SEARCH · Search NASA

Results for “MEMS sensor”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 109 records · Page 6

All sources NASA NTRS DOE OSTI

NASA NTRS2010

Shifting the Inertial Navigation Paradigm with MEMS Technology

Why don t you use MEMS? is one of the most common questions posed to navigation systems engineers designing inertial navigation solutions in the modern era. The question stems from a general understanding that great strides have been made in terrestrial MEMS accelerometers and attitude rate sensors in terms of accuracy, mass, and power. Yet, when compared on a unit-to-unit basis, MEMS devices do not provide comparable performance (accuracy) to navigation grade sensors. This paper will propose a paradigm shift where the comparison in performance is between multiple MEMS devices and a single navigation grade sensor. The concept is that systematically, a sufficient number of MEMS sensors may mathematically provide comparable performance to a single navigation grade device and be competitive in terms power and mass allocations when viewed on a systems level. The implication is that both inertial navigation system design and fault detection, identification, and recovery could benefit from a system of MEMS devices in the same way that swarm sensing has benefited Earth observation and astronomy. A survey of the state of the art in inertial sensor accuracy scaled by mass and power will be provided to show the specific error in MEMS and navigation graded devices, a mathematical comparison of multi-unit to single-unit sensor errors will be developed, and preliminary applications to Constellation vehicles will be explored.

Crain, Timothy↗

NASA NTRS2010

Shifting the Intertial Navigation Paradigm with the MEMS Technology

"Why don't you use MEMS?" is of the most common questions posed to navigation systems engineers designing inertial navigation solutions in the modern era. The question stems from a general understanding that great strides have been made in terrestrial MEMS accelerometers and attitude rate sensors in terms of accuracy, mass, and power. Yet, when compared on a unit-to-unit basis, MEMS devices do not provide comparable performance (accuracy) to navigation grade sensors in several key metrics. This paper will propose a paradigm shift where the comparison in performance is between multiple MEMS devices and a single navigation grade sensor. The concept is that systematically, a sufficient number of MEMS sensors may mathematically provide comparable performance to a single navigation grade device and be competitive in terms power and mass allocations when viewed on a systems level. The implication is that both inertial navigation system design and fault detection, identification, and recovery could benefit from a system of MEMS devices in the same way that swarm sensing has benefited Earth observation and astronomy. A survey of the state of the art in inertial sensor accuracy scaled by mass and power will be provided to show the scaled error in MEMS and navigation graded devices, a mathematical comparison of multi-unit to single-unit sensor errors will be developed, and preliminary application to an Orion lunar skip atmospheric entry trajectory will be explored.

Crain, Timothy P., II↗

NASA NTRS2016

800 C Silicon Carbide (SiC) Pressure Sensors for Engine Ground Testing

MEMS-based 4H-SiC piezoresistive pressure sensors have been demonstrated at 800 C, leading to the discovery of strain sensitivity recovery with increasing temperatures above 400 C, eventually achieving up to, or near, 100 recovery of the room temperature values at 800 C. This result will allow the insertion of highly sensitive pressure sensors closer to jet, rocket, and hypersonic engine combustion chambers to improve the quantification accuracy of combustor dynamics, performance, and increase safety margin. Also, by operating at higher temperature and locating closer to the combustion chamber, reduction of the length (weight) of pressure tubes that are currently used will be achieved. This will result in reduced costlb to access space.

Pressure sensors↗

NASA NTRS2006

Theory and Practice of Shear/Stress Strain Gage Hygrometry

Mechanical hygrometry has progressed during the last several decades from crude hygroscopes to state-of-the art strain-gage sensors. The strain-gage devices vary from different metallic beams to strain-gage sensors using cellulose crystallite elements, held in full shear restraint. This old technique is still in use but several companies are now actively pursuing development of MEMS miniaturized humidity sensors. These new sensors use polyimide thin film for water vapor adsorption and desorption. This paper will provide overview about modern humidity sensors.

