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A report discusses integrating multiple memory modules on the high-speed serial interconnect (IEEE 1393) that is used by a spacecraft?s inter-module communications in order to ease data congestion and provide for a scalable, strong, flexible system that can meet new system-level mass memory requirements.
In the work to be presented, vacuum plasma spray forming has been used as a process to deposit and consolidate prealloyed NiTi and NiTiPd powders into near net shape actuators. Testing showed that excellent shape memory behavior could be developed in the deposited materials and the investigation proved that VPS forming could be a means to directly form a wide range of shape memory alloy components. The results of DSC characterization and actual actuation test results will be presented demonstrating the behavior of a Nitinol 55 alloy and a higher transition temperature NiTiPd alloy in the form of torque tube actuators that could be used in aircraft and aerospace controls.
Solar cells, integrated circuits, and sensors are essential to manned and unmanned space flight and exploration, but such systems are highly susceptible to damage from radiation. Especially problematic, the Van Allen radiation belts encircle Earth in concentric radioactive tori at distances from about 6,300 to 38,000 km, though the inner radiation belt can dip as low as 700 km, posing a severe hazard to craft and humans leaving Earth s atmosphere. To avoid this radiation, the International Space Station and space shuttles orbit at altitudes between 275 and 460 km, below the belts range, and Apollo astronauts skirted the edge of the belts to minimize exposure, passing swiftly through thinner sections of the belts and thereby avoiding significant side effects. This radiation can, however, prove detrimental to improperly protected electronics on satellites that spend the majority of their service life in the harsh environment of the belts. Compact, high-performance electronics that can withstand extreme environmental and radiation stress are thus critical to future space missions. Increasing miniaturization of electronics addresses the need for lighter weight in launch payloads, as launch costs put weight at a premium. Likewise, improved memory technologies have reduced size, cost, mass, power demand, and system complexity, and improved high-bandwidth communication to meet the data volume needs of the next-generation high-resolution sensors. This very miniaturization, however, has exacerbated system susceptibility to radiation, as the charge of ions may meet or exceed that of circuitry, overwhelming the circuit and disrupting operation of a satellite. The Hubble Space Telescope, for example, must turn off its sensors when passing through intense radiation to maintain reliable operation. To address the need for improved data quality, additional capacity for raw and processed data, ever-increasing resolution, and radiation tolerance, NASA spurred the development of the Radiation Tolerant Intelligent Memory Stack (RTIMS).
High-density, commercial, nonvolatile flash memories with NAND architecture are now available from several manufacturers. This report examines SEE effects and TID response in single-level cell (SLC) and multi-level cell (MLC) NAND flash memories manufactured by Micron Technology.
Interest in high-temperature shape memory alloys (HTSMA) has been growing in the aerospace, automotive, process control, and energy industries. However, actual materials development has seriously lagged component design, with current commercial NiTi alloys severely limited in their temperature capability. Additions of Pd, Pt, Au, Hf, and Zr at levels greater than 10 at.% have been shown to increase the transformation temperature of NiTi alloys, but with few exceptions, the shape memory behavior (strain recovery) of these NiTiX systems has been determined only under stress free conditions. Given the limited amount of basic mechanical test data and general lack of information regarding the work attributes of these materials, a program to investigate the mechanical behavior of potential HTSMAs, with transformation temperatures between 100 and 500 C, was initiated. This paper summarizes the results of studies, focusing on both the practical temperature limitations for ternary TiNiPd and TiNiPt systems based on the work output of these alloys and the ability of these alloys to undergo repeated thermal cycling under load without significant permanent deformation or "walking". These issues are ultimately controlled by the detwinning stress of the martensite and resistance to dislocation slip of the individual martensite and austenite phases. Finally, general rules that govern the development of useful, high work output, next-generation HTSMA materials, based on the lessons learned in this work, will be provided
TiNiPt shape memory alloys are particularly promising for use as solid state actuators in environments up to 300 C, due to a reasonable balance of properties, including acceptable work output. However, one of the challenges to commercializing a viable high-temperature shape memory alloy (HTSMA) is to establish the appropriate primary and secondary processing techniques for fabrication of the material in a required product form such as rod and wire. Consequently, a Ti(50.5)Ni(29.5)Pt20 alloy was processed using several techniques including single-pass high-temperature extrusion, multiple-pass high-temperature extrusion, and cold drawing to produce bar stock, thin rod, and fine wire, respectively. The effects of heat treatment on the hardness, grain size, room temperature tensile properties, and transformation temperatures of hot- and cold-worked material were examined. Basic tensile properties as a function of temperature and the strain-temperature response of the alloy under constant load, for the determination of work output, were also investigated for various forms of the Ti(50.5)Ni(29.5)Pt20 alloy, including fine wire.
