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A commercial based, foundry independent, compiler design tool (ChipCrafter) with custom radiation hardened library cells is described. A unique analysis approach allows low hardness risk for Application Specific IC's (ASIC's). Accomplishments, radiation test results, and applications are described.
Application-specific integrated circuit (ASIC) performs 24-bit, fixed-point arithmetic operations on arrays of complex-valued input data. High-performance, wide-band arithmetic logic unit (ALU) designed for use in computing fast Fourier transforms (FFTs) and for performing ditigal filtering functions. Other applications include general computations involved in analysis of spectra and digital signal processing.
This paper discusses the implementation of a fuzzy logic system using an ASICs design approach. The approach is based upon combining the inherent advantages of symmetric triangular membership functions and fuzzy singleton sets to obtain a novel structure for fuzzy logic system application development. The resulting structure utilizes a fuzzy static RAM to store the rule-base and the end-points of the triangular membership functions. This provides advantages over other approaches in which all sampled values of membership functions for all universes must be stored. The fuzzy coprocessor structure implements the fuzzification and defuzzification processes through a two-stage parallel pipeline architecture which is capable of executing complex fuzzy computations in less than 0.55us with an accuracy of more than 95%, thus making it suitable for a wide range of applications. Using the approach presented in this paper, a fuzzy logic rule-base can be directly downloaded via a host processor to an onchip rule-base memory with a size of 64 words. The fuzzy coprocessor's design supports up to 49 rules for seven fuzzy membership functions associated with each of the chip's two input variables. This feature allows designers to create fuzzy logic systems without the need for additional on-board memory. Finally, the paper reports on simulation studies that were conducted for several adaptive filter applications using the least mean squared adaptive algorithm for adjusting the knowledge rule-base.
An Application Specific Integrated Circuit (ASIC) that implements the SpaceWire protocol has been developed in a radiation hardened 0.25 micron CMOS, technology. This effort began in March 2003 as a joint development between the NASA Goddard Space Flight Center (GSFC) and BAE Systems. The BAE Systems SpaceWire ASlC is comprised entirely of reusable core elements, many of which are already flight-proven. It incorporates a 4-port SpaceWire router with two local ports, dual PC1 bus interfaces, a microcontroller, 32KB of internal memory, -and a memory controller for additional external memory use. The SpaceWire ASlC is planned for use on both the Geostationary Operational Environmental Satellites (GOES)-R and the Lunar Reconnaissance Orbiter (LRO). Engineering parts have already been delivered to both programs. This paper discusses the SpaceWire protocol and those elements of it that have been built into the current SpaceWire reusable core. There are features within the core that go beyond the current standard that can be enabled or disabled by the user and these will be described. The adaptation of SpaceWire to BAE Systems' On Chip Bus (OCB) for compatibility with the other reusable cores will be discussed. Optional configurations within user systems will be shown. The physical imp!ementation of the design will be described and test results from the hardware will be discussed. Finally, the BAE Systems roadmap for SpaceWire developments will be discussed, including some products already in design as well as longer term plans.
An improved design has been devised for on-chip-circuitry for measuring the delay through a chain of combinational logic elements in a field-programmable gate array (FPGA) or application-specific integrated circuit (ASIC). In the improved design, the delay chain does not include input and output buffers and is not configured as an oscillator. Instead, the delay chain is made part of the signal chain of an on-chip pulse generator. The duration of the pulse is measured on-chip and taken to equal the delay.
The Reionization And Transient Infra-Red (RATIR) camera has been built for rapid Gamma-Ray Burst (GRE) followup and will provide simultaneous optical and infrared photometric capabilities. The infrared portion of this camera incorporates two Teledyne HgCdTe HAWAII-2RG detectors, controlled by Teledyne's SIDECAR ASICs. While other ground-based systems have used the SIDECAR before, this system also utilizes Teledyne's JADE2 interface card and IDE development environment. Together, this setup comprises Teledyne's Development Kit, which is a bundled solution that can be efficiently integrated into future ground-based systems. In this presentation, we characterize the system's read noise, dark current, and conversion gain.
The objective of this work was to develop a new class of readout integrated circuit (ROIC) arrays to be operated with Geiger avalanche photodiode (GPD) arrays, by integrating multiple functions at the pixel level (smart-pixel or active pixel technology) in 250-nm CMOS (complementary metal oxide semiconductor) processes. In order to pack a maximum of functions within a minimum pixel size, the ROIC array is a full, custom application-specific integrated circuit (ASIC) design using a mixed-signal CMOS process with compact primitive layout cells. The ROIC array was processed to allow assembly in bump-bonding technology with photon-counting infrared detector arrays into 3-D imaging cameras (LADAR). The ROIC architecture was designed to work with either common- anode Si GPD arrays or common-cathode InGaAs GPD arrays. The current ROIC pixel design is hardwired prior to processing one of the two GPD array configurations, and it has the provision to allow soft reconfiguration to either array (to be implemented into the next ROIC array generation). The ROIC pixel architecture implements the Geiger avalanche quenching, bias, reset, and time to digital conversion (TDC) functions in full-digital design, and uses time domain over-sampling (vernier) to allow high temporal resolution at low clock rates, increased data yield, and improved utilization of the laser beam.
Radiation hardened by design (RHBD) techniques allow commercial CMOS circuits to operate in high total ionizing dose and particle fluence environments. Our radiation hard multi-channel digitizer (MCD) ASIC (Figure 1) is a versatile analog system on a chip (SoC) fabricated in 180nm CMOS. It provides 18 chopper stabilized amplifier channels, a 16- bit sigma-delta analog-digital converter (SDADC) and an on-chip controller. The MCD was evaluated at Goddard Space Flight Center and Texas A&M University's radiation effects facilities and found to be immune to single event latchup (SEL) and total ionizing dose (TID) at 174 MeV-cm(exp 2)/mg and 50 Mrad (Si) respectively.
The invention relates to devices and methods of maintaining the current starved delay at a constant value across variations in voltage and temperature to increase the speed of operation of the sequential logic in the radiation hardened ASIC design.
This paper describes the capabilities of the Hardware Command Decode (HCD) application specific integrated circuit (ASIC) developed for the Cassini spacecraft.
This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.
High data rate detectors play an integral part in scientific research and their development is actively pursued at High Energy Physics (HEP) facilities around the world. Edge Machine Learning (ML) offers the ability to reduce data rates by integrating ML algorithms into Application Specific Integrated Circuits (ASICs) on the front end electronics. In this work, we explore a set of neural network architectures for predicting the peak amplitudes in the detector's sensor response. We have designed and synthesized several MLP based neural networks comparing their inference accuracy, power consumption, and area targeting for minimal latency. The neural networks are synthesized in a commercial 65nm process. The effect of quantizing the network's weights and biases on hardware performance and area is reported. We also conduct design space exploration to compare between design alternatives
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