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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5

PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling

Lateral gallium nitride (GaN) high-electron-mobility transistors (HEMTs) present better electrical characteristics compared to silicon or silicon carbide devices such as high switching speed and low gate charge, but also present additional challenges on the module design. Here, this paper discusses a high-density GaN power module with double-sided cooling, low inductance, on-package decoupling capacitors, and integrated gate drivers. The GaN dies as well as the gate drive are sandwiched between the printed circuit board (PCB) and direct bonded copper (DBC) substrate to achieve compact loop and double-sided cooling effect. Design considerations and thermal performance are analyzed. A module assembly procedure is presented utilizing the layer-by-layer attachment process. Finally, a 2.7 cm x 1.8 cm half-bridge GaN power module is fabricated and tested, achieving a low power-loop inductance of 1.03 nH, and the overshoot voltage of the switching waveform is less than 5% under a 400-V/25-A double-pulse test. The thermal resistance is 0.32 K/W, verified by simulation and experimental results. The design and assembly process can be generalized and applied to high power applications to achieve high power density and high performance.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

GT SUITE Fuel Cell Model Validation with Power Module Test Data

The AES Modular Power Systems (AMPS) Fuel Cell team at the NASA Glenn Research Center (GRC) has created a Microsoft Excel model of a regenerative fuel cell (RFC) system for potential lunar and Martian applications. Due to some limitations of this model, including the ability to predict transient effects in the thermal and fluidic performance of the system, a system-level transient thermal/fluids model was desired. GT-SUITE is a transient multi-physics simulation tool that is popular in the automotive industry and has a built in template for proton exchange membrane (PEM) fuel cells. However, terrestrial fuel cells used in the automotive industry vary significantly from aerospace fuel cells. A validation effort was undertaken to compare GT SUITE model results to actual data collected during the 2015 AMPS Power Module Demonstration in which the AMPS team used a PEM fuel cell system to power a 478 kg rover assembly at the Dunes test site located at GRC. The purpose of the model was to evaluate the efficacy of using GT SUITE to model a non-flow through PEM fuel cell system. The validation effort examined electrochemical performance including fuel cell stack voltage and power supplied, the thermal performance of the stack namely stack temperature and heat rejection rates, and the fluidic performance of the system including pressures, reactant consumption, and water production rates.

Gilligan, Ryan↗

Fuel Cell Model Validation with Power Module Test Data

The AES Modular Power Systems (AMPS) Fuel Cell team at the NASA Glenn Research Center (GRC) has created a Microsoft Excel model of a regenerative fuel cell (RFC) system for potential lunar and Martian applications. Due to some limitations of this model, including the ability to predict transient effects in the thermal and fluidic performance of the system, a system-level transient thermal/fluids model was desired. GT-SUITE is a transient multi-physics simulation tool that is popular in the automotive industry and has a built-in template for proton exchange membrane (PEM) fuel cells. However, terrestrial fuel cells used in the automotive industry vary significantly from aerospace fuel cells. A validation effort was undertaken to compare GT SUITE model results to actual data collected during the 2015 AMPS (Advanced Exploration Systems (AES) Modular Power Systems) Power Module Demonstration in which the AMPS team used a PEM fuel cell system to power a 478 kilogram rover assembly at the Dunes test site located at GRC. The purpose of the model was to evaluate the efficacy of using GT SUITE to model a non-flow through PEM fuel cell system. The validation effort examined electrochemical performance including fuel cell stack voltage and power supplied, the thermal performance of the stack namely stack temperature and heat rejection rates, and the fluidic performance of the system including pressures, reactant consumption, and water production rates.

Model Validation↗

SiC MOSFET Based Power Module Design and Analysis for EV Traction Systems

Wide bandgap (WBG) power semiconductor devices, specifically silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) have gained attention from electric vehicle (EV) system developers due to well-known superior properties in comparison to industry standard silicon (Si) based MOSFETs and insulated-gate bipolar transistors (IGBTs). In this work, a power module design based on SiC MOSFETs in a segmented two-level, three-phase inverter topology with 125 kW peak output power and 30 kHz switching frequency is presented. Three different SiC MOSFET die options are analyzed according to experimentally obtained operating conditions of a commercial EV traction system. Substrate design of the power module for multi-die layout, heat sink design, and integration of a segmented phase leg module are presented. Finite-element electrical and thermal analysis of the proposed system are presented and discussed.

