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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS1989

Materials properties numerical database system established and operational at CINDAS/Purdue University

A computerized comprehensive numerical database system on the mechanical, thermophysical, electronic, electrical, magnetic, optical, and other properties of various types of technologically important materials such as metals, alloys, composites, dielectrics, polymers, and ceramics has been established and operational at the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University. This is an on-line, interactive, menu-driven, user-friendly database system. Users can easily search, retrieve, and manipulate the data from the database system without learning special query language, special commands, standardized names of materials, properties, variables, etc. It enables both the direct mode of search/retrieval of data for specified materials, properties, independent variables, etc., and the inverted mode of search/retrieval of candidate materials that meet a set of specified requirements (which is the computer-aided materials selection). It enables also tabular and graphical displays and on-line data manipulations such as units conversion, variables transformation, statistical analysis, etc., of the retrieved data. The development, content, accessibility, etc., of the database system are presented and discussed.

Ho, C. Y.↗

NASA NTRS1990

Reliability and quality EEE parts issues

NASA policy and procedures are established which govern the selection, testing, and application of electrical, electronic, and electromechanical (EEE) parts. Recent advances in the state-of-the-art of electronic parts and associated technologies can significantly impact the electronic designs and reliability of NASA space transportation avionics. Significant issues that result from these advances are examined, including: recent advances in microelectronics technology (as applied to or considered for use in NASA projects); electron packaging technology advances (concurrent with, and as a result of, the development of the advanced microelectronic devices); availability of parts used in space avionics; and standardization and integration of parts activities between projects, centers, and contractors.

Barney, Dan↗

NASA NTRS1991

NASA's challenge for tomorrow

The early space probes provided our first detailed look at the planets, and demonstrated the critical role played by parts technology. The advanced orbital platform under development, the Space Station Freedom (which represents a pivotal step in the space program) contains about 5 million Electrical, Electronic and Electromechanical (EEE) parts. Thus, EEE parts continue to be crucial to mission success. The NASA EEE parts program establishes and directs policy and integration throughout the Agency. The EEE program structure, issues and solutions are described. The challenge presented by advanced electronic devices is discussed.

Barney, Daniel L.↗

NASA NTRS1991

Intelligent structures technology

Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.

Crawley, Edward F.↗

NASA NTRS1994

Earth Observing System/Advanced Microwave Sounding Unit-A (EOS/AMSU-A): Developer derating policy

The derating requirements/factors tabulated in Appendix B of the Goddard Space Flight Center Preferred Parts List (GSFC PPL) and Appendix A of MIL-STD-975 (NASA Standard Electrical, Electronic and Electromechanical (EEE) Parts List) should be used. Where differences occur, the PPL derating factors should have precedence over the derating factors of MIL-STD-975. When a derating factor is not provided in either the PPL or MIL-STD-975, the GSFC EOS Parts Branch Specialist should be consulted. In addition, the Performance Assurance Requirement (PAR) stipulates that all piece parts shall function at or above twice the expected ionizing radiation dose.

Maciel, Roberto M.↗

NASA NTRS1995

Low-temperature operation of a Buck DC/DC converter

Low-temperature (77 K) operation of a 42/28 V, 175 W, 50 kHz PWM Buck DC/DC converter designed with commercially available components is reported. Overall, the converter losses decreased at 77 K compared to room temperature operation. A full-load efficiency of 97 percent was recorded at liquid-nitrogen temperature, compared to 95.8 percent at room temperature. Power MOSFET operation improved significantly where as the output rectifier operation deteriorated at low-temperature. The performance of the output filter inductor and capacitor did not change significantly at 77 K compared to room temperature performance. It is possible to achieve high-density and high efficiency power conversion at low-temperatures due to improved electronic, electrical and thermal properties of materials.

Ray, Biswajit↗

NASA NTRS2003

Past, Present and Future Trends for NASA's EEE Parts Program

The foundation of NASA's Electrical, Electronic and Electromechanical (EEE) parts program is standardization. Standardization helps to reduce the number of unknown variables present as a project or program progresses; unknown variables equate to unknown risk. NASA spacecraft are usually 'one-offs' or at least part of a very short run, and every new part that is used represents a risk that has to be understood and mitigated as necessary. This equates directly to time and cost. Standardization of component parts is used to provide a foundation of known, dependable, qualified parts upon which a safe, reliable system can be built. In addition, the evaluation and selection of parts for the standard parts list unifies the activity under one group of experts rather than having engineers on each project overlapping and duplicating efforts. Thus, the project support engineers are able to concentrate on understanding and mitigating the risks for the non standard parts required to meet specific requirements of their project. Rapid technology change is producing conditions that make any form of parts-based standardization increasingly difficult, particularly the use of Commercial Off The Shelf (COTS) parts and assemblies. There are many complications to COTS-based standardization. COTS parts change rapidly and unpredictably, often have different characteristics fiom manufacturer to manufacturer, frequently are only available through distribution, have no universal specification and have variable and unpredictable radiation characteristics. This presentation will discuss some potential approaches to COTS parts standardization. Further into the future, in three to five years perhaps, the use of COTS boards and boxes will be extensive and standardization at these levels of assembly will be necessary. In five to ten years, most major spacecraft functions will probably be performed by COTS boards. How will this be achieved? What role will the parts engineer play, if any? This presentation will borrow from the lessons of the past to suggest some scenarios for the future.

