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81 records · Page 5

An Approach to Shape Parameterization Using Laboratory Hypervelocity Impact Experiments

NASA’s Orbital Debris Program Office relies on laboratory-based impact tests to supplement the measurement data of on-orbit events that defines the orbital debris environment. These experiments provide information that is essential to interpreting the radar and optical measurements of orbital fragmentation events into useful metrics, such as characteristic size of the debris, and to providing a better understanding of the distributions of fragment populations in terms of their masses, material constituents, fragment densities, cross-sectional areas, area-to-mass ratios, shapes, etc. The Satellite Orbital Debris Characterization Impact Test (SOCIT) was a notable laboratory impact experiment conducted in 1992 using a surplus U.S. Navy Transit navigation satellite of the 1960s. The data from this ground-based experiment were combined with on-orbit measurements to develop the NASA Standard Satellite Breakup Model (SSBM). To account for advancements in satellite design and construction since, a new impact test series – DebriSat – was conducted in 2014. This test utilized a high-fidelity mock-up spacecraft that better represents the materials and construction techniques used to design and manufacture modern spacecraft. Together, these tests offer valuable data to model an orbital debris environment composed of legacy and modern spacecraft. This paper presents an overview of the two laboratory impact tests, comparing their fragment parameter distributions with each other and with relevant distributions from the NASA SSBM. The categorization and descriptions of fragment shapes are of significant interest for future work, yet there are marked differences in the definitions of shape categories between each dataset. The categorizations of constituent materials, and the measurement techniques employed to populate these two datasets, are also different. New rubrics simplify and equate the categorizations between datasets to aid comparative analyses and to facilitate the potential use of both datasets in tandem with future environmental debris models. A preferred approach to classifying shape across disparate datasets uses the characteristic-length dimensions, and a simplified shape classification based on physical, solid-body dimensions, to mathematically construct an encapsulating right-circular cylinder that represents the fragment. The ratio of cylinder length-to-diameter (L:D) then provides a single continuum value for shape that is strongly correlated with its designated shape and size. This metric can then be used to further assess the distribution of shape with populations of other fragment characteristics within these datasets. The shape parameterization using the L:D ratios of right-circular cylinders is discussed.

John H Seago↗

PEM-INST-001: Instructions for Plastic Encapsulated Microcircuit (PEM) Selection, Screening, and Qualification

Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect poor-quality lots and screen out early random failures from use in space flight hardware. However, since it cannot be guaranteed that quality was designed and built into PEMs that are appropriate for space applications, users cannot screen in quality that may not exist. It must be understood that due to the variety of materials, processes, and technologies used to design and produce PEMs, this test process may not accelerate and detect all failure mechanisms. While the tests herein will increase user confidence that PEMs with otherwise unknown reliability can be used in space environments, such testing may not guarantee the same level of reliability offered by military microcircuits. PEMs should only be used where due to performance needs there are no alternatives in the military high-reliability market, and projects are willing to accept higher risk.

Teverovsky, Alexander↗

Instructions for Plastic Encapsulated Microcircuit(PEM) Selection, Screening and Qualification.

The use of Plastic Encapsulated Microcircuits (PEMs) is permitted on NASA Goddard Space Flight Center (GSFC) spaceflight applications, provided each use is thoroughly evaluated for thermal, mechanical, and radiation implications of the specific application and found to meet mission requirements. PEMs shall be selected for their functional advantage and availability, not for cost saving; the steps necessary to ensure reliability usually negate any initial apparent cost advantage. A PEM shall not be substituted for a form, fit and functional equivalent, high reliability, hermetic device in spaceflight applications. Due to the rapid change in wafer-level designs typical of commercial parts and the unknown traceability between packaging lots and wafer lots, lot specific testing is required for PEMs, unless specifically excepted by the Mission Assurance Requirements (MAR) for the project. Lot specific qualification, screening, radiation hardness assurance analysis and/or testing, shall be consistent with the required reliability level as defined in the MAR. Developers proposing to use PEMs shall address the following items in their Performance Assurance Implementation Plan: source selection (manufacturers and distributors), storage conditions for all stages of use, packing, shipping and handling, electrostatic discharge (ESD), screening and qualification testing, derating, radiation hardness assurance, test house selection and control, data collection and retention.

