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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗
NASA NTRS2013

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗
DOE OSTI2024

Entropy Analysis of FPGA Interconnect and Switch Matrices for Physical Unclonable Functions

Random variations in microelectronic circuit structures represent the source of entropy for physical unclonable functions (PUFs). In this paper, we investigate delay variations that occur through the routing network and switch matrices of a field-programmable gate array (FPGA). The delay variations are isolated from other components of the programmable logic, e.g., look-up tables (LUTs), flip-flops (FFs), etc., using a feature of Xilinx FPGAs called dynamic partial reconfiguration (DPR). A set of partial designs is created to fix the placement of a time-to-digital converter (TDC) and supporting infrastructure to enable the path delays through the target interconnect and switch matrices to be extracted by subtracting out common-mode delay components. Delay variations are analyzed in the different levels of routing resources available within FPGAs, i.e., local routing and across-chip routing. Data are collected from a set of Xilinx Zynq 7010 devices, and a statistical analysis of within-die variations in delay through a set of the randomly-generated and hand-crafted interconnects is presented.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2024

High-Level Assessment of Grid Infrastructure in Southeast Asia to Support Regional Interconnections

The purpose of this slide deck is to provide an overview of the benefits of interregional transmission and to assess the specific transmission landscape of Southeast Asia, with respect to potential interconnections between Singapore and neighboring countries. This analysis also explores the distribution of renewable resources and electricity demand in ASEAN (the Association of Southeast Asian Nations) as well as current and anticipated interregional transmission, in order to inform future interconnection plans.

ASEAN↗
DOE OSTI2026

Achieving 20.1% Efficiency in Organic Solar Cells Through Interconnected Fibrillar Networks via Local Molecular Stacking

ABSTRACT The performance of organic solar cells (OSCs) is governed by how molecular packing evolves into interconnected networks that facilitate exciton dissociation and charge transport. Using an all‐small‐molecule blend DR3TSBDT:Y6 as a model system, we study how local molecular stacking evolves into performance‐relevant morphology during solvent vapor annealing (SVA) and subsequent thermal annealing (TA). SVA promotes end‐to‐end stacking of amorphous acceptors to form interconnected fibrils, while TA compacts inter‐fibril spacing without disrupting favorable local order. Such molecular‐to‐morphological refinements broaden light absorption, enhance charge transport, and markedly improve device efficiency. Extending this approach to additional blend systems (D18:Y6, D18:L8‐BO, and DR3TSBDT:L8‐BO) yields similar structural evolution and performance gains, with the D18:L8‐BO system achieving up to 20.10% PCE. Our study establishes control over local stacking in amorphous acceptors into fibrillar networks as a general and effective route to realize high‐performance OSCs.

Wu, Junying↗
DOE OSTI2025

PtCoO 2 for Scaled Interconnects

Copper (Cu) interconnects are an increasingly important bottleneck in integrated circuits due to energy consumption and latency caused by the notable increase in Cu resistivity as dimensions decrease, primarily due to electron scattering at surfaces. Herein, the potential of a directional conductor, PtCoO 2 , which has a low bulk resistivity and a distinctive anisotropic structure that mitigates electron surface scattering is showcased. Thin films of PtCoO 2 of various thicknesses are synthesized by molecular beam epitaxy (MBE) coupled with a postdeposition annealing process and the superior quality of PtCoO 2 films is demonstrated by multiple characterization techniques. The thickness‐dependent resistivity curve illustrates that PtCoO 2 significantly outperforms effective Cu (Cu with TaN barriers) and Ru in resistivity below 20.0 nm with a more than 6x reduction compared to effective Cu below 6.0 nm, having a value of only 6.32 μΩ cm at 3.3 nm. It is determined that grain boundary scattering can still be improved for even lower resistivities in this material system through a combination of experiments and theoretical simulations. PtCoO 2 is therefore a highly promising alternative material for future interconnect technologies promising lower resistivities, better stability, and significant improvements in energy efficiency and latency for advanced integrated circuits.

