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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
DOE OSTI2018

Apparent Fracture Toughness of Pressureless Sintered Silver Interconnects

This study uses three-point flexural testing to estimate the room-temperature apparent fracture toughness ( K Ic_app ) of a pressureless sintered-silver interconnect - a candidate material for use in power electronic devices. The K Ic_app estimation occurs via work-of-fracture measurement of a chevron-shaped sintered-silver joint centrally located in an “interconnect bend test specimen”. The chevron-shape was stencil-printed on a silver (Ag)-plated direct bonded copper (DBC) substrate, mated to an Ag-plated DBC substrate, and then sintered. The chevron-shape, used for decades in fracture mechanics examinations and in standardized tests of monolithic materials, enables controlled stable crack initiation and propagation that are prerequisites for valid K Ic_app estimation. The employed combination of an interconnect bend test specimen and bend test method is robust and simple, enables a means for interpreting the resistance to crack growth and delamination in an interconnect, provides a dependable way to judge the efficacies of sintered-silver processing conditions, and ultimately supports process optimization of sintered-silver interconnects.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Queued Up: Characteristics of Power Plants Seeking Transmission Interconnection As of the End of 2021 [Slides]

Proposed large-scale electric generation and storage projects must apply for interconnection to the bulk power system via interconnection queues. While most projects that apply for interconnection are not subsequently built, data from these queues nonetheless provide a general indicator for mid-term trends in developer interest. Berkeley Lab compiled and analyzed data from all seven ISOs/RTOs in concert with 35 non-ISO utilities, representing an estimated 85% of all U.S. electricity load. We include all "active" projects in these generation interconnection queues through the end of 2021, as well as data on "operational" and "withdrawn" projects where those data are available. We find that the amount of new electric capacity in these queues is growing dramatically, with over 1,400 gigawatts (GW) of total generation and storage capacity now seeking connection to the grid (over 90% of which is for zero-carbon resources like solar, wind, and battery storage). Solar (676 GW) and battery storage (~420 GW) are – by far – the fastest growing resources in the queues; combined they accounted for nearly 85% of new capacity entering the queues in 2021. Substantial wind (247 GW) capacity is also seeking interconnection, 31% of which is for offshore projects (77 GW). In total, about 930 GW of zero-carbon generating capacity is currently seeking transmission access, as is 74 GW of natural gas capacity. Hybrids now comprise a large – and increasing – share of proposed projects, particularly in CAISO and the non-ISO West. 286 GW of solar hybrids (primarily solar+battery) and 19 GW of wind hybrids are currently active in the queues; nearly half of battery storage in the queues is paired with generation. However, much of this proposed capacity will be withdrawn from the queues and not built. Among a subset of queues for which data are available, only 23% of the projects seeking connection from 2000 to 2016 have subsequently been built. Completion percentages appear to be declining and are even lower for wind and solar than other resources. Additionally, wait times are on the rise: for the regions with available data, the typical duration from connection request to commercial operation increased from ~2.1 years for projects built in 2000-2010 to ~3.7 years for those built in 2011-2021.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2022

Fine Pitch Bonding for High Density Interconnects

CTE (coefficient of thermal expansion) mismatch between two wafers has potential for brittle failure when large areas are bonded on top of one another (wafer to wafer or wafer to die bonds). To address this type of failure, we proposed patterning a polymer around metallic interconnects. For this project, utilized benzo cyclobutene (BCB) to form the bond and accommodate stress. For the metal interconnects, we used indium. To determine the benefits of utilizing BCB, mechanical shear testing of die bonding with just BCB were compared to die bonded just with oxide. These tests demonstrated that BCB, when cured for only 30 minutes and bonded at 200°C, the BCB was able to withstand shear forces similar to oxide. Furthermore, when the BCB did fail, it experienced a more ductile failure, allowing the silicon to crack, rather than shatter. To demonstrate the feasibility of using BCB between indium interconnects, wafers were pattered with layers of BCB with vias for indium or ENEPIG (electroless nickel, electroless palladium, immersion gold). Subsequently, these wafers were pattered with a variety of indium or ENEPIG interconnect pitches, diameters, and heights. These dies were bonded under a variety of conditions, and those that held a bond, were cross-sectioned and imaged. Images revealed that certain bonding conditions allow for interconnects and BCB to achieve a void-less bond and thus demonstrate that utilizing polymers in place of oxide is a feasible way to reduce CTE stress.

