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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

Inexpensive Implementation of Many Strain Gauges

It has been proposed to develop arrays of strain gauges as arrays of ordinary metal film resistors and associated electronic readout circuitry on printed circuit boards or other suitable substrates. This proposal is a by-product of a development of instrumentation utilizing metal film resistors on printed-circuit boards to measure temperatures at multiple locations. In the course of that development, it was observed that in addition to being sensitive to temperature, the metal film resistors were also sensitive to strains in the printed-circuit boards to which they were attached. Because of the low cost of ordinary metal film resistors (typically <$0.01 apiece at 2007 prices), the proposal could enable inexpensive implementation of arrays of many (e.g., 100 or more) strain gauges, possibly concentrated in small areas. For example, such an array could be designed for use as a computer keyboard with no moving parts, as a device for sensing the shape of an object resting on a surface, or as a device for measuring strains at many points on a mirror, a fuel tank, an airplane wing, or other large object. Ordinarily, the effect of strain on resistance would be regarded as a nuisance in a temperature-measuring application, and the effect of temperature on resistance would be regarded as a nuisance in a strain-measuring application. The strain-induced changes in resistance of the metal film resistors in question are less than those of films in traditional strain gauges. The main novel aspect of present proposal lies in the use of circuitry affording sufficient sensitivity to measure strain plus means for compensating for the effect of temperature. For an array of metal film resistors used as proposed, the readout circuits would include a high-accuracy analog-to-digital converter fed by a low noise current source, amplifier chain, and an analog multiplexer chain. Corrections would be provided by use of high-accuracy calibration resistors and a temperature sensor. By use of such readout circuitry, it would be possible to read the resistances of as many as 100 fixed resistors in a time interval of 1 second at a resolution much greater than 16 bits. The readout data would be processed, along with temperature calibration data, to deduce the strain on the printed-circuit board or other substrate in the areas around the resistors. It should also be possible to also deduce the temperature from the readings.

Berkun, Andrew C.↗
NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

High Temperature, Packaging, Alumina, Thick Film↗
NASA NTRS2015

Wireless SAW Sensors Having Integrated Antennas

A wireless surface acoustic wave sensor includes a piezoelectric substrate, a surface acoustic wave device formed on the substrate, and an antenna formed on the substrate. In some embodiments, the antenna is formed on the surface of the substrate using one or more of photolithography, thin film processing, thick film processing, plating, and printing.

Gallagher, Mark↗
NASA NTRSDate not supplied

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.

high temperature↗
NASA NTRS1990

High Tc superconducting materials and devices

The high Tc Y1Ba2Cu3O(7-x) ceramic materials, initially developed in 1987, are now being extensively investigated for a variety of engineering applications. The superconductor applications which are presently identified as of most interest to NASA-LaRC are low-noise, low thermal conductivity grounding links; large-area linear Meissner-effect bearings; and sensitive, low-noise sensors and leads. Devices designed for these applications require the development of a number of processing and fabrication technologies. Included among the technologies most specific to the present needs are tapecasting, melt texturing, magnetic field grain alignment, superconductor/polymer composite fabrication, thin film MOD (metal-organic decomposition) processing, screen printing of thick films, and photolithography of thin films. The overall objective of the program was to establish a high Tc superconductivity laboratory capability at NASA-LaRC and demonstrate this capability by fabricating superconducting 123 material via bulk and thin film processes. Specific objectives include: order equipment and set up laboratory; prepare 1 kg batches of 123 material via oxide raw material; construct tapecaster and tapecaster 123 material; fabricate 123 grounding link; fabricate 123 composite for Meissner linear bearing; develop 123 thin film processes (nitrates, acetates); establish Tc and Jc measurement capability; and set up a commercial use of space program in superconductivity at LaRC. In general, most of the objectives of the program were met. Finally, efforts to implement a commercial use of space program in superconductivity at LaRC were completed and at least two industrial companies have indicated their interest in participating.

