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At least 91 records · Page 5

MEMS-Based Satellite Micropropulsion Via Catalyzed Hydrogen Peroxide Decomposition

Micro-electromechanical systems (MEMS) techniques offer great potential in satisfying the mission requirements for the next generation of "micro-scale" satellites being designed by NASA and Department of Defense agencies. More commonly referred to as "nanosats", these miniature satellites feature masses in the range of 10-100 kg and therefore have unique propulsion requirements. The propulsion systems must be capable of providing extremely low levels of thrust and impulse while also satisfying stringent demands on size, mass, power consumption and cost. We begin with an overview of micropropulsion requirements and some current MEMS-based strategies being developed to meet these needs. The remainder of the article focuses the progress being made at NASA Goddard Space Flight Center towards the development of a prototype monopropellant MEMS thruster which uses the catalyzed chemical decomposition of high concentration hydrogen peroxide as a propulsion mechanism. The products of decomposition are delivered to a micro-scale converging/diverging supersonic nozzle which produces the thrust vector; the targeted thrust level approximately 500 N with a specific impulse of 140-180 seconds. Macro-scale hydrogen peroxide thrusters have been used for satellite propulsion for decades; however, the implementation of traditional thruster designs on a MEMS scale has uncovered new challenges in fabrication, materials compatibility, and combustion and hydrodynamic modeling. A summary of the achievements of the project to date is given, as is a discussion of remaining challenges and future prospects.

Hitt, Darren L.↗

MEMS Using SOI Substrate

At NASA, the focus for smaller, less costly missions has given impetus for the development of microspacecraft. MicroElectroMechanical System (MEMS) technology advances in the area of sensor, propulsion systems, and instruments, make the notion of a specialized microspacecraft feasible in the immediate future. Similar to the micro-electronics revolution,the emerging MEMS technology offers the integration of recent advances in micromachining and nanofabrication techniques with microelectronics in a mass-producible format,is viewed as the next step in device and instrument miniaturization. MEMS technology offers the potential of enabling or enhancing NASA missions in a variety of ways. This new technology allows the miniaturization of components and systems, where the primary benefit is a reduction in size, mass and power. MEMS technology also provides new capabilities and enhanced performance, where the most significant impact is in performance, regardless of system size. Finally,with the availability of mass-produced, miniature MEMS instrumentation comes the opportunity to rethink our fundamental measurement paradigms. It is now possible to expand our horizons from a single instrument perspective to one involving multi-node distributed systems. In the distributed systems and missions, a new system in which the functionality is enabled through a multiplicity of elements. Further in the future, the integration of electronics, photonics, and micromechanical functionalities into "instruments-on-a-chip" will provide the ultimate size, cost, function, and performance advantage. In this presentation, I will discuss recent development, requirement, and applications of various MEMS technologies and devices for space applications.

Tang, Tony K.↗

Performance of multifunctional piezoelectric energy harvesting microgyroscopes with material degradation

Most microelectromechanical systems (MEMS) are made from brittle materials that are prone to cracking. Damage from the formation of cracks can occur anytime during the manufacturing process or due to mechanical loading of MEMS devices. Cracks can increase the structures flexibility and lead to changes in performance or total failure. Understanding the potential influences cracks in MEMS is necessary for the longevity of these systems. The energy harvesting microgyroscope studied in this work is susceptible to crack propagation in its silicon substrate and lead zirconate titanate piezoelectric patch. To this end, an electromechanical model is developed to capture the impacts of cracks on the performance of a damaged energy harvesting microgyroscope. Numerical methods are used to approximate the damage associated with distributed crack networks. Then, the static and dynamic responses of the damaged microgyroscope are analyzed for two possible multifunctional setups. Here, the current study revealed that cracks can significantly affect the static and dynamic behaviors of the microgyroscope energy harvester. Combinations of cracking and piezoelectric property degradation cause a decrease in the static pull-in voltage and shift the resonance frequencies of the system. Additionally, it is shown that the systems sensitivity to changes in the base rotation and energy harvesting capabilities vary widely depending on the severity of material degradation.

