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Microelectronics/electronic packaging potential
The trend toward smaller and lighter electronic packages was examined. It is suggested that electronic packaging engineers and microelectronic designers closely associate and give full attention to optimization of both disciplines on all product lines. Extensive research and development work underway to explore innovative ideas and make new inroads into the technology base, is expected to satisfy the demands of the 1980's.
The NASA Electronic Parts and Packaging (NEPP) Program - Automotive Electronics
Overview of NEPP Automotive Electronics Plans.
NASA Electronic Parts & Packaging (NEPP) program: contributions to MER success
Explore the source record for details and available documents.
The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies
This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments
Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation
Detecting internal defects in power electronics packages is critical for their performance and reliability, especially under extreme operating conditions, as these defects can lead to catastrophic failure if not properly addressed. Confocal scanning acoustic microscopy (C-SAM) plays a key role in the nondestructive evaluation of bond layer degradation within a power electronics package by detecting defects such as delamination, voids, and cracks. However, accurately quantifying and predicting these defects from C-SAM images remains a significant challenge due to the low noise-to-signal ratio, which typically arises from both imaging process and bond patterns itself. In this paper, we explore machine learning strategies for processing C-SAM images and providing predictive models of defect growth. We use C-SAM images of sintered copper and sintered silver samples, which are obtained under accelerated thermal experiments, as the representative dataset for our study. We investigate the effect of Fourier transforms and wavelet transforms on these datasets to remove high-frequency noise and address noise across multiple scales with histogram equalization to enhance the contrast and improve the visibility of defects. As a result, defect boundaries can be clearly distinguished, enabling more accurate tracking of their growth over time. We then employ different time-series forecasting algorithms on the denoised images to formulate an image-based lifetime prediction model. Statistical models and deep-learning techniques are trained on images obtained in the early stages of thermal shock, and defect growth in the later stages is predicted. Our work serves as a preliminary attempt to improve the accuracy of lifetime prediction models of power electronics packages, which is critical under extreme operating environments.
Packaging Technology Developed for High-Temperature SiC Sensors and Electronics
A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.
HTESP (High-throughput electronic structure package): A package for high-throughput ab initio calculations
High-throughput ab initio calculations are the indispensable parts of data-driven discovery of new materials with desirable properties, as reflected in the establishment of several online material databases. The accumulation of extensive theoretical data through computations enables data-driven discovery by constructing machine learning and artificial intelligence models to predict novel compounds and forecast their properties. Efficient usage and extraction of data from these existing online material databases can accelerate the next stage materials discovery that targets different and more advanced properties, such as electron–phonon coupling for phonon-mediated superconductivity. However, extracting data from these databases, generating tailored input files for different ab initio calculations, performing such calculations, and analyzing new results can be demanding tasks. Here, in this work, we introduce a software package named “HTESP” (High-Throughput Electronic Structure Package) written in Python and Bash languages, which automates the entire workflow including data extraction, input file generation, calculation submission, result collection and plotting. Our HTESP will help speed up future computational materials discovery processes.
The spacecraft structure and thermal design considerations
This paper covers the general structural and thermal design considerations of the Telstar satellite. The basic objectives were to maintain the electronic components in a near room temperature environment and to protect the electronics packge from high-frequency vibration excitation. These objectives were realized by dividing satellite into two lumped masses, the shell and the centrally located electronics package, and by utilizing nylon lacing for support of the electronics package. The package was provided with an active temperature control, regulating radiative heat flow between the skin and the package. Results of on-the-ground experimental evaluation and of telemetry data are given.
Integrated package of electron cyclotron emission imaging data processing and forward modeling in OMFIT
An Electron Cyclotron Emission Imaging (ECEI) data analysis module has been developed for the OMFIT platform to accommodate the needs of users at the DIII-D tokamak for physics applications. The user can easily access the ECEI spatial observation windows in the plasma that are calculated based on the automatically retrieved hardware setup and available DIII-D equilibria, perform spectral analysis, and make 2D electron temperature fluctuation images. The module provides a powerful data post processing package for extracting important physics parameters from the 2D measurements, including the radial structure and poloidal mode number of Alfven Eigenmodes, as well as the frequency-vs-wavenumber dispersion relationship of broadband MHD. Lastly, the module propagates characterized synthetic fluctuations for the user, so one can perform forward modeling tasks with simple analytical fluctuations.
Bolometric detectors for the high frequency instrument on the Planck surveyor
The High Frequency Instrument (HFI) on Planck will obtain all-sky images of the Cosmic Microwave Background (CMB) and other astrophysical sources of emission with resolution of 9 arcniin at 100 GHz, 7 arcmin at 143 GHz and 5 arcniin at 217, 353, 545 and 857 GHz. The HFI focal plane will contain 48 silicon nitride micromesh bolometric detectors operating from a 100 mK heat sink. Four detectors in each of the 6 bands will detect the sum of the power in both linear polarizations. An additional 4 pair of detectors will provide sensitivity to linear polarization of emission at 143, 217 and 353 GHz. We report on the development of these detectors, which are being produced at the JPL Micro Devices Laboratory, packaged at JPL Electronics Packaging, characterized at 100 mK before delivery to our HFI consortium partners at the UWCC, UK.
