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At least 109 records · Page 6

In-Situ Ice Adhesion Testing using the Deformed Skin Adhesion Test

There exists a plethora of ice adhesion testing methods such as centrifuge-based methods, push/pull methods, and lap joint shear tests. However, these methods often cannot be done in-situ during an icing spray and require researcher handling/preparation prior to testing. Additionally, many of these methods test ice accretions that are not representative of the ice shapes that grow on airframes which can have unintended consequences such as edge or corner stress concentrations. In order to mitigate the issues present with other ice adhesion tests a novel, hands-free, in-situ test method imbedded into the leading edge of the airfoil has been developed and tested in the NASA Glenn Research Center Icing Research Tunnel. The mechanics of the new test method are discussed with finite element simulations being used to highlight the fundamental mechanics of this test method. The testing procedures used during the experimental test campaign are discussed along with the icing cloud test matrix. Analysis of the force-displacement results highlights the repeatability of the test method with regards to both sample behavior across several days of testing and different ice shapes. The results from first run of the day showed a significant discrepancy from subsequent runs and differential image analysis was used to determine differences in the interfacial bonding states between runs.

Ice Adhesion↗

In-Situ Ice Adhesion Testing using the Deformed Skin Adhesion Test

There exists a plethora of ice adhesion testing methods such as centrifuge-based methods, push/pull methods, and lap joint shear tests. However, these methods often cannot be done in-situ during an icing spray and require researcher handling/preparation prior to testing. Additionally, many of these methods test ice accretions that are not representative of the ice shapes that grow on airframes which can have unintended consequences such as edge or corner stress concentrations. In order to mitigate the issues present with other ice adhesion tests a novel, hands-free, in-situ test method imbedded into the leading edge of the airfoil has been developed and tested in the NASA Glenn Research Center Icing Research Tunnel. The mechanics of the new test method are discussed with finite element simulations being used to highlight the fundamental mechanics of this test method. The testing procedures used during the experimental test campaign are discussed along with the icing cloud test matrix. Analysis of the force-displacement results highlights the repeatability of the test method with regards to both sample behavior across several days of testing and different ice shapes. The results from first run of the day showed a significant discrepancy from subsequent runs and differential image analysis was used to determine differences in the interfacial bonding states between runs.

Ice Adhesion↗

Microscopic aspects of interfacial reactions in diffusion bonding processes

Microscopic aspects of interfacial reactions are discussed, such as interdiffusion, formation of intermetallic phases, generation and annihilation of lattice defects, effect of temperature, grain size, etc., which normally occur in diffusion bonding processes. Relationships between properties and microstructure in thin film couples are examined utilizing a unique combination of contact resistance measurements and characterization by transmission electron microscopy.

Shearer, M. P.↗

Crack problems involving nonhomogeneous interfacial regions in bonded materials

Consideration is given to two classes of fracture-related solid mechanics problems in which the model leads to some physically anomalous results. The first is the interface crack problem associated with the debonding process in which the corresponding elasticity solution predicts severe oscillations of stresses and the crack surface displacements vary near the crack tip. The second deals with crack intersecting the interface. The nature of the solutions around the crack tips arising from these problems is reviewed. The rationale for introducing a new interfacial zone model is discussed, its analytical consequences within the context of the two crack-problem classes are described, and some examples are presented.

Erdogan, F.↗

Fiber reinforced solids possessing great fracture toughness: The role of interfacial strength

The high tensile strength characteristic of strong interfacial filament/matrix bonding can be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of high and low shear stress (and low and high toughness). Such weak and strong areas can be achieved by appropriate intermittent coating of the fibers. An analysis is presented for toughness and strength which demonstrates, in broad terms, the effects of varying the coating parameters of concern. Results show that the toughness of interfaces is an important parameter, differences in which may not be shown up in terms of interfacial strength. Some observations are made upon methods of measuring the components of toughness in composites.

Atkins, A. G.↗

The mode 3 crack problem in bonded materials with a nonhomogeneous interfacial zone

The mode 3 crack problem for two bonded homogeneous half planes was considered. The interfacial zone was modelled by a nonhomogeneous strip in such a way that the shear modulus is a continuous function throughout the composite medium and has discontinuous derivatives along the boundaries of the interfacial zone. The problem was formulated for cracks perpendicular to the nominal interface and was solved for various crack locations in and around the interfacial region. The asymptotic stress field near the tip of a crack terminating at an interface was examined and it was shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case the stresses have the standard square root singularity and their angular variation was identical to that of a crack in a homogeneous medium. With application to the subcritical crack growth process in mind, the results given include mostly the stress intensity factors for some typical crack geometries and various material combinations.

