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At least 109 records · Page 6

Measurement of the time-temperature dependent dynamic mechanical properties of boron/aluminum composites

A relatively simple flexural vibration test is developed for accurate measurement of the low-strain dynamic modulus and damping capacity of B/Al composite bar specimens from -200 C to over 500 C. The specimens are prepared from 8-ply unidirectional panels containing 50 volume percent fibers composed of 203-micron commercial boron-on-tungsten fibers. The basic test technique consists of the forced flexural vibration of the composite bar specimens at their two lowest free-free symmetrical resonant modes in a high-vacuum cryostat furnace. Specimen damping is determined from oscilloscope photographs of the free decay obtained after simultaneously removing the resonant drive signal and grounding the vibration-drive electrode. The availability of time-temperature dynamic data coupled with the predictive accuracy of composite theory suggests a future potential for using such data in examining environmental effects on composite macrostructure and microstructure.

Dicarlo, J. A.↗

Methods of Forming Visual Hydrogen Detector with Variable Reversibility

Methods, processes and compositions are provided for a visual or chemochromic hydrogen-detector with variable or tunable reversible color change. The working temperature range for the hydrogen detector is from minus 100 C to plus 500 C. A hydrogen-sensitive pigment, including, but not limited to, oxides, hydroxides and polyoxo-compounds of tungsten, molybdenum, vanadium, chromium and combinations thereof, is combined with nano-sized metal activator particles and preferably, coated on a porous or woven substrate. In the presence of hydrogen, the composition rapidly changes its color from white or light-gray or light-tan to dark gray, navy-blue or black depending on the exposure time and hydrogen concentration in the medium. After hydrogen exposure ceases, the original color of the hydrogen-sensitive pigment is restored, and the visual hydrogen detector can be used repeatedly. By changing the composition of the hydrogen-sensitive pigment, the time required for its complete regeneration is varied from a few seconds to several days.

Muradov, Nazim Z.↗

Single Crystal Rhombohedral Epitaxy of Sige on Sapphire at 450.Degree. C.-500.Degree. C. Substrate Temperatures

Various embodiments may provide a low temperature (i.e., less than 850° C.) method of Silicon-Germanium (SiGe) on sapphire (Al2O3) (SiGe/sapphire) growth that may produce a single crystal film with less thermal loading effort to the substrate than conventional high temperature (i.e., temperatures above 850° C.) methods. The various embodiments may alleviate the thermal loading requirement of the substrate, which in conventional high temperature (i.e., temperatures above 850° C.) methods had surface temperatures within the range of 850° C.-900° C. The various embodiments may provide a new thermal loading requirement of the sapphire substrate for growing single crystal SiGe on the sapphire substrate in the range of about 450° C. to about 500° C.

Choi, Sang Hyouk↗

Friction and wear of some ferrous-base metallic glasses

Sliding friction experiments, X-ray photoelectron spectroscopy (XPS) analysis, and electron microscopy and diffraction studies were conducted with ferrous base metallic glasses (amorphous alloys) in contact with aluminum oxide at temperatures to 750 C in a vacuum. Sliding friction experiments were also conducted in argon and air atmospheres. The results of the investigation indicate that the coefficient of friction increases with increasing temperature to 350 C in vacuum. The increase in friction is due to an increase in adhesion resulting from surface segregation of boric oxide and/or silicon oxide to the surface of the foil. Above 500 C the coefficient of friction decreased rapidly. The decrease correlates with the segregation of boron nitride to the surface. Contaminants can come from the bulk of the material to the surface upon heating and impart boric oxide and/or silicon oxide at 350 C and boron nitride above 500 C. The segregation of contaminants is responsible for the friction behavior. The amorphous alloys have superior wear resistance to crystalline 304 stainless steel. The relative concentrations of the various constituents at the surfaces of the amorphous alloys are very different from the nominal bulk compositions.

Miyoshi, K.↗

Friction and wear of some ferrous-base metallic glasses

Sliding friction experiments, X-ray photoelectron spectroscopy (XPS) analysis, and electron microscopy and diffraction studies were conducted with ferrous base metallic glasses (amorphous alloys) in contact with aluminium oxide at temperatures to 750 C in a vacuum. Sliding friction experiments were also conducted in argon and air atmospheres. The results of the investigation indicate that the coefficient of friction increases with increasing temperature to 350 C in vacuum. The increase in friction is due to an increase in adhesion resulting from surface segregation of boric oxide and/or silicon oxide to the surface of the foil. Above 500 C the coefficient of friction decreased rapidly. The decrease correlates with the segregation of boron nitride to the surface. Contaminants can come from the bulk of the material to the surface upon heating and impart boric oxide and/or silicon oxide at 350 C and boron nitride above 500 C. The segregation of contaminants is responsible for the friction behavior. The amorphous alloys have superior wear resistance to crystalline 304 stainless steel. The relative concentrations of the various constituents at the surfaces of the amorphous alloys are very different from the nominal bulk compositions.