36 MATERIALS SCIENCE↗

The Inertial Stellar Compass (ISC): A Multifunction, Low Power, Attitude Determination Technology Breakthrough

The Inertial Stellar Compass (ISC) is a miniature, low power, stellar inertial attitude determination system with an accuracy of better than 0.1 degree (1 sigma) in three axes. The ISC consumes only 3.5 Watts of power and is contained in a 2.5 kg package. With its embedded on-board processor, the ISC provides attitude quaternion information and has Lost-in-Space (LIS) initialization capability. The attitude accuracy and LIS capability are provided by combining a wide field of view Active Pixel Sensor (APS) star camera and Micro- ElectroMechanical System (MEMS) inertial sensor information in an integrated sensor system. The performance and small form factor make the ISC a useful sensor for a wide range of missions. In particular, the ISC represents an enabling, fully integrated, micro-satellite attitude determination system. Other applications include using the ISC as a single sensor solution for attitude determination on medium performance spacecraft and as a bolt on independent safe-hold sensor or coarse acquisition sensor for many other spacecraft. NASA's New Millennium Program (NMP) has selected the ISC technology for a Space Technology 6 (ST6) flight validation experiment scheduled for 2004. NMP missions, such a s ST6, are intended to validate advanced technologies that have not flown in space in order to reduce the risk associated with their infusion into future NASA missions. This paper describes the design, operation, and performance of the ISC and outlines the technology validation plan. A number of mission applications for the ISC technology are highlighted, both for the baseline ST6 ISC configuration and more ambitious applications where ISC hardware and software modifications would be required. These applications demonstrate the wide range of Space and Earth Science missions that would benefit from infusion of the ISC technology.

Bauer, Frank H.↗

Miniature On-Board Angle of Attack Measurement System for Hypersonic Facilities

The most prevalent method of establishing model angle of attack (AoA) in hypersonic wind tunnel facilities is using an encoder in the model support system then calculating sting/balance deflections based on balance output. This method has been shown to be less accurate than on-board methods in subsonic and transonic facilities and preliminary indications, as compared to optical methods, show large discrepancies in a hypersonic facility as well. With improvements in Micro-Electro- Mechanical Systems (MEMS) accelerometer technology more accurate onboard AoA measurement systems are now available for the small models usually found in hypersonic research facilities.

Crawford, Bradley L.↗

Getters for Reliable Hermetic Packages

A variety of sealed-off devices such as cathode ray tubes (CRT's) electron tubes, plasma displays, particle accelarators and colliders vacuum thermal insulation, ultra-high vacuum (UHV), extreme high vacuum (XHV) systems for semiconductor processing, X-ray tubes, lamps, field-emission displays (FEDs) flat panel displays (FPDs), some microelectromechanical systems (MEMS) and science instruments for space applications, nuclear systems require a vacuum for their successful operation.

getters hermetic packaging electronic↗

Aerospace Sensor Systems: From Sensor Development To Vehicle Application

This paper presents an overview of years of sensor system development and application for aerospace systems. The emphasis of this work is on developing advanced capabilities for measurement and control of aeropropulsion and crew vehicle systems as well as monitoring the safety of those systems. Specific areas of work include chemical species sensors, thin film thermocouples and strain gages, heat flux gages, fuel gages, SiC based electronic devices and sensors, space qualified electronics, and MicroElectroMechanical Systems (MEMS) as well as integrated and multifunctional sensor systems. Each sensor type has its own technical challenges related to integration and reliability in a given application. The general approach has been to develop base sensor technology using microfabrication techniques, integrate sensors with "smart" hardware and software, and demonstrate those systems in a range of aerospace applications. Descriptions of the sensor elements, their integration into sensors systems, and examples of sensor system applications will be discussed. Finally, suggestions related to the future of sensor technology will be given. It is concluded that smart micro/nano sensor technology can revolutionize aerospace applications, but significant challenges exist in maturing the technology and demonstrating its value in real-life applications.

