Multihorizon Model Predictive Control: An Application to Integrated Power and Thermal Management of Connected Hybrid Electric Vehicles
Not provided.
Automation & Control Systems↗
SEARCH · Search NASA
Results for “electrical connectivity”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Back-illuminated imager and method for making electrical and optical connections to same
Methods for bringing or exposing metal pads or traces to the backside of a backside-illuminated imager allow the pads or traces to reside on the illumination side for electrical connection. These methods provide a solution to a key packaging problem for backside thinned imagers. The methods also provide alignment marks for integrating color filters and microlenses to the imager pixels residing on the frontside of the wafer, enabling high performance multispectral and high sensitivity imagers, including those with extremely small pixel pitch. In addition, the methods incorporate a passivation layer for protection of devices against external contamination, and allow interface trap density reduction via thermal annealing. Backside-illuminated imagers with illumination side electrical connections are also disclosed.
Pain, Bedabrata↗
Functionally graded thermal vias for inductor winding heat flow control
Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.
Dede, Ercan↗
Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly
A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.
Takken, Todd E.↗
Mounting Thin Samples For Electrical Measurements
New method for mounting thin sample for electrical measurements involves use of vacuum chuck to hold a ceramic mounting plate, which holds sample. Contacts on mounting plate establish electrical connection to sample. Used to make electrical measurements over temperature range from 77 to 1,000 K and does not introduce distortions into magnetic field during Hall measurements.
Matus, L. G.↗
A Review of Distributed Electric Propulsion Concepts for Air Vehicle Technology
The emergence of distributed electric propulsion (DEP) concepts for aircraft systems has enabled new capabilities in the overall efficiency, capabilities, and robustness of future air vehicles. Distributed electric propulsion systems feature the novel approach of utilizing electrically-driven propulsors which are only connected electrically to energy sources or power-generating devices. As a result, propulsors can be placed, sized, and operated with greater flexibility to leverage the synergistic benefits of aero-propulsive coupling and provide improved performance over more traditional designs. A number of conventional aircraft concepts that utilize distributed electric propulsion have been developed, along with various short and vertical takeoff and landing platforms. Careful integration of electrically-driven propulsors for boundary-layer ingestion can allow for improved propulsive efficiency and wake-filling benefits. The placement and configuration of propulsors can also be used to mitigate the trailing vortex system of a lifting surface or leverage increases in dynamic pressure across blown surfaces for increased lift performance. Additionally, the thrust stream of distributed electric propulsors can be utilized to enable new capabilities in vehicle control, including reducing requirements for traditional control surfaces and increasing tolerance of the vehicle control system to engine-out or propulsor-out scenarios. If one or more turboelectric generators and multiple electric fans are used, the increased effective bypass ratio of the whole propulsion system can also enable lower community noise during takeoff and landing segments of flight and higher propulsive efficiency at all conditions. Furthermore, the small propulsors of a DEP system can be installed to leverage an acoustic shielding effect by the airframe, which can further reduce noise signatures. The rapid growth in flight-weight electrical systems and power architectures has provided new enabling technologies for future DEP concepts, which provide flexible operational capabilities far beyond those of current systems. While a number of integration challenges exist, DEP is a disruptive concept that can lead to unprecedented improvements in future aircraft designs.
electric propulsion↗
Methods of preparing a safety battery
The present invention relates, in part, to methods of preparing a safety battery. Methods can include dispensing a safety ink formulation between the two poles of a battery. Upon exposure to moisture, the formulation provides an electrical connection between two poles, thus minimizing electrical discharge and/or reducing the formation of electrochemically generated ions at the pole(s).
Kaehr, Bryan James↗
Reliability and Forensic Evaluation of Connectors and Connectivity
The National Laboratory of the Rockies (NLR) has a long history of studying the outdoor reliability of electrical connectivity components, including connectors, cables, wire harnesses, and fuses.
14 SOLAR ENERGY↗
Power connect safety and connection interlock
A power connect safety and connection interlock system is shown for use with inverters and other DC loads (16) which include capacitor filter banks (14) at their DC inputs. A safety circuit (20) operates a spring (26) biased, solenoid (22) driven mechanical connection interference (24) which prevents mating and therefore electrical connection between the power contactor halves (11, 13) of the main power contacts (12) until the capacitor bank is safely precharged through auxiliary contacts (18). When the DC load (16) is shut down, the capacitor bank (14) is automatically discharged through a discharging power resistor (66) by a MOSFET transistor (60) through a discharging power resistor (66) only when both the main power contacts and auxiliary contacts are disconnected.