A Review of Chip Scale Package Assembled Reliability
NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.
TeraChem: A graphical processing unit-accelerated electronic structure package for large-scale ab initio molecular dynamics
TeraChem was born in 2008 with the goal of providing fast on-the-fly electronic structure calculations to facilitate ab initio molecular dynamics studies of large biochemical systems such as photoswitchable proteins and multichromophoric antenna complexes. Originally developed for videogaming applications, graphics processing units (GPUs) offered a low-cost parallel computer architecture that became more accessible for general-purpose GPU computing with the release of CUDA in 2007. The evaluation of the electron repulsion integrals (ERIs) is a major bottleneck in electronic structure codes and provides an attractive target for acceleration on GPUs. Thus, highly efficient routines for evaluation of and contractions between the ERIs and density matrices were implemented in TeraChem. Here, electronic structure methods were developed and implemented to leverage these integral contraction routines, resulting in the first quantum chemistry package designed from the ground up for GPUs. This GPU acceleration makes TeraChem capable of performing large-scale ground and excited state calculations in the gas and condensed phase. Today, TeraChem's speed forms the basis for a suite of quantum chemistry applications, including optimization and dynamics of proteins, automated and interactive chemical discovery tools, and large-scale nonadiabatic dynamics simulations.
Thermal Management for Planar Package Power Electronics (CRADA Final Report)
The National Renewable Energy Laboratory (NREL) and John Deere Electronic Solutions (JDES) collaborated to develop and evaluate computer models and simulations related to the thermal performance of semiconductor device packaging for an inverter of an off-road vehicle ("Semiconductor Packaging"). The objective of the research was for NREL and JDES to develop a two or three-dimensional computer-aided design model of the Semiconductor Packaging ("Computer Model") for thermal performance evaluation in a simulation. The project developed computer models of a Semiconductor Package of silicon-carbide semiconductor devices with appropriate thermal dissipation via one or more of the following thermal features: a double-sided planar cooling configuration, an air-cooled configuration, a liquid-cooled configuration for off-road inverter applications in a relevant simulated operating environment. It is noted that surface area and prototype product embodiment consisting of air-cooled and liquid-cooled configurations may and may not be in direct contact with power semiconductor chips. The idea was to explore and develop packaging and thermal management technology for power semiconductors that was most effective in the performance yet had least burden in overall product cost for a given application.
The Juno Magnetic Field Investigation
The Juno Magnetic Field investigation (MAG) characterizes Jupiter's planetary magnetic field and magnetosphere, providing the first globally distributed and proximate measurements of the magnetic field of Jupiter. The magnetic field instrumentation consists of two independent magnetometer sensor suites, each consisting of a tri-axial Fluxgate Magnetometer (FGM) sensor and a pair of co-located imaging sensors mounted on an ultra-stable optical bench. The imaging system sensors are part of a subsystem that provides accurate attitude information (to approx. 20 arcsec on a spinning spacecraft) near the point of measurement of the magnetic field. The two sensor suites are accommodated at 10 and 12 m from the body of the spacecraft on a 4 m long magnetometer boom affixed to the outer end of one of 's three solar array assemblies. The magnetometer sensors are controlled by independent and functionally identical electronics boards within the magnetometer electronics package mounted inside Juno's massive radiation shielded vault. The imaging sensors are controlled by a fully hardware redundant electronics package also mounted within the radiation vault. Each magnetometer sensor measures the vector magnetic field with 100 ppm absolute vector accuracy over a wide dynamic range (to 16 Gauss = 1.6 x 10(exp. 6) nT per axis) with a resolution of approx. 0.05 nT in the most sensitive dynamic range (+/-1600 nT per axis). Both magnetometers sample the magnetic field simultaneously at an intrinsic sample rate of 64 vector samples per second. The magnetic field instrumentation may be reconfigured in flight to meet unanticipated needs and is fully hardware redundant. The attitude determination system compares images with an on-board star catalog to provide attitude solutions (quaternions) at a rate of up to 4 solutions per second, and may be configured to acquire images of selected targets for science and engineering analysis. The system tracks and catalogs objects that pass through the imager field of view and also provides a continuous record of radiation exposure. A spacecraft magnetic control program was implemented to provide a magnetically clean environment for the magnetic sensors, and residual spacecraft fields andor sensor offsets are monitored in flight taking advantage of Juno's spin (nominally 2 rpm) to separate environmental fields from those that rotate with the spacecraft.
Applications of heat pipes to cool PWBS and hybrid microcircuits
Some of the advanced thermal management techniques used to reduce operating junction temperature under extreme environmental temperature conditions are discussed. Heat pipes in actual electronic packaging applications, and those under development, are discussed. Performance characteristics of heat pipes are given, and examples are described of how thermal problems in electronic packaging are solved through the use of heat pipes.
Thermal Analysis Of The NASA Integrated Vehicle Health Monitoring Experiment Technology For X-Vehicles (NITEX)
The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.
Thermal Analysis of the NASA Integrated Vehicle Health Monitoring Experiment Technology for X-Vehicles (NITEX)
The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.