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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Vented enclosure is made from lightweight metal. Printed-circuit boards are attached to bottom and end bulkheads and to top cover. Airflow cools components indirectly through walls of inner compartment. Flammability and smoke tests demonstrate safety of enclosure.
Scale breaking model and gammaisation processes for high energies give a correct description of the longitudinal development of extensive air showers (E.A.S.). From the analysis of phenomenological characteristics of E.A.S. at Tien-Shan experiment, it follows that for energies near 10 to the 6 GeV the secondary particle multiplicity increases with energy faster than is predicted by the accepted scale breaking model.
One of the challenges in space qualification is to define the operational environment of a part such that it is tested to the limits of a mission without requiring expensive overdesign. To aid this, this document defines, discusses and recommends environmental design and verification requirements for using microelectronic components and assemblies in space environments.
Topics covered include: Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports
Topics: Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Life Sciences.
Topics:Graphics and Simulation; Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.
Topics covered include: Sensors/Imaging; Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.
Topics include: mechanical components, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, book and reports, and a special section of Federal laboratory computing Tech Briefs.
Crystal oscillators are extensively used in electronic circuits to provide timing or clocking signals in data acquisition, communications links, and control systems, to name a few. They are affordable, small in size, and reliable. Because of the inherent characteristics of the crystal, the oscillator usually exhibits extreme accuracy in its output frequency within the intrinsic crystal stability. Stability of the frequency could be affected under varying load levels or other operational conditions. Temperature is one of those important factors that influence the frequency stability of an oscillator; as it does to the functionality of other electronic components. Electronics designed for use in NASA deep space and planetary exploration missions are expected to be exposed to extreme temperatures and thermal cycling over a wide range. Thus, it is important to design and develop circuits that are able to operate efficiently and reliably under in these harsh temperature environments. Most of the commercial-off-the-shelf (COTS) devices are very limited in terms of their specified operational temperature while very few custom-made commercial and military-grade parts have the ability to operate in a slightly wider range of temperature than those of the COTS parts. These parts are usually designed for operation under one temperature extreme, i.e. hot or cold, and do not address the wide swing in the operational temperature, which is typical of the space environment. For safe and successful space missions, electronic systems must therefore be designed not only to withstand the extreme temperature exposure but also to operate efficiently and reliably. This report presents the results obtained on the evaluation of a new COTS crystal oscillator under extreme temperatures.
Electron radiation bombardment effect on optical properties of Nimbus satellite television camera lens
Electron beam application to welding spacecraft propulsion components
The Component Repair Experiment-1 (CRE-1) examines the capability for astronauts to perform electronics repair tasks in space. The goal is to determine the current capabilities and limits for the crew, and to make recommendations to improve and expand the range of work that astronauts may perform. CRE-1 provided two-layer, functional circuit boards and replacement components, a small tool kit, written and video training materials, and 1 hr of hands on training for the crew slated to perform the experiment approximately 7 months prior to the mission. Astronauts Michael Fincke and Sandra Magnus performed the work aboard the International Space Station (ISS) in February and March 2009. The astronauts were able to remove and replace components successfully, demonstrating the feasibility of performing component-level electronics repairs within a spacecraft. Several unsuccessful tasks demonstrated areas in need of improvement. These include improved and longer training prior to a mission, an improved soldering iron with a higher operating temperature and steady power source, video training and practice boards for refresher work or practice before a repair, and improved and varied hand tools and containment system.
Electronic or electromechanical failure-prone component pinpointing using various nondestructive testing methods
Heat conduction plays an important role in the efficiency and life span of electronic components. To keep electronic components running efficiently and at a proper temperature, thermal management systems transfer heat generated from the components to thermal surfaces such as heat sinks, heat pipes, radiators, or heat spreaders. Thermal surfaces absorb the heat from the electrical components and dissipate it into the environment, preventing overheating. To ensure the best contact between electrical components and thermal surfaces, thermal interface materials are applied. In addition to having high conductivity, ideal thermal interface materials should be compliant to conform to the components, increasing the surface contact. While many different types of interface materials exist for varying purposes, Energy Science Laboratories, Inc. (ESLI), of San Diego, California, proposed using carbon velvets as thermal interface materials for general aerospace and electronics applications. NASA s Johnson Space Center granted ESLI a Small Business Innovation Research (SBIR) contract to develop thermal interface materials that are lightweight and compliant, and demonstrate high thermal conductance even for nonflat surfaces. Through Phase II SBIR work, ESLI created Vel-Therm for the commercial market. Vel-Therm is a soft, carbon fiber velvet consisting of numerous high thermal conductivity carbon fibers anchored in a thin layer of adhesive. The velvets are fabricated by precision cutting continuous carbon fiber tows and electrostatically flocking the fibers into uncured adhesive, using proprietary techniques.