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Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗

NASA, We Have a Challenge and It's Food Packaging

Current Packaging: Freeze Dried Foods Packaging  The thermoformed base is fabricated from Combitherm PAXX230 [a coextrusion of nylon/medium-density polyethylene (MDPE)/nylon/ethylene-vinyl alcohol (EVOH)/nylon/MDPE/linear low-density polyethylene (LLDPE)].  The lid is fabricated from Combitherm PAXX115 (a coextrusion of nylon/EVOH/nylon/LF adhesive/HV polyethylene/LLDPE)  Natural form (Bite size) foods  The bite-size food package is fabricated from Combitherm PAXX115, a coextrusion of nylon/EVOH/nylon/LF adhesive/HV polyethylene/LLDPE.  Overwrap  Packages are wrapped in a white pouch,.003-mm thick, fabricated from a laminate of polyester/polyethylene/aluminum foil/Surlyn®. This overwrap is removed before the food is prepared and heated. Requirements  High barrier packaging - low oxygen and water vapor transmission rates  No aluminum layer  Mass - <145 grams per m2  Flexible  Puncture resistant  Approved for food use  Amenable to sterilization  Able to be heat sealed  Preferred (not required)  Transparent  Retortable, microwavable, high pressure use. Small Business Innovative Research Program - 7 years  8 Phase I contracts  4 Phase II contracts  Two workshops to bring together food packaging experts  Three internal research tasks  Public Outreach - average of 3 presentations/yr. for 8 years describing NASA's challenges  Department of Defense Collaboration - Combat Feeding Program No significant improvement in food packaging capabilities after these efforts. It was unlikely that a food packaging solution could be found within the food science community  There was a need to go outside to other industries such as pharmaceutical or electrical  Although a positive result was preferred, a negative result would also be useful  Two Innovation Techniques were used as a comparison  InnoCentive - Theoretical Challenge to identify new technologies  Yet2.com - A matchmaker between NASA and commercial packaging manufacturers

Perchonok, Michele↗

Evaluation methodology guidance for stack packages

This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight.

Gerke, David↗

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗

Additive Manufacturing of Frequency-Agile W-Band Packaging

Abstract —In this paper we demonstrate a fully additively manufactured packaged W-band amplifier with integrated bypass capacitors. This package was fabricated using a chip-first approach and aerosol jet printing. Package substrates (dielectrics), conductors and interconnects are printed around a bare die attached to a carrier. This package uses shaped ramp interconnects, allowing for frequency agnostic package performance of the interconnect with no impedance discontinuity, within the physical limits of the printer. High dielectric constant thin films of a polymer-matrix nanocomposite for bypass capacitors were printed using multi-material aerosol jet printing. The maximum measured packaged gain is 14.9 dB in the W-band, compared to the maximum bare die gain of 15.5 dB in the same frequency range. From 75 - 92 GHz, the average package loss is 1.1 dB including 3 mm transmission line, interconnects, and a GSG launch structure correlating to an average loss of 0.37 dB/mm.

Additive manufacturing, aerosol jet printing, hete↗

Dose Rate Evaluation for the ES-3100 Package with HEU Content Using MCNP, ADVANTG, Monaco, and MAVRIC

