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Grain2Mesh: Mesh Generation for Grain-Scale Nonlinear Elasticity Modeling
The nonlinear hysteretic behavior of rocks under cyclic loading is a crucial area of study in geomechanics. The macroscopic response of a variety of materials has been found to be contingent upon the behavior of the micro-scale structure. This project aims to develop a functional and maintainable software package for generating a multi-phase numerical mesh and accompanying simulation files for finite element modeling used in computational mechanics solvers. Meshes generated from images often lack key preprocessing that reduces noise and prevents mesh element distortion that can increase computational cost. By incorporating user feedback throughout, grain2mesh ensures a high-fidelity mesh that can be used to model grain-scale interactions such as shearing, crack propagation, and interfacial material contrast. Scientific applications of this software include material fracturing, stress-strain analysis for natural and engineered materials, and nonlinear meso-scale analysis.
Failure of morphology of (0 deg)8 graphite/epoxy as influenced by environments and processing
Optical and scanning electron microscopy were used to investigate the failure morphology of graphite/epoxy specimens which had been tested until tensile failure. Failure morphology was studied as a function of the quality control variables of specimen preparation technique, prepreg batch, and cure condition, and also as a function of the environmental parameters of temperature and moisture content. Defective specimens were found to exhibit a low energy failure morphology. Poor specimen edge preparation and one batch of prepreg when tested at elevated temperature or moisture content also exhibited energy failure morphology. Postcuring had no effect on strength but did slightly alter failure morphology. Temperature or moisture appeared to decrease flaw sensitivity and thus increase strength; however, moisture also appeared to increase interfacial debonding between filament and matrix. When combined moisture and temperature increased interfacial debonding and made the epoxy matrix more prone to fracture.
Nanoscale Interfacial Smoothing and Dissolution during Unconventional Reservoir Stimulation Implications for Hydrocarbon Mobilization and Transport
Hydraulic fracturing of low-permeability rocks significantly enhances hydrocarbon production from unconventional reservoirs. However, fluid transport through low-permeability rocks, and the influence of geochemical transformations on pore networks, are poorly constrained. Mineral reactivity during interactions with injected water may alter the physical nature of the rock, which may affect hydrocarbon mobility. To assess alteration to the rock, we previously conducted a hydrothermal experiment that reacted cubed rock samples (1 cm3) with synthetic hydraulic fracturing fluid to simulate physicochemical reactivity during hydraulic fracturing. We analyzed unreacted and reacted rocks by small-angle neutron scattering and high-pressure mercury intrusion to determine how nanoscale (~1-1400 nm) pore networks of unconventional reservoir rocks are influenced by reaction with hydraulic fracturing injectates. We show that fluid-rock interactions have a two-fold influence on hydrocarbon recovery, promoting both hydrocarbon mobilization and transport. Pore-matrix interfaces smooth via removal of clay mineral surface asperities, reducing available surface area for hydrocarbon adsorption by ca. 12-75%. Additionally, hydraulic fracturing fluid-induced dissolution creates new pores with diameters ranging in size from 800-1400 nm, increasing the permeability of the rocks by a factor of 5-10. These two consequences of mineral dissolution act in concert to release hydrocarbons from the host rock and facilitate transport through the rock during unconventional reservoir production.
Thin-Film Fracture Behavior for Diketopyrrolopyrrole Semiconducting Polymeric Films
Fracture energy, which quantifies a material’s resistance to the propagation of a pre-existing crack, is a key parameter for ensuring the mechanical reliability of stretchable organic electronic devices. However, most existing methods, such as a four-point bending fracture energy, utilized for measuring the fracture energy of semiconducting polymeric thin films are complicated by substrate effects, making it challenging to isolate the intrinsic behavior of the film from interfacial influences. In this study, we employed a pseudo free-standing pure shear method to systematically investigate the cohesive fracture energy of poly(diketopyrrolopyrrole-terthiophene) P(DPP-T)-based thin films to examine the effects of nanoconfinement, side chain length, degree of crystallinity, and strain rates. This method effectively eliminates substrate interference, enabling a direct assessment of the cohesive fracture energy of P(DPP-T) thin films. We found that thinner films and those with lower molecular weights exhibited significantly reduced fracture energies due to diminished chain entanglements. Additionally, films with shorter side chains displayed notably higher fracture energies, which were attributed to an increase in the degree of crystallinity. Finally, slower strain rates led to higher fracture energies, consistent with an enhanced stress relaxation. These insights offer practical guidelines for designing mechanically robust semiconducting polymers, contributing to the advancement of reliable, durable, flexible, and wearable electronic devices.
