Adaptation of models for minority-carrier devices to integrated circuits
Adaptation of models for minority carrier devices, and applicability in computer design evaluation studies of integrated circuits
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Adaptation of models for minority carrier devices, and applicability in computer design evaluation studies of integrated circuits
Azimuth correlator circuit synthetic-aperature radar (SAR) is designed for single integrated circuit (IC) chip. Azimuth correlator modules constructed with sets of such chips could make real-time signal processing possible. Primary advantages are realized in areas of weight and power requirement reductions.
The design of electrometer circuitry using an integrated circuit operational amplifier with a MOSFET input is described. Input protection against static voltages is provided by a dual ultra low leakage diode or a neon lamp. Factors affecting frequency response leakage resistance, and current stability are discussed, and methods are suggested for increasing response speed and for eliminating leakage resistance and current instabilities. Based on the above, two practical circuits, one having a linear response and the other a logarithmic response, were designed and evaluated experimentally. The design of a sweep circuit to implement mobility measurements using atmospheric probes is presented. A triangular voltage waveform is generated and shaped to contain a step in voltage from zero volts in both positive and negative directions.
Radio telescopes that employ arrays of many antennas are in operation, and ever larger ones are being designed and proposed. Signals from the antennas are combined by cross-correlation. While the cost of most components of the telescope is proportional to the number of antennas N, the cost and power consumption of cross-correlationare proportional to N2 and dominate at sufficiently large N. Here we report the design of an integrated circuit (IC) that performs digital cross-correlations for arbitrarily many antennas in a power-efficient way. It uses an intrinsically low-power architecture in which the movement of data between devices is minimized. In a large system, each IC performs correlations for all pairs of antennas but for a portion of the telescope's bandwidth (the so-called "FX" structure). In our design, the correlations are performed in an array of 4096 complex multiply-accumulate (CMAC) units. This is sufficient to perform all correlations in parallel for 64 signals (N=32 antennas with 2 opposite-polarization signals per antenna). When N is larger, the input data are buffered in an on-chipmemory and the CMACs are re-used as many times as needed to compute all correlations. The design has been synthesized and simulated so as to obtain accurate estimates of the IC's size and power consumption. It isintended for fabrication in a 32 nm silicon-on-insulator process, where it will require less than 12mm2 of silicon area and achieve an energy efficiency of 1.76 to 3.3 pJ per CMAC operation, depending on the number of antennas. Operation has been analyzed in detail up to N = 4096. The system-level energy efficiency, including board-levelI/O, power supplies, and controls, is expected to be 5 to 7 pJ per CMAC operation. Existing correlators for the JVLA (N = 32) and ALMA (N = 64) telescopes achieve about 5000 pJ and 1000 pJ respectively usingapplication-specific ICs in older technologies. To our knowledge, the largest-N existing correlator is LEDA atN = 256; it uses GPUs built in 28 nm technology and achieves about 1000 pJ. Correlators being designed for the SKA telescopes (N = 128 and N = 512) using FPGAs in 16nm technology are predicted to achieve about 100 pJ.
A technique has been developed to support the study of the effects of cosmic rays on integrated circuits. The system is designed to determine the particle distribution across the surface of an integrated circuit accurately while the circuit is bombarded by a particle beam. The system uses photomultiplier tubes, an octal discriminator, a computer-controlled NIM quad counter, and an IBM PC. It provides real-time operator feedback for fast beam tuning and monitors momentary fluctuations in the particle beam. The hardware, software, and system performance are described.
An application specific integrated circuit is optimized by translating a first representation of its digital design to a second representation. The second representation includes multiple syntactic expressions that admit a representation of a higher-order function of base Boolean values. The syntactic expressions are manipulated to form a third representation of the digital design.
A radiation hardened by design (RHBD) mixed-signal application specific integrated circuit (ASIC) has been designed for a thermopile readout for operation in the harsh Jovian orbital environment. The multi-channel digitizer (MCD) ASIC includes 18 low noise amplifier channels which have tunable gain/filtering coefficients, a 16-bit sigma-delta analog-digital converter (SDADC) and an on-chip controller. The 18 channels, SDADC and controller were designed to operate with immunity to single event latchup (SEL) and to at least 10 Mrad total ionizing dose (TID). The ASIC also contains a radiation tolerant 16-bit 20 MHz Nyquist ADC for general purpose instrumentation digitizer needs. The ASIC is currently undergoing fabrication in a commercial 180 nm CMOS process. Although this ASIC was designed specifically for the harsh radiation environment of the NASA led JEO mission it is suitable for integration into instrumentation payloads 011 the ESA JUICE mission where the radiation hardness requirements are slightly less stringent.
The Early Flight Fission Test Facilities (EFF-TF) team has been tasked by the NASA Marshall Space Flight Center Nuclear Systems Office to design, fabricate, and test an actively pumped alkali metal flow circuit. The system, which was originally designed for use with a eutectic mixture of sodium potassium (NaK), was redesigned to for use with lithium. Due to a shi$ in focus, it is once again being prepared for use with NaK. Changes made to the actively pumped, high temperature circuit include the replacement of the expansion reservoir, addition of remotely operated valves, and modification of the support table. Basic circuit components include: reactor segment, NaK to gas heat exchanger, electromagnetic (EM) liquid metal pump, load/drain reservoir, expansion reservoir, instrumentation, and a spill reservoir. A 37-pin partial-array core (pin and flow path dimensions are the same as those in a fill design) was selected for fabrication and test. This paper summarizes the integration and preparations for the fill of the pumped liquid metal NaK flow circuit.