Rippel, Wally E.↗
Making a Back-Illuminated Imager with Back-Side Contact and Alignment Markers
A design modification and a fabrication process that implements the modification have been conceived to solve two problems encountered in the development of back-illuminated, back-sidethinned complementary metal oxide/ semiconductor (CMOS) image-detector integrated circuits. The two problems are (1) how to form metal electrical-contact pads on the back side that are electrically connected through the thickness in proper alignment with electrical contact points on the front side and (2) how to provide alignment keys on the back side to ensure proper registration of backside optical components (e.g., microlenses and/or color filters) with the front-side pixel pattern. The essence of the design modification is to add metal plugs that extend from the desired front-side locations through the thickness and protrude from the back side of the substrate. The plugs afford the required front-to-back electrical conduction, and the protrusions of the plugs serve as both the alignment keys and the bases upon which the back-side electrical-contact pads can be formed.
Pain, Bedabrata↗
Climate Impact on CO2 Capture Efficiency and Levelized Cost of Liquid solvent-based DAC (Direct Air Capture) System
The transition towards net-zero emission poses economic, technical, and political challenges for the commercial-scale deployment of CO2 removal technologies by 2050. The opportunities for large-scale deployment will largely depend on the distinctive conditions found in the different locations of the world such as energy cost, carbon intensity of energy source, construction, transportation, and weather conditions. In this work, we focus on one of the promising negative emission technology, DAC (Direct Air Capture), and its response to different weather conditions. This work presents two potential operation scenarios: (i) natural gas standalone, (ii) grid electricity connected DAC plant. For the first time, we investigated the influence of temperature and RH (relative humidity) of the air on liquid-based DAC system and its response to carbon capture efficiency and levelized cost of carbon capture with operational sensitivity analysis. It is observed that the overall energy demand decreases from 11.1 to 8.3 GJ/ton-CO2 as the CO2 capture rate increases from 40 to 85%. We observed that a CO2 capture rate of 75% is only possible above 17°C even at 90% RH and this drops tremendously at lower temperatures. It is also observed that water evaporation in the air contactor is highest at dry and low RH as expected. The sensitivity analysis showed that weather conditions are insensitive to CO2 capture efficiency for the liquid-solvent based DAC plant for both scenarios. In addition, higher CO2 capture efficiency is achievable from lower upstream methane emissions and carbon intensity of grid electricity (for grid-connected scenario). Lastly, the levelized cost of natural gas standalone scenario varies from 239.7 to 408.8 $/t-CO2 is sensitive to temperature conditions more than relative humidity and compared to electricity grid-connected scenario, from 265.3 to 440.1 $/t-CO2.
An, Keju↗
Test Adapter For Infrared Detectors
Convenient fixture for testing infrared detector integrated circuits, such as those used in surveying sensors, optical communications, receivers, optical power meters, and noncontacting thermometers. Includes electrical connections for 42-pin dual-in-line package (DIP), thermal connection to cryogenic probe, and optical filter. Using fixture, electrical and optical properties of detector measured at 4 K.
Campbell, Albert G.↗
Grid-Free 2D Plasma Simulations of the Complex Interaction Between the Solar Wind and Small, Near-Earth Asteroids
We present results from a new grid-free 2D plasma simulation code applied to a small, unmagnetized body immersed in the streaming solar wind plasma. The body was purposely modeled as an irregular shape in order to examine photoemission and solar wind plasma flow in high detail on the dayside, night-side, terminator and surface-depressed 'pocket' regions. Our objective is to examine the overall morphology of the various plasma interaction regions that form around a small body like a small near-Earth asteroid (NEA). We find that the object obstructs the solar wind flow and creates a trailing wake region downstream, which involves the interplay between surface charging and ambipolar plasma expansion. Photoemission is modeled as a steady outflow of electrons from illuminated portions of the surface, and under direct illumination the surface forms a non-monotonic or ''double-sheath'' electric potential upstream of the body, which is important for understanding trajectories and equilibria of lofted dust grains in the presence of a complex asteroid geometry. The largest electric fields are found at the terminators, where ambipolar plasma expansion in the body-sized night-side wake merges seamlessly with the thin photoelectric sheath on the dayside. The pocket regions are found to be especially complex, with nearby sunlit regions of positive potential electrically connected to unlit negative potentials and forming adjacent natural electric dipoles. For objects near the surface, we find electrical dissipation times (through collection of local environmental solar wind currents) that vary over at least 5 orders of magnitude: from 39 Micro(s) inside the near-surface photoelectron cloud under direct sunlight to less than 1 s inside the particle-depleted night-side wake and shadowed pocket regions