Sampson, Michael J.↗

NASA NTRS2006

Prototype Software for Future Spaceflight Tested at Mars Desert Research Station

NASA scientists in MDRS Crew 49 (April 23-May 7, 2006) field tested and significantly extended a prototype monitoring and advising system that integrates power system telemetry with a voice commanding interface. A distributed, wireless network of functionally specialized agents interacted with the crew to provide alerts (e.g., impending shut-down of inverter due to low battery voltage), access md interpret historical data, and display troubleshooting procedures. In practical application during two weeks, the system generated speech over loudspeakers and headsets lo alert the crew about the need to investigate power system problems. The prototype system adapts the Brahms/Mobile Agents toolkit to receive data from the OneMeter (Brand Electronics) electric metering system deployed by Crew 47. A computer on the upper deck was connected to loudspeakers, four others were paired with wireless (Bluetooth) headsets that enabled crew members to interact with their personal agents from anywhere in the hab. Voice commands and inquiries included: 1. What is the {battery | generator} {volts | amps | volts and amps}? 2. What is the status of the {generator | inverter | battery | solar panel}? 3. What is the hab{itat} {power usage | volts | voltage | amps | volts and amps}? 4. What was the average hab{itat} {amps | volts | voltage} since <#> {AM | PM)? 5. When did the {generator | batteries} change status? 6. Tell {me I | everyone} when{ ever} the generator goes offline. 7. Tell {me | | everyone} when the hab{itat} {amps | volts | voltage} {exceeds | drops brelow} <#>. 8. {Send | Take | Record} {a} voice note {(for | to} } {at }. This research demonstrates the principles of design in the context of use, investigating requirements through experimental use of prototype systems in an analog setting, and use of MDRS as a research facility for designing and implementing new systems.

Clancey, William J.↗

NASA NTRS1970

Cumulative Index to NASA Tech Briefs 1963-1969

Tech Briefs are short announcements of new technology derived from the research and development activities of the National Aeronautics and Space Administration. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This Cumulative index to NASA Tech Briefs lists those published from 1963 through 1969. The main listing is divided into six categokies: Electrical (Electronic), Physical Sciences (Energy Sources), Materials (Chemistry), Life Sciences, Mechanical, and Computer Programs.

Source record↗

NASA NTRS2009

Parts and Components Reliability Assessment: A Cost Effective Approach

System reliability assessment is a methodology which incorporates reliability analyses performed at parts and components level such as Reliability Prediction, Failure Modes and Effects Analysis (FMEA) and Fault Tree Analysis (FTA) to assess risks, perform design tradeoffs, and therefore, to ensure effective productivity and/or mission success. The system reliability is used to optimize the product design to accommodate today?s mandated budget, manpower, and schedule constraints. Stand ard based reliability assessment is an effective approach consisting of reliability predictions together with other reliability analyses for electronic, electrical, and electro-mechanical (EEE) complex parts and components of large systems based on failure rate estimates published by the United States (U.S.) military or commercial standards and handbooks. Many of these standards are globally accepted and recognized. The reliability assessment is especially useful during the initial stages when the system design is still in the development and hard failure data is not yet available or manufacturers are not contractually obliged by their customers to publish the reliability estimates/predictions for their parts and components. This paper presents a methodology to assess system reliability using parts and components reliability estimates to ensure effective productivity and/or mission success in an efficient manner, low cost, and tight schedule.

Lee, Lydia↗

NASA NTRS1969

Cumulative Index to NASA Tech Briefs

Tech Briefs are short announcements of new technology derived from the R&D activities of the National Aeronautics and Space Administration. This Index to NASA Tech Briefs lists the technological innovations derived from the U.S. space program and published during the period January through December 1968. A new five year cycle of cumulative indexes begins with this index. The main section is arranged in six categories: Electrical (Electronic); Physical Sciences (Energy Sources); Materials (Chemistry); Life Sciences; Mechanical; and Computer Programs.