Here, this paper presents a comparative study of dose rate calculations for the ES-3100 package with highly enriched uranium (HEU) content for different source configurations using computer codes: (1) MCNP; (2) Automated Variance Reduction Generator (ADVANTG)/MCNP; (3) Monaco; and (4) Monaco with Automated Variance Reduction using Importance Calculations (MAVRIC). The Model ES-3100 package was developed at the Y-12 National Security Complex for domestic and international transportation of Type B fissile radioactive material. In this study, six different source configurations (i.e., solid cylinder, cylindrical hemi-shell, cylindrical shell, rectangular plate, cylindrical rod, or cylindrical segment form) having 36 kg of HEU metal inside the package containment vessel (based on configurations in the ES-3100/HEU safety analysis report for packaging) are evaluated. Dose rates at the package surfaces and 1 m from the package surfaces are calculated for these different source configurations. MCNP and Monaco cases are run without any biasing options to accelerate the convergence. Consistent Adjoint Driven Importance Sampling (CADIS) and Forward-Weighted CADIS (FW-CADIS) methods developed at the Oak Ridge National Laboratory are implemented in ADVANTG/MCNP and MAVRIC codes to accelerate the convergence. ADVANTG generates variance reduction parameters using Denovo code, and MCNP is used with the variance reduction parameters to accelerate the convergence. MAVRIC uses Denovo code to construct an importance map and a biased source distribution that are supplied to Monaco to accelerate the Monte Carlo simulation. The FW-CADIS option in ADVANTG and MAVRIC is used to accelerate the convergence in this study. The accelerated convergence cases (ADVANTG/MCNP and MAVRIC) are about 100 times faster with 100 times less particle simulation than those cases run without biasing options (analog MCNP and analog Monaco). Lastly, the MCNP, ADVANTG/MCNP, Monaco, and MAVRIC calculated dose rates at the package surfaces and at 1 m from the package surfaces for the different source configurations are compared and are found to be in general agreement.

42 ENGINEERING↗

Dose Rate Evaluation for the ES-3100 Package with HEU Content Using MCNP, ADVANTG, Monaco, and MAVRIC

This paper presents a comparative study of dose rate calculations for the ES-3100 package with highly enriched uranium (HEU) content for different source configurations using computer codes: (1) MCNP; (2) Automated Variance Reduction Generator (ADVANTG)/MCNP; (3) Monaco; and (4) Monaco with Automated Variance Reduction using Importance Calculations (MAVRIC). The Model ES-3100 package was developed at the Y-12 National Security Complex for domestic and international transportation of Type B fissile radioactive material. In this study, six different source configurations (i.e., solid cylinder, cylindrical hemi-shell, cylindrical shell, rectangular plate, cylindrical rod, or cylindrical segment form) having 36 kg of HEU metal inside the package containment vessel (based on configurations in the ES-3100/HEU safety analysis report for packaging) are evaluated. Dose rates at the package surfaces and 1 m from the package surfaces are calculated for these different source configurations. MCNP and Monaco cases are run without any biasing options to accelerate the convergence. Consistent Adjoint Driven Importance Sampling (CADIS) and Forward-Weighted CADIS (FW-CADIS) methods developed at the Oak Ridge National Laboratory are implemented in ADVANTG/MCNP and MAVRIC codes to accelerate the convergence. ADVANTG generates variance reduction parameters using Denovo code, and MCNP is used with the variance reduction parameters to accelerate the convergence. MAVRIC uses Denovo code to construct an importance map and a biased source distribution that are supplied to Monaco to accelerate the Monte Carlo simulation. The FW-CADIS option in ADVANTG and MAVRIC is used to accelerate the convergence in this study. The accelerated convergence cases (ADVANTG/MCNP and MAVRIC) are about 100 times faster with 100 times less particle simulation than those cases run without biasing options (analog MCNP and analog Monaco). The MCNP, ADVANTG/MCNP, Monaco, and MAVRIC calculated dose rates at the package surfaces and at 1 m from the package surfaces for the different source configurations are compared and are found to be in general agreement.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Verification Suite for the Application of the Limiting Surface Density Method to Arrays of 9975 Packages

Criticality Safety Engineering at the Savannah River Site’s K-Area Complex seeks to reduce the computational burden of analysis for the K-Area Complex. By applying an adapted Limiting Surface Density hand calculation method, the need for lengthy detailed Monte Carlo models of the storage arrays may be reduced or eliminated. After promising initial results using models of idealized but heterogeneous packages, application of the method to large arrays of highly heterogeneous 9975 shipping packages is attempted. A SCALE KENO-VI model of the 9975 package, with true dimensions and radial and axial heterogeneity is developed. A suite of array arrangements representing both arrays with equal number of packages per side (package-cubic) and arrays with unequal number of packages per side (non-cubic) are evaluated in SCALE. The cubic arrangements are used to derive the 9975-specific material and geometry constants for the LSD method. These constants are then used to implement the LSD method and compare the LSD- predicted critical mass per package to SCALE-predicted critical mass per package. Sensitivities to certain material and geometric nuances are evaluated for inclusion in the verification suite. Finally, the ability of the method to predict neutron multiplication changes induced by fissile mass changes is examined as a segue for evaluating credible abnormal conditions with the LSD method.