Shams, Qamar A.↗

NASA NTRS1996

Microelectromechanical Systems for Aerodynamics Applications

Microelectromechanical systems (MEMS) embody the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including micro-sensors and micro-actuators, are attractive because they can be made small (characteristic dimension about microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. MEMS pressure sensors, wall-shear-stress sensors, and micromachined hot-wires are nearing application in aeronautics. MEMS actuators face a tougher challenge since they have to be scaled (up) to the physical phenomena that are being controlled. MEMS actuators are proposed, for example, for controlling the small structures in a turbulent boundary layer, for aircraft control, for cooling, and for mixing enhancement. Data acquisition or control logistics require integration of electronics along with the transducer elements with appropriate consideration of analog-to-digital conversion, multiplexing, and telemetry. Altogether, MEMS technology offers exciting opportunities for aerodynamics applications both in wind tunnels and in flight

Mehregany, Mehran↗

NASA NTRS2011

Fabrication method for a room temperature hydrogen sensor

A sensor for selectively determining the presence and measuring the amount of hydrogen in the vicinity of the sensor. The sensor comprises a MEMS device coated with a nanostructured thin film of indium oxide doped tin oxide with an over layer of nanostructured barium cerate with platinum catalyst nanoparticles. Initial exposure to a UV light source, at room temperature, causes burning of organic residues present on the sensor surface and provides a clean surface for sensing hydrogen at room temperature. A giant room temperature hydrogen sensitivity is observed after making the UV source off. The hydrogen sensor of the invention can be usefully employed for the detection of hydrogen in an environment susceptible to the incursion or generation of hydrogen and may be conveniently used at room temperature.

Seal, Sudipta↗

NASA NTRS1993

Advanced microfabrication technologies for microspacecraft

Advanced microfabrication technologies offer the prospect of reducing the weight and size of spacecraft through the use of lighter and stronger materials in conjunction with new mechanical/structural design concepts and design optimization methods. At the same time, electronic components have been scaled down while increasing functional utility. A two-fold benefit is derived for space applications through the use of less expensive components and the lower launch costs associated with lighter components. GE-CRD is actively pursuing research in these key technologies for a wide range of applications including satellites. These key technologies will be reviewed and an update on GE progress will be given. The need to reduce weight and lower cost, while maintaining product quality and reliability are primary drivers in the design of satellites, in general, and microsatellites in particular. For the structural subsystem, these requirements pose a complex design problem unless new mechanical design concepts and computer-aided design optimization methods are employed. Several new concepts, such as battery packs doubling as panel reinforcements and fuel tanks as integral structural members, need to utilized. In addition, new viscoelastic material damping concepts for spacecraft components provide for lighter weight/lower cost designs, while satisfying the structural dynamics requirements. High density interconnect (HDI) technology permits the use of bare IC's on a ceramic substrate with 90 percent active area utilization. A copper/polyimide multilayer structure is the backbone of the technology, which has demonstrated a size/weight reduction of greater than 10x compared to printed circuit board with performance up to the GHz level. HDI modules have exceptional mechanical robustness as evidenced by survival of 180 kg rapid acceleration tests. Microelectromechanical systems (MEMS) are redefining sensors and actuators by miniaturization through micromachining techniques. Sharing many fabrication steps with HDI, we have developed a new technique for surface micromachining of copper/polyimide structures using computer-aided laser patterning.

Ghezzo, M.↗

NASA NTRS2023

Ventilation Heat Exchanger / Flow Meter for xPLSS

The flow meter / heat exchanger (FMHX) in the ventilation loop of the exploration EMU cools the ventilation gas and measures the ventilation flow rate. The heat exchanger transfers heat from the ventilation gas to the thermal control loop via a miniature shell-and-tube heat exchanger. The flow meters calculate the flow rate of gas through the ventilation loop based on the pressure drop across the heat exchanger core. Creare has delivered four design validation test (DVT) heat exchangers and five DVT flow meters to NASA JSC to support development of the exploration portable life support system (xPLSS). This paper describes the design and performance of the DVT units.The heat exchangers are designed to cool the ventilation gas to a specified temperature with low pressure losses under the most challenging operating conditions. The measured performance of the DVT heat exchangers agrees well with design models and meets all performance requirements. The flow meters use a MEMS thermal flow sensor to produce a signal that is proportional to a small bypass flow around the heat exchanger core. They are designed to achieve high measurement accuracy across the full range of xPLSS operating conditions. We calibrated the flow meters in a special-purpose flow facility that simulates operation in the xPLSS ventilation loop. Calibration testing shows that DVT flow meters produce digital output for vent loop mass flow that meets NASA’s accuracy requirements across the range of xPLSS operating conditions. This paper reviews the design of the heat exchangers and flow meters and presents data from the final flow meter calibration testing, heat exchanger performance validation, and initial ground testing in NASA’s xPLSS.

spacesuit↗

NASA NTRS2023

Ventilation Heat Exchanger / Flow Meter for xPLSS

spacesuit↗

NASA NTRS2002

Integrated Shear Stress/Temperature Micromachined Sensors

During this project we were able to design and initiate the fabrication of an integrated Micro ElectroMechanical Systems (MEMS)-based shear stress/temperature sensor for flow control applications. A brief summary of the completed activities during this project is presented.