Haertling, Gene H.↗
NASA NTRS1993

SeaWiFS technical report series. Volume 9: The simulated SeaWiFS data set, version 1

Data system development activities for the Sea-viewing Wide Field-of-view Sensor (SeaWiFS) must begin well before the scheduled 1994 launch. To assist in these activities, it is essential to develop a simulated SeaWiFS data set as soon as possible. Realism is of paramount importance in this data set, including SeaWiFS spectral bands, orbital and scanning characteristics, and known data structures. Development of the simulated data set can assist in identification of problem areas that can be addressed and solved before the actual data are received. This paper describes the creation of the first version of the simulated SeaWiFS data set. The data set includes the spectral band, orbital, and scanning characteristics of the SeaWiFS sensor and SeaStar spacecraft. The information is output in the data structure as it is stored onboard. Thus, it is a level-0 data set which can be taken from start to finish through a prototype data system. The data set is complete and correct at the time of printing, although the values in the telemetry fields are left blank. The structure of the telemetry fields, however, is incorporated. Also, no account for clouds has been included. However, this version facilitates early prototyping activities by the SeaWiFS data system, providing a realistic data set to assess performance.

Gregg, Watson W.↗
NASA NTRS2017

A UAV-Based Fog Collector Design for Fine-Scale Aerobiological Sampling

Airborne microbes are found throughout the troposphere and into the stratosphere. Knowing how the activity of airborne microorganisms can alter water, carbon, and other geochemical cycles is vital to a full understanding of local and global ecosystems. Just as on the land or in the ocean, atmospheric regions vary in habitability; the underlying geochemical, climatic, and ecological dynamics must be characterized at different scales to be effectively modeled. Most aerobiological studies have focused on a high level: 'How high are airborne microbes found?' and 'How far can they travel?' Most fog and cloud water studies collect from stationary ground stations (point) or along flight transects (1D). To complement and provide context for this data, we have designed a UAV-based modified fog and cloud water collector to retrieve 4D-resolved samples for biological and chemical analysis.Our design uses a passive impacting collector hanging from a rigid rod suspended between two multi-rotor UAVs. The suspension design reduces the effect of turbulence and potential for contamination from the UAV downwash. The UAVs are currently modeled in a leader-follower configuration, taking advantage of recent advances in modular UAVs, UAV swarming, and flight planning.The collector itself is a hydrophobic mesh. Materials including Tyvek, PTFE, nylon, and polypropylene monofilament fabricated via laser cutting, CNC knife, or 3D printing were characterized for droplet collection efficiency using a benchtop atomizer and particle counter. Because the meshes can be easily and inexpensively fabricated, a set can be pre-sterilized and brought to the field for 'hot swapping' to decrease cross-contamination between flight sessions or use as negative controls.An onboard sensor and logging system records the time and location of each sample; when combined with flight tracking data, the samples can be resolved into a 4D volumetric map of the fog bank. Collected samples can be returned to the lab for a variety of analyses. Based on a review of existing flight studies, we have identified ion chromatography, metagenomic sequencing, cell staining and quantification, and ATP quantification as high-priority assays for implementation. Support for specific toxicology assays, such as methylmercury quantification, is also planned.