In this review, oriented to the human factors community, I will summarize and provide a perspective on recent research and theory on prospective memory. This will not be an exhaustive review of literature, which is already available in two excellent recent books that provide a wealth of detail on the current state of experimental research (Kliegel, McCaniel, & Einstein, 2008; McDaniel & Einstein, 2007; also see Brandimonte, Einstein, & McDaniel, 1996, for a still relevant overview of the field as it was emerging). Rather, I will explore the limits of existing experimental paradigms and theory, Vvilich, in my opinion, fail to capture some critical aspects of performance outside the laboratory. I will also review the relatively few studies in workplace and everyday settings and will discuss several studies that attempt to bridge between the bulk of experimental studies and these few naturalistic studies. Finally, I will describe countermeasures that can reduce vulnerability to forgetting to perform intended tasks, and I will propose a research agenda that would extend existing experimental and theoretical approaches and would support human factors practitioners by generating information on a wide range of issues relevant to prospective memory performance in natural settings.
We compare the effectiveness of a conventional thermomechanical training procedure and severe plastic deformation via equal channel angular extrusion to achieve improved functional stability in a Ti50.5Ni24.5Pd25 high-temperature shape memory alloy. Thermomechanical testing indicates that both methods result in enhanced shape memory characteristics, such as reduced irrecoverable strain and thermal hysteresis. The mechanisms responsible for the improvements are discussed in light of microstructural findings from transmission electron microscopy.
We have compared the data retention of irradiated commercial NAND flash memories with that of unirradiated controls. Under some circumstanc es, radiation exposure has a significant effect on the retention of f lash memories.
A method of repairing a composite component having a damaged area including: laying a composite patch over the damaged area: activating the shape memory polymer resin to easily and quickly mold said patch to said damaged area; deactivating said shape memory polymer so that said composite patch retains the molded shape; and bonding said composite patch to said damaged part.
While NiTiPd alloys have been extensively studied for proposed use in high-temperature shape-memory applications, little is known about the shape-memory response of these materials under stress. Consequently, the isobaric thermal cyclic responses of five (Ni,Pd)49.5Ti50.5 alloys with constant stoichiometry and Pd contents ranging from 15 to 46 at. pct were investigated. From these tests, transformation temperatures, transformation strain (which is proportional to work output), and unrecovered strain per cycle (a measure of dimensional instability) were determined as a function of stress for each alloy. It was found that increasing the Pd content over this range resulted in a linear increase in transformation temperature, as expected. At a given stress level, work output decreased while the amount of unrecovered strain produced during each load-biased thermal cycle increased with increasing Pd content, during the initial thermal cycles. However, continued thermal cycling at constant stress resulted in a saturation of the work output and nearly eliminated further unrecovered strain under certain conditions, resulting in stable behavior amenable to many actuator applications.
This innovation provides reconfigurable circuitry and 2-Gb of error-corrected or 1-Gb of triple-redundant digital memory in a small package. RTIMS uses circuit stacking of heterogeneous components and radiation shielding technologies. A reprogrammable field-programmable gate array (FPGA), six synchronous dynamic random access memories, linear regulator, and the radiation mitigation circuits are stacked into a module of 42.7 42.7 13 mm. Triple module redundancy, current limiting, configuration scrubbing, and single- event function interrupt detection are employed to mitigate radiation effects. The novel self-scrubbing and single event functional interrupt (SEFI) detection allows a relatively soft FPGA to become radiation tolerant without external scrubbing and monitoring hardware
There are two conventional types of hinges for in-space deployment applications. The first type is mechanically deploying hinges. A typical mechanically deploying hinge is usually composed of several tens of components. It is complicated, heavy, and bulky. More components imply higher deployment failure probability. Due to the existence of relatively moving components among a mechanically deploying hinge, it unavoidably has microdynamic problems. The second type of conventional hinge relies on strain energy for deployment. A tape-spring hinge is a typical strain energy hinge. A fundamental problem of a strain energy hinge is that its deployment dynamic is uncontrollable. Usually, its deployment is associated with a large impact, which is unacceptable for many space applications. Some damping technologies have been experimented with to reduce the impact, but they increased the risks of an unsuccessful deployment. Coalescing strain energy components with shape memory composite (SMC) components to form a hybrid hinge is the solution. SMCs are well suited for deployable structures. A SMC is created from a high-performance fiber and a shape memory polymer resin. When the resin is heated to above its glass transition temperature, the composite becomes flexible and can be folded or packed. Once cooled to below the glass transition temperature, the composite remains in the packed state. When the structure is ready to be deployed, the SMC component is reheated to above the glass transition temperature, and it returns to its as-fabricated shape. A hybrid hinge is composed of two strain energy flanges (also called tape-springs) and one SMC tube. Two folding lines are placed on the SMC tube to avoid excessive strain on the SMC during folding. Two adapters are used to connect the hybrid hinge to its adjacent structural components. While the SMC tube is heated to above its glass transition temperature, a hybrid hinge can be folded and stays at folded status after the temperature is reduced to below its glass transition temperature. After the deployable structure is launched in space, the SMC tube is reheated and the hinge is unfolded to deploy the structure. Based on test results, the hybrid hinge can achieve higher than 99.999% shape recovery. The hybrid hinge inherits all of the good characteristics of a tape-spring hinge such as simplicity, light weight, high deployment reliability, and high deployment precision. Conversely, it eliminates the deployment impact that has significantly limited the applications of a tape-spring hinge. The deployment dynamics of a hybrid hinge are in a slow and controllable fashion. The SMC tube of a hybrid hinge is a multifunctional component. It serves as a deployment mechanism during the deployment process, and also serves as a structural component after the hinge is fully deployed, which makes a hybrid hinge much stronger and stiffer than a tape-spring hinge. Unlike a mechanically deploying hinge that uses relatively moving components, a hybrid hinge depends on material deformation for its packing and deployment. It naturally eliminates the microdynamic phenomenon.
