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At least 109 records · Page 6

The Analysis of Adhesive Residue Failure

Adhesives have always been, and will continue to be, a crucial component of assembling flight hardware. Unfortunately, adhesives have a long standing history of being a source of costly contaminations. There are currently no existing documents that can aid a technician in discerning the proper adhesive/substrate combinations, nor the optimal solvent to use when removing adhesive residue. This project seeks to evaluate the performance of adhesive tapes on various flight hardware substrates in order to create an easy-to-use guide for spacecraft ground processing. The analyses performed were the adhesive/solvent solubility, SEM examinations, and peel adhesion tests. The solubility tests showed that amyl acetate, acetone, and MEK were the most successful in dissolving the adhesives. The SEM data gives preliminary insight into the morphology of the residues. Lastly, the peel adhesion testing proved that there is no relationship between the length of time the adhesive was applied and its adhesive strength.

Smiley, Adrienne↗

System for providing dynamic feedback for selective adhesion PCB production

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

Hatch, Jonathan Douglas↗

A study of adhesive bonding in metal–metal, metal–CFRP, and CFRP–CFRP material combinations under shear deformation: Fracture morphologies and damage mechanisms

Safe design of adhesive joining in multi-materials in engineered structures requires the accumulation of numerous experimental data on the failure behavior of various adhesively-bonded material combinations under different loading conditions. The deep understanding of mechanical performance, fracturing morphologies, and main damage mechanisms is also quintessential for accelerating the development of proper physics-based and multi-scale models for assisting the design. Towards this goal, this work presents a comprehensive characterization of the failure behavior of adhesively-bonded metal–metal, metal–CFRP, and CFRP–CFRP material combinations under global shear deformation via single lap shear testing. Thanks to a synergistic combination of measurement methods by using Digital Imaging Correlation (DIC) and 3D optical profilometry, adhesive features on the adherend after failure were quantified and the main progressive damage mechanisms were identified. The characterization performed in this work provides quantitative data that contributes to a better understanding of shear failure in adhesive bonding across different bi-material combinations. Finally, the obtained results have practical implications, including the potential to enhance adhesive bonding design, identify failure causes in adhesive joints, and develop or validate computational models capable of capturing the observed behavior in various adhesively-bonded materials under global shear deformation.

36 MATERIALS SCIENCE↗

Encapsulation and backsheet adhesion metrology for photovoltaic modules

Photovoltaic modules are designed to operate for decades in terrestrial environments. However, mechanical stress, moisture, and ultraviolet radiation eventually degrade protective materials in modules, particularly their adhesion properties, eventually leading to reduced solar cell performance. Despite the significance of interfacial adhesion to module durability, currently there is no reliable technique for characterizing module adhesion properties. We present a simple and reproducible metrology for characterizing adhesion in photovoltaic modules that is grounded in fundamental concepts of beam and fracture mechanics. Using width-tapered cantilever beam fracture specimens, interfacial adhesion was evaluated on relevant interfaces of encapsulation and backsheet structures of new and 27-year-old historic modules. The adhesion energy, Gc [J/m 2 ], was calculated from the critical value of the strain energy release rate, G, using G = βP 2 , where β (a mechanical and geometric parameter of the fracture specimen) and P (the experimentally measured critical load) are constants. Under some circumstances where testing may result in cracking of brittle layers in the test specimen, measurement of the delamination length in addition to the critical load was necessary to determine G. Relative to new module materials, backsheet adhesion was 95% and 98% lower for historic modules that were exposed (operated in the field) and unexposed (stored on-site, but out of direct sunlight), respectively. Encapsulation adhesion was 87-94% lower in the exposed modules and 31% lower in the unexposed module. As a result, the metrology presented here can be used to improve module materials and assess long-term reliability.

14 SOLAR ENERGY↗

Quantitative adhesion characterization of antireflective coatings in multijunction photovoltaics

We discuss the development of a new composite dual cantilever beam (cDCB) thin-film adhesion testing method, which enables the quantitative measurement of adhesion on the thin and fragile substrates used in multijunction photovoltaics. In particular, we address the adhesion of several 2- and 3-layer antireflective coating systems on multijunction cells. By varying interface chemistry and morphology through processing, we demonstrate the marked effects on adhesion and help to develop an understanding of how high adhesion can be achieved, as adhesion values ranging from 0.5 J/m2 to 10 J/m2 were measured. Damp heat (85 degrees C/85% RH) was used to invoke degradation of interfacial adhesion. We demonstrate that even with germanium substrates that fracture relatively easily, quantitative measurements of adhesion can be made at high test yield. The cDCB test is discussed as an important new methodology, which can be broadly applied to any system that makes use of thin, brittle, or otherwise fragile substrates.