Hunter, Gary W.↗

Mass Spectrometry for Planetary Probes: Past, Present and Future

Atmospheric entry probes present a unique opportunity for performing quantitative analysis of extra-terrestrial atmospheres in cases where remote sensing alone may not be sufficient and measurements with balloons or aircraft is not practical. An entry probe can provide a complete vertical profile of atmospheric parameters including chemical composition, which cannot be obtained with most other techniques. There are, however, unique challenges associated with building instruments for an entry probe, as compared to orbiters, landers, or rovers. Conditions during atmospheric entry are extreme, there are inherent time constraints due to the short duration of the experiment, and the instrument experiences rapid environmental changes in temperature and pressure as it descends. In addition, there are resource limitations, i.e. mass, power, size and bandwidth. Finally, the demands on the instrument design are determined in large part by conditions (pressure, temperature, composition) unique to the particular body under study, and as a result there is no one-size-fits-all instrument for an atmospheric probe. Many of these requirements can be more easily met by miniaturizing the probe instrument. Our experience building mass spectrometers for atmospheric entry probes leads us to believe that the time is right for a fundamental change in the way spaceflight mass spectrometers are built. The emergence over the past twenty years of Micro-electro- mechanical Systems (MEMS), utilizing lithographic semiconductor fabrication techniques to produce instrument systems in miniature, holds great promise for application to spaceflight mass spectrometry. A highly miniaturized, high performance and low-power mass spectrometer would be an enormous benefit to future entry probe missions, allowing, for example, parallel measurements (e.g., multiple simultaneous gas chromatographic analyses and direct atmospheric leaks.) Such an instrument would also enable mass spectrometry on board small multiple entry probes. In the development of a MEMS Mass Spectrometer, the challenge facing us is to move beyond the proof-of-concept, where research dollars tend to focus, and carry out the detailed work of developing a high performance mass spectrometer system on a chip which meets the unique technical requirements for an atmospheric entry probe described above.

Niemann, Hasso B.↗

MEMS AO for Planet Finding

This slide presentation reviews a method for planet finding using microelectromechanical systems (MEMS) Adaptive Optics (AO). The use of a deformable mirror (DM) is described as a part of the instrument that was designed with a nulling interferometer. The strategy that is used is described in detail.

calibration interferometer↗

Development of Probabilistic Life Prediction Methodologies and Testing Strategies for MEMS

This effort is to investigate probabilistic life prediction methodologies for MicroElectroMechanical Systems (MEMS) and to analyze designs that determine stochastic properties of MEMS. This includes completion of a literature survey regarding Weibull size effect in MEMS and strength testing techniques. Also of interest is the design of a proper test for the Weibull size effect in tensile specimens. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. Another potential item of interest is analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structuredlife (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads. Along these lines work may also be performed on transient fatigue life prediction methodologies.

Jadaan, Osama M.↗

MEMS Microshutter Array System for James Webb Space Telescope

A complex MEMS microshutter array system has been developed at NASA Goddard Space Flight Center (GSFC) for use as a multi-object aperture array for a Near-Infrared Spectrometer (NIRSpec). The NIRSpec is one of the four major instruments carried by the James Webb Space Telescope (JWST), the next generation of space telescope after the Hubble Space Telescope retires. The microshutter arrays (MSAs) are designed for the selective transmission of light with high efficiency and high contrast. It is demonstrated in Figure 1 how a MSA is used as a multiple object selector in deep space. The MSAs empower the NIRSpec instrument simultaneously collect spectra from more than 100 targets therefore increases the instrument efficiency 100 times or more. The MSA assembly is one of three major innovations on JWST and the first major MEMS devices serving observation missions in space. The MSA system developed at NASA GSFC is assembled with four quadrant fully addressable 365x171 shutter arrays that are actuated magnetically, latched and addressed electrostatically. As shown in Figure 2, each MSA is fabricated out of a 4' silicon-on-insulator (SOI) wafer using MEMS bulk-micromachining technology. Individual shutters are close-packed silicon nitride membranes with a pixel size close to 100x200 pm (Figure 3). Shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. In order to prevent light leak, light shields are made on to the surrounding frame of each shutter to cover the gaps between the shutters and the Game (Figure 4). Micro-ribs and sub-micron bumps are tailored on hack walls and light shields, respectively, to prevent sticktion, shown in Figures 4 and 5. JWST instruments are required to operate at cryogenic temperatures as low as 35K, though they are to be subjected to various levels of ground tests at room temperature. The shutters should therefore maintain nearly flat in the entire temperature range between 35K and 300K. Through intensive numerical simulations and experimental studies, an optically opaque and electrically conductive metal-nitride thin film was selected as a coating material deposited on the shutters with the best thermal-expansion match to silicon nitride - the shutter blade thin film material. A shutter image shown in Figure 6 was taken at room temperature, presenting shutters slightly bowing down as expected. Shutters become flat when the temperature decreases to 35K. The MSAs are then bonded to silicon substrates that are fabricated out of 6" single-silicon wafers in the thickness of 2mm. The bonding is conducted using a novel single-sided indium flip-chip bonding technology. Indium bumps fabricated on a substrate are shown in Figure 7. There are 180,000 indium bumps for bonding a flight format MSA array to its substrate. Besides a MSA, each substrate houses five customer-designed ASIC (Application Specific Integrated Circuit) multiplexer/address chips for 2-dimensional addressing, twenty capacitors, two temperature sensors, numbers of resistors and all necessary interconnects, as shown in Figure 8. Complete MSA quadrant assemblies have been successfully manufactured and fully functionally tested. The assemblies have passed a series of critical reviews required by JWST in satisfying all the design specifications. The qualification tests cover programmable 2-D addressing, life tests, optical contrast tests, and environmental tests including radiation, vibration, and acoustic tests. A 2-D addressing pattern with 'ESA' letters programmed in a MSA is shown in Figure 9. The MSAs passed 1 million cycle life tests and achieved high optical contrast over 10,000. MSA teams are now making progress in final fabrication, testing and assembly (Figure 10). The delivery of flight-format MSA system is scheduled at the end of 2008 for being integrated to the focal plane of the NIRSpec detectors.

