The Potential for Health Monitoring in Expandable Space Modules: the Bigelow Expandable Activity Module (BEAM) on the ISS
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The term "SiC MCPMs" (wherein "MCPM" signifies "multi-chip power module") denotes electronic power-supply modules containing multiple silicon carbide power devices and silicon-on-insulator (SOI) control integrated-circuit chips. SiC MCPMs are being developed as building blocks of advanced expandable, reconfigurable, fault-tolerant power-supply systems. Exploiting the ability of SiC semiconductor devices to operate at temperatures, breakdown voltages, and current densities significantly greater than those of conventional Si devices, the designs of SiC MCPMs and of systems comprising multiple SiC MCPMs are expected to afford a greater degree of miniaturization through stacking of modules with reduced requirements for heat sinking. Moreover, the higher-temperature capabilities of SiC MCPMs could enable operation in environments hotter than Si-based power systems can withstand. The stacked SiC MCPMs in a given system can be electrically connected in series, parallel, or a series/parallel combination to increase the overall power-handling capability of the system. In addition to power connections, the modules have communication connections. The SOI controllers in the modules communicate with each other as nodes of a decentralized control network, in which no single controller exerts overall command of the system. Control functions effected via the network include synchronization of switching of power devices and rapid reconfiguration of power connections to enable the power system to continue to supply power to a load in the event of failure of one of the modules. In addition to serving as building blocks of reliable power-supply systems, SiC MCPMs could be augmented with external control circuitry to make them perform additional power-handling functions as needed for specific applications: typical functions could include regulating voltages, storing energy, and driving motors. Because identical SiC MCPM building blocks could be utilized in a variety of ways, the cost and difficulty of designing new, highly reliable power systems would be reduced considerably. Several prototype DC-to-DC power-converter modules containing SiC power-switching devices were designed and built to demonstrate the feasibility of the SiC MCPM concept. In anticipation of a future need for operation at high temperature, the circuitry in the modules includes high-temperature inductors and capacitors. These modules were designed to be stacked to construct a system of four modules electrically connected in series and/or parallel. The packaging of the modules is designed to satisfy requirements for series and parallel interconnection among modules, high power density, high thermal efficiency, small size, and light weight. Each module includes four output power connectors two for serial and two for parallel output power connections among the modules. Each module also includes two signal connectors, electrically isolated from the power connectors, that afford four zones for signal interconnections among the SOI controllers. Finally, each module includes two input power connectors, through which it receives power from an in-line power bus. This design feature is included in anticipation of a custom-designed power bus incorporating sockets compatible with snap-on type connectors to enable rapid replacement of failed modules.
In 1989, Boeing announced the fabrication of a tandem gallium concentrator solar cell with an energy conversion efficiency of 30 percent. This research breakthrough has now led to panels which are significantly smaller, lighter, more radiation resistant, and potentially less expensive than the traditional silicon flat plate electric power supply. The new Boeing tandem concentrator (BTC) module uses an array of lightweight silicone Fresnel lenses mounted on the front side of a light weight aluminum honeycomb structure to focus sunlight onto small area solar cells mounted on a thin back plane. This module design is shown schematically. The tandem solar cell in this new module consists of a gallium arsenide light sensitive cell with a 24 percent energy conversion efficiency stacked on top of a gallium antimonide infrared sensitive cell with a conversion efficiency of 6 percent. This gives a total efficiency 30 percent for the cell-stack. The lens optical efficiency is typically 85 percent. Discounting for efficiency losses associated with lens packing, cell wiring, and cell operating temperature still allows for a module efficiency of 22 percent which leads to a module power density of 300 Watts/sq. m. This performance provides more than twice the power density available from a single crystal silicon flat plate module and at least four times the power density available from amorphous silicon modules. The fact that the lenses are only 0.010 ft. thick and the aluminum foil back plane is only 0.003 ft. thick leads to a very lightweight module. Although the cells are an easy to handle thickness of 0.020 ft., the fact that they are small, occupying one-twenty-fifth of the module area, means that they add little to the module weight. After summing all the module weights and given the high module power, we find that we are able to fabricate BTC modules with specific power of 100 watts/kg.
