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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1993

Compression strength failure mechanisms in unidirectional composite laminates containing a hole

Experiments on graphite-epoxy laminated plates containing unloaded small holes show that these laminates are notch insensitive. That is, the uniaxial strength of these laminates with small holes exceeds the strength predicted by a point stress criterion using the stress concentration factor for the in-plane stress field. Laminates containing large holes exhibit notch sensitive behavior and consequently their strength is reasonably well predicted by the stress concentration effect. This hole size effect is manifested both in tension and in compression. Apparently, some mechanism must cause in-plane stress relief for laminates containing small holes. The purpose of this research was to study the influence of geometric nonlinearity on the micromechanical response of a filamentary composite material in the presence of a strain gradient caused by a discontinuity such as a hole. A mathematical model was developed at the micromechanical level to investigate this geometrically nonlinear effect.

Johnson, Eric R.↗
NASA NTRS1992

Damage and failure mechanisms of continuous glass fiber reinforced polyphenylene sulfide

The damage that accompanies flexural deformation of a unidirectional glass fiber composite of polyphenylene sulfide was examined by AE and SEM. These complementary techniques were used to identify damage mechanisms at the microscale and correlate them with the macroscopic stress state in four-point bending. The flexural stress-strain curve was nominally linear to about 1.0 percent strain, but the onset of damage detectable by AE occurred at 0.3 percent strain. Two peaks in the AE amplitude distribution were observed at 35 dB and 60 dB. Low-amplitude events were detected along the entire length of the specimen, and correlation with direct observations of damage made by deforming the composite on the SEM stage suggested that these events arose from matrix cracking and fiber debonding concentrated at flaws on the composite. High amplitude events occurred primarily in the region of highest flexural stress between the inner loading points. They were attributed to fracture of glass fibers on the tension side and surface damage on the compressive side.

Chen, F.↗
NASA NTRS1999

Accelerated Thermal Cycling and Failure Mechanisms

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

BGA CSP CBGA thermal cycle solder joint reliabilit↗
NASA NTRS2008

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

plastic ball grid array (PBGA)↗
NASA NTRS1998

Aerothermal Effects of Cavities and Protuberances for High-Speed Sample Return Capsules

Extraterrestrial sample return is a growing component of solar system exploration. Currently, four missions, Stardust, 1 Muses-C, 2 Genesis, and Mars Sample Return, are under development that employ sample return as a prime component of the mission architecture. Respectively, these missions will return samples from the tail of a comet, an asteroid, the solar wind, and, Mars. An important component of these missions and the focus of this paper is the design of the sample return capsule (SRC). The purpose of the SRC is to safely return to Earth any gathered samples for terrestrial analysis. The two major design constraints for any SRC are as follows: 1) it must be able to survive a high-speed Earth entry (11 km/s to as a high as 15 km/s), 2) the mass of the SRC must be as small as possible. Because the SRC mass is carried from Earth to the sample sight and back, the SRC mass is a strong driver in the mission mass budget. Further, for the Mars Sample Return Capsule, planetary protection is another constraint. For this capsule, the probability of planetary contamination at Earth due to an SRC failure at entry must be minimal. For an SRC, a possible failure mechanism is severe local heating as a result of cavities and or protuberances in the SRC forebody heatshield. For example, the Apollo Command Module had a number of cavities and protuberances as part of the baseline designs Wind-tunnel tests of models containing small cavities and protuberances showed severe local heating augmentations in the vicinity of these surface discontinuities.4-5 As another example, the Genesis SRC forebody heat-shield contains penetrations (cavities) to mount the vehicle to the carrier bus. It is expected that these penetrations will also experience a severe local heating environment. A concern is that the large thermal gradients may produce sufficient thermal stress to cause local mechanical failure of the heatshield. Penetrations to the forebody heat-shield can also result from damage at vehicle integration, during launch, or during transportation of the sample return capsule from earth to the sample site and back. For example, the Starting SRC was damaged near the shoulder during the heatshield integration process producing a local surface discontinuity. Also, the Starting SRC traverses through the tail of a comet and is in space for 7 years. Thus, damage to the heatshield as a result of micrometeroid impact is a concern. Finally, it is difficult to characterize the effects of these potential heatshield singularities with ground-test facilities. Either detailed simulation or a dedicated flight test is required.