42 ENGINEERING↗

How R Developers explain their Package Choice: A Survey

Background: Contemporary software development relies heavily on reusing already implemented functionality, usually in the form of packages. Aims: We aim to shed light on developers' preferences when selecting packages in R language. Method: To do that, we create and administer a survey to over 1000 developers who have added one of two common dataframe enhancement libraries in R to their projects: data.table or tidyr. We design a questionnaire using the Social Contagion Theory (SCT) following prior work on technology adoption and ensure that key dimensions affecting developer choice are considered. Results: Of the 1085 developers we contacted, 803 completed the survey asking them to prioritize various factors known to affect developer perceptions of package quality and to provide their background. Most developers self-identified as data scientists with two to five years of work experience. We found significant differences between the preferences of developers who chose data.table and tidyr. Surprisingly, package reputation based on easy-to-see measures, such as the number of stars on GitHub, was not an important factor for either group. Conclusions: Our findings demonstrate the inherently social nature of package adoption. They can help design future studies on how different populations of developers make decisions on which software packages to use in their projects. Finally, package developers and maintainers can benefit by better understanding the prime concerns of the users of their packages.

Malviya Thakur, Addi↗

Fiberboard Properties and Degradation Rates for Storage of 9975 Shipping Package in KAC (2022 Status Report)

Thermal, mechanical, and physical properties have been measured on fiberboard samples following accelerated aging for up to 17 years. The aging environments include elevated temperature up to 250 °F (the maximum allowed service temperature for fiberboard in 9975 packages) and elevated humidity. Accelerated aging results have been analyzed and used to build aging models. Correlations relating several properties (thermal conductivity, energy absorption, weight, dimensions, and density) to their rate of change in potential storage environments have been developed. Combined with an estimate of the actual conditions the fiberboard experiences in K-Area Complex (KAC), these models allow development of service life predictions. KAC completed calculations that supported extending the service life of 9975 packages with 3013 containers in storage from 20 years to 40 years. These calculations addressed the potential for degraded fiberboard properties following 40 years in storage using degradation models developed previously. Due to differences in containers, 9975 packages with non-3013 containers are only approved for 20 years of storage. The updated degradation models developed in this report have been compared to the assumptions in those calculations, and the current results for fiberboard dimensions, density, radial thermal conductivity, and energy absorption remain consistent with those calculations. The axial thermal conductivity degradation rate slightly exceeds calculations estimate of 0.5% per year between 130 and 160 °F. Additional data will continue to be collected to permit future refinements to the models and assumptions. Some of the predicted degradation rates presented in this report are extreme. However, these relate to environments that do not exist within KAC or would be postulated only as upset conditions that would not likely persist for an extended period. For a typical package stored in KAC with approximately 10-12 watts internal heat load or less, and ambient temperatures below 90 °F, the fiberboard assemblies experience storage conditions less severe than any of the aging environments. Fiberboard in conforming packages with lower internal heat loads should experience little or no degradation and is expected to provide a service life beyond the currently approved 40 year storage period. Packages with higher internal heat loads may not continue to perform their required safety functions beyond 40 years. Ultimately, service life will be determined by the cumulative effect of degradation from all the conditions these packages might encounter. The results and model predictions presented in this report are applicable to 9975 packages with cane or softwood fiberboard overpack assemblies. These degradation models do not address the effects of non-conforming conditions such as the presence of excess moisture and mold or beetle infestations.