King, Terry↗

Impact of Solar Array Designs on High Voltage Operations

As power levels of advanced spacecraft climb above 25 kW, higher solar array operating voltages become attractive. Even in today s satellites, operating spacecraft buses at 100 V and above has led to arcing in GEO communications satellites, so the issue of spacecraft charging and solar array arcing remains a design problem. In addition, micrometeoroid impacts on all of these arrays can also lead to arcing if the spacecraft is at an elevated potential. For example, tests on space station hardware disclosed arcing at 75V on anodized A1 structures that were struck with hypervelocity particles in Low Earth Orbit (LEO) plasmas. Thus an understanding of these effects is necessary to design reliable high voltage solar arrays of the future, especially in light of the Vision for Space Exploration of NASA. In the future, large GEO communication satellites, lunar bases, solar electric propulsion missions, high power communication systems around Mars can lead to power levels well above 100 kW. As noted above, it will be essential to increase operating voltages of the solar arrays well above 80 V to keep the mass of cabling needed to carry the high currents to an acceptable level. Thus, the purpose of this paper is to discuss various solar array approaches, to discuss the results of testing them at high voltages, in the presence of simulated space plasma and under hypervelocity impact. Three different types of arrays will be considered. One will be a planar array using thin film cells, the second will use planar single or multijunction cells and the last will use the Stretched Lens Array (SLA - 8-fold concentration). Each of these has different approaches for protection from the space environment. The thin film cell based arrays have minimal covering due to their inherent radiation tolerance, conventional GaAs and multijunction cells have the traditional cerium-doped microsheet glasses (of appropriate thickness) that are usually attached with Dow Corning DC 93-500 silicone adhesive. In practice, these cover glasses and adhesive do not cover the cell edges. Finally, in the SLA, the entire cell and cell edges are fully encapsulated by a cover glass that overhangs the cell perimeter and the silicone adhesive covers the cell edges providing a sealed environment. These three types of blanket technology have been tested at GRC and Auburn. The results of these tests will be described. For example, 15 modules composed of four state-of-the-art 2x4 cm GaAs solar cells with 150 pm cover glasses connected in two-cell series strings were tested at high voltage, in plasma under hypervelocity impact. A picture of one of the modules is shown in figure 1. These were prepared by standard industry practice from a major supplier and had efficiencies above 18%. The test results and other fabrication factors that influenced the tests will be presented. In addition, results for SLA segments tested under the same conditions will be presented. Testing of thin film blankets at GRC will also be presented. Figure 1 : Typical GaAs Solar Cell Module These results will show significant differences in resistance to arcing that are directly related to array design and manufacturing procedures. Finally, the approaches for mitigating the problems uncovered by these tests will be described. These will lay the foundation for future higher voltage array operation, even including voltages above 300-600 V for direct drive SEP applications.

Brandhorst, Henry W., Jr.↗

Technology Development for the Modification of High Aspect Ratio Geometries for Thermal and Environmental Control

A key technology development driver in environmental control systems and next generation optics are discussed utilizing thin film development borrowed from the semiconductor industry. The optical and physical properties of spacecraft radiator coatings are dictated by orbital environmental conditions. For example, coatings must adequately dissipate charge buildup when orbital conditions, such as polar, geostationary or gravity neutral, result in surface charging. Current dissipation techniques include depositing a layer of ITO (indium tin oxide) on the radiator surface in a high temperature process. The application of these enhanced coatings must be such that the properties in question are tailored to mission-specific requirements. The multi-billion-dollar semiconductor industry has adopted Atomic Layer Deposition (ALD) for self-assembly and atomic-scale placement. ALD is a cost-effective nanoadditive-manufacturing technique that allows for the conformal coating of substrates with atomic control in a benign temperature and pressure environment. By using ALD, modification of these coatings can be accomplished during coating application preprocessing. The preprocessing is rendered directly on the coating dry pigment before binding. Through the introduction of paired precursor gases, thin films can be deposited on a myriad of substrates ranging from glass, polymers, aerogels, metals, powders, and other high aspect-ratio micro- and nano- structures. By providing atomic-level control, where single layers of atoms can be deposited, the fabrication of metal transparent films, precise nano-laminates, and coatings of nano-channels and pores is achievable. A method has been demonstrated for the ALD of In2O3 and films on a variety of substrates from Si(100) wafers, glass slides, and on Z93P pigments resulting in a direct spaceflight application. Results will be presented that verify the chemical composition of ALD pigments and charge dissipation properties when the pigment goes through its binding and coating process and we present early results of ALD for carbon nanotube formation and encapsulation.