Olynick, David↗
NASA NTRS2020

A Multiscale Cohesive Law for Carbon Fiber Networks

Better predictive models of mechanical failure in low-weight heat shield composites would aid material certification for missions with aggressive atmospheric entry conditions. Here, we develop such a model for the rapid engineering analysis of the failure limits of phenolic impregnated carbon ablator (PICA) - a leading heat shield material whose structural component is a carbon fiber network. We hypothesize inelastic deformation failure mechanisms and model their behavior using molecular dynamics simulations to calculate the binding energy. We then upscale this binding energy to the macroscale using a renormalization argument. The approach delivers insightful and reasonably accurate macroscale predictions that compare favorably to experiments. In application, the model is validated for a particular variety of PICA by comparison to experiment and would then be used to study design scenarios in different entry conditions.

W. SCHILL↗
NASA NTRS1992

Mechanisms of compressive failure in 3D composites

The present study of angle-interlock woven polymer matrix composite behavior under uniaxial monotonic compression notes these materials to be macroscopically ductile, with compressive strains in failure that can exceed 15 percent. Some of the tests conducted on stitched laminates indicated brittle behavior. Woven composite failure mechanisms have been studied by a combination of optical microscopy, moire interferometry, stereoscopy, and digital image comparisons; the critical failure event was in all cases a kink band formation in the primary load-bearing axial rows.

Cox, B. N.↗
NASA NTRS1992

Mechanisms of compressive failure in woven composites and stitched laminates

Stitched laminates and angle interlock woven composites have been studied in uniaxial, in-plane, monotonic compression. Failure mechanisms have been found to depend strongly on both the reinforcement architecture and the degree of constraint imposed by the loading grips. Stitched laminates show higher compressive strength, but are brittle, possessing no load bearing capacity beyond the strain for peak load. Post-mortem inspection shows a localized shear band of buckled and broken fibers, which is evidently the product of an unstably propagating kink band. Similar shear bands are found in the woven composites if the constraint of lateral displacements is weak; but, under strong constraint, damage is not localized but distributed throughout the gauge section. While the woven composites tested are weaker than the stitched laminates, they continue to bear significant loads to compressive strains of approx. 15 percent, even when most damage is confined to a shear band.

Cox, B. N.↗
NASA NTRS2014

The Inclusion of Arbitrary Load Histories in the Strength Decay Model for Stress Rupture

Stress rupture is a failure mechanism where failures can occur after a period of time, even though the material has seen no increase in load. Carbon/epoxy composite materials have demonstrated the stress rupture failure mechanism. In a previous work, a model was proposed for stress rupture of composite overwrap pressure vessels (COPVs) and similar composite structures based on strength degradation. However, the original model was limited to constant load periods (holds) at constant load. The model was expanded in this paper to address arbitrary loading histories and specifically the inclusions of ramp loadings up to holds and back down. The broadening of the model allows for failures on loading to be treated as any other failure that may occur during testing instead of having to be treated as a special case. The inclusion of ramps can also influence the length of the "safe period" following proof loading that was previously predicted by the model. No stress rupture failures are predicted in a safe period because time is required for strength to decay from above the proof level to the lower level of loading. Although the model can predict failures during the ramp periods, no closed-form solution for the failure times could be derived. Therefore, two suggested solution techniques were proposed. Finally, the model was used to design an experiment that could detect the difference between the strength decay model and a commonly used model for stress rupture. Although these types of models are necessary to help guide experiments for stress rupture, only experimental evidence will determine how well the model may predict actual material response. If the model can be shown to be accurate, current proof loading requirements may result in predicted safe periods as long as 10(13) years. COPVs design requirements for stress rupture may then be relaxed, allowing more efficient designs, while still maintaining an acceptable level of safety.

Reeder, James R.↗
NASA NTRS1995

Effect of Preloading on Fatigue Strength in Dynamic Fatigue Testing of Ceramic Materials at Elevated Temperatures

Previously derived solutions of fatigue strength as a function of preloading were verified by applying preloads to elevated temperature dynamic fatigue tests of 96 wt% alumina at 1000 C and NC 132 silicon nitride at 1100 C. The technique was found very useful in identification and control of the governing failure mechanism when multiple failure mechanisms, such as slow crack growth, creep and oxidation occurred simultaneously at elevated temperatures.

