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At least 109 records · Page 6

Elastomer-toughened polyimide adhesives

A study has been conducted to determine the effects of added elastomers on the Tg, thermal stability, adhesive strength, and fracture toughness of LARC-13, a high-temperature addition polyimide adhesive. Various butadiene/acrylonitrile and silicone elastomers were incorporated into the polyimide resin (1) as physical polyblends, and (2) by chemically reacting the elastomers with the polyimide backbone. Adhesive single lap-shear and T-peel strengths were measured before and after aging at elevated temperature. A tapered double-cantilever beam specimen was used to determine the fracture toughness of the elastomer-modified polyimide adhesives.

Saint Clair, A. K.↗

Tribological properties and thermal stability of various types of polyimide films

Thermal exposure experiments at 315 and 350 C were conducted on seven different types of polyimide films to determine which was the most thermally stable and adherent. The polyimides were ranked according to the rate of which they lost weight and how well they adhered to the metallic substrate. Friction and wear experiments were conducted at 25 C (room temperature) on films bonded to 440C HT stainless steel. Friction, film wear rates, wear mechanisms, and transfer films of the seven films were investigated and compared. The polyimides were found to fall into two groups as far as friction and wear properties were concerned. Group I had lower friction but an order of magnitude higher film wear rate than did group II. The wear mechanism was predominately adhesive, but the size of the wear particles was larger for group I polyimides.

Fusaro, R. L.↗

PMR polyimide composites for aerospace applications

Fiber reinforced PMR polyimides are finding increased acceptance as engineering materials for high performance structural applications. Prepreg materials based on this novel class of highly processable, high temperature resistant polyimides, are commercially available and the PMR concept was incorporated in several industrial applications. The status of PMR polyimides is reviewed. Emphasis is given to the chemistry, processing, and applications of the first generation PMR polyimides known as PMR-15.

Serafini, T. T.↗

Colorless, Transparent, Aromatic Polyimide Films

New process yields aromatic condensation polyimide films essentially colorless. Films between 90- and 100-percent transparent at visible wavelength of 500 nm. Optically transparent polyimide films made from variety of aromatic condensation polyimides. Range from very pale in color to colorless, compared to bright yellow color of conventional/ commercial aromatic polyimide film. Increased transparency achieved at no sacrifice in thermal stability, flexibility, toughness, or mechanical properties. These features extremely attractive as films or coating materials for aerospace applications or for any other applications where high optical transparency or thermal stability is required.

St. Clair, A. K.↗

Evaluation of colorless polyimide film for thermal control coating applications

A series of essentially colorless aromatic polyimide films was synthesized and characterized with the objective of obtaining maximum optical transparency for applications in space. Optical transparency is a requirement for high performance polymeric films used in second surface mirror coatings on thermal control systems. The intensity in color of aromatic polyimide films was lowered by reducing the electronic interaction between chromophoric centers in the polymer molecular structure and by using highly purified monomers. The resulting lightly colored to colorless polyimide films were characterized by UV-visible and infrared spectroscopy before and after exposure to 300 equivalent solar hours UV irradiation and varying doses of 1 MeV electron irradiation. After irradiation, the films were found to be 2 to 2.5 times more transparent than commercial polyimide film of the same thickness.

St.clair, A. K.↗

Polyimide adhesives - Modified with ATBN and silicone elastomers

A series of studies evaluating the effects of added elastomers on the properties of a high-temperature addition polyimide adhesive is reviewed. First, thermoset polyimides containing various butadiene/acrylonitrile and silicone elastomers were synthesized either as physical polybends or by chemically reacting the elastomers directly onto the polymer backbone. The modified adhesive resins were characterized for thermomechanical properties, fracture toughness and adhesive strength. A second series of elastomer-containing polyimides was also prepared in order to study the effects of the elastomer chain length on polymer properties. Aromatic amine-terminated silicone rubbers with repeat units varying from n = 10 to 105 were reacted onto the polyimide backbone, and the resulting polymers were characterized for their adhesive properties.

St. Clair, A. K.↗

Evaluation of colorless polyimide film for thermal control coating applications

A series of essentially colorless aromatic polyimide films was synthesized and characterized with the objective of obtaining maximum optical transparency for applications in space. Optical transparency is a requirement for high performance polymeric films used in second surface mirror coatings on thermal control systems. The intensity in color of aromatic polyimide films was lowered by reducing the electronic interaction between chromophoric centers in the polymer molecular structure and by using highly purified monomers. The resulting lightly colored to colorless polyimide films were characterized by UV-visible and infrared spectroscopy before and after exposure to 300 equivalent solar hours UV irradiation and varying doses of 1 MeV electron irradiation. After irradiation, the films were found to be 2 to 2.5 times more transparent than commercial polyimide film of the same thickness.