Li, Yansong [Department of Electrical Engineering ↗
DOE OSTI2025

Monthly hydropower generation data for Western Canada to support Western-US interconnect power system studies

Hydroelectric power generation in Western Canada significantly contributes to power grid operations of the North American Western Interconnection through substantial generation, some of which is exported to the United States (U.S.). However, the lack of publicly available hydropower generation datasets poses challenges for future market projections and resource adequacy evaluations. We present a simulation-based monthly power system model-ready hydropower generation dataset for 110 facilities in British Columbia and Alberta from 1981 to 2019. These monthly hydropower generation estimates are developed from integrated hydrologic model simulations of runoff and reservoir-operated streamflow, followed by scaling that considers diversion inflow constraints based on hydropower water license information. To address the lack of comparable hydropower generation records, we conduct step-by-step evaluations for simulated runoff, regulated streamflow, and hydropower generation using available observations or estimates. The presented hydropower dataset aims to enhance the representation of hydropower resources in Western Canada, supporting power grid system studies for the Western Interconnection of the U.S. and Canada.

13 HYDRO ENERGY↗
DOE OSTI2024

Western Interconnection Baseline Study

The purpose of the baseline study is to evaluate the degree to which current industry planning processes meet the national 2035 decarbonization goals for the Western Interconnection. This analysis serves as a comparative baseline for the scenario analysis conducted in the NTP Study using a Western Interconnection dataset that is readily available to industry. This baseline analysis differs from the production cost modeling analysis and power flow analysis in the main NTP Study report (forthcoming). In particular, the analysis presented in this report reflects a business-as-usual future with an optimistic build out of specific planned transmission projects and foreseeable generation. In contrast, the NTP Study models a future generation and transmission expansion based on optimization from a capacity expansion model. The analysis presented herein also reflects a 2030 timeframe, whereas the main NTP Study production cost modeling analysis and power flow analysis reflect a 2035 time frame. This baseline analysis utilizes industry’s most reliable data to account for future transmission projects across various stages of development, with a particular focus on those in the permitting stage. Additionally, it incorporates projections for changes in generation capacity (both additions and retirements). This baseline analysis outlines a probable trajectory, given current process and practice, for the future of the bulk power system with a horizon extending to 2030.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
DOE OSTI2026

A Review of Distributed Wind Interconnection Technology and Standards

The objectives of this report are to discuss the uniqueness of power converters in distributed wind (DW), identify challenges in complying with existing standards, prioritize technological innovations to facilitate interconnection of DW energy systems, and, where necessary, propose potential clarifications or revisions to standards. This report evaluates IEEE 1547-2018, IEEE 1547.1-2020, and UL 1741 SB standards and their implications for DW. A standards review and interviews of DW industry stakeholders were conducted to identify challenges in the application of current standards to DW. The study concludes with a combination of recommendations of pathways towards facilitating DW product commercialization and DW interconnection, which draws on participation from multiple stakeholders in the space. These solutions can continue to be explored to improve DW standards compliance, improve the applicability of the standards to DW, reduce certification testing barriers, and ensure the safe and reliable operation of DW energy resources and electric power systems.

17 WIND ENERGY↗
DOE OSTI2026

Queued Up: 2026 Edition, Characteristics of Power Plants Seeking Transmission Interconnection As of the End of 2025 [Slides]

Electric transmission system operators (ISOs, RTOs, or utilities) require proposed power plants seeking to connect to the transmission grid to undergo a series of impact studies before they can be built. This process establishes what new transmission equipment or upgrades may be needed before a project can connect to the system and assigns the costs of that equipment. The lists of projects in this process are known as “interconnection queues”. In collaboration with https://www.interconnection.fyi. Berkeley Lab compiled, aggregated, and cleaned interconnection queue data from >50 transmission grid operators (7 ISO/RTOs and 50 non-ISO balancing areas), which collectively represent ~98% of currently installed U.S. electric generating capacity.

24 POWER TRANSMISSION AND DISTRIBUTION↗
NASA NTRS1972

Interconnections for fluidic circuits

Circuit elements are grouped on functional basis in rectangular two-dimensional planar arrays or modules. Another interconnection method brings all connections out to module edge. For smaller fluidic circuits, manifold and interconnections are fabricated as single blocks. Advantages of methods are given.

