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At least 109 records · Page 6

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NASA NTRS1982

Bisimide amine cured epoxy /IME/ resins and composites. II - Ten-degree off-axis tensile and shear properties of Celion 6000/IME composites

Bisimide amines (BIAs), which are presently used as curing agents in a state-of-the-art epoxy resin, are oligomeric and polymeric mixtures. A series of composites consisting of the novel BIA-cured epoxy resin reinforced with Celion 6000 graphite fibers were fabricated and evaluated, and the ten-degree, off-axis uniaxial tensile and shear properties of these composites were determined. The use of the intralaminar shear strain-to-failure was used in the calculation of resin shear strain-to-failure. Study results indicate that several of these novel composite systems exhibit shear strain properties that are superior to those of the control composite system of the present experiments, which employed a sulfone curing agent.

Scola, D. A.↗

NASA NTRS1982

Detection of trace quantities of dimethylacetamide during the curing process of a polyimide film

An experimental study of positive ion clustering of dimethylacetamide (DMAC) with water molecules using high pressure mass spectrometry techniques is reported. The possibilities of using these techniques to determine the concentration levels of DMAC evolved from a polyimide film during the curing process, are examined. The test sample of gas contained DMAC of the order of a few micrograms, water, nitrogen, oxygen, and other compounds that might evolve during the curing cycle of a polyimide film. It is found that PPM concentrations such as DMAC lost from polyimide during curing stages can be detected with this technique. Improvement of the detection of lower concentrations (50 picograms) can be made by using electron multipliers with a gain in the 10 to the 8th power range and pulse counting techniques.

Smith, A. C.↗

NASA NTRS1983

Curing of epoxy resins with 1-DI(2-chloroethoxyphosphinyl) methyl-2,4 and -2,6-diaminobenzene

Fire resistant compositions were prepared using 1-di(2-chloroethoxy-phosphinyl)methyl-2,4- and -2,6-diaminobenzene (DCEPD) as a curing agent for typical epoxy resins such as EPON 828 (Shell), XD 7342 (Dow), and My 720 (Ciba Geigy). In addition, compositions of these three epoxy resins with common curing agents such as m-phenylenediamine (MPD) or 4,4'-diaminodiphenylsulphone (DDS) were studied to compare their reactions with those of DCEPD. The reactivity of the three curing agents toward the epoxy resins, measured by differential calorimetry (DSC), was of the order MPD DCEPD DDS. The relatively lower reactivity of DCEPD toward epoxy resins was attributed to electronic effects.

Mikroyannidis, J. A.↗

NASA NTRS1986

Ultrasonic Mixing of Epoxy Curing Agents

New ultrasonic mixing technique used to mix several curing agents/epoxy combinations. Major component of commercially available base epoxy resin used in tetraglycidylmethylenedianiline (TGMDA). In ultrasonic mixing system cup holds resin and curing agent during acoustic excitation. Samples placed in cup with top to ultrasonic horn forming bottom of cup. Ultrasonically treated until amber colored and transparent. Because ultrasonic agitation drives out entrapped air, degassing not necessary before cure.

Hodges, W. T.↗

NASA NTRS1985

Phenoxy resins containing pendent ethynyl groups and cured resins obtained therefrom

Phenoxy resins containing pendent ethynyl groups, the process for preparing the same, and the cured resin products obtained therefrom are disclosed. Upon the application of heat, the ethynyl groups react to provide branching and crosslinking with the cure temperature being lowered by using a catalyst if desired but not required. The cured phenoxy resins containing pendent ethynyl groups have improved solvent resistance and higher use temperature than linear uncrosslinked phenoxy resins and are applicable for use as coatings, films, adhesives, composited matrices and molding compounds.

Hergenrother, P. M.↗

NASA NTRS1984

Curing of epoxy resins with 1-/di(2-chloroethoxyphosphinyl)methyl/-2,4- and -2,6-diaminobenzene

Mikroyannidis, J. A.↗

NASA NTRS1984

Analysis of cure in composites processing

Finite element analysis is a general numerical tool for solving the field equations of engineering practice, and this paper demonstrates its use in modeling the nonisothermal cure of pultruded composite material. A very simple grid is used in this case to model a narrow strip of material, and this grid is then solved using a time-stepping transient algorithm to simulate the passage of the strip along the pultruder die. As time proceeds, heat is conducted into the strip from the heated boundaries at the die walls, and cure proceeds at a rate dependent on the local temperature. The computer model can be used to minimize the time needed for sufficient cure, and helps avoid such processing errors as undercure or thermal degradation.

