Search NASA⌕ Search

SEARCH · Search NASA

Results for “Grid Reliability”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Kessel, Kurt↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

The primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Kessel, Kurt R.↗
NASA NTRS1992

Towards industrial-strength Navier-Stokes codes

In this paper we discuss our experiences with Navier-Stokes (NS) codes using central differencing (CD) and scalar artificial dissipation (SAD). The NS-CDSAD codes have been developed by several researchers. Our results confirm that for typical commercial transport wing and wing/body configurations flying at transonic conditions with all turbulent boundary layers, NS-CDSAD codes, when used with the Johnson-King turbulence model, are capable of computing pressure distributions in excellent agreement with experimental data. However, results are not as good when laminar boundary layers are present. Exhaustive 2-D grid refinement studies supported by detailed analysis suggest that the numerical errors associated with SAD severely contaminate the solution in the laminar portion of the boundary layer. It is left as a challenge to the CFD community to find and fix the problems with Navier-Stokes codes and to produce a NS code which converges reliably and properly captures the laminar portion of the boundary layer on a reasonable grid.

Jou, Wen-Huei↗
NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗
NASA NTRSDate not supplied

Microgrid for Lunar Surface Power

Sustained lunar surface operations will require access to continuous and highly reliable power to support mission needs and an ability to evolve and grow over time (years). The first initial loads that arrive on the lunar surface will contain their own dedicated power sources. Over time, as the lunar surface operations and power demands grow, these individual power loads will require more power than can be generated with any single power device. This demand drives the need for inter-connecting loads and power devices to share power between them, resulting in a micro-grid. One advantage of developing a lunar surface micro-grid is that it will allow lunar surface operations to resemble electrical utility operations on Earth; it allows power to be generated where it is convenient and allows power to be consumed where it is convenient and required. The micro-grid concept also provides another benefit of affording the ability to increase overall system reliability by integrating dissimilar power generation and energy storage devices together, for example modifying the power generation strategy to include both solar arrays and nuclear. This talk provides an overview of NASA’s interest in developing a lunar microgrid and provides areas where external entities can play a role in developing futuristic power needs.

Jeffrey Csank↗
NASA NTRS2006

Thermal Cycle Reliability of PBGA/CCGA 717 I/Os

Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version. both having 560 I/Os. were presented in last year's conference. Test results included environmental data for three different thermal cycle regimes (-55 C/125 C, -55 C/100 C, and -50 C /75 C). Update information on these - especially failure type for assemblies with high and low solder volumes-were presented. The thermal cycle test procedure followed those recommended IPC-9701 for tin-lead solder joint assemblies. Revision A of this specification covers guideline thermal cycle requirements for Pb-free solder joints. Some background information discussed during release of this specification with its current guideline recommendations were also presented. In a recent reliability investigation a fully populated CCGA with 717 I/Os was also considered for assembly reliability. evaluation. The functional package is a field-programmable gate array that has much higher processing power than its previous version. This new package is smaller in dimension, has no interposer, and has a thinner column wrapped with copper for reliability improvement. This paper will also present thermal cycle test results for this package assembly and its plastic version with 728 I/Os. both of which were exposed to three different cycle regimes. Two cycle profiles were those specified by IPC- 9701A for tin-lead, i.e. -55 to 100 C and -55 to 125 C and one was a cycle profile specified by Mil-Std-883, i.e.. -65 C/150 C which is generally used for ceramic hybrid packages. Per IPC-9701 A, test vehicles were built using daisy chain packages and were continuously monitored. The effects of many process and assembly variables-including corner staking commonly used for improving resistance to mechanical loading such as drop and vibration loads--were also considered as part of the test matrix. Optical photomicrographs were taken at various thermal cycle intervals to document damage progress and behavior. Representative samples of these along with cross-sectional photomicrographs at higher magnification taken by scanning electron microscopy (SEM) to determine crack propagation and failure analyses for packages are also presented.

staking↗
NASA NTRS2017

The Challenge Posed by Geomagnetic Activity to Electric Power Reliability: Evidence from England and Wales

This paper addresses whether geomagnetic activity challenged the reliability of the electric power system during part of the declining phase of solar cycle 23. Operations by National Grid in England and Wales are examined over the period of 11 March 2003 through 31 March 2005. This paper examines the relationship between measures of geomagnetic activity and a metric of challenged electric power reliability known as the net imbalance volume (NIV). Measured in megawatt hours, NIV represents the sum of all energy deployments initiated by the system operator to balance the electric power system. The relationship between geomagnetic activity and NIV is assessed using a multivariate econometric model. The model was estimated using half-hour settlement data over the period of 11 March 2003 through 31 December 2004. The results indicate that geomagnetic activity had a demonstrable effect on NIV over the sample period. Based on the parameter estimates, out-of-sample predictions of NIV were generated for each half hour over the period of 1 January to 31 March 2005. Consistent with the existence of a causal relationship between geomagnetic activity and the electricity market imbalance, the root-mean-square error of the out-of-sample predictions of NIV is smaller; that is, the predictions are more accurate, when the statistically significant estimated effects of geomagnetic activity are included as drivers in the predictions.

Forbes, Kevin F.↗
NASA NTRS2009

Reliability of recolumned area array packages

This report presents qualification guidelines developed for recolumned, high I/O ceramic column grid array (CCGA) packages assembled onto printed wiring/circuit boards (PWBs/PCBs). It includes recolumn and assembly process development for two types of CCGA packages: those with and those without interposer. Thermal cycle test results and photomicrographs showing damage progress for recolumned CCGA assemblies are documented and presented.