Adhesion at the interface in cured graphite fiber epoxy-amine resin composites
The effect of high temperature curing on the interface between unsized or epoxy-sized graphite fiber tow and epoxy-amine resin was examined by scanning electron microscopy of compression and freeze fractured specimens. Little or no adhesion was found between the unsized graphite fiber tows and the epoxy-amine resin on curing at 165 C for 17 hrs. Epoxy-sized graphite fibers showed a similar lack of adhesion between the fiber tows and the epoxy-amine resin at 3 and 17 hr cures, although good penetration of the resin into the sized fiber tows had occurred. Interfacial bond strengths for the composites could not be effectively measured by compression fracture of specimens.
Interface Finite Elements for the Analysis of Fracture Initiation and Progression
Progressive failure analyses (PFA) are important for the prediction of residual strength and damage tolerance of vehicle structures, and to predict the energy absorbing capability of vehicle structures under crash-type loads. Typically continuum damage mechanics (CDM) and fracture mechanics (FM) are the methods used for PFA. The method of interfacial damage mechanics (IDM) is used for PFA in this research. IDM has capabilities intermediate between CDM and FM, and is used to numerically model the initiation, growth, and arrest of cracks. IDM smooths the stress singularity at the crack tip, and is easily adaptable with other nonlinearties such as plasticity and material damage. IDM is implemented by user-defined interface elements in the ABAQUS/ Standard structural analysis software package. The structural components selected to demonstrate the effectiveness PFA using interface elements are, for the most part, those with published test data. These structural components were subjected to quasi-static loading in the tests. Thus, the ABAQUS analyses are used to predict geometrically and materially nonlinear equilibrium states. Impact loading, dynamic fracture, reflected stress waves, inertia, and time dependent material behavior are not considered.
Plasma surface modification coupled with thermal and step-over distance effects on significant fracture improvement of adhesively-bonded metal-$\mathrm{CFRTP}$ dissimilar materials
Here, this work proposes an approach to improve the interfacial bonding between carbon-fiber-reinforced thermoplastic polymers (CFRTP) and thermoset adhesive by using the surface modification with the combination of air plasma, thermal, and step-over effects. Thanks to the proper heating which causes the exposure of carbon fibers on the CFRTP surface, both polymer matrix and these exposed carbon fibers can have improved bonding with adhesive due to air plasma treatment. By conducting the Double Cantilever Beam (DCB) tests performed on adhesively-bonded AA5052/CFRP-PA66 dissimilar joints, it was shown in this work that the average Mode I specific fracture energy can be improved up to about 180% compared to non-treated counterparts. The foregoing improvement can be further increased by considering the step-over distance of the surface treatment, which triggers the tortuous damage path in the failure process of adhesively-bonded structures. By manipulating this treatment parameter, often overlooked in the literature, and other parameters (i.e., treatment speed, nozzle tip-to-surface distance, etc.) investigated in this study, the average Mode I specific fracture energy of adhesively-bonded AA5052/CFRP-PA66 dissimilar joints can be improved reaching up to about 410% compared to non-treatment counterparts.