Asteroids↗
On-PIC Light Source Integration & Micro-dispensing of Solder Paste for Flip Chip Application
To reach the next level benefits of photonic integrated circuits (PICs), the Integrated Photonic Systems Roadmap-International describes the necessity of either heterogeneous or hybrid integration of light sources [1]. A new approach for hybrid integration is Photonic Wire Bonding where 3D nanolithography is used to pattern a polymer waveguide that connects light sources to PIC waveguides. The waveguides resemble electrical wire bonds and essentially do the same as their electrical counterpart for packaging photonic chips together. In order to reap the full benefits of a photonic wire bonds, the light source must be carefully packaged. In this work I seek to expand RIT’s photonic packaging capability by establishing a packaging process to integrate light sources, specifically an Indium Phosphide distributed feedback lasers and a reflective semiconductor optical amplifiers, directly onto a photonic integrated circuits. Another necessary requirement for PIC packaging is densely integrated electrical connectivity. In this thesis I developed a fine pitch flip chip interconnect technique demonstrated using gold stud bumps in conjunction with micro-dispensed solder paste. This work opens the door to high density photonic flip chip applications. The micro-dispensed solder paste dots having diameters 50-125 µm are currently being tested at a pitch of 150 µm . The gold stud bumps are formed with 1mil gold wire creating bumps with a diameter of 40-60 µm depending on specific parameter values. These capabilities will allow RIT to assemble and test novel photonic integrated devices, cutting down on the time and cost associated with third party assembly and tests facilities. Thereby keeping RIT at the forefront of photonic research.
Wongk, Nicole↗
Fabrication of Lanthanum Telluride 14-1-11 Zintl High-Temperature Thermoelectric Couple
The development of more efficient thermoelectric couple technology capable of operating with high-grade heat sources up to 1,275 K is key to improving the performance of radioisotope thermoelectric generators. Lanthanum telluride La3-xTe4 and 14-1-11 Zintls (Yb14MnSb11) have been identified as very promising materials. The fabrication of advanced high-temperature thermoelectric couples requires the joining of several dissimilar materials, typically including a number of diffusion bonding and brazing steps, to achieve a device capable of operating at elevated temperatures across a large temperature differential (up to 900 K). A thermoelectric couple typically comprises a heat collector/ exchanger, metallic interconnects on both hot and cold sides, n-type and ptype conductivity thermoelectric elements, and cold-side hardware to connect to the cold-side heat rejection and provide electrical connections. Differences in the physical, mechanical, and chemical properties of the materials that make up the thermoelectric couple, especially differences in the coefficients of thermal expansion (CTE), result in undesirable interfacial stresses that can lead to mechanical failure of the device. The problem is further complicated by the fact that the thermoelectric materials under consideration have large CTE values, are brittle, and cracks can propagate through them with minimal resistance. The inherent challenge of bonding brittle, high-thermal-expansion thermoelectric materials to a hot shoe material that is thick enough to carry the requisite electrical current was overcome. A critical advantage over prior art is that this device was constructed using all diffusion bonds and a minimum number of assembly steps. The fabrication process and the materials used are described in the following steps: (1) Applying a thin refractory metal foil to both sides of lanthanum telluride. To fabricate the n-type leg of the advanced thermoelectric couple, the pre-synthesized lanthanum telluride coupon was diffusion bonded to the metal foil using a thin adhesion layer. (2) Repeating a similar process for the 14-1-11 Zintl p-type leg of the advanced thermoelectric couple. (3) Bonding thick CTE-matched metal plates on the metallized lanthanum telluride and Yb14MnSb11 to form the hot and cold sides of the thermoelectric couple. The calculated conversion efficiency of such an advanced couple would be about 10.5 percent, about 35 percent better than heritage radioisotope thermoelectric technology that relies on Si-Ge alloys. In addition, unlike Si-Ge alloys, these materials can be combined with many other thermoelectric materials optimized for operation at lower temperatures to achieve conversion efficiency in excess of 15 percent (a factor of 2 increase over heritage technology).
Ravi, Vilupanur A.↗
Non-galvanic mass transport in molten fluoride salt isothermal corrosion cells
Mass transport of corrosion products between Ni-201 test samples and 316 L capsules in a 500-hour FLiNaK corrosion experiment has been investigated. In one experiment, the capsule and samples were electrically connected for galvanic coupling, while in the other they were electrically isolated using boron-nitride. Post-corrosion characterization of Ni-201 from the two experiments did not reveal any remarkable differences. Substantial transport of Fe and Cr from the 316 L to the Ni-201 via the salt was observed, with notable diffusion of these elements in the near-surface regions of the Ni-201 samples, while a Cr-rich film was also observed on their surfaces.