Gurpinar, Emre↗

The 25 kW power module - First step beyond the baseline STS

The backbone of the first reusable Space Transportation System (STS) is the Space Shuttle. The 25 kW Power Module is currently being defined by NASA as the first significant increment in capability beyond the baseline STS and is to be available for use in 1983. The Power Module is an orbit-based space system which will augment the capability of the Space Shuttle Orbiter to support Spacelab sortie missions and will provide a unique free-flying mode for a variety of payloads which require high capability, long duration, and man-tended operation. The Power Module will make it possible for the Space Shuttle Orbiter and Spacelab to remain on-orbit for periods of time significantly in excess of that provided by the baseline STS (7 days) without major penalty to the Shuttle and its payload.

Mordan, G. W.↗

Towers: Critical Initial Infrastructure for the Moon, Such as a Power Module Support

Towers are an efficient structure commonly used to elevate systems against a gravity field, such as above the surface of a planet or the Moon. Towers can be used to elevate antennas, transmitters and sensors for communication, navigation, and observation infrastructure in support of surface operations. Near the Lunar poles, elevation of rotating solar panels enables nearly continuous panel illumination for solar power production despite the Sun remaining near the horizon year-round. Further, once technology is developed for tower assembly, this same technology can be extended to the assembly of a variety of structures including rocket blast containment shields, bridges, shelters, and habitats from either Earth-sourced or Lunar-sourced structural members. Environmental factors on the Lunar surface are vastly different than those found on Earth and have significant impact on the design of towers. Towers designed for the Lunar surface have no heritage nor Earth analog. The designs discussed herein are therefore breaking new ground creating a fundamentally new class of structures outside of current experience and intuition. The purpose of this paper is to: a) describe the unique environmental factors affecting tower design on the Lunar surface compared to Earth-based systems, b) evaluate two structural forms for the tower; telescoping tubes and an assembled truss, as well as c)provide recommendations on when each structural form is most suitable. A major contribution presented in the current paper is to provide parametric plots and supporting equations of mass and volume versus module power level and blanket height above the Lunar surface for the solar array application, to enable system level studies of optimum power module distribution and size. A secondary contribution are plots of the mass and volume of aluminum or structural glass required for assembled truss towers formed from Lunar derived structural members. An objective of achieving 1 MW of total power has been used to enable comparison of structural forms, because the total mass of solar arrays is consistent. It will be shown that for moderate module sizes, up to ~50 kW power modules, based on a telescoping tube tower have advantages, but for power modules from 50 kW to 200 kW an assembled truss tower can be created with half to one third of the tube tower mass. More significantly, when shipped from Earth, an assembled truss tower can be packed into 1/14th to 1/25th of the tube tower volume. Truss designs in the 100 kW to 200 kW range will be shown to be a favorable when assembled from either graphite-epoxy angles shipped from Earth or aluminum angles fabricated from Lunar materials. 50 kW towers are an attractive choice for both a telescoping or assembled tower with the solar arrays elevated 10 m above the Lunar surface, while increased solar array elevation favors 100 kW to 200 kW power modules.

assembly↗

Engineering aspects of a thermal control subsystem for the 25 kW power module

The paper presents the key trade study results, analysis results, and the recommended thermal control approach for the 25 kW power module defined by NASA. Power conversion inefficiencies and component heat dissipation results in a minimum heat rejection requirement of 9 kW to maintain the power module equipment at desired temperature levels. Additionally, some cooling capacity should be provided for user payloads in the sortie and free-flying modes. The baseline thermal control subsystem includes a dual-loop-pumped Freon-21 coolant with the heat rejected from deployable existing orbiter radiators. Thermal analysis included an assessment of spacecraft orientations, radiator shapes and locations, and comparison of hybrid heat pipe and all liquid panels.

Schroeder, P. E.↗

Automation in the Space Station module power management and distribution Breadboard

The Space Station Module Power Management and Distribution (SSM/PMAD) Breadboard, located at NASA's Marshall Space Flight Center (MSFC) in Huntsville, Alabama, models the power distribution within a Space Station Freedom Habitation or Laboratory module. Originally designed for 20 kHz ac power, the system is now being converted to high voltage dc power with power levels on a par with those expected for a space station module. In addition to the power distribution hardware, the system includes computer control through a hierarchy of processes. The lowest level process consists of fast, simple (from a computing standpoint) switchgear, capable of quickly safing the system. The next level consists of local load center processors called Lowest Level Processors (LLP's). These LLP's execute load scheduling, perform redundant switching, and shed loads which use more than scheduled power. The level above the LLP's contains a Communication and Algorithmic Controller (CAC) which coordinates communications with the highest level. Finally, at this highest level, three cooperating Artificial Intelligence (AI) systems manage load prioritization, load scheduling, load shedding, and fault recovery and management. The system provides an excellent venue for developing and examining advanced automation techniques. The current system and the plans for its future are examined.