NASA currently projects ending the ISS mission in approximately 2016, due primarily to the expense of re-boost and re-supply. Lunar outposts are expected to be in place in the same timeframe. In support of these mission goals, a scheme to reuse ISS modules on the moon has been identified. These modules could function as pressurized volumes for human habitation in a lunar vacuum as they have done in low-earth orbit. The ISS hull is structurally capable of withstanding a lunar landing because there is no atmospheric turbulence or friction. A compelling reason to send ISS modules to the moon is their large mass; a large portion of the ISS would survive re-entry if allowed to de-orbit to Earth. ISS debris could pose a serious risk to people or structures on Earth unless a controlled re-entry is performed. If a propulsive unit is devised to be attached to the ISS and control re-entry, a propulsion system could be used to propel the modules to the moon and land them there. ISS modules on the lunar surface would not require re-boost. Radiation protection can be attained by burying the module in lunar regolith. Power and a heat removal system would be required for the lunar modules which would need little support structure other than the lunar surface. With planetary mass surrounding the module, heat flux may be controlled by conductance. The remaining requirement is the re-supply of life-support expendables. There are raw materials on the moon to supplement these vital resources. The lunar maria is known to contain approximately 40% oxygen by mass in inorganic mineral compounds. Chemical conversion of moon rocks to release gaseous oxygen is known science. Recycling and cleaning of air and water are currently planned to be accomplished with ISS Environmental Control & Life Support Systems (ECLSS). By developing a Propulsion and Landing Module (PLM) to dock to the Common Berthing Mechanism (CBM), several identical PLMs could be produced to rescue and transfer the ISS modules to the lunar surface, one by one. The propulsion does not need to be as swift as Apollo, nor would the modules need to be manned during transportation to the moon. The trajectory from low-Earth to lunar orbit would avoid or quickly pass through the Van Allen belts to minimize radiation exposure to electronics onboard. A landing technology similar to Apollo's could be utilized to land an ISS module on the moon. Since the mission will be unmanned, system redundancy could be minimized to keep the cost down. If the mission failed and a module crashed landed on the moon, the risk of debris landing on Earth would be avoided and the raw materials could be used in future lunar missions.
Photovoltaic modules were tested for qualification. Tests involved the following: (1) delivery of 20 solar cells for use as reference cells; (2) module documentation and inspection plans specifying the 10 Group I modules; (3) design review of module documentation from Group I modules; (4) revise module documentation to overcome any problems of deficiencies associated with the Group I modules; (5) delivery of 10 Group II modules built to revised specifications; (6) testing of Group II modules to the criteria as outlined in qualification specification. It is found that the solarvolt MSP43E40B satisfies the design criteria of qualification specification for intermediate load modules. Design changes were made in the Group I modules to overcome the deficiencies which allowed Group II modules to pass the qualification tests.
When a linear dynamical system admits more than one inverse, it is known that the pole module of any inverse must contain, either as a submodule or as a factor module, a module of fixed poles isomorphic to the zero module of the original system. Design of the pole module for such an inverse system is resolved by introducing a variable pole module for the inverse, by determining necessary and sufficient conditions for a desired module to be a variable pole module, and by studying the manner in which the fixed and variable modules assemble into the pole module of the inverse. If the fixed and variable pole spectra are disjoint, the pole module of the inverse system is a direct sum of the fixed- and variable-pole modules; if not, procedures for addressing the Jordan structure are presented.