Source record↗

NASA NTRS2008

X-ray Fluorescence Spectroscopy Study of Coating Thickness and Base Metal Composition

For electrical, electronic, and electromechanical (EEE) parts to be approved for space use, they must be able to meet safety standards approved by NASA. A fast, reliable, and precise method is needed to make sure these standards are met. Many EEE parts are coated in gold (Au) and nickel (Ni), and the thickness coating is crucial to a part s performance. A nondestructive method that is efficient in measuring coating thickness is x-ray fluorescence (XRF) spectroscopy. The XRF spectrometer is a machine designed to measure layer thickness and composition of single or multilayered samples. By understanding the limitations in the collection of the data by this method, accurate composition and thickness measurements can be obtained for samples with Au and Ni coatings. To understand the limitations of data found, measurements were taken with the XRF spectrometer and compared to true values of standard reference materials (SRM) that were National Institute of Standards and Technology (NIST) traceable. For every sample, six different parameters were varied to understand measurement error: coating/substrate combination, number of layers, counting interval, collimator size, coating thickness, and test area location. Each measurement was taken in accordance with standards set by the American Society for Testing and Materials (ASTM) International Standard B 568.

Rolin, T. D.↗

NASA NTRS2010

Three-Dimensional Computed Tomography as a Method for Finding Die Attach Voids in Diodes

NASA analyzes electrical, electronic, and electromechanical (EEE) parts used in space vehicles to understand failure modes of these components. The diode is an EEE part critical to NASA missions that can fail due to excessive voiding in the die attach. Metallography, one established method for studying the die attach, is a time-intensive, destructive, and equivocal process whereby mechanical grinding of the diodes is performed to reveal voiding in the die attach. Problems such as die attach pull-out tend to complicate results and can lead to erroneous conclusions. The objective of this study is to determine if three-dimensional computed tomography (3DCT), a nondestructive technique, is a viable alternative to metallography for detecting die attach voiding. The die attach voiding in two- dimensional planes created from 3DCT scans was compared to several physical cross sections of the same diode to determine if the 3DCT scan accurately recreates die attach volumetric variability

Brahm, E. N.↗

NASA NTRS2014

Summer 2014 Final Report

Description A report on my term as an intern for the Ground Electrical and Electronics Branch, Electrical Engineering Division, Engineering Directorate at KSC during the summer of 2014.

GODU LH2↗

NASA NTRS2015

Standards for Radiation Effects Testing: Ensuring Scientific Rigor in the Face of Budget Realities and Modern Device Challenges

An overview is presented of the space radiation environment and its effects on electrical, electronic, and electromechanical parts. Relevant test standards and guidelines are listed. Test standards and guidelines are necessary to ensure best practices, minimize and bound systematic and random errors, and to ensure comparable results from different testers and vendors. Test standards are by their nature static but exist in a dynamic environment of advancing technology and radiation effects research. New technologies, failure mechanisms, and advancement in our understanding of known failure mechanisms drive the revision or development of test standards. Changes to standards must be weighed against their impact on cost and existing part qualifications. There must be consensus on new best practices. The complexity of some new technologies exceeds the scope of existing test standards and may require development of a guideline specific to the technology. Examples are given to illuminate the value and limitations of key radiation test standards as well as the challenges in keeping these standards up to date.

Test Standard↗

NASA NTRS2015

Solid State Ultracapacitor

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts used in space vehicles. One area that NASA wishes to advance is energy storage and delivery. Currently, space vehicles use rechargeable batteries that utilize silver zinc or lithium ion electrochemical processes. These current state-of-the-art rechargeable batteries cannot be rapidly charged, contain harmful chemicals, and suffer from early wear-out mechanisms. A solid state ultracapacitor is an EEE part that offers significant advantages over current electrochemical and electrolytic devices. The objective of this research is to develop an internal barrier layer ultracapacitor (IBLC) using novel dielectric materials as a battery replacement with a focus on these advantages: longer life, lower mass-toweight ratio, rapid charging, on-demand pulse power, improved on-pad standby time without maintenance, and environmental friendliness. The approach is unique in two areas. A deposition technique is used that has been shown to produce a more uniformly coated nanoparticle than sol-gel, which has resulted in colossal permittivities. These particles are then distributed in an ink formulation developed at NASA Marshall Space Flight Center (MSFC) and deposited utilizing a 3D aerosol jet technique. This additive manufacturing technique controls layer thickness, resulting in extremely large capacitance and energy density.

Rolin, Terry D.↗

NASA NTRS2017

Echoes of the Past, Glimpses of the Future - Ongoing Trends in Assurance of EEE Parts for Spaceflight

This presentation will review some past NASA presentations that had identified challenges and future trends in the assurance of Electrical, Electronic and Electromechanical (EEE) parts for spaceflight applications. It will contrast the concerns expressed in those presentations with the challenges of today and identify trends that give insight into the future. Common themes include the use of commercial parts, limited technical and physical resources, the pace of technology change and the difficulties in handling and testing individual parts as they become smaller and more complex. Some options for dealing with these challenges will be suggested to accommodate increasing numbers of smallsats, cubesats, constellations and other disruptive concepts, as space becomes more and more commercialized.

NASA Electronic Parts and Packaging (NEPP) Program↗

NASA NTRS2017

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