Walls, Bryan↗

Characterization and Analysis of Insulated Metal Substrate-Based SiC Power Module for Traction Application

This paper presents the electrical characterization and drive cycle--based thermal analysis of an insulated metal substrate (IMS)--based silicon carbide power module for high-power traction inverters. The substrate was constructed using a thin layer of polymer--ceramic blend dielectric material with a thick copper core to improve transient thermal performance. The cooling performance of this module has already been validated with promising results. In this paper, an experimental test bed was set up to evaluate the dynamic and static electrical performance of the designed module under a wide range of operating conditions. The characterization results were then used to develop a drive cycle--based thermal model to validate the performance compared to the traditional direct bonded copper--based power module. The results indicate that the IMS-based power module is a suitable solution for high-power traction applications.

Chowdhury, Shajjad↗

Power module assembly with reduced inductance

A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

42 ENGINEERING↗

A Smart Silicon Carbide Power Module With Pulse Width Modulation Over Wi-Fi and Wireless Power Transfer-Enabled Gate Driver, Featuring Onboard State of Health Estimator and High-Voltage Scaling Capabilities

A wide range of utility applications require controllable switches with features such as high-voltage blocking and high-current carrying capacity, especially at high pulse width modulation (PWM) frequency. Low- and medium-voltage utility applications such as motor drives and flexible AC transmission systems as well as solid state transformers could also benefit from a low-cost high-voltage switching module. Wide-bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) metal oxide semiconductor field effect transistors (MOSFETs) are considered to be the present and next-generation device choices, although they have limitations. For relatively high-voltage applications with demanding thermal management, SiC is still the only choice, and GaN dominates the low-voltage regime. This manuscript proposes a new half-bridge power MOSFET module that is suitable for conventional H-bridge of multilevel configurations used in high-voltage applications. Constructed from bare SiC dies, this half-bridge module takes advantage of (1) optimized MOSFET placement inside the module, (2) customized heat exchanger, manifold, and cooling, (3) integrated gate driver module with pulse width modulation (PWM) over wi-fi to eliminate the need for low-voltage signals, (4) wireless power transfer (WPT)-enabled gate driver and other ancillary circuits, (5) and the option to incorporate an onboard state-of-health (SOH) estimator module. The entire architecture has been designed and built at the National Renewable Energy Laboratory (NREL) in Golden, CO.

Ga2O3 devices↗

A Smart Silicon Carbide Power Module With Pulse Width Modulation Over Wi-Fi and Wireless Power Transfer-Enabled Gate Driver, Featuring Onboard State of Health Estimator and High-Voltage Scaling Capabilities: Preprint

A wide range of utility applications require controllable switches with features such as high-voltage (HV) blocking and high-current carrying capacity especially at high pulse width modulation (PWM) frequency. Low and medium voltage utility applications such as motor drives and flexible AC transmission systems (FACTS) as well as solid state transformers (SST) could also benefit from a low-cost HV switching module. Wide band gap (WBG) semiconductors such as SiC and GaN MOSFETs are considered to be the present and next generation device choices, although they have their own limitations. For relatively HV applications with demanding thermal management, SiC is still the only choice, and GaN dominates the low voltage regime. This manuscript proposes a new half bridge power MOSFET module that is suitable for conventional H-bridge of multilevel configurations used in HV applications. Constructed from bare SiC dies, this half bridge module takes advantage of (1) optimized MOSFET placement inside the module, (2) customized heat exchanger, manifold and cooling, (3) integrated gate driver module with PWM over wi-fi to eliminate the need for low voltage signals, (4) wireless power transfer (WPT) enabled gate driver and other ancillary circuits, (5) and the option to incorporate an onboard state of health (SOH) estimator module onboard. The entire architecture has been designed and built at National Renewable Energy Laboratory (NREL), Golden, CO.

baseplate design↗

Space Station Module Power Management and Distribution System (SSM/PMAD)

This report provides an overview of the Space Station Module Power Management and Distribution (SSM/PMAD) testbed system and describes recent enhancements to that system. Four tasks made up the original contract: (1) common module power management and distribution system automation plan definition; (2) definition of hardware and software elements of automation; (3) design, implementation and delivery of the hardware and software making up the SSM/PMAD system; and (4) definition and development of the host breadboard computer environment. Additions and/or enhancements to the SSM/PMAD test bed that have occurred since July 1990 are reported. These include: (1) rehosting the MAESTRO scheduler; (2) reorganization of the automation software internals; (3) a more robust communications package; (4) the activity editor to the MAESTRO scheduler; (5) rehosting the LPLMS to execute under KNOMAD; implementation of intermediate levels of autonomy; (6) completion of the KNOMAD knowledge management facility; (7) significant improvement of the user interface; (8) soft and incipient fault handling design; (9) intermediate levels of autonomy, and (10) switch maintenance.