Design↗
NASA NTRS2016

A UAV-Based Fog Collector Design for Fine-Scale Aerobiological Sampling

Airborne microbes are found throughout the troposphere and into the stratosphere. Knowing how the activity of airborne microorganisms can alter water, carbon, and other geochemical cycles is vital to a full understanding of local and global ecosystems. Just as on the land or in the ocean, atmospheric regions vary in habitability; the underlying geochemical, climatic, and ecological dynamics must be characterized at different scales to be effectively modeled. Most aerobiological studies have focused on a high level: 'How high are airborne microbes found?' and 'How far can they travel?' Most fog and cloud water studies collect from stationary ground stations (point) or along flight transects (1D). To complement and provide context for this data, we have designed a UAV-based modified fog and cloud water collector to retrieve 4D-resolved samples for biological and chemical analysis.Our design uses a passive impacting collector hanging from a rigid rod suspended between two multi-rotor UAVs (Unmanned Aerial Vehicles). The suspension design reduces the effect of turbulence and potential for contamination from the UAV downwash. The UAVs are currently modeled in a leader-follower configuration, taking advantage of recent advances in modular UAVs, UAV swarming, and flight planning.The collector itself is a hydrophobic mesh. Materials including Tyvek, PTFE, nylon, and polypropylene monofilament fabricated via laser cutting, CNC knife, or 3D printing were characterized for droplet collection efficiency using a benchtop atomizer and particle counter. Because the meshes can be easily and inexpensively fabricated, a set can be pre-sterilized and brought to the field for 'hot swapping' to decrease cross-contamination between flight sessions or use as negative controls.An onboard sensor and logging system records the time and location of each sample; when combined with flight tracking data, the samples can be resolved into a 4D volumetric map of the fog bank. Collected samples can be returned to the lab for a variety of analyses. Based on a review of existing flight studies, we have identified ion chromatography, metagenomic sequencing, cell staining and quantification, and ATP quantification as high-priority assays for implementation. Support for specific toxicology assays, such as methyl-mercury quantification, is also planned.

Design↗
NASA NTRS1984

Characterizing the scientific potential of satellite sensors

Eleven thematic mapper (TM) radiometric calibration programs were tested and evaluated in support of the task to characterize the potential of LANDSAT TM digital imagery for scientific investigations in the Earth sciences and terrestrial physics. Three software errors related to integer overflow, divide by zero, and nonexist file group were found and solved. Raw, calibrated, and corrected image groups that were created and stored on the Barker2 disk are enumerated. Black and white pixel print files were created for various subscenes of a San Francisco scene (ID 40392-18152). The development of linear regression software is discussed. The output of the software and its function are described. Future work in TM radiometric calibration, image processing, and software development is outlined.

Source record↗
NASA NTRS1981

Test of charge injection device, phase 1

A computer-controlled automatic facility containing two interactive microprocessors, peripherals, and an optical bench was used to obtain device characteristics for use in evaluating CID's as the sensor element in a prospective star tracker application. Each of the ST-256 chips tested contains a 256 x 256 pixel element array with 65536 picture elements. Two ST-256 devices were tested at 20 C under light levels of 10%, 0.1%, and 0.01% saturation, and in darkness. The saturation level was established at 0.95 microwatts sq cm as measured by the radiometeric sensor. Two test runs under each condition were performed for each chip. Two complete sets of data for each of the devices were thus obtained. A separate data field was used to store the results of each test condition. Repetitive runs of a test condition were stored sequentially in the same file. Examination of the data using print-outs is shown in examples.

Gradinger, A.↗
NASA NTRSDate not supplied

Operational Experience with the Electromagnetic Position Sensor (EPS) for the NASA 6-inch MSBS

We rebuilt the wind tunnel model position signal conditioner for the MIT 6-Inch Magnetic Suspension and Balance System (MSBS) Electromagnetic Position Sensor (EPS) that is now in use at the NASA Langley Research Center (LaRC). The effort began at LaRC in ~1990 to replace the original MIT system that was still operating with the low speed wind tunnel until its decommissioning a few years later. The MIT filtering and demodulating scheme mostly remained in the newly designed two-layer printed circuit boards (PCB) with some rearranging of order. The finished product was hampered by noise problems due to problematic grounding design etc. and never successfully operated in the MSBS. After over 20 years, the Langley unit was recovered from Old Dominion University where the MSBS was on loan from NASA but never refurbished. The EPS was brought back to LaRC in 2015 while planning for the return of the MSBS and work began to evaluate its condition and acquire supporting instrumentation. The repair, testing, operational issues, and future improvements are discussed along with an overview of the EPS as a subsystem.