Chemical controls on the propagation and healing of subcritical fractures
Human activities involving subsurface reservoirs—resource extraction, carbon and nuclear waste storage—alter thermal, mechanical, and chemical steady-state conditions in these systems. Because these systems exist at lithostatic pressures, even minor chemical changes can cause chemically assisted deformation. Therefore, understanding how chemical effects control geomechanical properties is critical to optimizing engineering activities. The grand challenge in predicting the effect of chemical processes on mechanical properties lays in the fact that these phenomena take place at molecular scales, while they manifest all the way to reservoir scales. To address this fundamental challenge, we investigated chemical effects on deformation in model and real systems spanning molecular- to centimeter scales. We used theory, experiment, molecular dynamics simulation, and statistical analysis to (1) identify the effect of simple reactions, such as hydrolysis, on molecular structures in interfacial regions of stressed geomaterials; (2) quantify chemical effects on the bulk mechanical properties, fracture and displacement for granular rocks and single crystals; (3) develop initial understanding of universal scaling for individual displacement events in layered geomaterials; and (4) develop analytic approximations for the single-chain mechanical response utilizing asymptotically correct statistical thermodynamic theory. Taken together, these findings advance the challenging field of chemo-mechanics.
An Irreversible Constitutive Law for Modeling the Delamination Process Using Interface Elements
An irreversible constitutive law is postulated for the formulation of interface elements to predict initiation and progression of delamination in composite structures. An exponential function is used for the constitutive law such that it satisfies a multi-axial stress criterion for the onset of delamination, and satisfies a mixed mode fracture criterion for the progression of delamination. A damage parameter is included to prevent the restoration of the previous cohesive state between the interfacial surfaces. To demonstrate the irreversibility capability of the constitutive law, steady-state crack growth is simulated for quasi-static loading-unloading cycle of various fracture test specimens.
An Irreversible Constitutive Law for Modeling the Delamination Process using Interface Elements
An irreversible constitutive law is postulated for the formulation of interface elements to predict initiation and progression of delamination in composite structures. An exponential function is used for the constitutive law such that it satisfies a multi-axial stress criterion for the onset of delamination, and satisfies a mixed mode fracture criterion for the progression of delamination. A damage parameter is included to prevent the restoration of the previous cohesive state between the interfacial surfaces. To demonstrate the irreversibility capability of the constitutive law, steady-state crack growth is simulated for quasi-static loading-unloading cycle of various fracture test specimens.
Effect of Thin-Film Adhesives on Mode II Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts
A single sheet of nickel-titanium (NiTi) shape memory alloy (SMA) was introduced within an IM7/8552 polymer matrix composite (PMC) panel in conjunction with multiple thin film adhesives to promote the interfacial bond strength between the SMA and PMC. End notched flexure (ENF) testing was performed in accordance to ASTM D7905 method for evaluation of mode II interlaminar fracture toughness (GIIC) of unidirectional fiber-reinforced polymer matrix composites. Acoustic emissions (AE) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels were subjected to C-scan before testing, and examined using optical and scanning electron microscopy techniques after part failure. GIIC values for the control composite samples were found to be higher than those of samples with embedded SMA sheets. The presence of adhesives bonded to SMA sheets further diminished the GIIC values. AE values revealed poor bonding of the panels, with little to no signals during testing.
The Effect of Thin Film Adhesives on Mode II Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts
A single sheet of nickel-titanium (NiTi) shape memory alloy (SMA) was introduced within an IM7/8552 polymer matrix composite (PMC) panel in conjunction with multiple thin film adhesives to promote the interfacial bond strength between the SMA and PMC. End notched flexure (ENF) testing was performed in accordance to ASTM D7905 method for evaluation of mode II interlaminar fracture toughness (GIIC) of unidirectional fiber-reinforced polymer matrix composites. Acoustic emissions (AE) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels examined using scanning electron microscopy techniques after part failure. GIIC values for the control composite samples were found to be higher than those of samples with embedded SMA sheets. The presence of adhesives bonded to SMA sheets further diminished the GIIC values. AE values revealed poor bonding of the panels, with little to no signals during testing.
