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At least 109 records · Page 6

Radiation Hardness Assurance (RHA) Guideline

Radiation Hardness Assurance (RHA) consists of all activities undertaken to ensure that the electronics and materials of a space system perform to their design specifications after exposure to the mission space environment. The subset of interests for NEPP and the REAG, are EEE parts. It is important to register that all of these undertakings are in a feedback loop and require constant iteration and updating throughout the mission life. More detail can be found in the reference materials on applicable test data for usage on parts.

Radiation Hardness Assurance (RHA)↗

My Internship at NASA

My name is Isaac Lopez and I am a junior at the University of Houston majoring in Mechanical Engineering Technology. I will be completing my first tour at the NASA-Johnson Space Center ("JSC") as a Mechanical Engineer within the Human Interfaces Branch. Throughout my tour, I was given the opportunity to work on multiple projects that have expanded my knowledge and interest in acoustics and engineering design. One of the projects I worked on at JSC consisted of doing acoustic simulation of the EVA comm. cap. While working on the comm. cap headset, my main duty consisted of simulating the acoustics of the headset to find a solution to the condensing water that can accumulate and block the acoustic tube, causing attenuation or complete loss of audio in one ear for an astronaut using the EVA. For this project, I had to create a Creo model of the comm. cap so that I would be able to import it into Comsol for acoustic simulation. I also had the opportunity to design a portable and lightweight beam degrader for the EEE Parts and Radiation team. With the help of Creo, I was able to make a CAD design and put together a small working prototype for the radiation team to demonstrate the capabilities that the beam degrader had. In addition to these projects, JSC allowed me to work closely on projects with other interns. I had the opportunity to help another intern with his acoustic diverter, intended to improve the sound quality in Node 1 of the ISS. During this project, I helped with some of the acoustic testing inside the anechoic chamber as well as helping record data during testing at the ISS mock up. During the course of my first tour, I was able to learn and continually improve on my CAD drafting skills. With each project I worked on, I acquired new ways to create and improve various designs with various constraints. Furthermore, I also had the opportunity to work with electrical engineers and learn about the electronic components that would provide control of the beam degrader functions. I was able to take the knowledge, skills and designs I had acquired during my tour at JSC (such as Finite Element Analysis) and apply them to my work on the Comsol Multiphysics software for acoustics simulation. I was also able to use it to do some stress analysis on a proposed design for a proposed Habitat structure. My time at JSC has been invaluable as it helped me grow and more fully-comprehend my major as well as spark an interest in acoustics and how much it relates to mechanical engineering. This internship has taught me that engineering is much more than a profession - it is embedded in our daily lives as a puzzle that requires critical thinking as an everyday challenge that makes life more interesting.

Lopez, Isaac↗

Radiation Engineering for Designers

This tutorial provides an overview of the natural space radiation environment, an introduction to radiation effect types, an overview of EEE parts selection, scrubbing, and radiation mitigation, and an introduction to radiation testing.

radiation effects↗

Application of Temperature-Controlled Thermal Atomization for Printing Electronics in Space

Additive Manufacturing (AM) is a technology that builds three dimensional objects by adding material layer-upon-layer throughout the fabrication process. The Electrical, Electronic and Electromechanical (EEE) parts packaging group at Marshall Space Flight Center (MSFC) is investigating how various AM and 3D printing processes can be adapted to the microgravity environment of space to enable on demand manufacturing of electronics. The current state-of-the art processes for accomplishing the task of printing electronics through non-contact, direct-write means rely heavily on the process of atomization of liquid inks into fine aerosols to be delivered ultimately to a machine's print head and through its nozzle. As a result of cumulative International Space Station (ISS) research into the behaviors of fluids in zero-gravity, our experience leads us to conclude that the direct adaptation of conventional atomization processes will likely fall short and alternative approaches will need to be explored. In this report, we investigate the development of an alternative approach to atomizing electronic materials by way of thermal atomization, to be used in place of conventional aerosol generation and delivery processes for printing electronics in space.