Miyoshi, K.↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

Study of the effects of MeV Ag, Cu, Au, and Sn implantation on the optical properties of LiNbO3

The authors present the results of characterization of linear absorption and nonlinear refractive index of Au, Ag, Cu and Sn ion implantation into LiNbO3. Ag was implanted at 1.5 MeV to fluences of 2 to 17 x 17(exp 16)/sq cm at room temperature. Au and Cu were implanted to fluences of 5 to 20 x 10(exp 16)/sq cm at an energy of 2.0 MeV. Sn was implanted to a fluence of 1.6 x 10(exp 17)/sq cm at 160 kV. Optical absorption spectrometry indicated an absorption peak for the Au implanted samples after heat treatment at 1,000 C at approx. 620 nm. The Ag implanted samples absorption peaks shifted from approx. 450 nm before heat treatment to 550 nm after 500 C for 1h. Heat treatment at 800 C returned the Ag implanted crystals to a clear state. Cu nanocluster absorption peaks disappears at 500 C. No Sn clusters were observed by optical absorption or XRD. The size of the Ag and Au clusters as a function of heat treatment were determined from the absorption peaks. The Ag clusters did not change appreciably in size with heat treatment. The Au clusters increased from 3 to 9 nm diameter upon heat treatment at 1000 C. TEM analysis performed on a Au implanted crystal indicated the formation of Au nanocrystals with facets normal to the c-axis. Measurements of the nonlinear refractive indices were carried out using the Z-scan method with a tunable dye laser pumped by a frequency doubled mode-locked Nd:YAG laser. The dye laser had a 4.5 ps pulse duration time and 76 MHz pulse repetition rate (575 nm).

Williams, E. K.↗

Late-Glacial to Early Holocene Climate Changes from a Central Appalachians Pollen and Macrofossil Record

A Late-glacial to early Holocene record of pollen, plant macrofossils and charcoal, based on two cores, is presented for Browns Pond in the central Appalachians of Virginia. An AMS radiocarbon chronology defines the timing of moist and cold excursions, superimposed upon the overall warming trend from 14,200 to 7,500 C-14 yr B.P. This site shows cold, moist conditions from approximately 14,200 to 12,700 C-14 yr B.P., with warming at 12,730, 11,280 and 10,050 C-14 yr B.P. A decrease in deciduous broad-leaved tree taxa and Pinus strobus (haploxylon) pollen, simultaneous with a re-expansion of Abies denotes a brief, cold reversal from 12,260 to 12,200 C-14 yr B.P. A second cold reversal, inferred from increases in montane conifers, is centered at 7,500 C-14 yr B.P. The cold reversals at Browns Pond may be synchronous with climate change in Greenland, and northwestern Europe. Warming at 11,280 C-14 yr B.P. shows the complexity of regional climate responses during the Younger Dryas chronozone.

Kneller, Margaret↗

Experimental Durability Testing of 4H SiC JFET Integrated Circuit Technology at 727 C

We have reported SiC integrated circuits (IC's) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 C [1, 2]. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 C [3]. However, this thermal ramp was not ended until a peak temperature of 880 C (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology. Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 C. In one test, the temperature was ramped and then held at 727 C, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 C before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 C (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 C.

JFET↗

Comparison of GRCop-84 to Other High Thermal Conductive Cu Alloys

The mechanical properties of five copper alloys (GRCop-84, AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, Cu-0.9Cr) competing in high temperature, high heat flux applications such as rocket nozzles, were compared. Tensile, creep, thermal expansion, and compression tests are presented. Tests were done on as-received material, and on material which received a simulated brazing heat treatment at 935 C. The 935 C heat treatment weakened AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr, and the strength of as-received AMZIRC dropped precipitously as test temperatures exceeded 500 C. The properties of GlidCop Al-15 and GRCop-84 were not significantly affected by the 935 C heat treatment. Thus GRCop-84 is better than AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr at temperatures greater than 500 C. Ductility was lowest in GlidCop Al-15 and Cu-0.9Cr. The creep properties of GRCop-84 were superior to those of brazed AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr. At equivalent rupture life and stress, GRCop-84 had a 150 C temperature advantage over brazed AMZIRC; for equivalent rupture life and temperature GRCop-84 was two times stronger. The advantages of GRCop-84 over GlidCop Al-15 associated with ease of processing were confirmed by GlidCop s marginal ductility. In the post brazed condition, GRCop-84 was found to be superior to the other alloys due to its greater strength and creep resistance (compared to AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr) and ductility (compared to GlidCop Al-15)

deGroh, Henry C., III↗

Improvement of GRCop-84 Through the Addition of Zirconium

GRCop-84 (Cu-8 at.% Cr-4 at.% Nb) has excellent strength, creep resistance, low cycle fatigue (LCF) life and stability at elevated temperatures. It suffers in comparison to many commercially available precipitation-strengthened alloys below 500 C (932 F). It was observed that the addition of Zr consistently improved the mechanical properties of Cu-based alloys especially below 500 C. In an effort to improve the low temperature properties of GRCop-84, 0.35 wt.% Zr was added to the alloy. Limited tensile, creep, and LCF testing was conducted to determine if improvements occur. The results showed some dramatic increases in the tensile and creep properties at the conditions tested with the probability of additional improvements being possible through cold working. LCF testing at room temperature did not show an improvement, but improvements might occur at elevated temperatures.