36 MATERIALS SCIENCE↗

2025 Status Report - Fiberboard Properties and Degradation Rates for Storage of 9975 Shipping Package in KAC

Fiberboard assemblies in the 9975 package were identified as susceptible to aging and degradation under long-term storage conditions. Thermal, mechanical, and physical properties have been measured on fiberboard samples aging for up to 20 years at accelerated conditions. The aging environments include elevated temperature up to 250 ºF (the maximum allowed service temperature for fiberboard in 9975 packages) and elevated humidity. Accelerated aging results have been analyzed and used to build aging models. Correlations relating several properties (thermal conductivity, energy absorption, weight, dimensions, and density) to their rate of change in potential storage environments have been developed. Combined with an estimate of the actual conditions the fiberboard experiences in K-Area Complex (KAC), these models allow development of service life predictions. KAC completed calculations that supported extending the service life of 9975 packages with 3013 containers in storage from 20 years to 40 years. These calculations addressed the potential for degraded fiberboard properties following 40 years in storage using degradation models. The 40 year storage evaluations assumed the degradation rates from initial values for density, dimensional, and thermal properties were 0.5% per year (i.e., after 40 years, the density, dimensional, and thermal properties of fiberboard were 80% of its initial values). The updated degradation models developed in this report were compared to the assumptions in those calculations, and the current results for fiberboard dimensions, density, axial and radial thermal conductivities, and energy absorption remain consistent with those calculations. Additional data will continue to be collected to permit future refinements to the models and assumptions. Some of the predicted degradation rates presented in this report are purposely high to accelerate aging. These rates relate to environments that do not exist within KAC or are postulated to only occur as upset conditions that are unlikely to persist for an extended period. For a typical package stored in KAC with approximately 10-12 watts internal heat load or less, and ambient temperatures below 90 ºF, the fiberboard assemblies experience storage conditions less severe than any of the aging environments (i.e., under 125 °F) used in this study. Fiberboard in conforming packages with lower internal heat loads should experience little or no degradation and is expected to provide a service life beyond the currently approved 40 year storage period. Packages with higher internal heat loads may not continue to perform their required safety functions beyond 40 years. Ultimately, service life will be determined by the cumulative effect of degradation from all the conditions these packages might encounter. The results and model predictions presented in this report are applicable to 9975 packages with cane or softwood fiberboard overpack assemblies. These degradation models do not address the effects of non&#x2;conforming conditions such as the presence of excess moisture and mold or beetle infestations.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Valorization of Hemp-Based Packaging Waste with One-Pot Ionic Liquid Technology

The range of applications for industrial hemp has consistently increased in various sectors over the years. For example, hemp hurd can be used as a resource to produce biodegradable packaging materials when incorporated into a fungal mycelium composite, a process that has been commercialized. Although these packaging materials can be composted after usage, they may present an opportunity for valorization in a biorefinery setting. Here, we demonstrate the potential of using this type of discarded packaging composite as a feedstock for biofuel production. A one-pot ionic liquid-based biomass deconstruction and conversion process was implemented, and the results from the packaging material were compared with those obtained from untreated hemp hurd. At a 120 °C reaction temperature, 7.5% ionic liquid loading, and 2 h reaction time, the packaging materials showed a higher lignocellulosic sugar yield and sugar concentrations than hemp hurd. Hydrolysates prepared from packaging materials also promoted production of higher titers (1400 mg/L) of the jet-fuel precursor bisabolene when used to cultivate an engineered strain of the yeast Rhodosporidium toruloides. Box–Behnken experiments revealed that pretreatment parameters affected the hemp hurd and packaging materials differently, evidencing different degrees of recalcitrance. This study demonstrated that a hemp hurd-based packaging material can be valorized a second time once it reaches the end of its primary use by supplying it as a feedstock to produce biofuels.

59 BASIC BIOLOGICAL SCIENCES↗

Optimal Design of Food Packaging Considering Waste Management Technologies to Achieve Circular Economy

Plastic packaging plays a fundamental role in the food industry, avoiding food waste and facilitating food access. The increasing plastic production and the lack of appropriate plastic waste management technologies represent a threat to the environmental and human welfare. Therefore, there is an urgent need to identify sustainable packaging solutions. Circular economy (CE) promotes reducing waste and increasing recycling practices to achieve sustainability. In this work, we propose a CE framework based on multi-objective optimization, considering both economic and environmental impacts, to identify optimal packaging designs and waste management technologies. Using mixed-integer linear programming (MILP), techno-economic analysis (TEA), and life cycle assessment (LCA), this work aims to build the first steps in packaging design, informing about the best packaging alternatives and the optimal technology or technologies to process packaging waste. For the economic analysis, we consider the minimum increase in price (MIP) when adding recycling to the cost of each packaging solution, while for the environmental analysis, the greenhouse gas emissions impact was considered. A case study on ground coffee packaging is used to illustrate the proposed framework. The results demonstrate that the multilayer bag option is the most convenient when considering both the chosen economic and environmental impacts.