36 MATERIALS SCIENCE↗
NASA NTRS1984

Solar-cell interconnect design for terrestrial photovoltaic modules

Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

Mon, G. R.↗
NASA NTRS1989

Optical backplane interconnect switch for data processors and computers

An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

Hendricks, Herbert D.↗
NASA NTRS2005

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗
NASA NTRS2011

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Strickland, S. M.↗
DOE OSTI2016

Fuel cell electrode interconnect contact material encapsulation and method

A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2023

Radio frequency tuning using a multichip module electrical interconnect structure

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

Young, Barbara Diane↗
DOE OSTI2024

Communication engine for hybrid interconnect technologies

Systems, apparatuses, and methods for dynamically selecting between wired and wireless interconnects for sending packets are disclosed. A system includes at least a hybrid communication engine and a plurality of interconnects for connecting to various end-points. The communication engine dynamically discovers and utilizes the best interconnect technology available in between given end-points. The communication engine dynamically chooses the physical interconnect that is best suited at any given time to send data from one source to one or multiple destinations. This communication can be either on-chip or across nodes. The communication engine makes a decision based on a set of predetermined parameters that can be re-adjusted by the application layer, such as latency of the transmission, message data size, physical distance from source to destination, the energy cost, and the current congestion on the alternative interconnects.

Blagodurov, Sergey↗
DOE OSTI2024

Defining Safe and Efficient Interconnection Policies for Energy Storage and Solar + Storage to Improve Integration and Reduce Costs

Energy storage has a unique and pivotal role to play in the transition to a low-carbon economy because it can help the electric grid accommodate more renewable energy. However, a number of barriers currently impede the process of connecting energy storage systems to the distribution grid. The Toolkit and Guidance for the Interconnection of Energy Storage and Solar-Plus-Storage (the “BATRIES Toolkit”), which is the publication subject to this Final Technical / Scientific Report, provides vetted solutions to eight regulatory and technical barriers to the interconnection of standalone storage and solar-plus-storage systems (referred to as “energy storage”) to the distribution grid. These recommendations are based on over a year of research and analysis by utility and industry experts. The BATRIES Toolkit also includes model language that utilities and utility regulators can use to update state interconnection rules to reduce the costs and time to safely interconnect energy storage and solar-plus-storage systems. The solutions are nationally applicable and can be applied in diverse states and markets across the U.S.

14 SOLAR ENERGY↗
DOE OSTI2020

Evolution of Distributed Energy Resource Grid Interconnection Standards for Integrating Emerging Storage Technologies

Grid interconnection standards facilitate safe and reliable grid integration of distributed energy resources (DERs). Evolution of a standard for DERs is expected to capture and accommodate widely different characteristics of DER and minimize unique grid integration challenges. This makes development of a uniform grid interconnection standard for all types of DERs a challenging and an ever-evolving consideration. This paper presents a detailed timeline of evolution, from the early 2000s to 2018, of DER interconnection standards and the research that informed their development. This is followed by a review of the research topics being considered in the grid integration of Energy Storage Systems (ESSs) which are expected to have the most significant growth amongst all DER types. These help in highlighting the need for a new standard to accommodate the unique characteristics of ESSs, and where the existing DER interconnection standard frameworks may be leveraged.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2024

Evaluating Interconnection Queue Impacts Using Hosting Capacity Analysis

The interconnection queue has been identified as a bottleneck in the efforts to shift the nations generation resources towards renewable sources and meet various state and federal goals. Efforts such as the interconnection innovation e-Xchange (i2X) are therefore trying to come up with ways in which the queue could be altered to make interconnection faster, cheaper, and fairer. This paper proposes using hosting capacity analysis methods to simulate the evolution of a power system as new resources are added. Modeling the interconnection process in this way enables simulation based study of various policy decisions for queue management and cost allocation. Sample results are presented to illustrate how some queue modifications might play out both in distribution and transmission systems.

Distributed Energy Resources, Interconnection↗
DOE OSTI2019

Fit Fly: A Case Study of Interconnect Innovation through Parallel Simulation

To meet the demand for exascale-level performance from high-performance computing (HPC) interconnects, many system architects are turning to simulation results for accurate and reliable predictions of the performance of prospective technologies. Testing full-scale networks with a variety of benchmarking tools, including synthetic workloads and application traces, can give crucial insight into what ideas are most promising without needing to physically construct a test network. While flexible, however, this approach is extremely compute time intensive. We address this time complexity challenge through the use of large-scale, optimistic parallel simulation that ultimately leads to faster HPC network architecture innovations. In this paper we demonstrate this innovation capability through a real-world network design case study. Specifically, we have simulated and compared four extreme-scale interconnects: Dragonfly, Megafly, Slim Fly, and a new dual-rail-dual-plane variation of the Slim Fly network topology. We present this new variant of Slim Fly, dubbed Fit Fly, to show how interconnect innovation and evaluation-beyond what is possible through analytic methods-can be achieved through parallel simulation. We validate and compare the model with various network designs using the CODES interconnect simulation framework. By running large-scale simulations in a parallel environment, we are able to quickly generate reliable performance results that can help network designers break ground on the next generation of high-performance network designs.