36 MATERIALS SCIENCE↗
Compact, Low-Force, Low-Noise Linear Actuator
Actuators are critical to all the robotic and manipulation mechanisms that are used in current and future NASA missions, and are also needed for many other industrial, aeronautical, and space activities. There are many types of actuators that were designed to operate as linear or rotary motors, but there is still a need for low-force, low-noise linear actuators for specialized applications, and the disclosed mechanism addresses this need. A simpler implementation of a rotary actuator was developed where the end effector controls the motion of a brush for cleaning a thermal sensor. The mechanism uses a SMA (shape-memory alloy) wire for low force, and low noise. The linear implementation of the actuator incorporates a set of springs and mechanical hard-stops for resetting and fault tolerance to mechanical resistance. The actuator can be designed to work in a pull or push mode, or both. Depending on the volume envelope criteria, the actuator can be configured for scaling its volume down to 4 2 1 cm3. The actuator design has an inherent fault tolerance to mechanical resistance. The actuator has the flexibility of being designed for both linear and rotary motion. A specific configuration was designed and analyzed where fault-tolerant features have been implemented. In this configuration, an externally applied force larger than the design force does not damage the active components of the actuator. The actuator housing can be configured and produced using cost-effective methods such as injection molding, or alternatively, its components can be mounted directly on a small circuit board. The actuator is driven by a SMA -NiTi as a primary active element, and it requires energy on the order of 20 Ws(J) per cycle. Electrical connections to points A and B are used to apply electrical power in the resistive NiTi wire, causing a phase change that contracts the wire on the order of 5%. The actuation period is of the order of a second for generating the stroke, and 4 to 10 seconds for resetting. Thus, this design allows the actuator to work at a frequency of up to 0.1 Hz. The actuator does not make use of the whole range of motion of the SMA material, allowing for large margins on the mechanical parameters of the design. The efficiency of the actuator is of the order of 10%, including the margins. The average dissipated power while driving at full speed is of the order of 1 W, and can be scaled down linearly if the rate of cycling is reduced. This design produces an extremely quiet actuator; it can generate a force greater than 2 N and a stroke greater than 1 cm. The operational duration of SMA materials is of the order of millions of cycles with some reduced stroke over a wide temperature range up to 150 C.
Badescu, Mircea↗
Compact, Low-Force, Low-Noise Linear Actuator
Actuators are critical to all the robotic and manipulation mechanisms that are used in current and future NASA missions, and are also needed for many other industrial, aeronautical, and space activities. There are many types of actuators that were designed to operate as linear or rotary motors, but there is still a need for low-force, low-noise linear actuators for specialized applications, and the disclosed mechanism addresses this need. A simpler implementation of a rotary actuator was developed where the end effector controls the motion of a brush for cleaning a thermal sensor. The mechanism uses a SMA (shape-memory alloy) wire for low force, and low noise. The linear implementation of the actuator incorporates a set of springs and mechanical hard-stops for resetting and fault tolerance to mechanical resistance. The actuator can be designed to work in a pull or push mode, or both. Depending on the volume envelope criteria, the actuator can be configured for scaling its volume down to 4x2x1 cu cm. The actuator design has an inherent fault tolerance to mechanical resistance. The actuator has the flexibility of being designed for both linear and rotary motion. A specific configuration was designed and analyzed where fault-tolerant features have been implemented. In this configuration, an externally applied force larger than the design force does not damage the active components of the actuator. The actuator housing can be configured and produced using cost-effective methods such as injection molding, or alternatively, its components can be mounted directly on a small circuit board. The actuator is driven by a SMA -NiTi as a primary active element, and it requires energy on the order of 20 Ws(J) per cycle. Electrical connections to points A and B are used to apply electrical power in the resistive NiTi wire, causing a phase change that contracts the wire on the order of 5%. The actuation period is of the order of a second for generating the stroke, and 4 to 10 seconds for resetting. Thus, this design allows the actuator to work at a frequency of up to 0.1 Hz. The actuator does not make use of the whole range of motion of the SMA material, allowing for large margins on the mechanical parameters of the design. The efficiency of the actuator is of the order of 10%, including the margins. The average dissipated power while driving at full speed is of the order of 1 W, and can be scaled down linearly if the rate of cycling is reduced. This design produces an extremely quiet actuator; it can generate a force greater than 2 N and a stroke greater than 1 cm. The operational duration of SMA materials is of the order of millions of cycles with some reduced stroke over a wide temperature range up to 150 C.
Badescu, Mircea↗