14 SOLAR ENERGY↗

Generating tissue topology through remodeling of cell-cell adhesions

During tissue morphogenesis, cellular rearrangements give rise to a large variety of three-dimensional structures. Final tissue architecture varies greatly across organs, and many develop to include combinations of folds, tubes, and branched networks. To achieve these different tissue geometries, constituent cells must follow different programs that dictate changes in shape and/or migratory behavior. One essential component of these changes is the remodeling of cell-cell adhesions. Invasive migratory behavior and separation between tissues require localized breakdown of cadherin-mediated adhesions. Conversely, tissue folding and fusion require the formation and reinforcement of cell-cell adhesions. Cell-cell adhesion plays a critical role in tissue morphogenesis; its manipulation may therefore prove to be invaluable in generating complex topologies ex vivo. Recapitulating these shapes in engineered tissues would enable a better understanding of how these processes occur in vivo, and may lead to improved design of organs for clinical applications. In this review, we discuss work investigating the formation of folds, tubes, and branched networks with an emphasis on known or possible roles for cell-cell adhesion. We then examine recently developed tools that could be adapted to manipulate cell-cell adhesion in engineered tissues. - Highlights: • Cell shape changes and rearrangements give rise to highly varied tissue topology. • Generating 3D structures requires differential remodeling of cell-cell adhesions. • Cell-cell adhesion could be experimentally manipulated to engineer tissues.

60 APPLIED LIFE SCIENCES↗

Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers

The use of a metallic adhesion layer is known to increase the thermo-mechanical stability of Au thin films against solid-state dewetting, but in turn results in damping of the plasmonic response, reducing their utility in applications such as heat-assisted magnetic recording (HAMR). In this work, 50 nm Au films with Ti adhesion layers ranging in thickness from 0 to 5 nm were fabricated, and their thermal stability, electrical resistivity, and plasmonic response were measured. Subnanometer adhesion layers are demonstrated to significantly increase the stability of the thin films against dewetting at elevated temperatures (>200 °C), compared to more commonly used adhesion layer thicknesses that are in the range of 2-5 nm. For adhesion layers thicker than 1 nm, the diffusion of excess Ti through Au grain boundaries and subsequent oxidation was determined to result in degradation of the film. This mechanism was confirmed using transmission electron microscopy and X-ray photoelectron spectroscopy on annealed 0.5 and 5 nm adhesion layer samples. The superiority of subnanometer adhesion layers was further demonstrated through measurements of the surface-plasmon polariton resonance; those with thinner adhesion layers possessed both a stronger and spectrally sharper resonance. Furthermore, these results have relevance beyond HAMR to all Ti/Au systems operating at elevated temperatures.

36 MATERIALS SCIENCE↗

Comparison of Metal Adhesion Layers for Au Films in Thermoplasmonic Applications

If thermoplasmonic applications such as heat-assisted magnetic recording are to be commercially viable, it is necessary to optimize both thermal stability and plasmonic performance of the devices involved. In this work, a variety of different adhesion layers were investigated for their ability to reduce dewetting of sputtered 50 nm Au films on SiO 2 substrates. Traditional adhesion layer metals Ti and Cr were compared with alternative materials of Al, Ta, and W. Film dewetting was shown to increase when the adhesion material diffuses through the Au layer. An adhesion layer thickness of 0.5 nm resulted in superior thermomechanical stability for all adhesion metals, with an enhancement factor of up to 200X over 5 nm thick analogues. The metals were ranked by their effectiveness in inhibiting dewetting, starting with the most effective, in the order Ta > Ti > W > Cr > AI. Finally, the Au surface-plasmon polariton response was compared for each adhesion layer, and it was found that 0.5 nm adhesion layers produced the best response, with W being the optimal adhesion layer material for plasmonic performance.