Dwivedi, Vivek H.↗

Application and Development of Atomic Layer Deposition Techniques to Improve Thermo-Optical Coatings for Spacecraft Thermal Control and Advanced Optical Instruments

A key technology development driver in environmental control systems and next generation optics are discussed utilizing thin film development borrowed from the semiconductor industry. The optical and physical properties of spacecraft radiator coatings are dictated by orbital environmental conditions. For example, coatings must adequately dissipate charge buildup when orbital conditions, such as polar, geostationary or gravity neutral, result in surface charging. Current dissipation techniques include depositing a layer of ITO (indium tin oxide) on the radiator surface in a high temperature process. The application of these enhanced coatings must be such that the properties in question are tailored to mission-specific requirements. The multi-billion-dollar semiconductor industry has adopted Atomic Layer Deposition (ALD) for self-assembly and atomic-scale placement. ALD is a cost-effective nanoadditive-manufacturing technique that allows for the conformal coating of substrates with atomic control in a benign temperature and pressure environment. By using ALD, modification of these coatings can be accomplished during coating application preprocessing. The preprocessing is rendered directly on the coating dry pigment before binding. Through the introduction of paired precursor gases, thin films can be deposited on a myriad of substrates ranging from glass, polymers, aerogels, metals, powders, and other high aspect-ratio micro- and nano- structures. By providing atomic-level control, where single layers of atoms can be deposited, the fabrication of metal transparent films, precise nano-laminates, and coatings of nano-channels and pores is achievable. A method has been demonstrated for the ALD of In2O3 and films on a variety of substrates from Si(100) wafers, glass slides, and on Z93P pigments resulting in a direct spaceflight application. Results will be presented that verify the chemical composition of ALD pigments and charge dissipation properties when the pigment goes through its binding and coating process and we present early results of ALD for carbon nanotube formation and encapsulation.

Dwivedi, Vivek H.↗

NASA Tech Briefs, September 2012

Topics covered include: Beat-to-Beat Blood Pressure Monitor; Measurement Techniques for Clock Jitter; Lightweight, Miniature Inertial Measurement System; Optical Density Analysis of X-Rays Utilizing Calibration Tooling to Estimate Thickness of Parts; Fuel Cell/Electrochemical Cell Voltage Monitor; Anomaly Detection Techniques with Real Test Data from a Spinning Turbine Engine-Like Rotor; Measuring Air Leaks into the Vacuum Space of Large Liquid Hydrogen Tanks; Antenna Calibration and Measurement Equipment; Glass Solder Approach for Robust, Low-Loss, Fiber-to-Waveguide Coupling; Lightweight Metal Matrix Composite Segmented for Manufacturing High-Precision Mirrors; Plasma Treatment to Remove Carbon from Indium UV Filters; Telerobotics Workstation (TRWS) for Deep Space Habitats; Single-Pole Double-Throw MMIC Switches for a Microwave Radiometer; On Shaft Data Acquisition System (OSDAS); ASIC Readout Circuit Architecture for Large Geiger Photodiode Arrays; Flexible Architecture for FPGAs in Embedded Systems; Polyurea-Based Aerogel Monoliths and Composites; Resin-Impregnated Carbon Ablator: A New Ablative Material for Hyperbolic Entry Speeds; Self-Cleaning Particulate Prefilter Media; Modular, Rapid Propellant Loading System/Cryogenic Testbed; Compact, Low-Force, Low-Noise Linear Actuator; Loop Heat Pipe with Thermal Control Valve as a Variable Thermal Link; Process for Measuring Over-Center Distances; Hands-Free Transcranial Color Doppler Probe; Improving Balance Function Using Low Levels of Electrical Stimulation of the Balance Organs; Developing Physiologic Models for Emergency Medical Procedures Under Microgravity; PMA-Linked Fluorescence for Rapid Detection of Viable Bacterial Endospores; Portable Intravenous Fluid Production Device for Ground Use; Adaptation of a Filter Assembly to Assess Microbial Bioburden of Pressurant Within a Propulsion System; Multiplexed Force and Deflection Sensing Shell Membranes for Robotic Manipulators; Whispering Gallery Mode Optomechanical Resonator; Vision-Aided Autonomous Landing and Ingress of Micro Aerial Vehicles; Self-Sealing Wet Chemistry Cell for Field Analysis; General MACOS Interface for Modeling and Analysis for Controlled Optical Systems; Mars Technology Rover with Arm-Mounted Percussive Coring Tool, Microimager, and Sample-Handling Encapsulation Containerization Subsystem; Fault-Tolerant, Real-Time, Multi-Core Computer System; Water Detection Based on Object Reflections; SATPLOT for Analysis of SECCHI Heliospheric Imager Data; Plug-in Plan Tool v3.0.3.1; Frequency Correction for MIRO Chirp Transformation Spectroscopy Spectrum; Nonlinear Estimation Approach to Real-Time Georegistration from Aerial Images; Optimal Force Control of Vibro-Impact Systems for Autonomous Drilling Applications; Low-Cost Telemetry System for Small/Micro Satellites; Operator Interface and Control Software for the Reconfigurable Surface System Tri-ATHLETE; and Algorithms for Determining Physical Responses of Structures Under Load.

