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Results for “Electroplating”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Editors’ Choice—Rapid Deactivation Convolutes Electrochemical CO 2 Reduction Selectivity Measurements on Gold Rotating Ring Disk Electrodes

Voltammetric measurements of electrochemical CO 2 reduction reaction (CO 2 RR) selectivity on rotating ring disk electrodes (RRDE) are a rapid and sensitive method for quantifying an electrocatalyst’s selectivity, i.e. faradaic efficiency (FE). This method has been applied to polycrystalline Au electrocatalysts where a Au disk electrode catalyzes both the CO 2 RR and hydrogen evolution reaction while the concentric Au ring electrode selectively senses CO by oxidizing CO back to CO 2 . Such measurements enabled fundamental mechanistic studies but suffer from poor inter-laboratory reproducibility. This work identifies causes of variability in RRDE selectivity measurements by comparing protocols with different electrochemical methods, reagent purities, and glassware cleaning procedures. We observed FE CO decrease by 56% during 5 min chronoamperometry measurements, a phenomenon that is not readily apparent in voltammetric scans due to their dynamic nature. Electroplating of electrolyte impurities onto the disk and ring surfaces were identified as a major contributor to Au deactivation. Additionally, the oxygen reduction reaction may lead to higher disk currents in inadequately purged electrolytes, causing an apparent underestimation of FE CO at low overpotentials. Lastly, we propose operational bounds for CO 2 RR selectivity measurements on Au using the RRDE method and provide suggestions on steps for improving the accuracy of this technique.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2024

BeyondFingerprinting: AI-guided discovery of robust materials & processes

BeyondFingerprinting was a 2021-2024 Sandia Grand Challenge LDRD exploring the potential to develop new resilient materials and manufacturing processes by taking an artificial-intelligence (AI)-guided approach that integrates human-subject-matter expertise with algorithms enriched with physics-based constraints to unearth process-structure-property correlations. Such algorithms, trained on high-throughput experiments and simulations, are shown to serve as surrogate models that efficiently detect key “fingerprints” in materials data, prognose material performance, and guide effective process improvements. To accelerate broader adoption across mission areas, this AI-guided approach was demonstrated with three complex process-centric exemplars: electroplating, physical vapor deposition, and laser powder bed fusion. Together, these exemplars impact nearly every hardware component relevant to DOE and NNSA national security missions.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Fabrication of a Point-Like Transmission Target for Reducing Computed Tomography Imaging Artifacts

In this study, we address the challenge of enhancing image quality and spatial resolution in computed tomography (CT) imaging by introducing simulation and fabrication of high aspect ratio, point-like transmission targets. Utilizing advanced electroplating techniques, traditionally employed in the fabrication of Through Substrate Via (TSV) interconnects for CMOS circuitry, we successfully embed copper targets within silicon substrates. This method allows us to create high-aspect-ratio features specifically designed for X-ray transmission targets, resulting in micro targets that exhibit a volume increase compared to conventional evaporated surface targets. Furthermore, we present simulation results of the X-ray spectrum generated by these targets, demonstrating their potential to significantly improve both image quality and spatial resolution in CT applications. Our findings suggest that leveraging advanced fabrication techniques can open new avenues for the development of enhanced imaging technologies in medical diagnostics and beyond.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

Advancements in HF-free bipolar pulsed electropolishing for next-generation superconducting cavities

Hydrofluoric acid (HF)-free bipolar pulsed electropolishing (BPEP) offers an environmentally sustainable alternative to conventional Buffered Chemical Polishing (BCP) and Electropolishing (EP) techniques for superconducting radiofrequency (SRF) cavities. Recent studies at Jefferson Lab have demonstrated that a single-cell 1.3 GHz niobium cavity processed using HF-free BPEP achieved an accelerating gradient Eacc of 35 MV/m with a quality factor Q0 of 1E10 at 2 K, following extensive research and optimization. This talk will highlight the challenges encountered in developing this technique, key insights gained from experimental studies, and ongoing efforts to enhance its capabilities. In particular, we will explore its potential for refining Nb3Sn-coated niobium cavities via vapor diffusion techniques and for electroplating Nb3Sn films onto various cavity substrates, contributing to the advancement of high-performance SRF systems.

Tian, Hui [Thomas Jefferson National Accelerator F↗
DOE OSTI2026

Strategies for using membrane-based separations to extract critical metals from waste streams

Critical metals are currently extracted by mining followed by their purification. These processes are costly and not environmentally very desirable. In this perspective paper we discuss the potential of extracting these critical metals from a range waste-streams available in abundance globally. These waste streams include brine from desalination plants, effluents from oil drilling and hydraulic fracturing, as well as discharges from various industrial processes such as metal finishing, electroplating, mining, and chemical manufacturing. We show that with a range of new separation processes being developed their separation is showing potential of being both technologically and economically feasible. We also show how high performance computing can be combined with computational models to screen and accelerate the development of new technologies for extracting critical metals from waste streams.

36 MATERIALS SCIENCE↗
NASA NTRS1967

Silver plating ensures reliable diffusion bonding of dissimilar metals

Dissimilar metals are reliably joined by diffusion bonding when the surfaces are electroplated with silver. The process involves cleaning and etching, anodization, silver striking, and silver plating with a conventional plating bath. It minimizes the formation of detrimental intermetallic phases and provides greater tolerance of processing parameters.

Source record↗
NASA NTRS1967

Study to minimize hydrogen embrittlement of ultrahigh-strength steels

Hydrogen-stress cracking in high-strength steels is influenced by hydrogen content of the material and its hydrogen absorption tendency. Non-embrittling cleaning, pickling, and electroplating processes are being studied. Protection from this hydrogen embrittlement is important to the aerospace and aircraft industries.

Elsea, S. T.↗
NASA NTRS1969

Effects of hydrogen on metals

Several rules to guide choice of materials, and methods of welding, electroplating, and heat treatment will provide a method for minimizing failures in storage tanks and related hardware. Failures are caused by high-pressure hydrogen effects, the formation of hydrides in titanium, and hydrogen absorption through various metals processing techniques.

Cataldo, C. E.↗
NASA NTRS1969

Improved nickel plating of Inconel X-750

Electroplating technique with acid pickling provides a method of applying nickel plating on Inconel X-750 tubing to serve as a wetting agent during brazing. Low-stress nickel-plating bath contains no organic wetting agents that cause the nickel to blister at high temperatures.

Farmer, M. E.↗
NASA NTRS1972

Batch fabrication process development for ferrite logic conductors

A process for fabricating ultrareliable magnetic ferrite logic circuits is described in which the conductors are formed by a combination of two batch type processes - photolithography and electroplating - and a mechanized writing process for completing conductors in the third dimension. Up to 4 turns, through an aperture 1 mm in diameter, are formed by the described process. The number of joints in the conductors is reduced by use of this process to only those which are required for input, output and power connections of a logic block. To demonstrate feasibility, 8-stage magnetic ring counter circuits have been fabricated.

Heckler, C. H., Jr.↗