36 MATERIALS SCIENCE↗

The Natural and Accelerated Evolution of EVA Adhesion Through Intermediate Exposures

Ethylene vinyl acetate (EVA) encapsulants comprise the majority of the encapsulants currently in use; much work has been done to understand and model the adhesive characteristics of EVA-encapsulated modules, but limited work has provided reliable insight into adhesion during the intermediate stages of exposure, limiting the ability to validate model predictions in this range. We provide the adhesion energy measurements for EVA adhesion after nearly six years of field aging and 10 000 h of accelerated aging. Both field and accelerated aging reveal a distinct plateau that emerges during the intermediate exposure periods (after one year in the field and after 1000 h in a chamber). At 10 000 h, adhesion within accelerated aged minimodules falls to a level generally seen after long-term field exposures (>15 years). Previous modeling predicted that adhesion would steadily decrease over the lifetime of a module, but these current results uncover an intermediate plateauing trend that is important to accurately modeling the evolution of adhesion and predicting adhesive failure. Based on these findings, three key model refinements concerning the rate of UV-radical formation and subsequent β-scission, the rate and acceleration of hydrolytic depolymerization, and the profile of the plasticity contribution over time are implemented and discussed.

14 SOLAR ENERGY↗

An Investigation of the Grain Size and Adhesion Strength of High-Speed Impact Ice

Ice accumulation on aircraft from supercooled water droplets (impact icing) can increase drag and decrease lift, leading to a decrease in fuel efficiency and a potential for unsafe situations. Anti-icing materials and coatings are of high interest to prevent aircraft icing. Because no anti-icing material suitable for in-flight situations has been realized, icing models aim to predict the accumulation and shape of the ice to understand its effects. In both cases, understanding the physical mechanism behind ice adhesion and shedding is necessary. A recent literature review has shown that the apparent ice adhesion strength to any specific material varies over several orders of magnitude across studies and test methods. One of the reasons for this high variance is likely to be the varying microstructure of the ice used for different studies. Although the microstructure of impact ice has been studied in the past, those conditions were not relevant to that of in-flight aircraft icing. The microstructure of the ice formed will determine both its bulk and surface properties, yet it has been overlooked in the ice adhesion community. Here, we use optical microscopy to study the non-uniform ice crystal grain size in impact ice accreted in NASA Glenn Research Center’s Icing Research Tunnel at various icing conditions. Similar to other environmental conditions studied in the literature, we show an increase in grain size at larger distances from the growth interface; however, the data shows substantially larger grains than what was expected from the prior literature. Ice accrued at lower temperatures has a smaller grain size at all distances from the growth interface. No change in grain size was noticed when varying only the wind speed. A correlational analysis shows that smaller grain sizes at the growth interface corresponded to an increase in the apparent ice adhesion strength when the adhesive failure was interfacial, but not when the failure was cohesive. These results may explain the overall trend in the literature of increasing apparent adhesion strength with decreasing temperature. Incorporating microstructure trends for various environmental conditions in icing models may increase the certainty in predicting ice adhesion strength and shedding, and will provide a better basis for comparison between adhesive tests on ice produced in different facilities and at different storage times.

• Ice Fabric↗

Developmental endothelial locus-1 prevents development of peritoneal adhesions in mice

Postoperative peritoneal adhesions, fibrous bands formed in the peritoneal cavity following surgery, represent a common, challenging and costly problem faced by surgeons and patients, for which effective therapeutic options are lacking. Since aberrant inflammation is one of the key mechanisms underlying peritoneal adhesion formation, here we set out to study the role of developmental endothelial locus-1 (Del-1), which has been recently identified as an endogenous inhibitor of inflammation, in the formation of postoperative peritoneal adhesions using a mouse model of peritoneal adhesions induced by ischemic buttons. Del-1-deficient mice had a higher incidence of adhesions, and their adhesions had higher quality and tenacity scores. Del-1 deficiency also led to enhanced inflammation mediators and collagen production. Finally, Del-1 supplementation decreased the incidence and severity of postoperative peritoneal adhesions. Taken together, these results indicate a protective role for Del-1 in postoperative peritoneal adhesion formation.