Wu, Chih-Hao↗

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗

NASA and COTS Electronics: Past Approach and Successes - Future Considerations

NASA has a long history of using commercial grade electronics in space. In this talk, a brief history of NASAâ's trends and approaches to commercial grade electronics focusing on processing and memory systems will be presented. This will include providing summary information on the space hazards to electronics as well as NASA mission trade space. We will also discuss developing recommendations for risk management approaches to Electrical, Electronic and Electromechanical (EEE) parts and reliability in space. The final portion of the talk will discuss emerging aerospace trends and the future for Commercial Off The Shelf (COTS) usage.

LaBel, Kenneth A.↗

Radiation Single Event Effects (SEE) Impact on Complex Avionics Architecture Reliability

The NASA Engineering and Safety Center (NESC) has an urgent need to understand how system-level reliability of an avionics architecture is compromised when portions of the architecture are temporarily unavailable due to single event effects (SEE). The proposed activity parametrically evaluated these SEE impacts on system reliability based on mission duration, upset rate and recovery times for a representative redundant architecture. The key stakeholders for this study are NASA programs and projects that expect to use avionics architectures with electrical, electronic and electromechanical (EEE) parts susceptible to SEE when exposed to the mission expected radiation environment.

Hodson, Robert F.↗

TPSAS-NF1676L-30470-DND

Outside NASA: Single Agency document that can be referenced in NASA contracts (e.g. CCP) and used in NASA-ESA-JAXA Mutual Recognition of SMA Standards Within NASA: - Lists requirements from Center documents that must be addressed by Programs and Projects in their EEE Parts Management and Control Plan (EPMCP) - Tailor-able by Center/Project Technical Authority - Standardize requirements for “Low Risk” projects -not to overburden “Higher Risk” projects with excessive requirements

Peter J Majewicz↗

R-Gentic-SEAM Interface and Harmonization

SEAM is a useful resource for model-based radiation hardness assurance but can be technically challenging for new users. R-Gentic is a NASA developed website that aims at assisting engineers better understand the radiation concerns in their EEE parts. This work aims at providing an update on an ongoing effort to interface R-Gentic with SEAM. Once integration is completed, R-Gentic can be used to seed new SEAM projects, making project creation easier and more accessible.

Procedures↗

A Discussion of the Failure of a Quad Diode Module and Efforts to Assure the Flight Spares

In 2019 the International Space Station (ISS) experienced an on on-orbit failure that affected 1 of 28 Battery Charge Discharge Units (BCDUs). Telemetry pointed to a short circuit failure of a Power Rectifier Quad Diode Module. Astronauts removed the failed unit from service which was then returned to Earth for failure analysis. The failure analysis confirmed that the quad diode module had failed short circuit. The investigation identified silver dendrites had grown on the insulated, sloped edge of the mesa semiconductor die of the failed diode and also a 2nd diode in the same quad diode module. Voids between the diode’s protective encapsulating ring and the die provided space within which dendrites were able to form and cause catastrophic failure. The NASA Engineering & Safety Center (NESC) convened a EEE Parts Sub-Team to investigate root cause and to assist with risk assessment for all of the flight diode modules (4 distinct production lots) and the flight spares (from a 5th lot). Analysis of the original diode manufacturer’s read and record screening test data identified some lots which contained diodes with parametric instabilities that could signal conditions suited for silver dendrite formation. Computed Tomography (CT) X-ray screening inspection was performed on flight spare modules to identify diodes that do not exhibit voids between the edge of die and encapsulating ring as a mitigation against dendrite formation.

Jay Brusse↗

Assurance of Electronic Parts for Aerospace System Reliability: Past, Present, and Future

Over the last two to three decades, the balance of influence within the electronics industry has shifted decisively towards the consumer electronics and information technology products, away from the defense or aerospace markets. This shift towards the commercial markets has changed certain ground rules in the electronics industry. Reliance of the aerospace industry, in particular, on components from supply chains dedicated to other products, or cross-vertical product integration, creates a supply web and introduces significant risks that are not necessarily present for volume-driven electronic products. Many of the unique risks in the aerospace industry emanate from the key characteristics of this industry. Although selection and usage of commercial electronics in NASA flight hardware is possible at a comparable (and in many cases lower) level of risk to that of employing parts that are screened to military or NASA specifications, for a large majority of flight projects it is difficult to distinguish the difference in on-orbit performance or reliability for parts screened at any level, or commercial parts that have no additional screening performed by the government. This paper identifies several bases for establishing context and developing unique or alternative approaches for successful parts selection and application within NASA and across the commercial space community.