High Performance Computing↗
DOE OSTI2016

U.S. Laws and Regulations for Renewable Energy Grid Interconnections

Rapidly declining costs of wind and solar energy technologies, increasing concerns about the environmental and climate change impacts of fossil fuels, and sustained investment in renewable energy projects all point to a not-so-distant future in which renewable energy plays a pivotal role in the electric power system of the 21st century. In light of public pressures and market factors that hasten the transition towards a low-carbon system, power system planners and regulators are preparing to integrate higher levels of variable renewable generation into the grid. Updating the regulations that govern generator interconnections and operations is crucial to ensure system reliability while creating an enabling environment for renewable energy development. This report presents a chronological review of energy laws and regulations concerning grid interconnection procedures in the United States, highlighting the consequences of policies for renewable energy interconnections. Where appropriate, this report places interconnection policies and their impacts on renewable energy within the broader context of power market reform.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
DOE OSTI2018

Frequency Response Study of a U.S. Western Interconnection under Extra-High Photovoltaic Generation Penetrations: Preprint

Increasing penetration levels of solar photovoltaic (PV) and the reduced inertia of inverter-based generation technologies have caught the attention of the electric power industry and academia in the United States. This paper conducts a comprehensive frequency response study of the Western Interconnection under high penetration levels of PV, which are up to 80% at the interconnection level and 100% at the regional level. Based on the 2022 Light Spring case, PV has been projected by areas for four PV penetration levels based on collected realistic PV distribution information. The overall system frequency response has been analyzed under different scenarios. In particular, the 100% regional PV penetration case has been developed to reveal local frequency issues in the Western Interconnection. The potential of using existing resources to improve frequency response has also been studied. New insights in this paper address the implications of the rapid deployment of solar generation in the Western Interconnection.

14 SOLAR ENERGY↗
DOE OSTI2022

Use of Operating Agreements and Energy Storage to Reduce Photovoltaic Interconnection Costs: Conceptual Framework

This report explores one integrated technical and process concept designed to manage interconnection costs and streamline interconnection timelines to support near-term renewable energy deployment. We describe a new agreement between renewable energy developers and utilities, informed by the technical analysis. The agreement defines the operational parameters for a renewable energy system, with the goal of reducing risk and cost to all parties. This work provides a foundation upon which other states and utilities may build proof of concept. This report is supported by a technical analysis that is detailed in a companion report, "Use of Operating Agreements and Energy Storage to Reduce Photovoltaic Interconnection Costs: Technical and Economic Analysis" (McLaren et al. 2022).

14 SOLAR ENERGY↗
DOE OSTI2019

Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature

Abstract The interconnect half‐pitch size will reach ≈20 nm in the coming sub‐5 nm technology node. Meanwhile, the TaN/Ta (barrier/liner) bilayer stack has to be >4 nm to ensure acceptable liner and diffusion barrier properties. Since TaN/Ta occupy a significant portion of the interconnect cross‐section and they are much more resistive than Cu, the effective conductance of an ultrascaled interconnect will be compromised by the thick bilayer. Therefore, 2D layered materials have been explored as diffusion barrier alternatives. However, many of the proposed 2D barriers are prepared at too high temperatures to be compatible with the back‐end‐of‐line (BEOL) technology. In addition, as important as the diffusion barrier properties, the liner properties of 2D materials must be evaluated, which has not yet been pursued. Here, a 2D layered tantalum sulfide (TaS x ) with ≈1.5 nm thickness is developed to replace the conventional TaN/Ta bilayer. The TaS x ultrathin film is industry‐friendly, BEOL‐compatible, and can be directly prepared on dielectrics. The results show superior barrier/liner properties of TaS x compared to the TaN/Ta bilayer. This single‐stack material, serving as both a liner and a barrier, will enable continued scaling of interconnects beyond 5 nm node.

Lo, Chun‐Li↗