60 APPLIED LIFE SCIENCES↗

An Experimental and Numerical Study of Plasma Treatment Effects on Adhesive Joints of Metals, CFRTPs, and Metal–CFRTP Combinations

This work investigates the effects of plasma surface treatment on both the local adherend–adhesive interfacial strength and the global lap shear strength (LSS) of adhesively-bonded joints composed of metals, CFRTPs, and metal-CFRTP combinations, using AA6061 and CFRPPA as representative examples. Experimental and computational results show that plasma treatment improved the ratio of CFRPPA–adhesive interfacial normal strength to adhesive tensile strength (sint,n/scri,t,adhesive) from 0.59–1.00 to 0.91–1.73, leading to an average 90% increase in LSS for CFRPPA-related joints. In contrast, the LSS and sint,n/scri,t,adhesive values of AA6061–AA6061 joints (>=2.27) remained nearly unchanged after plasma treatment. The enhanced joint bonding was further supported by post-failure surface morphologies from three-dimensional profilometry and simulations, showing a transition from dominant interfacial failure to mixed modes involving interfacial, cohesive, and slight fiber-peeling failures. The LSS evolution with respect to sint,n/scri,t,adhesive was numerically established until the saturation of the LSS of various joints, and the behavior of AA6061–CFRPPA T-joints with varying interfacial strengths was also modeled. This study highlights the importance of local interfacial bonding strength, rather than global LSS, for understanding and optimizing the mechanical performance of adhesively-bonded composite–metal and composite-composite structures via different surface modification strategies.

Qiao, Yao (ORCID:0000000265867604)↗

Corrosion Resistance of Lignin-Based Thermoplastic Adhesive-Bonded Aluminum Joints

Adhesive-bonded joints are essential for lightweight, multimaterial automotive structures. We developed a lignin-based thermoplastic adhesive with adhesion strength comparable to conventional epoxy adhesives (20–23 MPa), while offering exceptional durability, recyclability, and corrosion resistance. Unlike commercial epoxy adhesives requiring refrigerated storage, our adhesive retains its bonding potential after a year of ambient conditioning. Bonded joints can be repeatedly disassembled and rejoined with less than 2% strength loss. After 500 h of salt fog exposure, the adhesive-bonded aluminum joints exhibited a 24% strength reduction, compared to 61% reduction in strength of joints based on a commercial epoxy adhesive.

Yu, Zeyang [ORNL] (ORCID:0000000209002374)↗

Structure-induced switching of interpolymer adhesion at a solid–polymer melt interface

In this paper, we report a link between the interfacial structure and adhesive property of homopolymer chains physically adsorbed (i.e., via physisorption) onto solids. Polyethylene oxide (PEO) was used as a model and two different chain conformations of the adsorbed polymer were created on silicon substrates via the well-established Guiselin's approach: “flattened chains” which lie flat on the solid and are densely packed, and “loosely adsorbed polymer chains” which form bridges jointing up nearby empty sites on the solid surface and cover the flattened chains. We investigated the adhesion properties of the two different adsorbed chains using a custom-built adhesion testing device. Bilayers of a thick PEO overlayer on top of the flattened chains or loosely adsorbed chains were subjected to the adhesion test. The results revealed that the flattened chains do not show any adhesion even with the chemically identical free polymer on top, while the loosely adsorbed chains exhibit adhesion. Neutron reflectivity experiments corroborated that the difference in the interfacial adhesion is not attributed to the interfacial brodening at the free polymer–adsorbed polymer interface. Instead, coarse-grained molecular dynamics simulation results suggest that the tail parts of the loosely adsorbed chains act as “connector molecules”, bridging the free chains and substrate surface and improving the interfacial adhesion. Finally, these findings not only shed light on the structure–property relationship at the interface, but also provide a novel approach for developing sticking/anti-sticking technologies through precise control of the interfacial polymer nanostructures.

36 MATERIALS SCIENCE↗

High-performance reversible adhesive from PET waste for underwater, structural, and pressure-sensitive applications

Developing versatile, tough, and sustainable adhesives that function effectively in both wet and dry environments is a major challenge. Here, we report a bioinspired design for versatile, tough, and reversible adhesives upcycled from consumer poly(ethylene terephthalate) (PET) waste. Our approach uses solvent-free, room-temperature dynamic cross-linking of deconstructed PET macromonomers with a diacetoacetate cross-linker, generating a dynamic, vinylogous urethane–bonded, amphiphilic adhesive. Tunable cross-linker concentration and amphiphilicity yield versatile adhesives suitable for underwater, structural, and pressure-sensitive applications on diverse substrates. Our adhesive exhibits high lap-shear strength and work of debonding under both wet and dry conditions, outperforming common commercial adhesives. The dynamic bonds enable thermal repair, on-demand multicycle debonding/rebonding, facile removal, and chemical recycling. Our strategy of transforming plastic waste into versatile, tough, and reversible adhesives offers a sustainable solution for both plastic waste management and next-generation adhesive design while also providing a commercially viable pathway for valorizing plastic waste.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