Timothy D Schott↗
NASA NTRS2006

Universal Controller for Spacecraft Mechanisms

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Levanas, Greg↗
NASA NTRS2013

NASA Tech Briefs, July 2013

Dielectrophoresis-Based Particle Sensor Using Nanoelectrode Arrays; Multi-Dimensional Damage Detection for Surfaces and Structures; ULTRA: Underwater Localization for Transit and Reconnaissance Autonomy; Autonomous Cryogenic Leak Detector for Improving Launch Site Operations; Submillimeter Planetary Atmospheric Chemistry Exploration Sounder; Method for Reduction of Silver Biocide Plating on Metal Surfaces; Silicon Micromachined Microlens Array for THz Antennas; Forward-Looking IED Detector Ground Penetrating Radar; Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication, Battery Charge Equalizer with Transformer Array; An Efficient, Highly Flexible Multi-Channel Digital Downconverter Architecture; Dimmable Electronic Ballast for a Gas Discharge Lamp; Conductive Carbon Nanotube Inks for Use with Desktop Inkjet Printing Technology; Enhanced Schapery Theory Software Development for Modeling Failure of Fiber-Reinforced Laminates; High-Performance, Low-Temperature-Operating, Long-Lifetime Aerospace Lubricants; Carbon Nanotube Microarrays Grown on Nanoflake Substrates; Differential Muon Tomography to Continuously Monitor Changes in the Composition of Subsurface Fluids; Microgravity Drill and Anchor System; 20 Granular Media-Based Tunable Passive Vibration Suppressor; 21 Miga Aero Actuator and 2D Machined Mechanical Binary Latch; Micro-XRF for In Situ Geological Exploration of Other Planets; Hydrogen-Enhanced Lunar Oxygen Extraction and Storage Using Only Solar Power; Uplift of Ionospheric Oxygen Ions During Extreme Magnetic Storms; Miniaturized, High-Speed, Modulated X-Ray Source; Hollow-Fiber Spacesuit Water Membrane Evaporator 25 High-Power Single-Mode 2.65-micrometers InGaAsSb/AlInGaAsSb Diode Lasers; Optical Device for Converting a Laser Beam Into Two Co-aligned but Oppositely Directed Beams; A Hybrid Fiber/Solid-State Regenerative Amplifier with Tunable Pulse Widths for Satellite Laser Ranging; X-Ray Diffractive Optics; SynGenics Optimization System (SynOptSys); 29 CFD Script for Rapid TPS Damage Assessment; radEq Add-On Module for CFD Solver Loci-CHEM; Science Opportunity Analyzer (SOA) Version 8; 30 Autonomous Byte Stream Randomizer; Distributed Engine Control Empirical/Analytical Verification Tools; Dynamic Server-Based KML Code Generator Method for Level-of-Detail Traversal of Geospatial Data; Automated Planning of Science Products Based on Nadir Overflights and Alerts for Onboard and Ground Processing; Linked Autonomous Interplanetary Satellite Orbit Navigation; Risk-Constrained Dynamic Programming for Optimal Mars Entry, Descent, and Landing; Scheduling Operations for Massive Heterogeneous Clusters; Deepak Condenser Model (DeCoM); Flight Software Math Library; Recirculating 1-K-Pot for Pulse-Tube Cryostats; 35 Method for Processing Lunar Regolith Using Microwaves; Wells for In Situ Extraction of Volatiles from Regolith (WIEVR); and Estimating the Backup Reaction Wheel Orientation Using Reaction Wheel Spin Rates Flight Telemetry from a Spacecraft.

