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At least 109 records · Page 6

High-Pressure Oxygen Test Evaluations

The relevance of impact sensitivity testing to the development of the space shuttle main engine is discussed in the light of the special requirements for the engine. The background and history of the evolution of liquid and gaseous oxygen testing techniques and philosophy is discussed also. The parameters critical to reliable testing are treated in considerable detail, and test apparatus and procedures are described and discussed. Materials threshold sensitivity determination procedures are considered and a decision logic diagram for sensitivity threshold determination was plotted. Finally, high-pressure materials sensitivity test data are given for selected metallic and nonmetallic materials.

Schwinghamer, R. J.

Thermal shock testing for assuring reliability of glass-sealed microelectronic packages

Tests were performed to determine if thermal shocking is destructive to glass-to-metal seal microelectronic packages and if thermal shock step stressing can compare package reliabilities. Thermal shocking was shown to be not destructive to highly reliable glass seals. Pin-pull tests used to compare the interfacial pin glass strengths showed no differences between thermal shocked and not-thermal shocked headers. A 'critical stress resistance temperature' was not exhibited by the 14 pin Dual In-line Package (DIP) headers evaluated. Headers manufactured in cryogenic nitrogen based and exothermically generated atmospheres showed differences in as-received leak rates, residual oxide depths and pin glass interfacial strengths; these were caused by the different manufacturing methods, in particular, by the chemically etched pins used by one manufacturer. Both header types passed thermal shock tests to temperature differentials of 646 C. The sensitivity of helium leak rate measurements was improved up to 70 percent by baking headers for two hours at 200 C after thermal shocking.

Thomas, Walter B., III

Infant Mortality and Wear-Out Failures in Polymer and MnO2 Tantalum Capacitors

Reliability testing of modern tantalum capacitors shows the presence of both types, infant mortality (IM) and wearout (WO) failures. To assure reliable operation, the probability of IM failures should be reduced to below the specified level, and the time of WO inception should be greater than the required useful life of the parts at operation conditions. In this work, several types of MnO2 and polymer cathode tantalum capacitors have been tested at highly accelerated conditions to assess voltage acceleration factors, determine adequate burn-in conditions, and assess the useful life. A modified time dependent dielectric breakdown (TDDB) model has been suggested to explain both types of failure, and a physical mechanism of degradation that is based on migration and reactions of oxygen vacancies explains increase of the defect related, IM failures with the level of stress.

tantalum capacitors

An Intelligent Strain Gauge with Debond Detection and Temperature Compensation

The harsh rocket propulsion test environment will expose any inadequacies associated with preexisting instrumentation technologies, and the criticality for collecting reliable test data justifies investigating any encountered data anomalies. Novel concepts for improved systems are often conceived during the high scrutiny investigations by individuals with an in-depth knowledge from maintaining critical test operations. The Intelligent Strain Gauge concept was conceived while performing these kinds of activities. However, the novel concepts are often unexplored even if it has the potential for advancing the current state of the art. Maturing these kinds of concepts is often considered to be a tangential development or a research project which are both normally abandoned within the propulsion-oriented environment. It is also difficult to justify these kinds of projects as a facility enhancement because facility developments are only accepted for mature and proven technologies. Fortunately, the CIF program has provided an avenue for bringing the Intelligent Strain Gauge to fruition. Two types of fully functional smart strain gauges capable of performing reliable and sensitive debond detection have been successfully produced. Ordinary gauges are designed to provide test article data and they lack the ability to supply information concerning the gauge itself. A gauge is considered to be a smart gauge when it provides supplementary data relating other relevant attributes for performing diagnostic function or producing enhanced data. The developed strain gauges provide supplementary signals by measuring strain and temperature through embedded Karma and nickel chromium (NiCr) alloy elements. Intelligently interpreting the supplementary data into valuable information can be performed manually, however, integrating this functionality into an automatic system is considered to be an intelligent gauge. This was achieved while maintaining a very low mass. The low mass enables debond detection and temperature compensation to be performed when the gauge is utilized on small test articles. It was also found that the element's mass must be relatively small to avoid overbearing the desired thermal dissipation characteristics. Detecting the degradation of a gauge s bond was reliably achieved by correlating thermal dissipation with the bond s integrity. This was accomplished by precisely coupling a NiCr element with a Karma element for accurately interjecting and quantifying thermal energy. A finite amount of thermal energy is consistently placed in the gauge by electrically powering the NiCr element. The energy will only be temporarily stored before it begins to dissipate into the surrounding structure through the gauge bond. The ability to transmit the energy into the structure becomes greatly inhibited by any discontinuity in the bond s substrate. Therefore, the way the thermal dissipation occurs will reveal even the slightest change in the integrity of the bond.