Erdogan, Fazil↗

The mode III crack problem in bonded materials with a nonhomogeneous interfacial zone

The mode 3 crack problem for two bonded homogeneous half planes was considered. The interfacial zone was modelled by a nonhomogeneous strip in such a way that the shear modulus is a continuous function throughout the composite medium and has discontinuous derivatives along the boundaries of the interfacial zone. The problem was formulated for cracks perpendicular to the nominal interface and was solved for various crack locations in and around the interfacial region. The asymptotic stress field near the tip of a crack terminating at an interface was examined and it was shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case the stresses have the standard square root singularity and their angular variation was identical to that of a crack in a homogeneous medium. With application to the subcritical crack growth process in mind, the results given include mostly the stress intensity factors for some typical crack geometries and various material combinations.

Erdogan, F.↗

Wear and interfacial transport of material

Bonding across the interface for two solids in contact and the subsequent transfer of material from one surface to another is a direct result of the interfacial bonds being stronger than the cohesive bonds in either of the two solids. Surface tools such as LEED, Auger emission spectroscopy, field ion microscopy, and the atom probe are used to examine adhesive contacts and to determine the direction, nature, quantity of material transfer and properties of the solids which effect transfer and wear. The electronic nature, cohesive binding energies, surface structure, lattice disregistry and distribution of species in surface layers are all found to effect adhesion and transfer or transport for clean surfaces in solid state contact. The influence of adsorbed and reacted surface films from fractions of a monolayer to multilayer reactive films are considered. It is shown that even fractions of a monolayer of surface active species such as oxygen and sulfur can markedly inhibit adhesion and transport.

Buckley, D. H.↗

Chemical bonding technology for terrestrial photovoltaic modules

Encapsulated photovoltaic modules must hold together for 20 years, reliably resisting delamination and separation of any of the component materials. Delamination of encapsulation materials from each other, or from solar cells and interconnects, can create voids for accumulation of water, promoting corrosive failure. Delamination of silicone elastomers from unprimed surfaces was a common occurrence with early modules, but the incidences of silicone delamination with later modules decreased when adhesion promoters recommended by silicone manufacturers were used. An investigation of silicone delamination from unprimed surfaces successfully identified the mechanism, which was related to atmospheric oxygen and moisture. This early finding indicated that reliance on physical bonding of encapsulation interfaces for long life in an outdoor environment would be risky. For long outdoor life, the material components of a module must therefore be held together by weather-stable adhesion promoters that desirably form strong, interfacial chemical bonds.

Coulter, D. R.↗

Sulfur at nickel-alumina interfaces - Molecular orbital theory

Previous studies on Al-Ni alloys containing sulfur as an impurity suggest that, when S is in the interface between a metal and an oxide scale, it weakens the chemical bonding between them. This paper investigates factors responsible for this effect, using a molecular orbital theory to predict sulfur structures and electronic properties on the Ni-Al2O3 interface. It is shown that, in absence of S, the basal plane of Al2O3 will bind strongly through the Al(3+) cation surface to Ni (111). When segregated S impurity is present on the Ni surface, there are too few interfacial AlS bonds to effect good adhesion, leading to an inhibition of the oxide scale adhesion in NiCrAl alloys.

Hong, S. Y.↗

Adhesion, friction, and deformation of ion-beam-deposited boron nitride films

The tribological properties and mechanical strength of boron nitride films were investigated. The BN films were predominantly amorphous and nonstoichiometric and contained small amounts of oxides and carbides. It was found that the yield pressure at full plasticity, the critical load to fracture, and the shear strength of interfacial adhesive bonds (considered as adhesion) depended on the type of metallic substrate on which the BN was deposited. The harder the substrate, the greater the critical load and the adhesion. The yield pressures of the BN film were 12 GPa for the 440C stainless steel substrate, 4.1 GPa for the 304 stainless steel substrate, and 3.3 GPa for the titanium substrate.

Miyoshi, Kazuhisa↗

Adhesion, friction and deformation of ion-beam-deposited boron nitride films

The tribological properties and mechanical strength of boron nitride films were investigated. The BN films were predominantly amorphous and nonstoichiometric and contained small amounts of oxides and carbides. It was found that the yield pressure at full plasticity, the critical load to fracture, and the shear strength of interfacial adhesive bonds (considered as adhesion) depended on the type of metallic substrate on which the BN was deposited. The harder the substrate, the greater the critical load and the adhesion. The yield pressures of the BN film were 12 GPa for the 440C stainless steel substrate, 4.1 GPa for the 304 stainless steel substrate, and 3.3 GPa for the titanium substrate.