According to a proposal, a silicon dioxide layer in a high-speed, low-power, silicon- based electro-optical modulator would be replaced by a layer of lead zirconate titanate or other ferroelectric oxide material. The purpose of this modification is to enhance the power performance and functionality of the modulator. In its unmodified form, the particular silicon- based electro-optical modulator is of an advanced design that overcomes the speed limitation of prior silicon-based electro- optical modulators. Whereas modulation frequencies of such devices had been limited to about 20 MHz, this modulator can operate at modulation frequencies as high as 1 GHz. This modulator can be characterized as a silicon-waveguide-based metal oxide/semiconductor (MOS) capacitor phase shifter in which modulation of the index of refraction in silicon is obtained by exploiting the free-charge-carrier-plasma dispersion effect. As shown in the figure, the modulator includes an n-doped crystalline silicon slab (the silicon layer of a silicon- on-insulator wafer) and a p-doped polycrystalline silicon rib with a gate oxide layer (the aforementioned silicon dioxide layer) sandwiched between them. Under accumulation conditions, the majority charge carriers in the silicon waveguide modify the index of refraction so that a phase shift is induced in the optical mode propagating in the waveguide. The advantage of using an MOS capacitor phase shifter is that it is possible to achieve high modulation speed because there are no slow carrier-generation or -recombination processes involved in the accumulation operation. The main advantage of the proposed substitution of a ferroelectric oxide layer for the silicon dioxide layer would arise from the spontaneous polarization effect of the ferroelectric layer: This spontaneous polarization would maintain accumulation conditions in the absence of applied voltage. Consequently, once the device had been switched to a given optical state, it would remain in that state, even in the absence of applied voltage (in other words, even with power turned off). A secondary advantage is that because the ferroelectric layer would have an index of refraction larger than that of silicon dioxide, there could be some reduction of optical losses attributable to fabrication of the modulator
A breadboard version of a transmitter for radio communication at a carrier frequency of 32 GHz (which is in the Ka band) utilizes a vector modulator operating at a carrier frequency of 8 GHz (the low end of the X band) to generate any of a number of advanced modulations that could include amplitude and/or phase modulation components. The 8-GHz modulated signal is mixed with a 24-GHz signal generated by an upconverter to obtain the desired 32-GHz modulated output. The transmitter is being developed as a prototype of downlink transmitters for transmission of data from spacecraft to Earth at high rates (>100 Mb/s). The transmitter design could also be adapted to terrestrial and Earth/satellite communication links. The advanced modulations (which can include M-ary phase-shift keying (M-PSK), offset phase-shift keying (OPSK), and M-ary quadrature amplitude modulation (M-QAM). These modulations are needed because for a given amount of signal bandwidth, they enable transmission of data at rates greater than those of older, simpler modulation schemes. The transmitter architecture (see figure) was chosen not only to enable generation of the required modulations at 32 GHz but also to reduce the number of components needed to implement the transmitter. Instead of incorporating an 8-GHz signal source, the transmitter utilizes an 8-GHz signal generated by a voltage-controlled oscillator that is part of an X-band transponder with which the fully developed version of this transmitter would be used in the original intended spacecraft application. The oscillator power is divided onto two paths, one of which goes through the vector modulator, the other through amplifiers and a 3 frequency multiplier. Band-pass filters are included downstream of the frequency multiplier to suppress unwanted harmonics.
A modulator circuit board has recently been developed to be used in conjunction with a vector modulator to generate any of a large number of modulations for bandwidth-efficient radio transmission of digital data signals at rates than can exceed 100 Mb/s. The modulations include quadrature phaseshift keying (QPSK), offset quadrature phase-shift keying (OQPSK), Gaussian minimum-shift keying (GMSK), and octonary phase-shift keying (8PSK) with square-root raised-cosine pulse shaping. The figure is a greatly simplified block diagram showing the relationship between the modulator board and the rest of the transmitter. The role of the modulator board is to encode the incoming data stream and to shape the resulting pulses, which are fed as inputs to the vector modulator. The combination of encoding and pulse shaping in a given application is chosen to maximize the bandwidth efficiency. The modulator board includes gallium arsenide serial-to-parallel converters at its input end. A complementary metal oxide/semiconductor (CMOS) field-programmable gate array (FPGA) performs the coding and modulation computations and utilizes parallel processing in doing so. The results of the parallel computation are combined and converted to pulse waveforms by use of gallium arsenide parallel-to-serial converters integrated with digital-to-analog converters. Without changing the hardware, one can configure the modulator to produce any of the designed combinations of coding and modulation by loading the appropriate bit configuration file into the FPGA.