electronic parts↗

A New, Cots-Inclusive, Approach for Parts Assurance in NASA

This talk will provide insights into new options for parts assurance that are being introduced into NASA policy, which build on the results of the NASA Engineering and Safety Center (NESC) COTS Phase 2 study. It will provide some of the highlights and drivers for the use of COTS and brief recommendations for how to successfully select and use COTS parts.

risk↗

Re-thinking the Approach to COTS Electronics for Space Applications

This talk will provide the immediate drivers for broad introduction of COTS into NASA missions and the supporting new options for parts assurance that are being introduced into NASA policy, which build on the results of the NASA Engineering and Safety Center (NESC) COTS Phase 2 study. It will also provide a new approach at electronics development that will be necessary to align the agency with the current reality in manufacturing, technology, budgetary, and time limitations. It will also provide some of the highlights and drivers for the use of COTS and brief recommendations for how to successfully select and use COTS parts.

risk↗

NASA Electronic Parts and Packaging (NEPP) Program

Recent Findings from Audits, New Technology Data Reviews a) Disabled Chip Burn-ins A recent audit for a QML device discovered that the chip was disabled during the static burn-in, thus it was not drawing any current. Recommendation: For new SMDs add a statement within the burn-in paragraphs stating that the parts shall be kept in their enabled state during the burn-in. b) Class Q 160-hr/125oC Burn-in This is being interpreted as a static burn-in (even for CMOS technology). Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. c) At Frequency (Dynamic) Burn-ins Test equipment limitation is being cited for not doing burn-ins at the application frequency. Recommendation: The burn-in task group to discuss and provide guidance. When the SMD says that the part can be used at 200 MHz, then doing burn-in at 6 MHz (cited as burn-in equipment limitation frequency) is not going to be meaningful! d) Two Static Burn-ins Some manufacturers are doing electrical testing between the two static burn-ins, whereas others do electricals after completing both static burn-ins. Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. e) Thermal Imaging For a device with hot spots, the thermal resistance, junction-to-case, would be much higher than the guidelines given in MIL-STD-1835. One of the suppliers used thermal imaging to find hot spots on the die. Recommendation: Assign a task group to evaluate the effectiveness of thermal imaging at the product development stage.

Class Y↗

Challenges with Electrical, Electronics, and Electromechanical Parts for James Webb Space Telescope

James Webb Space Telescope (JWST) is the space-based observatory that will extend the knowledge gained by the Hubble Space Telescope (HST). Hubble focuses on optical and ultraviolet wavelengths while JWST focuses on the infrared portion of the electromagnetic spectrum, to see the earliest stars and galaxies that formed in the Universe and to look deep into nearby dust clouds to study the formation of stars and planets. JWST, which commenced creation in 1996, is scheduled to launch in 2018. It includes a suite of four instruments, the spacecraft bus, optical telescope element, Integrated Science Instrument Module (ISIM, the platform to hold the instruments), and a sunshield. The mass of JWST is approximately 6200 kg, including observatory, on-orbit consumables and launch vehicle adaptor. Many challenges were overcome while providing the electrical and electronic components for the Goddard Space Flight Center hardware builds. Other difficulties encountered included developing components to work at cryogenic temperatures, failures of electronic components during development and flight builds, Integration and Test electronic parts problems, and managing technical issues with international partners. This paper will present the context of JWST from a EEE (electrical, electronic, and electromechanical) perspective with examples of challenges and lessons learned throughout the design, development, and fabrication of JWST in cooperation with our associated partners including the Canadian Space Agency (CSA), the European Space Agency (ESA), Lockheed Martin and their respective associated partners. Technical challenges and lessons learned will be discussed.

EEE Parts↗

NASA Engineering & Safety Center (NESC) Assessment – Recommendations on Use of Commercial-Off-The-Shelf (COTS) Parts for NASA Missions

This presentation is to provide an update on the NASA Engineering & Safety Center (NESC) Assessment of "Recommendations on Use of Commercial-Off-The-Shelf (COTS) Parts for NASA Missions". Phase I was a published report and Phase II is on-going. Phase I captured the current NASA center practices on using COTS parts while Phase II provides updated NESC recommendation of using COTS parts for NASA missions with different risk classifications.

EEE parts↗