Miller, William↗

Design of a nuclear isotope heat source assembly for a spaceborne mini-Brayton power module.

Results of a study to develop a feasible design definition of a heat source assembly (HSA) for use in nominal 500-, 1200-, or 2000-W(e) mini-Brayton spacecraft power systems. The HSA is a modular design which is used either as a single unit to provide thermal energy to the 500-W(e) mini-Brayton power module or in parallel with one or two additional HSAs for the 1200- or 2000-W(e) power module systems. Principal components consist of a multihundred watt RTG isotope heat source, a heat source heat exchanger which transfers the thermal energy from the heat source to the mini-Brayton power conversion system, an auxiliary cooling system which provides requisite cooling during nonoperation of the power conversion module and an emergency cooling system which precludes accidental release of isotope fuel in the event of system failure.

Wein, D.↗

Augmentation of the space station module power management and distribution breadboard

The space station module power management and distribution (SSM/PMAD) breadboard models power distribution and management, including scheduling, load prioritization, and a fault detection, identification, and recovery (FDIR) system within a Space Station Freedom habitation or laboratory module. This 120 VDC system is capable of distributing up to 30 kW of power among more than 25 loads. In addition to the power distribution hardware, the system includes computer control through a hierarchy of processes. The lowest level consists of fast, simple (from a computing standpoint) switchgear that is capable of quickly safing the system. At the next level are local load center processors, (LLP's) which execute load scheduling, perform redundant switching, and shed loads which use more than scheduled power. Above the LLP's are three cooperating artificial intelligence (AI) systems which manage load prioritizations, load scheduling, load shedding, and fault recovery and management. Recent upgrades to hardware and modifications to software at both the LLP and AI system levels promise a drastic increase in speed, a significant increase in functionality and reliability, and potential for further examination of advanced automation techniques. The background, SSM/PMAD, interface to the Lewis Research Center test bed, the large autonomous spacecraft electrical power system, and future plans are discussed.

Walls, Bryan↗

Gate Drive Technology Evaluation and Development to Maximize Switching Speed of SiC Discrete Devices and Power Modules in Hard Switching Applications

To understand the limitation of maximizing the switching speed of SiC low current discrete devices and high current power modules in hard switching applications, double pulse tests are conducted and the testing results are analyzed. For power modules, the switching speed is generally limited by the parasitics rather than the gate drive capability. For the discrete SiC device, the conventional voltage source gate drive (VSG) is not sufficient to maximize the switching speed even if the external gate resistance is minimized. The limitation of existing current source gate drives (CSG) are analyzed, and a CSG dedicated for SiC discrete devices is proposed, which can provide constant current during the switching transient regardless of the high Miller voltage and large internal gate resistance. Compared with the conventional VSG, the proposed CSG achieves 67% faster turnon time and 50% turn-off time, and 68% reduction in switching loss at full load condition.

Handong Gui↗

Evaluation of Low-Pressure-Sintered Multi-Layer Substrates for Medium-Voltage SiC Power Modules: Preprint

Direct-bonded aluminum (DBA) multi-layer substrates have been fabricated using low-pressure silver sintering. These multi-layer substrates can be used to reduce the peak electric field strength inside power modules. This benefit is particularly important for medium-voltage silicon carbide (SiC) MOSFETs due to their higher operating voltages. The voiding content and defect density of the bond used to create the multi-layer substrate stackup is critical to the thermal performance and reliability of the power module. This work two low-pressure-assisted sintering techniques; one using nano-silver preform and the other using nano-silver paste to bond 23 mm by 49 mm DBA substrates. Scanning acoustic microscopy (C-SAM) is used to evaluate the bond quality after sintering. To evaluate the reliability of the sintered multi-layer substrates, passive thermal cycling from –40 °C to 200 °C was performed. Cross-sections were cut at pre-determined intervals and imaged with Scanning Electron Microscopy (SEM). After 1,000 thermal cycles, minor cracking was observed, but no failures have occurred.

28 EE - Advanced Manufacturing Office (EE-5A)↗