Ellis, David L.↗

Photovoltaic properties of ferroelectric BaTiO3 thin films RF sputter deposited on silicon

Ferroelectric thin films of BaTiO3 have been successfully deposited on n-type silicon substrates at temperatures above 500 C by RF sputtering in an O2/Ar atmosphere. Analysis by X-ray diffraction patterns show that films deposited at room temperature are amorphous. At temperatures above 500 C, crystalline BaTiO3 films with a tetragonal structure are obtained. The polarization-electric field (P-E) hysteresis loops and a broad peak in the dielectric constant versus temperature curve at Curie point indicate that the RF sputtered BaTiO3 films are ferroelectric. An anomalous photovoltaic effect is observed in these thin films which is related to the remanent polarization of the material. The results on open-circuit and short-circuit measurements provide an important basis for a better understanding of the role of photovoltaic field, photovoltaic current, and the pyroelectric properties in photoferroelectric domain switching.

Dharmadhikari, V. S.↗

Some properties of Ni-Cu foils and their behavior when heated in hydrogen

Nickel foils of nominal thickness 0.1 and 1 micron have been resistively evaporated onto copper-foil substrates of thickness 25 and 2.5 microns. In depositions in which the pressure was as high as 0.00001 torr, the deposited nickel was not shiny and appeared granular in a 100x microscope. Foils evaporated in higher vacuums were shiny, but became granular if heated to 500 C in oxygen at pressures greater than 0.000005 torr, or in carbon dioxide at pressures greater than 0.0000005 torr. This phenomenon has been interpreted as recrystallization. Foils heated to 500 C at pressures of hydrogen above 0.0003 torr exhibit cracking characteristic of hydrogen embrittlement. The bimetallic foils curled concave toward the nickel during evaporation, consistent with a connected-island form of film growth.

Morrison, R. A.↗

A characterization study of a hydroxylated polycrystalline tin oxide surface

In this study Auger electron spectroscopy, electron spectroscopy for chemical analysis (ESCA) and electron-stimulated desorption (ESD) have been used to examine a polycrystalline tin oxide surface before and after annealing in vacuum at 500 C. Features due to surface hydroxyl groups are present in both the ESCA and ESD spectra, and ESD shows that several chemical states of hydrogen are present. Annealing at 500 C causes a large reduction in the surface hydrogen concentration but not complete removal.

Hoflund, Gar B.↗

Oxidation Behavior of Glassy Alloys

The oxidation behavior of high temperature glassy alloys produced by rapid solidification processing is investigated and the effects of processing and composition on oxidation behavior is studied. Glassy Ta-44.5at%Ir, Ta-40at%Ir-10at%B and Nb-45at%Ir oxidized rapidly at 700 to 800 C at an oxygen partial pressure of .001 atm. The alloys were embrittled during the oxidation process. No apparent oxidation or embrittlement of the Ta-Ir alloy occurred after oxidation for 4h at 500 C at an oxygen partial pressure of .001 atm. Embrittlement occurred, however, after 100h of exposure under the latter conditions. Alloy embrittlement is associated with the partial or full conversion of the metallic glass to a mixture of crystalline beta-Ta2O5 and metallic iridium. Hot compaction of glassy alloys of this type must be limited to relatively low temperatures (approx. 500 C) and short times at the low temperatures unless extremely low oxygen partial pressures can be achieved during the compaction process.

Yurek, G.↗

Lower-curing-temperature PMR polyimides

Studies were performed to achieve a lower-curing-temperature PMR polyimide. The use of m-aminostyrene as the end-cap instead of the monoalkyl ester of 5-normbornene-2,3 dicarboxylic acid was investigated in typical PMR formulations. Model compound studies were also performed. Differential scanning calorimetry studies were performed on model compounds and neat resins to establish their melting and curing characteristics. The elevated temperature weight loss characteristics of neat resins and graphite fiber composites were determined. The room temperature and short-time 260 C (500 F) mechanical properties of the composites were also determined. The use of m-aminostyrene end-caps reduced the final cure temperature of PMR resins by about 55 C (100 F), but the composites prepared with these resins are limited to use temperatures of about 260 C (500 F).

Serafini, T. T.↗

A study of fatigue damage mechanisms in Waspaloy from 25 to 800 C

The objective of the study was to examine the effect of various microstructures on the fatigue and damage accumulation behavior of Waspaloy, a nickel-base alloy commonly used in aircraft engines. Shearing was the dominant deformation mode in specimens with coarse grains and small (50-80 A) gamma prime particles, whereas Orowan looping was dominant in fine-grained specimens with large (about 900 A) gamma prime particles. At temperatures up to 500 C, cracks initiated transgranularly, while at 800 C the failure process was intergranular for both coarse-grained and fine-grained specimens. At temperatures above 500 C, a significant decrease in the fatigue life was observed for both coarse-grained and fine-grained material.

Lerch, B. A.↗