Source record↗

The Development of an Edible Peanut Protein Film

The peanut is one of the crops chosen for use in NASA's Advanced Life Support Program (ALS). The peanut is a source of both oil and protein. After oil is extracted from the peanut, a protein rich flour remains. An edible peanut protein film is one use for this flour. Two types of film are developed for this study, one set of film contains 10% fat while the other set contains no fat. For film without fat the defatting of the peanut by the Soxhlet method is the first step in the manufacturing process of the film. Secondly, the protein is precipitated at its isoelectric point (pH 4.5) and centrifuged to separate the protein from the non-protein. After freeze-drying the protein it is milled in a ceramic ball mill to decrease particle size and sifted through a series of sieves to determine particle size distribution. Those particles retained on the 100 mesh sieves are utilized for film formation. Larger particles are re-ground and sifted. Five grams of protein is mixed with 50 mL of distilled water, 70 mL of 80% ethanol, 15 mL of 6N ammonium hydroxide and a plasticizer. This mixture is heated for 30 minutes until the temperature reaches 70 C. The mixture is then poured onto a level Teflon coated glass surface. After allowing the film to form overnight under a ventilation hood, it is manually removed from the plate. The processes and methods adopted have created flexible films of uniform thickness that are free of air bubbles. Thickness of films made from defatted peanut protein and partially defatted peanut protein were 0.10 Lm and 0.13 Lm respectively. Films with natural peanut fat are approximately three times as flexible and almost four times as strong as the films made without fat. Further research will be performed to evaluate its mechanical properties. This paper will greatly contribute to food preservation and waste management. Potential applications of this film are edible/biodegradable containers, wrapping for food preservation (against water, oxygen and oil), storage packets for seasonings or other ingredients and encapsulation for pharmaceutical use.

Patrick, N.↗

Customized Hermetic Feedthrough Developed to Isolate Fluids

A common problem occurs when refrigerant fluids wick inside the insulation of thermocouple wires through a compressor's casing feedthrough and then leak into the adjacent disconnect box outside the casing. Leaking fluids create an unfavorable situation inside the disconnect box and may contaminate the fluids. To address this problem, NASA Lewis Research Center s Manufacturing Engineering Division developed a customized hermetic feedthrough for a bank of Worthington compressors. In these compressors, bearing temperatures are measured by internal thermocouples embedded in bearings located inside the compressor casings. The thermocouple wires need to be routed outside the casing and read at another location. These wires are short and are terminated to a disconnect strip inside the casing. The bearings operate at about 170 F, but because the casing is filled with R12 refrigerant oil, the casing has a maximum temperature of about 100 F. The operating conditions of these compressors permit the use of an epoxy that is compatible with the R12 fluid. The desired finished product is a stainless steel tube that has been filled solid with epoxy after thermocouple wires bonded and sealed by epoxy have been inserted through its length. Shrink tubing extends from both ends of the tube. The process that was developed to isolate the thermocouple wires from the R12 fluid follows. For this application, use an 8-in.-long piece of 0.500-in. 304 stainless steel tube with six pairs of 24-gauge stranded, PTFE-insulated (polytetrafluoroethylene) type "T" thermocouple wires for each feedthrough. Use shrink tubing to strain relief the insulated wires at their exit from the stainless steel tube. Cut the wire to length and identify the location of the stainless steel tube sleeve with masking tape. Then, remove the outer insulation from a 2-in. section of wire that will be inside the tube, and carefully strip to bare wire a 1-in. section in the middle of the section with the outer insulation removed. For an effective seal, the epoxy must penetrate between the strands when stranded conductors are used. Make the seal with epoxy bond on the bare wire. The bare wire must be encapsulated with a thin layer of the epoxy that leaves only a very low profile. These encapsulated wires must cure before the assembly can be continued. Then, inspect the cured wires for complete encapsulation before going to the next step. Insert the wires in the stainless steel tube and orient them so that the epoxied stripped sections are staggered within the tube; then, apply shrink tubing to one end of the cleaned wires, positioning it inside the edge of the tube. The small gaps between the wires on the other end will be used to inject the epoxy into the tube. Let the epoxy cure inside the tube, free of any voids. Then, continue to fill the tube until the entire 8-in. length is nearly filled, allowing room for the other strain-relieving shrink tubing. Since this first design, the process has been adjusted to fit many needs and situations. Customized feedthroughs have been assembled from various wire types, wire gauges, and/or stainless steel tube passages. The fittings selected to mount these feedthroughs allow their use in other areas, such as pressure or vacuum systems.

Meredith, Roger D.↗