Li, Mary J.↗

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗

Additive Manufacturing of Energy Harvesting Material System for Active Wireless MEMS Sensors

Combustion systems make up a large sum of the world’s yearly energy production despite advances in renewable energy sources. Precise control of pressure and temperature in combustion chambers allows for lower carbon emissions, and overall higher efficiency. Wireless temperature and pressure sensors are critical for the operation of combustion chambers. Energy harvesters have emerged as a viable way to power wireless sensors when heat and mechanical energy are available. Lithium niobate (LNB), barium titanate (BTO), and lead zirconate titanate (PZT) pyroelectric ceramics were studied and fabricated through additive manufacturing (AM) for use as energy harvesting structures in combustion environments. The electric power generation potential of LNB and PZT ceramics was studied by varying the temperature from 50 to 60 °C and by introducing cyclic compression loads of 2000 N amplitude. It was found that thermal energy conversion had the highest output of 500 nW and that combined thermal and mechanical conversion did not increase the harvesting potential because of the competing contributions of both effects. Powder bed and slurry extrusion AM methods were used to fabricate BTO and PZT ceramic structures. Optimization of the powder-based binder jetting method produced BTO ceramics with a relative density of 36.77% a piezoelectric coefficient of 153 pC/N. The density of the ceramics increased up to 56% when increasing the saturation of binder in the powder to because of liquid phase sintering. Finally, PZT structures were manufactured through AM and fin features were added to the design to enhance the heat transfer along the material. The harvested power density of the flat samples was 3.643 μW/cm 3 and of the finned samples was 3.034 μW/cm3. This research paves the ways for the development of self-powered wireless sensors in critical areas of operation such as combustion.

01 COAL, LIGNITE, AND PEAT↗

MEMS Memory Elements

This paper presents a design example that illustrates the potential of microelectromechanical systems (MEMS) to perform the mechanical positioning required for addressing stored data and to enable an entirely new mechanism for reading and writing magnetic data. Specifically, MEMS sensors and actuators can be used to achieve active servo control of the separation between magnetic probe tips and a media surface with sub-nanometer accuracy. This allows mechanical position to be used to selectively write magnetic marks in a continuous thin-film magnetic media. In addition, MEMS sensors can be used to measure the separation between a magnetic probe tip and the media with a noise floor of roughly 22 picometers, allowing them to be used as position sensors in a magnetic force microscope (MFM) style data detection system.

Carley, L. Richard↗

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗

Proceedings of the International Conference on Integrated Micro/Nanotechnology for Space Applications

The recent evolution of microelectronic technologies coupled with the growth of micro-electro-mechanical systems (MEMS) has had significant impact in the commercial sector. The focus of this conference was to anticipate and extend the incorporation of nano-electronics and MEMS into application specific integrated microinstruments (ASIM's) in space systems. Presentations ranged from mission application of nano-satellites to silicon micromachining for photonic applications.

Source record↗