A cryogenic 160-GHz MMIC heterodyne receiver module has demonstrated a system noise temperature of 100 K or less at 166 GHz. This module builds upon work previously described in Development of a 150-GHz MMIC Module Prototype for Large-Scale CMB Radiation (NPO-47664), NASA Tech Briefs, Vol. 35, No. 8 (August 2011), p. 27. In the original module, the local oscillator signal was saturating the MMIC low-noise amplifiers (LNAs) with power. In order to suppress the local oscillator signal from reaching the MMIC LNAs, the W-band (75 110 GHz) signal had to be filtered out before reaching 140 170 GHz. A bandpass filter was developed to cover 120 170 GHz, using microstrip parallel-coupled lines to achieve the desired filter bandwidth, and ensure that the unwanted W-band local oscillator signal would be sufficiently suppressed. With the new bandpass filter, the entire receiver can work over the 140 180-GHz band, with a minimum system noise temperature of 460 K at 166 GHz. The module was tested cryogenically at 20 K ambient temperature, and it was found that the receiver had a noise temperature of 100 K over an 8-GHz bandwidth. The receiver module now includes a microstrip bandpass filter, which was designed to have a 3-dB bandwidth of approximately 120-170 GHz. The filter was fabricated on a 3-mil-thick alumina substrate. The filter design was based on a W-band filter design made at JPL and used in the QUIET (Q/U Imaging ExperimenT) radiometer modules. The W-band filter was scaled for a new center frequency of 150 GHz, and the microstrip segments were changed accordingly. Also, to decrease the bandwidth of the resulting scaled design, the center gaps between the microstrip lines were increased (by four micrometers in length) compared to the gaps near the edges. The use of the 150-GHz bandpass filter has enabled the receiver module to function well at room temperature. The system noise temperature was measured to be less than 600 K (at room temperature) from 154 to 168 GHz. Additionally, the use of a W-band isolator between the receiver module and the local oscillator source also improved the noise temperature substantially. This may be because the mixer was presented with a better impedance match with the use of the isolator. Cryogenic testing indicates a system noise temperature of 100 K or less at 166 GHz. Prior tests of the MMIC amplifiers alone have resulted in a system noise temperature of 65.70 K in the same frequency range (.160 GHz) when cooled to an ambient temperature of 20 K. While other detector systems may be slightly more sensitive (such as SIS mixers), they require more cooling (to 4 K ambient) and are not as easily scalable to build a large array, due to the need for large magnets and other equipment. When cooled to 20 K, this receiver module achieves approximately 100 K system noise temperature, which is slightly higher than single-amplifier module results obtained at JPL (65.70 K when an amplifier is corrected for back-end noise contributions). If this performance can be realized in practice, and a scalable array can be produced, the impact on cosmic microwave background experiments, astronomical and Earth spectroscopy, interferometry, and radio astronomy in general will be dramatic.