St. Clair, A. K.↗

Polyimide Film of Increased Tear Strength

High-temperature linear aromatic polyimide with improved resistance to tearing made by new process that incorporates elastomer into polyimide. Linear aromatic condensation polyimides are materials of prime choice for use as films and coatings on advanced spacecraft and aircraft where durability at temperatures in range of 200 to 300 degree C required. Elastomer-containing polyimide film with improved toughness proves useful for applications where resistance to tearing and long-term thermal stability necessary. Desired resistance to tearing achieved by careful control of amount and chemical composition of added elastomer.

St. Clair, A. K.↗

Process for preparing essentially colorless polyimide film containing phenoxy-linked diamines

A polyimide film that is approximately 90% transparent at 500 nm, useful for thermal protective coatings and solar cells, and the processes for preparing the same by thermal and chemical conversion are disclosed. An essential feature for achieving maximum optical transparency films requires utilizing recrystallized and/or sublimated specific aromatic diamines and dianhydride monomers and introducing phenoxy or thiophenyl separator groups and isomeric m,m' or o,p'-oriented diamines into the polymer molecular structure. The incorporation of these groups in the polymer structure serves to separate the chromaphoric centers and reduce the formation of inter-chain and intra-chain charge transfer complexes which normally cause absorptions in the UV-visible range. The films may be obtained by hand, brushing, casting, or spraying a layer of polyamic acid solutions onto a surface and thermally converting the applied layer to the polyimide, or the polyamic acid solution can be chemically converted to the polyimide, subsequentially dissolved in an organic solvent, and applied as a polyimide film layer with the solvent therein thermally removed.

Stclair, A. K.↗

Evaluation of colorless polyimide film for thermal control coating applications

A series of essentially colorless aromatic polyimide films has been synthesized and characterized with the objective of obtaining maximum optical transparency for applications in space. Optical transparency is a requirement for high performance polymeric films used in second surface mirror coatings on thermal control systems. The intensity in color of aromatic polyimide films was lowered by reducing the electronic interaction between chromophoric centers in the polymer molecular structure and by using highly purified monomers. The resulting lightly colored to colorless polyimide films have been characterized by UV-visible and infrared spectroscopy before and after exposure to 300 equivalent solar hours UV irradiation and varying doses of 1 MeV electron irradiation. After irradiation, the films were found to be 2 to 2.5 times more transparent than commercial polyimide film of the same thickness.

St. Clair, A. K.↗

Additives Improve Processing Of Polyimides

Melt-processable polyimides maintain desirable polymer properties prepared by adding small amounts of certain low-molecular-weight, thermally stable additives. Useful in preparing void-free polyimide composites from higher flow resins that wet out fibers at lower processing temperatures. Applied to preparing high-temperature polyimide adhesives allowing enhanced wetting of adherends and ultimately better adhesion. Improvement to processing polyimides and potential application for production of films, coatings, adhesives, and composites.

St. Clair, Terry L.↗

In situ deposits of copper and copper oxide containing condensation polyimide films

Novel copper-polyimide composites have been synthesized via simultaneous thermal decomposition of solid solutions of bis (trifluoroacetylacetonato) copper (II) and thermal cyclodehydration of polyimide acid. In contrast to conventional filled polymer composites which are prepared by dispersion of particles or fibers in a polymer matrix this study has yielded in general uniform Cu or CuO dispersions of very small particle size that reside near the film surface that was exposed to the atmosphere during curing. The nature of the copper deposit, the thickness of the copper deposit, and the polyimide overlayer which bonds the copper to the polymer substrate depend on the curing atmosphere used. A variety of analytical surface methods along with thermogravimetric analysis and variable temperature (surface and volume) electrical resistivity measurements have been used to characterize these thin, flexible copper doped polyimide films.

Porta, G. M.↗

Polyimides containing carbonyl and ether connecting groups - II

In a study of polyimides containing carbonyl and ether connecting groups between aromatic rings, several new polyimides were prepared and characterized. A few of these polymers were semicrystalline. Glass transition temperatures ranged from 164 to 258 C, and crystalline melt temperatures were observed between 350 and 424 C. The semicrystalline polyimide from the reaction of 3.3',4,4'-benzophenonetetracarboxylic dianhydride and 1,3-bis(4-aminophenoxy-4'-benzoyl)benzene provided transparent orange films with excellent tensile properties, exceptional resistance to solvents and strong base, and high thermooxidative stability. In addition, this polyimide provided excellent adhesive strength for joining titanium (6Al-4V) to titanium.