Source record↗
NASA NTRS2000

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗
NASA NTRS1999

Conformal, Transparent Printed Antenna Developed for Communication and Navigation Systems

Conformal, transparent printed antennas have advantages over conventional antennas in terms of space reuse and aesthetics. Because of their compactness and thin profile, these antennas can be mounted on video displays for efficient integration in communication systems such as palmtop computers, digital telephones, and flat-panel television displays. As an array of multiple elements, the antenna subsystem may save weight by reusing space (via vertical stacking) on photovoltaic arrays or on Earth-facing sensors. Also, the antenna could go unnoticed on automobile windshields or building windows, enabling satellite uplinks and downlinks or other emerging high-frequency communications.

Lee, Richard Q.↗
NASA NTRS2017

Design and Requirements Creep In A Build-To-Print Mission

Build-to-Print designs, or rebuilds of flight proven designs, are attractive to mission stakeholders, as they give the appearance of minimal engineering development cost, risk, and schedule. The reality is that seldom is a project an exact duplicate of a predecessor. Mission reclassification, improvements in hardware, and science objective changes can all serve as a source of requirements and design creep and have ramifications often not fully anticipated during initial proposals. The Thermal Infrared Sensor Instrument (TIRS) was a late addition to the LandSat-8 program to provide infrared imaging to measure evapotranspiration for water cycle management. To meet the launch requirements for LandSat-8, instrument design life requirements were relaxed, the sensor development expedited, and technology development was minimized. Consequently, TIRS was designed as a higher risk instrument, with less redundancy than an instrument critical to mission success. After the successful LandSat-8 launch in 2013 and instrument performance, a rebuild of the instrument for the next LandSat spacecraft was included in the baseline mission success criteria. This paper discusses the technical challenges encountered during the rebuild of the TIRS-2 (Thermal Infrared Sensor 2) instrument and the resultant impacts on the thermal system design.

TIRS-2 Thermal Design↗
NASA NTRS1975

Interactive digital image manipulation system

The system is designed for manipulation, analysis, interpretation, and processing of a wide variety of image data. LANDSAT (ERTS) and other data in digital form can be input directly into the system. Photographic prints and transparencies are first converted to digital form with an on-line high-resolution microdensitometer. The system is implemented on a Hewlett-Packard 3000 computer with 128 K bytes of core memory and a 47.5 megabyte disk. It includes a true color display monitor, with processing memories, graphics overlays, and a movable cursor. Image data formats are flexible so that there is no restriction to a given set of remote sensors. Conversion between data types is available to provide a basis for comparison of the various data. Multispectral data is fully supported, and there is no restriction on the number of dimensions. In this way multispectral data collected at more than one point in time may simply be treated as a data collected with twice (three times, etc.) the number of sensors. There are various libraries of functions available to the user: processing functions, display functions, system functions, and earth resources applications functions.

Henze, J.↗
NASA NTRS1994

Experimental design for the evaluation of high-T(sub c) superconductive thermal bridges in a sensor satellite

Infrared sensor satellites, which consist of cryogenic infrared sensor detectors, electrical instrumentation, and data acquisition systems, are used to monitor the conditions of the earth's upper atmosphere in order to evaluate its present and future changes. Currently, the electrical connections (instrumentation), which act as thermal bridges between the cryogenic infrared sensor and the significantly warmer data acquisition unit of the sensor satellite system, constitute a significant portion of the heat load on the cryogen. As a part of extending the mission life of the sensor satellite system, the researchers at the National Aeronautics and Space Administration's Langley Research Center (NASA-LaRC) are evaluating the effectiveness of replacing the currently used manganin wires with high-temperature superconductive (HTS) materials as the electrical connections (thermal bridges). In conjunction with the study being conducted at NASA-LaRC, the proposed research is to design a space experiment to determine the thermal savings on a cryogenic subsystem when manganin leads are replaced by HTS leads printed onto a substrate with a low thermal conductivity, and to determine the thermal conductivities of HTS materials. The experiment is designed to compare manganin wires with two different types of superconductors on substrates by determining the heat loss by the thermal bridges and providing temperature measurements for the estimation of thermal conductivity. A conductive mathematical model has been developed and used as a key tool in the design process and subsequent analysis.

Scott, Elaine P.↗