The deformation and transformation mechanisms of polycrystalline Ni49.9Ti50.1 and Ni50.3Ti29.7Hf20 (in at.%) shape memory alloys were investigated by combined experimental and modeling efforts aided by an in situ neutron diffraction technique at stress and temperature. The thermomechanical response of the low temperature martensite, the high temperature austenite phases, and changes between these two states during thermomechanical cycling were probed and reported. In the cubic austenite phase, stress-induced martensite, deformation twinning and slip processes were observed which helped in constructing a deformation map that contained the limits over which each of the identified mechanisms was dominant. Deformation of the monoclinic martensitic phase was also investigated where the microstructural changes (texture, lattice strains, and phase fractions) during room-temperature deformation and subsequent thermal cycling were compared to the bulk macroscopic response. When cycling between these two phases, the evolution of inelastic strains, along with the shape setting procedures were examined and used for the optimization of the transformation properties as a function of deformation levels and temperatures. Finally, this work was extended to the development of multiaxial capabilities at elevated temperatures for the in situ neutron diffraction measurements of shape memory alloys on the VULCAN Diffractometer at Oak Ridge National Laboratory.
CN-250X is a new material with higher performance than Nickel-Titanium Shape Memory Alloy (SMA). For space mechanisms, the main disadvantage of Nickel-Titanium Shape Memory Alloy is the limited transformation temperature. The new CN-250X Nimesis alloy is a Cu-Al-Ni single crystal wire available in large quantity because of a new industrial process. The triggering of actuators made with this Cu-Al-Ni single crystal wire can range from ambient temperature to 200 C in cycling and even to 250 C in one-shot mode. Another advantage of CN-250X is a better shape recovery (8 to 10%) than Ni-Ti (6 to 7%). Nimesis is the first company able to produce this type of material with its new special industrial process. A characterization study is presented in this work, including the two main solicitation modes for this material: tensile and torsion. Different tests measure the shape recovery of Cu-Al-Ni single crystals wires during heating from room temperature to a temperature higher than temperature of end of martensitic transformation.
The report summarizes the accomplishments made during the 4-year duration of the project. Here, the major emphasis is placed on the different tasks performed by the two research teams; i.e., the modeling activities by the University of Akron (UA) team and the experimental and neutron diffraction studies conducted by the University of Central Florida (UCF) team, during this 4-year period. Further technical details are given in the upcoming sections by UA and UCF for each of the milestones/years (together with the corresponding figures and captions).The project majorly involved the development, validation, and application of a general theoretical model that is capable of capturing the nonlinear hysteretic responses, including pseudoelasticity, shape memory effect, rate-dependency, multi-axiality, asymmetry in tension versus compression response of shape memory alloys. Among the targeted goals for the SMA model was its ability to account for the evolutionary character response (including transient and long term behavior under sustained cycles) for both conventional and high temperature (HT) SMAs, as well as being able to simulate some of the devices which exploit these unique material systems. This required extensive (uniaxial and multi-axial) experiments needed to guide us in calibrating and characterizing the model. Moreover, since the model is formulated on the theoretical notion of internal state variables (ISVs), neutron diffraction experiments were needed to establish the linkage between the micromechanical changes and these ISVs. In addition, the design of the model should allow easy implementation in large scale finite element application to study the behavior of devices making use of these SMA materials under different loading controls. Summary of the activities, progress/achievements made during this period is given below in details for the University of Akron and the University (Section 2.0) of Central Florida (Section 3.0).
A thermal management system includes a first substrate having a first conductive inner surface. A second substrate has a second conductive inner surface. A connecting structure is attached to the first and second substrates to space apart the first and second inner surfaces defining an insulating space for a single architecture. One or more passively-acting elements are attached to the inner surface of at least one substrate and including a shape memory material such as a shape memory alloy (SMA). The SMA passively reacts to the temperature of the first substrate by thermally contacting or separating from the second inner surface of the second substrate for the control of the conduction of heat energy in either direction.
The last few years have seen a surge in technology, device, and architecture introductions in commercial memories such as SDRAM and NAND driven by the explosion of handheld and portable electronics. Some of the resultant devices provide high density in very small and light packages, which may be possible to leverage for the miniaturization of future GN&C systems in addition to providing considerable memory capacity to enable advanced capabilities such as image-based navigation or adaptive/autonomous operations. We will show that these advanced SDRAM and NAND technologies are worth serious consideration for the next generation of GN&C needs by highlighting reliability and radiation effects results from some of these devices.