HEMT-based receiver arrays with excellent noise and scalability are already starting to be manufactured at 100 GHz, but the advances in technology should make it possible to develop receiver modules with even greater operation frequency up to 200 GHz. A prototype heterodyne amplifier module has been developed for operation from 140 to 170 GHz using monolithic millimeter-wave integrated circuit (MMIC) low-noise InP high electron mobility transistor (HEMT) amplifiers. The compact, scalable module is centered on the 150-GHz atmospheric window using components known to operate well at these frequencies. Arrays equipped with hundreds of these modules can be optimized for many different astrophysical measurement techniques, including spectroscopy and interferometry. This module is a heterodyne receiver module that is extremely compact, and makes use of 35-nm InP HEMT technology, and which has been shown to have excellent noise temperatures when cooled cryogenically to 30 K. This reduction in system noise over prior art has been demonstrated in commercial mixers (uncooled) at frequencies of 160-180 GHz. The module is expected to achieve a system noise temperature of 60 K when cooled. An MMIC amplifier module has been designed to demonstrate the feasibility of expanding heterodyne amplifier technology to the 140 to 170-GHz frequency range for astronomical observations. The miniaturization of many standard components and the refinement of RF interconnect technology have cleared the way to mass-production of heterodyne amplifier receivers, making it a feasible technology for many large-population arrays. This work furthers the recent research efforts in compact coherent receiver modules, including the development of the Q/U Imaging ExperimenT (QUIET) modules centered at 40 and 90 GHz, and the production of heterodyne module prototypes at 90 GHz.
Future interferometric synthetic aperture radar (InSAR) systems require electronically scanned phased-array antennas, where the transmit/receive (T/R) module is a key component. The T/R module efficiency is a critical figure of merit and has direct implications on the power dissipation and power generation requirements of the system. Significant improvements in the efficiency of the T/R module will make SAR missions more feasible and affordable. The results of two high-efficiency T/R modules are presented, each based on different power amplifier technologies. One module uses a 30W GaAs Class-AlB power amplifier and the second module uses a 70W LD-MOS Class-ElF power amplifier, where both modules use a common low power section. Each module operates over an 80MHz bandwidth at L-band (1.2GHz) with an overall module efficiency greater than 58%. We will present the results of these two T/R modules that have been designed, built and tested.
In support of the Space Station Freedom (SSF) Solar Dynamic Power Module effort, structural design studies were performed to investigate issues related to the design of the power module, its pointing capabilities, and the integration of the module into the SSF infrastructure. Of particular concern from a structural viewpoint are the dynamics of the power module, the impact of the power module on the Space Station dynamics and controls, and the required control effort for obtaining the specified Solar Dynamic Power Module pointing accuracy. Structural analyses were performed to determine the structural dynamics attributes of both the existing and the proposed structural dynamics module designs. The objectives of these analyses were to generate validated Solar Dynamic Power Module NASTRAN finite element models, combine Space Station and power module models into integrated system models, perform finite element modal analyses to assess the effect of the relocations of the power module center of mass, and provide modal data to controls designers for control systems design.
An electro-optic resonant cavity is used to achieve phase modulation with lower driving voltages. Laser damage thresholds are inherently higher than with previously used integrated optics due to the utilization of bulk optics. Phase modulation is achieved at higher speeds with lower driving voltages than previously obtained with non-resonant electro-optic phase modulators. The instant scheme uses a data locking dither approach as opposed to the conventional sinusoidal locking schemes. In accordance with a disclosed embodiment, a resonant cavity modulator has been designed to operate at a data rate in excess of 100 Mbps. By carefully choosing the cavity finesse and its dimension, it is possible to control the pulse switching time to within 4 ns and to limit the required switching voltage to within 10 V. Experimentally, the resonant cavity can be maintained on resonance with respect to the input laser signal by monitoring the fluctuation of output intensity as the cavity is switched. This cavity locking scheme can be applied by using only the random data sequence, and without the need of additional dithering of the cavity. Compared to waveguide modulators, the resonant cavity has a comparable modulating voltage requirement. Because of its bulk geometry, resonant cavity modulator has the potential of accommodating higher throughput power. Furthermore, mode matching into a bulk device is easier and typically can be achieved with higher efficiency. On the other hand, unlike waveguide modulators which are essentially traveling wave devices, the resonant cavity modulator requires that the cavity be maintained in resonance with respect to the incoming laser signal. An additional control loop is incorporated into the modulator to maintain the cavity on resonance.