Sheplak, Mark↗

NASA NTRS2002

Structural Health Monitoring Sensor Development at NASA Langley Research Center

NASA is applying considerable effort on the development of sensor technology for structural health monitoring (SHM). This research is targeted toward increasing the safety and reliability of aerospace vehicles, while reducing operating and maintenance costs. Research programs are focused on applications to both aircraft and space vehicles. Sensor technologies under development span a wide range including fiber-optic sensing, active and passive acoustic sensors, electromagnetic sensors, wireless sensing systems, MEMS, and nanosensors. Because of their numerous advantages for aerospace applications, fiber-optic sensors are one of the leading candidates and are the major focus of this presentation. In addition, recent advances in active and passive acoustic sensing will also be discussed.

Prosser, W. H.↗

NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗

NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗

NASA NTRS2003

Development of Structural Health Management Technology for Aerospace Vehicles

As part of the overall goal of developing Integrated Vehicle Health Management (IVHM) systems for aerospace vehicles, NASA has focused considerable resources on the development of technologies for Structural Health Management (SHM). The motivations for these efforts are to increase the safety and reliability of aerospace structural systems, while at the same time decreasing operating and maintenance costs. Research and development of SHM technologies has been supported under a variety of programs for both aircraft and spacecraft including the Space Launch Initiative, X-33, Next Generation Launch Technology, and Aviation Safety Program. The major focus of much of the research to date has been on the development and testing of sensor technologies. A wide range of sensor technologies are under consideration including fiber-optic sensors, active and passive acoustic sensors, electromagnetic sensors, wireless sensing systems, MEMS, and nanosensors. Because of their numerous advantages for aerospace applications, most notably being extremely light weight, fiber-optic sensors are one of the leading candidates and have received considerable attention.

Prosser, W. H.↗

NASA NTRS2008

Aerospace Sensor Systems: From Sensor Development To Vehicle Application

This paper presents an overview of years of sensor system development and application for aerospace systems. The emphasis of this work is on developing advanced capabilities for measurement and control of aeropropulsion and crew vehicle systems as well as monitoring the safety of those systems. Specific areas of work include chemical species sensors, thin film thermocouples and strain gages, heat flux gages, fuel gages, SiC based electronic devices and sensors, space qualified electronics, and MicroElectroMechanical Systems (MEMS) as well as integrated and multifunctional sensor systems. Each sensor type has its own technical challenges related to integration and reliability in a given application. The general approach has been to develop base sensor technology using microfabrication techniques, integrate sensors with "smart" hardware and software, and demonstrate those systems in a range of aerospace applications. Descriptions of the sensor elements, their integration into sensors systems, and examples of sensor system applications will be discussed. Finally, suggestions related to the future of sensor technology will be given. It is concluded that smart micro/nano sensor technology can revolutionize aerospace applications, but significant challenges exist in maturing the technology and demonstrating its value in real-life applications.

Hunter, Gary W.↗

NASA NTRS2014

Demonstration of SiC Pressure Sensors at 750 C

We report the first demonstration of MEMS-based 4H-SiC piezoresistive pressure sensors tested at 750 C and in the process confirmed the existence of strain sensitivity recovery with increasing temperature above 400 C, eventually achieving near or up to 100% of the room temperature values at 750 C. This strain sensitivity recovery phenomenon in 4H-SiC is uncharacteristic of the well-known monotonic decrease in strain sensitivity with increasing temperature in silicon piezoresistors. For the three sensors tested, the room temperature full-scale output (FSO) at 200 psig ranged between 29 and 36 mV. Although the FSO at 400 C dropped by about 60%, full recovery was achieved at 750 C. This result will allow the operation of SiC pressure sensors at higher temperatures, thereby permitting deeper insertion into the engine combustion chamber to improve the accurate quantification of combustor dynamics.

Semiconductor↗

NASA NTRS2002

Micro sun sensor

A new generation of sun sensors is emerging. These sun sensors utilize an imaging detector and the sun sensor determines the sun angles based on an image of fringes or centroids on the detector plane. Typically determines the sun angle in two axes.

APS MEMS sun sensor↗

NASA NTRS2003

Fuzzy image processing in sun sensor

This paper will describe how the fuzzy image processing is implemented in the instrument. Comparison of the Fuzzy image processing and a more conventional image processing algorithm is provided and shows that the Fuzzy image processing yields better accuracy then conventional image processing.

MEMS sun sensor APS attitude determination fuzzy i↗