Aylward, L.↗

NASA NTRS1987

Thermomechanical Properties Indicate Degree of Epoxy Cure

Glass-transition temperature and density increase as reaction proceeds. Cured epoxy resin found to be related to extent of cure. In addition to providing insight into chemical reactions of curing, relationships show potential for process monitoring and control in fabrication of strong, lightweight composite parts.

Cizmecioglu, Muzaffer↗

NASA NTRS1986

Process for curing bismaleimide resins

This invention relates to vinyl pyridine group containing compounds and oligomers, their advantageous copolymerization with bismaleimide resins, and the formation of reinforced composites based on these copolymers. When vinyl pyridines including vinyl stilbazole materials and vinyl styrylpyridine oligomer materials are admixed with bismaleimides and cured to form copolymers the cure temperatures of the copolymers are substantially below the cure temperatures of the bismaleimides alone.

Parker, John A.↗

NASA NTRS1977

Aminophenoxycyclotriphosphazene cured epoxy resins and the composites, laminates, adhesives and structures thereof

Aminophenoxy cyclotriphosphazenes such as hexakis (4-aminophenoxy) cyclotriphosphazene and tris (4-aminophenoxy)-tris phenoxy cyclotriphosphazene are used as curing agents for epoxy resins. These 1,2-epoxy resins are selected from di- or polyepoxide containing organic moieties of the formula (CH2-CHO-CH2) m-W-R-W- (CH2CH-CH2O)m where R is diphenyl dimethylmethane, diphenylmethane; W is a nitrogen or oxygen atom; and m is 1 when W is oxygen and 2 when W is nitrogen. The resins are cured thermally in stages at between about 110 to 135 C for between about 1 and 10 min, then at between about 175 to 185 C for between 0.5 to 10 hr and post cured at between about 215 and 235 C for between 0.1 and 2 hr. These resins are useful for making fire resistant elevated temperature stable composites, laminates, molded parts, and adhesives and structures, usually for aircraft secondary structures and for spacecraft construction.

Kumar, Devendra↗

NASA NTRS1985

Optimal cure cycle design for autoclave processing of thick composites laminates: A feasibility study

The thermal analysis and the calculation of thermal sensitivity of a cure cycle in autoclave processing of thick composite laminates were studied. A finite element program for the thermal analysis and design derivatives calculation for temperature distribution and the degree of cure was developed and verified. It was found that the direct differentiation was the best approach for the thermal design sensitivity analysis. In addition, the approach of the direct differentiation provided time histories of design derivatives which are of great value to the cure cycle designers. The approach of direct differentiation is to be used for further study, i.e., the optimal cycle design.

Hou, Jean W.↗

NASA NTRS1987

Adhesion at the interface in cured graphite fiber epoxy-amine resin composites

The effect of high temperature curing on the interface between unsized or epoxy-sized graphite fiber tow and epoxy-amine resin was examined by scanning electron microscopy of compression and freeze fractured specimens. Little or no adhesion was found between the unsized graphite fiber tows and the epoxy-amine resin on curing at 165 C for 17 hrs. Epoxy-sized graphite fibers showed a similar lack of adhesion between the fiber tows and the epoxy-amine resin at 3 and 17 hr cures, although good penetration of the resin into the sized fiber tows had occurred. Interfacial bond strengths for the composites could not be effectively measured by compression fracture of specimens.