Receiver for 2.4-kbit/s differential minimum-shift keying (DMSK) and Gaussian minimum-shift keying(GMSK) suitable for communication between land-mobile stations via geostationary satellites. Operating on phase-shifted signal in 800-MHz band, in presence of fading and Doppler frequency shifts, receiver compact, makes efficient use of frequency spectrum, and wastes little power. Receiver design implemented in very-large-scale-integrated circuits. Basic DMSK receiver design relies on baseband rather than intermediate-frequency processing of in-phase and quadrature signal components because phase errors due to differential delays smaller at baseband.
Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.
A telemetry data processing system was defined of the Data Reduction. Data reduction activities in support of the developmental flights of the Space Shuttle were used as references against which requirements are assessed in general terms. A conceptual system design believed to offer significant throughput for the anticipated types of data reduction activities is presented. The design identifies the use of a large, intermediate data store as a key element in a complex of high speed, single purpose processors, each of which performs predesignated, repetitive operations on either raw or partially processed data. The recommended approach to implement the design concept is to adopt an established interface standard and rely heavily on mature or promising technologies which are considered main stream of the integrated circuit industry. The design system concept, is believed to be implementable without reliance on exotic devices and/or operational procedures. Numerical methods were employed to examine the feasibility of digital discrimination of FDM composite signals, and of eliminating line frequency noises in data measurements.
This work compares design layouts and circuit simulations of the next two prototype NASA Glenn SiC JFET-R IC fabrication runs designated “IC Gen. 12” and “IC Gen. 13”. Even though both generations employ the same physical JFET gate length and chip size, SPICE simulations predict drastic improvements to IC capabilities and performance metrics for Gen. 13 over Gen. 12. The main factors behind simulated performance differences are thinner n-channel layer leading to reduced operating voltages and switch to stepper-based photolithography that enables roughly 4-fold layout area reductions for functionally identical circuit blocks.
The key to implementing self-diagnosing design is a systems engineering task focused on design for testability concurrent with design for functionality. The design for testability process described here is the product of several years of DOD study and experience. Its application to the space station has begun on Work Package II under NASA and McDonnell direction. Other work package teams are being briefed by Harris Corporation with the hope of convincing them to embrace the process. For the purpose of this discussion the term testability is used to describe the systems engineering process by which designers can assure themselves and their reviewers that their designs are TESTABLE, that is they will support the downstream process of determining their functionality. Due to the complexity and density of present-day state-of-the-art designs, such as pipeline processors and high-speed integrated circuit technology, testability feature design is a critical requirement of the functional design process. A systematic approach to Space systems test and checkout as well as fault detection fault isolation reconfiguration (FDFIR) will minimize operational costs and maximize operational efficiency. An effective design for the testability program must be implemented by all contractors to insure meeting this objective. The process is well understood and technology is here to support it.
Next generation space-based robotics systems will be constructed using distributed architectures where electronics capable of working in the extreme environments of the planets of the solar system are integrated with the sensors and actuators in plug-and-play modules and are connected through common multiple redundant data and power buses.
The Mars Microprobe Mission is the second spacecraft developed as part of the New Millennium Program deep space missions. The objective of the Microprobe Project is to demonstrate the applicability of key technologies for future planetary missions by developing two probes for deployment on Mars. The probes are designed with a single stage entry, descent, and landing system and impact the Martian surface at speeds of approximately 200 meters per second. The microprobes are composed of two main sections, a forebody section that penetrates to a depth below the Martian surface of 0.5 to 2 meters, and an aftbody section that remains on the surface. Each probe system consists of a number of advanced technology components developed specifically for this mission. These include a non-erosive aeroshell for entry into. the atmosphere, a set of low temperature batteries to supply probe power, an advanced microcontroller to execute the mission sequence, collect the science data, and react to possible system fault conditions, a telecommunications subsystem implemented on a set of custom integrated circuits, and instruments designed to provide science measurements from above and below the Martian surface. All of the electronic components have been designed and fabricated to withstand the severe impact shock environment and to operate correctly at predicted temperatures below -100 C.
The engineering development of a solid-state transmitter amplifier operating in the 20-GHz frequency range is described. This effort involved a multitude of disciplines including IMPATT device development, circulator design, multiple-diode circuit design, and amplifier integration and test. The objective was to develop a transmitter amplifier demonstrating the feasibility of providing an efficient, reliable, lightweight solid-state transmitter to be flown on a 30 to 20 GHz communication demonstration satellite. The work was done under contract from NASA/Lewis Research Center for a period of three years. The result was the development of a GaAs IMPACT diode amplifier capable of an 11-W CW output power and a 2-dB bandwidth of 300 MHz. GaAs IMPATT diodes incorporating diamond heatsink and double-Read doping profile capable of 5.3-W CW oscillator output power and 15.5% efficiency were developed. Up to 19% efficiency was also observed for an output power level of 4.4 W. High performance circulators with a 0.2 dB inserting loss and bandwidth of 5 GHz have also been developed. These represent a significant advance in both device and power combiner circuit technologies in K-band frequencies.
Preamplifier with hybrid discrete components and integrated-circuit packaging is designed specifically for use as television image-tube output signal conditioner. Circuit is fabricated on alumina substrate, measuring 0.5 by 0.5 by 0.015 inch using gold-base conductor with conductive gold crossovers and dielectric insulation.
Integrated sensing circuits were designed, fabricated, and packaged for use in determining the direction and fluence of ionizing radiation passing through a multiwire proportional chamber. CMOS on sapphire was selected because of its high speed and low power capabilities. The design of the proposed circuits is described and the results of computer simulations are presented. The fabrication processes for the CMOS on sapphire sensing circuits and hybrid substrates are outlined. Several design options are described and the cost implications of each discussed. To be most effective, each chip should handle not more than 32 inputs, and should be mounted on its own hybrid substrate.