mishina, H.↗
NASA NTRS2005

Angular Distribution of Elastically Scattered Electrons Determined and Its Effect on Collector Performance Computed

It has been demonstrated that the suppression of secondary electron emission significantly improves the performance of electron beam collectors (ref. 1). However, a complete analysis of the effects of secondary electron emission with respect to collector performance has not been possible because of the lack of quantitative data on angular distributions of secondary electrons. Secondary electrons are emitted with energies ranging from near zero to the energy of the incident primary. For our purposes, we define elastically scattered electrons as secondary electrons within 20 percent of the incident energy. Elastically scattered electrons are of great concern because their energy allows them to follow trajectories that can carry them almost anywhere within the vacuum envelope. If these secondaries leave the collector and reenter the slow wave circuit, they can produce undesired signal distortion and oscillation.This apparatus, which was built by Krainsky (ref. 2), was used at the NASA Lewis Research Center to obtain detailed measurements of the angular distributions of elastically scattered secondaries. Data were obtained for three surfaces of significant interest to collector applications: highly polished copper, copper roughened by ion sputtering, and isotropic graphite. Lewis researchers discovered that elastically scattered electrons have a complex angular distribution that is strongly dependent on the atomic number and surface morphology of the target material, as well as the energy and angle of incidence of the primary beam. At low energies, secondary emission from polished copper in the chosen energy range is primarily directed back to the source of primary electrons (backscattering). Forward scattering increases with primary energy until, at high energies, forward scattering dominates the angular distribution. Although back-scattered secondaries dominate the distributions of the textured copper surface, the yield is substantially lower. From the standpoint of secondary emission, isotropic graphite is the most attractive material because it exhibits low yield and little back scattering.

Krainsky, Isay L.↗
NASA NTRS1990

A dynamic technique for measuring surface tension at high temperatures in microgravity environment

The feasibility of a dynamic technique for measuring surface tension of liquid metals at high temperatures in a microgravity environment was demonstrated. The basic method involves heating a tubular specimen resistively from ambient temperature through its melting point in about 1 sec by passing an electrical current pulse through it, while simultaneously recording the pertinent experimental quantities. Static equilibrium for the molten specimen is achieved in a microgravity environment by splitting the current after it passes through the specimen tube and returning a fraction along the tube axis, and the remaining fraction outside the specimen. Adjustments to the current split enable a balance between the magnetic and surface tension forces acting on the specimen. Values for surface tension are determined from measurements of the equilibrium dimensions of the molten specimen tube, and the magnitudes of the currents. Rapid melting experiments, performed during microgravity simulations with the NASA KC-135 aircraft, yield a value for the surface tension of copper at its melting point which is in agreement with literature data. Measurements of surface tension of a refractory metal (tantalum) are underway.

Miiller, A. P.↗
NASA NTRS1985

Preventing Fires in Cryogenic Oxidizer Lines

Friction and compression induced ignition prevented by heat-dissipation layer. Thin layer of copper placed inside surfaces of pipes and other parts in contact with flowing liquid oxygen, fluorine, or other oxidizers. Copper layer of only 0.001 to 0.005 inch (0.0254 to 0.127 mm) ensures heat away from hotspots thereby discouraging ignition. Copper layer increases oxygen ignition threshold of pipe by 5 to 20 times.

Wagner, W. R.↗
NASA NTRS1981

Single pass rub phenomena - Analysis and experiment

An experimental and analytical investigation is presented of contact phenomena for the case of a fully-dense copper gas path seal segment which is rubbed by a single steel blade tip at room temperature. The experiments were executed on a pendulum-type test device, with forces, rub energy, surface temperature and residual deformation being determined for each single-path rub test. The thermal and mechanical factors influencing single-pass rub surface temperatures were modeled analytically. It is found that large plastic strains occurred on or near the contact surface of the copper rub specimens. A study of the influence of various material properties on surface temperature showed that increased thermal conductivity of the stationary component played a role in lowering contact temperatures. Increased thermal conductivity of the moving blade tip component and increased thermal diffusivity of the stationary material also had a beneficial effect.

Kennedy, F. E.↗
NASA NTRS1973

Role of plastic deformation in wear of copper and copper - 10-percent-aluminum alloy in cryogenic fuels

High-purity copper specimens and a copper-aluminum (10%) alloy specimen were subjected to sliding against Type 440 C in cryogenic fuel environments. It was found that virtually all wear occurred by the plastic deformation of a recrystallized layer extending to about 10 micrometers below the wear scar surface of the copper or copper alloy. The wear debris was in the form of a layered structure adhering to the exit region of the wear scar. Measurements on the high purity copper specimens indicated that the wear rate was proportional to the applied load and to the sliding velocity squared. A physical model of the wear process is proposed to account for these observations.

Bill, R. C.↗