Miyoshi, K.↗

Fundamental tribological properties of ion-beam-deposited boron nitride films

The adhesion, friction, and micromechanical properties of ion-beam-deposited boron nitride (BN) films are reviewed. The BN films are examined in contact with BN metals and other harder materials. For simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. First, the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces are discussed. The effects of surface films, hardness of metals, and temperature on tribological response with respect to adhesion and friction are considered. The second part deals with the abrasion of the BN films. Elastic, plastic, and fracture behavior of the BN films in solid-state contact are discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of BN films deposited on substrates is also addressed.

Miyoshi, Kazuhisa↗

Fundamental tribological properties of ion-beam-deposited boron nitride films

The adhesion, friction, and micromechanical properties of ion-beam-deposited boron nitride (BN) films are reviewed. The BN films are examined in contact with BN metals and other harder materials. For simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. First, the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces are discussed. The effects of surface films, hardness of metals, and temperature on tribological response with respect to adhesion and friction are considered. The second part deals with the abrasion of the BN films. Elastic, plastic, and fracture behavior of the BN films in solid-state contact are discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of BN films deposited on substrates is also addressed.

Miyoshi, K.↗

Evaluation of Ti-48Al-2Nb Under Fretting Conditions

An investigation was conducted to examine the fretting behavior of lambda-TiAl (Ti-48Al-2Cr-2Nb) in contact with a nickel-base superalloy (Inconel 718) in air at temperatures from 23 to 550 C. Fretting wear experiments were conducted with 9.4-mm-diameter hemispherical Inconel (IN) 718 pins in contact with Ti-48Al-2Cr-2Nb flats (and the reverse) at loads from 1 to 40 N and fretting frequencies from 50 to 160 Hz with slip amplitudes from 50 to 200 microns for 1 to 20 million fretting cycles. The results were similar for both combinations of pin and flat. Reference fretting wear experiments were also conducted with 9.4-mm-diameter hemispherical Ti-6Al-4V pins in contact with IN718 flats. The interfacial adhesive bonds between Ti-48Al-2Cr-2Nb and IN718 in contact were generally stronger than the cohesive bonds in the cohesively weaker Ti-48Al-2Cr-2Nb. The failed Ti-48Al-2Cr-2Nb subsequently transferred to the IN718 surface at any fretting condition. The wear scars produced on Ti-48Al-2Cr-2Nb contained metallic and oxide wear debris, scratches, plastically deformed asperities, cracks, and fracture pits. Oxide layers readily formed on the Ti-48Al-2Cr-2Nb surface at 550 C, but cracks easily occurred in the oxide layers. Factors including fretting frequency, temperature, slip amplitude, and load influenced the fretting behavior of Ti-48Al-2Cr-2Nb in contact with IN718. The wear volume loss of Ti-48Al-2Cr-2Nb generally decreased with increasing fretting frequency. The increasing rate of oxidation at elevated temperatures up to 200 C led to a drop in wear volume loss at 200 C. However, the fretting wear increased as the temperature was increased from 200 to 550 C. The highest temperatures of 450 and 550 C resulted in oxide film disruption with generation of cracks, loose wear debris, and pits on the Ti-48Al-2Cr-2Nb wear surface. The wear volume loss generally increased as the slip amplitude increased. The wear volume loss also generally increased as the load increased. Increasing slip amplitude and increasing load both tended to produce more metallic wear debris, causing severe abrasive wear in the contacting metals.

Miyoshi, Kazuhisa↗

Evaluation of Ti-48Al-2Cr-2Nb Under Fretting Conditions

The fretting behavior of Ti-48Al-2Cr-2Nb (y-TiAl) in contact with the nickel-base superalloy 718 was examined in air at temperatures from 296 to 823 K (23 to 550 C). The interfacial adhesive bonds between Ti-48Al-2Cr-2Nb and superalloy 718 were generally stronger than the cohesive bonds within Ti-48Al-2Cr-2Nb. The failed Ti-48Al-2Cr-2Nb debris subsequently transferred to the superalloy 718. In reference experiments conducted with Ti-6Al-4V against superalloy 718 under identical fretting conditions, the degree of transfer was greater for Ti-6A1-4V than for Ti-48Al-2Cr-2Nb. Wear of Ti-48Al-2Cr-2Nb generally decreased with increasing fretting frequency. The increasing rate of oxidation at elevated temperatures led to a drop in wear at 473 K. However, fretting wear increased as the temperature was increased from 473 to 823 K. At 723 and 823 K, oxide film disruption generated cracks, loose wear debris, and pits on the Ti-48Al-2Cr-2Nb wear surface. Both increasing slip amplitude and increasing load tended to produce more metallic wear debris, causing severe abrasive wear in the contacting metals.

Miyoshi, Kazuhisa↗