The Roles of Interface, Adherend, and Adhesive in Plasma- and Other-treated Joints of Metals and FRP Materials Under Shear Deformation

This work investigated the role of interface, adherend, and adhesive in adhesively-bonded metal-metal, metal-CFRTP, and CFRTP-CFRTP combinations with plasma-treated surfaces under shear deformation. To this end, aluminum alloys (AA5052 and AA6061) and short-carbon-fiber-reinforced polyamide 66 (CFRPA66) were used as examples and performed through single lap shear testing. The results showed that air plasma surface treatment can improve the shear behavior of adhesively-bonded AA5052-CFRPA66 and CFRPA66-CFRPA66 joints with about 20% enhanced lap shear strength compared to non-treated cases. Failure surface morphology of plasma-treated CFRPA66 adherend confirmed this improvement by showing an increased amount of adhesive failure than interfacial failure between CFRPA66 and adhesive. But this is not true for AA5052-AA6061 joints with plasma-treated surfaces exhibiting almost no enhanced lap shear strength. This study also showed the importance of selecting a proper surface modification method for the enhancement of adhesive-bonded structures under shear deformation through the analysis of the results in this study and in the literature. For fiber-reinforced polymers (FRPs), improving FRP/adhesive interface may be prioritized via different surface modification methods (e.g., plasma, chemical coating, etc.) than adhesive modification methods. However, for surface-cleaned metals, toughening adhesive via different enhancement methods (e.g., nano-particles, chemical enhancement, etc.) may be more important than improving metal/adhesive interface. These insightful results are valuable in the area of multi-materials joining.

Qiao, Yao↗

Surface Preparation Techniques for Adhesive Bonding of Aluminum and Copper

Adhesive bonding is a commonly used technique to join different parts or structures. The bonding is attributed surface adhesion. Adhesion is defined by the ASTM as “the state in which two surfaces are held together by interfacial forces which consist of valence force or interlocking action or both.” Both of these are highly dependent on the surface conditions, which makes the surface preparation very critical to the performance of adhesive bonding. Obtaining a strong adhesive bond requires various considerations. Wegman and Levi describe several key steps of adhesive bonding that are summarized here: receiving materials, knowledge of the fabrication process for the parts, mating the parts to be bonded, and surface preparation. Among all these steps, surface preparation is usually the most critical, complex, and frequently neglected step in the bonding sequence. Surface preparation can remove the intermediate surface, paint, rust or oxide layer. Different materials including adherents, adhesives, and chemicals require different surface preparation techniques but in general, the surface preparation needs to consider the cleanliness, roughness, and functionality of the surface. Adhesive bonding techniques specific to Aluminum and Copper are highlighted.

36 MATERIALS SCIENCE↗

Development of design allowables data for adhesives for attaching reusables surface insulation, addendum 1A

The task consisted of conducting mechanical and thermal tests to establish design allowables data on a new room temperature vulcanizing (RTV) silicone adhesive, X3-6004. Low modulus, coupled with relatively low density and good low-temperature properties of this adhesive, places it in contention as a candidate for attaching reusable surface insulation on the space shuttle. Data obtained show that the modulus values of X3-6004 are significantly lower than those of RTV-560 and the other three adhesives characterized at test temperatures from 550 to -175 F. At -175, -200 and -270 F, the modulus of X3-6004 is approximately the same as GE RTV-560 and the other three silicone adhesives. The X3-6004 adhesive exhibits good processing properties. It has a 12 percent lower density than RTV-560. Although lower in overall strength properties as compared to the other adhesives in the program, X3-6004 has adequate adhesion to 2024T81 aluminum to compete as an adhesive for attaching reusable surface insulation. It does exhibit some tendency to revert and soften at temperatures above 350 F when in a confined area.

Owen, H. P.↗