Choi, Sung R.↗
NASA NTRS1986

Investigation of advanced fault insertion and simulator methods

The cooperative agreement partly supported research leading to the open-literature publication cited. Additional efforts under the agreement included research into fault modeling of semiconductor devices. Results of this research are presented in this report which is summarized in the following paragraphs. As a result of the cited research, it appears that semiconductor failure mechanism data is abundant but of little use in developing pin-level device models. Failure mode data on the other hand does exist but is too sparse to be of any statistical use in developing fault models. What is significant in the failure mode data is that, unlike classical logic, MSI and LSI devices do exhibit more than 'stuck-at' and open/short failure modes. Specifically they are dominated by parametric failures and functional anomalies that can include intermittent faults and multiple-pin failures. The report discusses methods of developing composite pin-level models based on extrapolation of semiconductor device failure mechanisms, failure modes, results of temperature stress testing and functional modeling. Limitations of this model particularly with regard to determination of fault detection coverage and latency time measurement are discussed. Indicated research directions are presented.

Dunn, W. R.↗
NASA NTRS1999

Analyses of Transistor Punchthrough Failures

The failure of two transistors in the Altitude Switch Assembly for the Solid Rocket Booster followed by two additional failures a year later presented a challenge to failure analysts. These devices had successfully worked for many years on numerous missions. There was no history of failures with this type of device. Extensive checks of the test procedures gave no indication for a source of the cause. The devices were manufactured more than twenty years ago and failure information on this lot date code was not readily available. External visual exam, radiography, PEID, and leak testing were performed with nominal results Electrical testing indicated nearly identical base-emitter and base-collector characteristics (both forward and reverse) with a low resistance short emitter to collector. These characteristics are indicative of a classic failure mechanism called punchthrough. In failure analysis punchthrough refers to an condition where a relatively low voltage pulse causes the device to conduct very hard producing localized areas of thermal runaway or "hot spots". At one or more of these hot spots, the excessive currents melt the silicon. Heavily doped emitter material diffuses through the base region to the collector forming a diffusion pipe shorting the emitter to base to collector. Upon cooling, an alloy junction forms between the pipe and the base region. Generally, the hot spot (punch-through site) is under the bond and no surface artifact is visible. The devices were delidded and the internal structures were examined microscopically. The gold emitter lead was melted on one device, but others had anomalies in the metallization around the in-tact emitter bonds. The SEM examination confirmed some anomalies to be cosmetic defects while other anomalies were artifacts of the punchthrough site. Subsequent to these analyses, the contractor determined that some irregular testing procedures occurred at the time of the failures heretofore unreported. These testing irregularities involved the use of a breakout box and were the likely cause of the failures. There was no evidence to suggest a generic failure mechanism was responsible for the failure of these transistors.

Nicolas, David P.↗
NASA NTRS1993

Compressive behavior of undulations in filament-wound composites

The compressive performance of a filament-wound cylinder can be severely degraded by unavoidable fiber curvatures due to the presence of crossover bands. These crossover bands contain fiber undulations which influence the compressive strength, stiffness, and associated failure mechanisms of a filament-wound structure. The primary objectives of this study were to identify failure mechanisms and measure the compressive strength and stiffness of test specimens which model the microundulations. Compressive tests were conducted on flat-panel coupons which were developed to model the mechanics of large-scale fiber undulation regions in filament-wound composite cylinders. The primary effect of the undulation regions within a filament-wound structure is to initiate failure. Depending on the overall laminate configuration, the failure process includes various combinations of failure mechanisms, such as delaminations, matrix splitting and/or fiber fracture. These failure mechanisms are aggravated by the presence of large deformations caused by the reduction in local compressive stiffness and the introduction of complex material couplings due to the fiber undulation. Furthermore, the adjacent layers have been shown to strongly influence the compressive strength, stiffness, and associated failure mechanisms by weakening or reinforcing the laminate.

Jensen, David W.↗