Hergenrother, P. M.↗

Microcracking mechanisms and interface toughening of semi-IPN polyimide matrix composites

A new research program was initiated as a preliminary phase. The following three objectives are being pursued for the overall program: to elucidate the mechanisms of microcracking for graphite fiber-reinforced semi-IPN polyimide matrix composites under mechanical and thermal cyclic loading; to devise material engineering solutions for possible improvement of fatigue damage resistance (or the increase of fatigue endurance strength) of semi-IPN matrix composites by tailoring of modulus and toughness of fiber-resin interface region; and to assess processing characteristics of the composites and their roles in controlling the resistance of composites to microcracking and the effectiveness of interface toughening. The main emphasis was placed upon the initial screening of material systems and optimization of processing conditions for semi-IPN matrix composites with tailored interface. As a first set of control material systems to study, the composites were prepared with unsized Celion 6000 graphite fiber reinforcement and the following resin matrices of varied fracture toughness: PMR-15 thermoset polyimide, semi-IPN of PNR-15 thermoset polyimide and NR150B2 thermoplastic polyimide in 75/25 ratio, and semi-IPN of PMR-15 and NR150B2 in 50/50 ratio. For the composites with the resin matrix of semi-IPN in 75/25 ratio, interface tailoring was attempted by using graphite fibers coated with the resins of systematically varied fracture toughness. In the continuing work, a broad range of interlayer toughness will be achieved by coating the fibers with reactants of semi-IPN having lower or higher content of thermoplastic constituent in comparison with the composition of surrounding resin matrix. In pursuing the objectives of the overall research program, the respective roles and interaction of critical parameters were defined.

Lee, Byung L.↗

Cyclopentadiene evolution during pyrolysis-gas chromatography of PMR polyimides

The effect of formulated molecular weight (FMW), extent of cure, and cumulative aging on the amount of cyclopentadiene (CPD) evolved from Polymerization of Monomeric Reactants (PMR) polyimides were investigated by pyrolysis-gas chromotography (PY-GC). The PMR polyimides are additional crosslinked resins formed from an aromatic diamine, a diester of an aromatic tetracarboxylic acid and a monoester of 5-norbornene-2, 3-dicarboxylic acid. The PY-GC results were related to the degree of crosslinking and to the thermo-oxidative stability (weight loss) of PMR polyimides. Thus, PY-GC has shown to be a valid technique for the characterization of PMR polyimide resins and composites via correlation of the CPD evolved versus the thermal history of the PMR sample.

Alston, William B.↗

Low coefficient of thermal expansion polyimides containing metal ion additives

Polyimides have become widely used as high performance polymers as a result of their excellent thermal stability and toughness. However, lowering their coefficient of thermal expansion (CTE) would increase their usefulness for aerospace and electronic applications where dimensional stability is a requirement. The incorporation of metal ion-containing additives into polyimides, resulting in significantly lowered CTE's, has been studied. Various metal ion additives have been added to both polyamic acid resins and soluble polyimide solutions in the concentration range of 4-23 weight percent. The incorporation of these metal ions has resulted in reductions in the CTE's of the control polyimides of 12 percent to over 100 percent depending on the choice of additive and its concentration.

Stoakley, D. M.↗

Low toxicity high temperature PMR polyimide

In-situ polymerization of monomer reactants (PMR) type polyimides constitute an important class of ultra high performance composite matrix resins. PMR-15 is the best known and most widely used PMR polyimide. An object of the present invention is to provide a substantially improved high temperature PMR-15 system that exhibits better processability, toughness, and thermo-oxidative stability than PMR-15, as well as having a low toxicity. Another object is to provide new PMR polyimides that are useful as adhesives, moldings, and composite matrices. By the present invention, a new PMR polyimide comprises a mixture of the following compounds: 3,4'-oxydianiline (3,4'-ODA), NE, and BTDE which are then treated with heat. This PMR was designated LaRC-RP46 and has a broader processing window, better reproducibility of high quality composite parts, better elevated temperature mechanical properties, and higher retention of mechanical properties at an elevated temperature, particularly, at 371 C.

Pater, Ruth H.↗

Crosslinked polyimides prepared from N-(3-ethynylphenyl)maleimide

The compound N-(3-ethynylphenyl)maleimide (NEPMI) was used to prepare thermally stable, glassy polyimides which did not exhibit glass transition temperatures below 500 C. NEPMI was blended with the maleimide of methylene dianiline (BMI) and heated to form the polyimide. NEPMI was also mixed with Thermid 600 R, a commercially available bisethynyl oligomeric material, and heated to form a thermally stable, glassy polyimide. Lastly, NEPMI was blended with both BMI and Thermid 600 R to form thermally stable, glassy polyimides.

Gerber, Margaret K.↗