Mechanical strength and tribological behavior of ion-beam deposited boron nitride films on non-metallic substrates
An investigation was conducted to examine the mechanical strength and tribological properties of boron nitride (BN) films ion-beam deposited on silicon (Si), fused silica (SiO2), gallium arsenide (GaAs), and indium phosphide (InP) substrates in sliding contact with a diamond pin under a load. The results of the investigation indicate that BN films on nonmetallic substrates, like metal films on metallic substrates, deform elastically and plastically in the interfacial region when in contact with a diamond pin. However, unlike metal films and substrates, BN films on nonmetallic substrates can fracture when they are critically loaded. Not only does the yield pressure (hardness) of Si and SiO2 substrates increase by a factor of 2 in the presence of a BN film, but the critical load needed to fracture increases as well. The presence of films on the brittle substrates can arrest crack formation. The BN film reduces adhesion and friction in the sliding contact. BN adheres to Si and SiO2 and forms a good quality film, while it adheres poorly to GaAs and InP. The interfacial adhesive strengths were 1 GPa for a BN film on Si and appreciably higher than 1 GPa for a BN film on SiO2.
Mechanical strength and tribological behavior of ion-beam-deposited boron nitride films on non-metallic substrates
An investigation was conducted to examine the mechanical strength and tribological properties of boron nitride (BN) films ion-beam deposited on silicon (Si), fused silica (SiO2), gallium arsenide (GaAs), and indium phosphide (InP) substrates in sliding contact with a diamond pin under a load. The results of the investigation indicate that BN films on nonmetallic substrates, like metal films on metallic substrates, deform elastically and plastically in the interfacial region when in contact with a diamond pin. However, unlike metal films and substrates, BN films on nonmetallic substrates can fracture when they are critically loaded. Not only does the yield pressure (hardness) of Si and SiO2 substrates increase by a factor of 2 in the presence of a BN film, but the critical load needed to fracture increases as well. The presence of films on the brittle substrates can arrest crack formation. The BN film reduces adhesion and friction in the sliding contact. BN adheres to Si and SiO2 and forms a good quality film, while it adheres poorly to GaAs and InP. The interfacial adhesive strengths were 1 GPa for a BN film on Si and appreciably higher than 1 GPa for a BN film on SiO2.
Effect of Thin-Film Adhesives on Mode I Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts
A single sheet of NiTi shape memory alloy (SMA) was introduced within a unidirectional HexPly® 8552/IM7 (Hexcel®) polymer matrix composite (PMC) panel in conjunction with multiple thin-film adhesives to promote the interfacial bond strength between the SMA and PMC. A double cantilever beam (DCB) test was performed in accordance with the ASTM D5528 method for evaluation of Mode I interlaminar fracture toughness of unidirectional fiber-reinforced PMCs. The modal acoustic emissions (MAEs) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels were subjected to a C-scan before testing and examined using optical and scanning electron microscopy (SEM) techniques after part failure. The data were used in conjunction with modified beam theory (MBT), the compliance calibration (CC) method, and the modified compliance calibration (MCC) method. The Mode I interlaminar toughness (G(sub IC)) values for control specimens were higher than previously reported and are attributed to extensive fiber bridging during testing. The presence of adhesives with SMA inserts stabilized crack propagation during DCB testing. The results reveal a new phenomenon of SMA bridging, whereby crack propagation would switch from one side of the SMA insert to the other, thus increasing the load and G(sub IC) values of specimens containing SMA.
A Power-Law Decrease in Interfacial Resistance Between Li 7 La 3 Zr 2 O 12 and Lithium Metal After Removing Stack Pressure
The high interfacial resistance between solid electrolytes and lithium metal is a hurdle to developing all solid-state batteries. External pressure applied on the lithium and solid electrolyte interface prior to electrochemical cycling is known to effectively lower the interfacial resistance. Here we report that the interfacial resistance between Li 6.4 La 3 Zr 1.4 Ta 0.6 O 12 (LLZTO) and lithium metal decreases over time even after removing the external pressure. The irreversible decrease of interfacial resistance can be understood by a gradual reduction of the total energy of the system, including strain energy and interfacial energy. Under external pressure exceeding ~25 MPa, however, lithium can be squeezed into LLZTO, fracturing the ceramic solid electrolyte. As a result, these observations can help improve the understanding of lithium metal creep and the interactions between garnet-type solid electrolytes and lithium metal.