An assembly that contains a sensor, sensor-signal-conditioning circuitry, a sensor-readout analog-to-digital converter (ADC), data-storage circuitry, and a microprocessor that runs special-purpose software and communicates with one or more external computer(s) has been developed as a prototype of "smart" sensor modules for monitoring the integrity and functionality (the "health") of engineering systems. Although these modules are now being designed specifically for use on rocket-engine test stands, it is anticipated that they could also readily be designed to be incorporated into health-monitoring subsystems of such diverse engineering systems as spacecraft, aircraft, land vehicles, bridges, buildings, power plants, oilrigs, and defense installations. The figure is a simplified block diagram of the "smart" sensor module. The analog sensor readout signal is processed by the ADC, the digital output of which is fed to the microprocessor. By means of a standard RS-232 cable, the microprocessor is connected to a local personal computer (PC), from which software is downloaded into a randomaccess memory in the microprocessor. The local PC is also used to debug the software. Once the software is running, the local PC is disconnected and the module is controlled by, and all output data from the module are collected by, a remote PC via an Ethernet bus. Several smart sensor modules like this one could be connected to the same Ethernet bus and controlled by the single remote PC. The software running in the microprocessor includes driver programs for operation of the sensor, programs that implement self-assessment algorithms, programs that implement protocols for communication with the external computer( s), and programs that implement evolutionary methodologies to enable the module to improve its performance over time. The design of the module and of the health-monitoring system of which it is a part reflects the understanding that the main purpose of a health-monitoring system is to detect damage and, therefore, the health-monitoring system must be able to function effectively in the presence of damage and should be capable of distinguishing between damage to itself and damage to the system being monitored. A major benefit afforded by the self-assessment algorithms is that in the output of the module, the sensor data indicative of the health of the engineering system being monitored are coupled with a confidence factor that quantifies the degree of reliability of the data. Hence, the output includes information on the health of the sensor module itself in addition to information on the health of the engineering system being monitored.
Global measurement of terrestrial snow cover is critical to two of the NASA Earth Science focus areas: (1) climate variability and change and (2) water and energy cycle. For radar backscatter measurements, Ku-band frequencies, scattered mainly within the volume of the snowpack, are most suitable for the SWE (snow-water equivalent) measurements. To isolate the complex effects of different snowpack (density and snowgrain size), and underlying soil properties and to distinctly determine SWE, the space-based synthetic aperture radar (SAR) system will require a dual-frequency (13.4 and 17.2 GHz) and dual polarization approach. A transmit/receive (T/R) module was developed operating at Ku-band frequencies to enable the use of active electronic scanning phased-array antenna for wide-swath, high-resolution SAR imaging of terrestrial snow cover. The T/R module has an integrated calibrator, which compensates for all environmental- and time-related changes, and results in very stable power and amplitude characteristics. The module was designed to operate over the full frequency range of 13 to 18 GHz, although only the two frequencies, 13.4 GHz and 17.2 GHz, will be used in this SAR radar application. Each channel of the transmit module produces > 4 W (35 dbm) over the operating bandwidth of 20 MHz. The stability requirements of <0.1 dB receive gain accuracy and <0.1 dB transmit power accuracy over a wide temperature range are achieved using a self-correction scheme, which does real-time amplitude calibration so that the module characteristics are continually corrected. All the calibration circuits are within the T/R module. The timing and calibration sequence is stored in a control FPGA (field-programmable gate array) while an internal 128K 8bit high-speed RAM (random access memory) stores all the calibration values. The module was designed using advanced components and packaging techniques to achieve integration of the electronics in a 2 x6.5x1-in. (5x17x2.5-cm) package. The module size allows 4 T/R modules to feed the 16 16-element subarray on an antenna panel. The T/R module contains four transmit channels and eight receive channels (horizontal and vertical polarizations).