Mangion, C.↗
NASA NTRS1972

Manufacture and quality control of interconnecting wire hardnesses, Volume 1

A standard is presented for manufacture, installation, and quality control of eight types of interconnecting wire harnesses. The processes, process controls, and inspection and test requirements reflected are based on acknowledgment of harness design requirements, acknowledgment of harness installation requirements, identification of the various parts, materials, etc., utilized in harness manufacture, and formulation of a typical manufacturing flow diagram for identification of each manufacturing and quality control process, operation, inspection, and test. The document covers interconnecting wire harnesses defined in the design standard, including type 1, enclosed in fluorocarbon elastomer convolute, tubing; type 2, enclosed in TFE convolute tubing lines with fiberglass braid; type 3, enclosed in TFE convolute tubing; and type 5, combination of types 3 and 4. Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated.

Source record↗
NASA NTRS1972

Development of automatic through-insulation welding for microelectric interconnections

The capability to automatically route, remove insulation from, and weld small-diameter solid conductor wire is presented. This would facilitate the economical small-quantity production of complex miniature electronic assemblies. An engineering model of equipment having this capability was developed and evaluated. Whereas early work in the use of welded magnet wire interconnections was concentrated on opposed electrode systems, and generally used heat to melt the wire insulation, the present method is based on a concentric electrode system and a wire feed system which splits the insulation by application of pressure prior to welding. The work deals with the design, fabrication, and evaluation testing of an improved version of this concentric electrode system. Two different approaches to feeding the wire to the concentric electrodes were investigated. It was concluded that the process is feasible for the interconnection of complex miniature electronic assemblies.

Arnett, J. C.↗
NASA NTRS1974

Solar cell welded interconnection development program

Parallel gap welding and ultrasonic bonding techniques were developed for joining selected interconnect materials (silver, aluminum, copper, silver plated molybdenum and Kovar) to silver-titanium and aluminum contact cells. All process variables have been evaluated leading to establishment of optimum solar cell, interconnect, electrodes and equipment criteria for obtainment of consistent high quality welds. Applicability of nondestructive testing of solar cell welds has been studied. A pre-weld monitoring system is being built and will be utilized in the numerically controlled parallel gap weld station.

Katzeff, J. S.↗
NASA NTRS1976

Stability of interconnected dynamical systems described on Banach spaces

New stability results for a large class of interconnected dynamical systems (also called composite systems or large scale systems) described on Banach spaces are established. In the present approach, the objective is always the same: to analyze large scale systems in terms of their lower order and simpler subsystems and in terms of their interconnecting structure. The present results provide a systematic procedure of analyzing hybrid dynamical systems (i.e., systems that are described by a mixture of different types of equations). To demonstrate the method of analysis advanced, two specific examples are considered.

Rasmussen, R. D.↗
NASA NTRS1981

Panel C report: Standards needed for the use of ISO Open Systems Interconnection - basic reference model

The use of an International Standards Organization (ISO) Open Systems Interconnection (OSI) Reference Model and its relevance to interconnecting an Applications Data Service (ADS) pilot program for data sharing is discussed. A top level mapping between the conjectured ADS requirements and identified layers within the OSI Reference Model was performed. It was concluded that the OSI model represents an orderly architecture for the ADS networking planning and that the protocols being developed by the National Bureau of Standards offer the best available implementation approach.

Source record↗
NASA NTRS1982

Method for sequentially processing a multi-level interconnect circuit in a vacuum chamber

The processing of wafer devices to form multilevel interconnects for microelectronic circuits is described. The method is directed to performing the sequential steps of etching the via, removing the photo resist pattern, back sputtering the entire wafer surface and depositing the next layer of interconnect material under common vacuum conditions without exposure to atmospheric conditions. Apparatus for performing the method includes a vacuum system having a vacuum chamber in which wafers are processed on rotating turntables. The vacuum chamber is provided with an RF sputtering system and a DC magnetron sputtering system. A gas inlet is provided in the chamber for the introduction of various gases to the vacuum chamber and the creation of various gas plasma during the sputtering steps.

Routh, D. E.↗