Life Cycle Analysis↗

Packaging's Contribution for the Effectiveness of the Space Station's Food Service Operation

Storage limitations will have a major effect on space station food service. For example: foods with low bulk density such as ice cream, bread, cake, standard type potato chips and other low density snacks, flaked cereals, etc., will exacerbate the problem of space limitations; package containers are inherently volume consuming and refuse creating; and the useful observation that the optimum package is no package at all leads to the tentative conclusion that the least amount of packaging per unit of food, consistent with storage, aesthetics, preservation, cleanliness, cost and disposal criteria, is the most practical food package for the space station. A series of trade offs may have to be made to arrive at the most appropriate package design for a particular type of food taking all the criteria into account. Some of these trade offs are: single serve vs. bulk; conventional oven vs. microwave oven; nonmetallic aseptically vs. non-aseptically packaged foods; and comparison of aseptic vs. nonaseptic food packages. The advantages and disadvantages are discussed.

Rausch, B. A.↗

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗

A Compact, Modular Package for Superconducting Bolometer Arrays

As bolometer arrays grow to ever-larger formats, packaging becomes a more critical engineering issue. We have designed a detector package to house a superconducting bolometer array, SQUID multiplexers, bias and filtering circuitry, and electrical connectors. The package includes an optical filter, magnetic shielding, and has well-defined thermal and mechanical interfaces. An early version of this package has been used successfully in the GISMO 2mm camera, a 128-pixel camera operating at a base temperature of 270mK. A more advanced package permits operation at lower temperatures by providing direct heat sinking to the SQUIDS and bias resistors, which generate the bulk of the dissipation in the package. Standard electrical connectors provide reliable contact while enabling quick installation and removal of the package. We describe how the design compensates for differing thermal expansions, allows heat sinking of the bolometer array, and features magnetic shielding in critical areas. We highlight the performance of this detector package and describe its scalability to 1280-pixel arrays in the near future.

Benford, D.↗

The Assurance Challenges of Advanced Packaging Technologies for Electronics

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Sampson, Michael J.↗

Ultra Low Temperature Ultra Low Power Instrument Packages for Planetary Surfaces

Achievement of solar system exploration roadmap goals will involve robotic or human deployment and longterm operation of surface science packages remote from human presence, thus requiring autonomous, self-powered operation. The major challenge such packages face will be operating during long periods of darkness in extreme cold potentially without the Pu238 based power and thermal systems available to Apollo era packages (ALSEP). Development of such science payloads will thus require considerable optimization of instrument and subsystem design, packaging and integration for a variety of planetary surface environments in order to support solar system exploration fully. Our work supports this process through the incorporation of low temperature operational components and design strategies which radically minimize power, mass, and cost while maximizing the performance under extreme surface conditions that are in many cases more demanding than those routinely experienced by spacecraft in deep space. Chief instruments/instrument package candidates include those which could provide long-term monitoring of the surface and subsurface environments for fundamental science and human crew safety. The initial attempt to design a 10 instrument environmental monitoring package with a solar/battery based power system led to a package with a unacceptably large mass (500 kg) of which over half was battery mass. In phase 1, a factor of 5 reduction in mass was achieved, first through the introduction of high performance electronics capable of operating at far lower temperature and then through the use of innovative thermal balance strategies involving the use of multi-layer thin materials and gravity-assisted heat pipes. In phase 2, reported here, involves strategies such as universal incorporation of ULT/ULP digital and analog electronics, and distributed or non-conventionally packaged power systems. These strategies will be required to meet the far more challenging thermal requirements of operating through a normal 28 day diurnal cycle. The limited temperature range of efficient battery operation remains the largest obstacle.

Clark, P. E.↗