Ghaffarian, Reza↗
NASA NTRS2011

BOK-Underfill Optimization for FPGA Package/Assembly

Commercial-off-the-shelf area array package technologies in high-reliability versions are being considered for NASA electronic systems. These packages are prone to early failure due to the severe mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of ball interconnections decrease, susceptibility to mechanical loading and cycling fatigue grows. This report presents a summary of the body of knowledge developed for the evaluation of area array packages and is based on surveys of literature from industry and academia. For high-reliability applications, the limited data that exists will be presented. Most data from industry deals with mechanical fatigue caused by four-point bend tests, as well as from drop tests for hand-held electronics; the most recent data will be presented, along with a brief background of prior literature. Understanding the key design guidelines and failure mechanisms from past tests is critical to developing an approach that will minimize future failures. Additional specific testing enables low-risk insertion of these advanced electronic packages.

mechanical fatigue↗
NASA NTRS1978

The verification of LANDSAT data in the geographical analysis of wetlands in west Tennessee

The reliability of LANDSAT imagery as a medium for identifying, delimiting, monitoring, measuring, and mapping wetlands in west Tennessee was assessed to verify LANDSAT as an accurate, efficient cartographic tool that could be employed by a wide range of users to study wetland dynamics. The verification procedure was based on the visual interpretation and measurement of multispectral imagery. The accuracy testing procedure was predicated on surrogate ground truth data gleaned from medium altitude imagery of the wetlands. Fourteen sites or case study areas were selected from individual 9 x 9 inch photo frames on the aerial photography. These sites were then used as data control calibration parameters for assessing the cartography accuracy of the LANDSAT imagery. An analysis of results obtained from the verification tests indicated that 1:250,000 scale LANDSAT data were the most reliable scale of imagery for visually mapping and measuring wetlands using the area grid technique. The mean areal percentage of accuracy was 93.54 percent (real) and 96.93 percent (absolute). As a test of accuracy, the LANDSAT 1:250,000 scale overall wetland measurements were compared with an area cell mensuration of the swamplands from 1:130,000 scale color infrared U-2 aircraft imagery. The comparative totals substantiated the results from the LANDSAT verification procedure.

Rehder, J.↗
NASA NTRS1992

Computational fluid dynamic design of rocket engine pump components

Integration of computational fluid dynamics (CFD) for design and analysis of turbomachinery components is needed as the requirements of pump performance and reliability become more stringent for the new generation of rocket engine. A fast grid generator, designed specially for centrifugal pump impeller, which allows a turbomachinery designer to use CFD to optimize the component design will be presented. The CFD grid is directly generated from the impeller blade G-H blade coordinates. The grid points are first generated on the meridional plane with the desired clustering near the end walls. This is followed by the marching of grid points from the pressure side of one blade to the suction side of a neighboring blade. This fast grid generator has been used to optimize the consortium pump impeller design. A grid dependency study has been conducted for the consortium pump impeller. Two different grid sizes, one with 10,000 grid points and one with 80,000 grid points were used for the grid dependency study. The effects of grid resolution on the turnaround time, including the grid generation and completion of the CFD analysis, is discussed. The impeller overall mass average performance is compared for different designs. Optimum design is achieved through systematic change of the design parameters. In conclusion, it is demonstrated that CFD can be effectively used not only for flow analysis but also for design and optimization of turbomachinery components.

Chen, Wei-Chung↗
NASA NTRS1991

Final design of a free-piston hydraulic advanced Stirling conversion system

Under the US Department of Energy's (DOEs) Solar Thermal Technology Program, Sandia National Laboratories is evaluating heat engines for solar distributed receiver systems. The final design is described of an engineering prototype advanced Stirling conversion system (ASCS) with a free-piston hydraulic engine output capable of delivering about 25 kW of electric power to a utility grid. The free-piston Stirling engine has the potential for a highly reliable engine with long life because it has only a few moving parts, has noncontacting bearings, and can be hermetically sealed. The ASCS is designed to deliver maximum power per year over a range of solar input with a design life of 30 years (60,000 h). The system includes a liquid Nak pool boiler heat transport system and a free-piston Stirling engine with high-pressure hydraulic output, coupled with a bent axis variable displacement hydraulic motor and a rotary induction generator.

Wallace, D. A.↗
NASA NTRS1979

Solar power satellite system definition study. Volume 1, phase 1: Executive summary

A systems definition study of the solar satellite system (SPS) is presented. The technical feasibility of solar power satellites based on forecasts of technical capability in the various applicable technologies is assessed. The performance, cost, operational characteristics, reliability, and the suitability of SPS's as power generators for typical commercial electricity grids are discussed. The uncertainties inherent in the system characteristics forecasts are assessed.

Source record↗
NASA NTRS1982

Flight evaluation of Loran-C for general aviation area navigation

This paper reports on a flight evaluation of Loran-C which was part of a long range study of area navigation systems for general aviation. Tests involved two different Loran-C receivers, 6 different aircraft, and a variety of antennas. Uncorrected position fixes were typically accurate to one quarter mile. With measured corrections, repeatability was good to within 200 ft. Signal reliability was 99.7%. The receiver was not sensitive to atmospheric noise. The time difference grid demonstrated a long term stability of 0.3 microsecond. Vertical whip and ADF E-field antennas were found suitable for airborne use. Loran-C was found satisfactory for instrument approaches to runways at general aviation airports where published latitude-longitude coordinates were available. Accuracy was further improved by using locally measured Loran-C time difference coordinates.

Hollister, W. M.↗
NASA NTRS2002

SIP qualification and PRA approaches

System in a package (SIP) development is a response to an increasing demand for integration of different functions into one unit to reduce size and cost and improve functionality. Qualification of the newly developed multifunctional electronics are becoming complex at the package level and even more at the second and system levels.

probability risk assessment weibull lognormal ball↗