Needles, Howard L.↗

NASA NTRS1990

Effects of cure temperature, electron radiation, and thermal cycling on P75/930 composites

Graphite/epoxy composites are candidates for future space structures due to high stiffness and dimensional stability requirements of these structures. Typical graphite/epoxy composites are brittle and have high residual stresses which often result in microcracking during the thermal cycling typical of the space environment. Composite materials used in geosynchronous orbit applications will also be exposed to high levels of radiation. The purpose of the present study was to determine the effects of cure temperature and radiation exposure on the shear strength and thermal cycling-induced microcrack density of a high modulus, 275 F cure epoxy, P75/930. The results from the P75/930 are compared to previously reported data on P75/934 and T300/934 where 934 is a standard 350 F cure epoxy. The results of this study reveal that P75/930 is significantly degraded by total doses of electron radiation greater than 10(exp 8) rads and by thermally cycling between -250 F and 150 F. The P75/930 did not have improved microcrack resistance over the P75/934, and the 930 resin system appears to be more sensitive to electron radiation-induced degradation than the 934 resin system.

Funk, Joan G.↗

NASA NTRS1992

Lower temperature curing thermoset polyimides utilizing a substituted norbornene endcap

Methoxycarbonyl bridgehead substituted nadic diacid monomethyl ester, when used as an endcapping monomer, lowered the cure temperature of thermoset PMR polyimides without seriously affecting other desirable properties, such as glass transition temperature and thermal oxidative stability. The C-13 CP/MAS NMR of model compounds was used to follow the cure of resin systems using both the unmodified nadic endcap and the methoxycarbonyl-substituted endcap. Rheological analysis and differential scanning calorimetry DSC also provided evidence for the lower curing nature of the substituted endcap. Two regioisomers of the bridgehead-substituted endcap were isolated, and their chemical structures were elucidated by X-ray crystallography. The model compound and molecular modeling studies conducted ruled out the possibility of regioisomeric imide formation in the substituted endcaps.

Waters, John F.↗

NASA NTRS1995

Mathematical Model Of Curing Behavior Of A Polymer

Mathematical model predicts selected aspects of chemical, thermal and mechanical responses of polymeric liner and propellant materials during curing process. Predictions made both prior to processing and during process in quasi-real time. Developed specifically for use in designing and analyzing process in which bondline materials (including polymeric liners) and propellant cast and cured in rocket motor. With modifications, model applicable to curing of other polymeric materials. Further development may provide direct "in-line" program for calculations, including comparisons, in real time. This will constitute basis for more sophisticated control of process.

Loomis, Willard C.↗

NASA NTRS1995

Stress In A Fiber During Curing Of Surrounding Matrix Resin

Experiments run to determine variation in tensile stress in single fiber during curing of matrix resin surrounding fiber. Study part of effort to understand physical mechanisms affecting residual stresses in matrix/fiber composites, with view toward optimizing curing cycles (in particular, optimizing temperature-vs.-time schedules of final cooldowns to ambient temperature) to minimize residual stresses. Results signify primary mechanisms affecting residual stress in fibers are thermal expansion and contraction and cure shrinkage of matrix material.

Bowles, Kenneth J.↗

NASA NTRS1995

Slide Rule For Calculating Curing Schedules

Special-purpose slide rule devised for calculating schedules for storing and curing adhesives, sealants, and other materials characterized by known curing times and shelf lives. Prevents mistakes commonly made in determining storage and curing schedules.

Heater, Don↗

NASA NTRS1994

High Flow Addition Curing Polyimides

A new series of high flow PMR-type addition curing polyimides was developed, which employed the substitution of 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (BTDB) for p-phenylenediamine (p -PDA) in a PMR-IL formulation. These thermoset polyimides, designated as 12F resins, were prepared from BTDB and the dimethyl ester of 4,4'- (hexafluo- roisopropylidene) -diphthalic acid (HFDE) with either nadic ester (NE) or p-aminostyrene (PAS) as the endcaps for addition curing. The 12F prepolymers displayed lower melting temperatures in DSC analysis, and higher melt flow in rheological studies than the cor- responding PMR-11 polyimides. Long-term isothermal aging studies showed that BTDB- based 12F resins exhibited comparable thermo-oxidative stability to P-PDA based PMR-11 polyimides. The noncoplanar 2- and 2'-disubstituted biphenyldiamine (BTDB) not only lowered the melt viscosities of 12F prepolymers, but also retained reasonable thermal sta- bility of the cured resins. The 12F polyimide resin with p-aminostyrene endcaps showed the best promise for long-term, high-temperature application at 343 C (650 F).

Chuang, Kathy C.↗