Jensen, Scott L.

A Systems Engineering Approach to Quality Assurance for Aerospace Testing

On the surface, it appears that AS9100 has little to say about how to apply a Quality Management System (QMS) to major aerospace test programs (or even smaller ones). It also appears that there is little in the quality engineering Body of Knowledge (BOK) that applies to testing, unless it is nondestructive examination (NDE), or some type of lab or bench testing associated with the manufacturing process. However, if one examines: a) how the systems engineering (SE) processes are implemented throughout a test program; and b) how these SE processes can be mapped to the requirements of AS9100, a number of areas for involvement of the quality professional are revealed. What often happens is that quality assurance during a test program is limited to inspections of the test article; what could be considered a manufacturing al fresco approach. This limits the quality professional and is a disservice to the programs and projects, since there are a number of ways that quality can enhance critical processes, and support efforts to improve risk reduction, efficiency and effectiveness. The Systems Engineering (SE) discipline is widely used in aerospace to ensure the progress from Stakeholder Expectations (the President, Congress, the taxpayers) to a successful, delivered product or service. Although this is well known, what is not well known is that these same SE processes are implemented in varying complexity, to prepare for and implement test projects that support research, development, verification and validation, qualification, and acceptance test projects. Although the test organization's terminology may vary from the SE terminology, and from one test service provider to another, the basic process is followed by successful, reliable testing organizations. For this analysis, NASA Procedural Requirements (NPR) 7123.1, NASA Systems Engineering Processes and Requirements is used to illustrate the SE processes that are used for major aerospace testing. Many of these processes are also implemented for smaller test projects, and this set of processes will also look familiar to those who have participated in launch site activation and flight demonstrations.

Shepherd, Christena C.

Rolling-Element Fatigue Testing and Data Analysis - A Tutorial

In order to rank bearing materials, lubricants and other design variables using rolling-element bench type fatigue testing of bearing components and full-scale rolling-element bearing tests, the investigator needs to be cognizant of the variables that affect rolling-element fatigue life and be able to maintain and control them within an acceptable experimental tolerance. Once these variables are controlled, the number of tests and the test conditions must be specified to assure reasonable statistical certainty of the final results. There is a reasonable correlation between the results from elemental test rigs with those results obtained with full-scale bearings. Using the statistical methods of W. Weibull and L. Johnson, the minimum number of tests required can be determined. This paper brings together and discusses the technical aspects of rolling-element fatigue testing and data analysis as well as making recommendations to assure quality and reliable testing of rolling-element specimens and full-scale rolling-element bearings.

Vlcek, Brian L.

Modal Analysis with the Mobile Modal Testing Unit

Recently, National Aeronautics and Space Administration's (NASA's) White Sands Test Facility (WSTF) has tested rocket engines with high pulse frequencies. This has resulted in the use of some of WSTF's existing thrust stands, which were designed for static loading, in tests with large dynamic forces. In order to ensure that the thrust stands can withstand the dynamic loading of high pulse frequency engines while still accurately reporting the test data, their vibrational modes must be characterized. If it is found that they have vibrational modes with frequencies near the pulsing frequency of the test, then they must be modified to withstand the dynamic forces from the pulsing rocket engines. To make this determination the Mobile Modal Testing Unit (MMTU), a system capable of determining the resonant frequencies and mode shapes of a structure, was used on the test stands at WSTF. Once the resonant frequency has been determined for a test stand, it can be compared to the pulse frequency of a test engine to determine whether or not that stand can avoid resonance and reliably test that engine. After analysis of test stand 406 at White Sands Test Facility, it was determined that natural frequencies for the structure are located around 75, 125, and 240 Hz, and thus should be avoided during testing.

Wilder, Andrew J.

Software reliability through fault-avoidance and fault-tolerance

Accomplishments in the following research areas are summarized: structure based testing, reliability growth, and design testability with risk evaluation; reliability growth models and software risk management; and evaluation of consensus voting, consensus recovery block, and acceptance voting. Four papers generated during the reporting period are included as appendices.

Vouk, Mladen A.

Test effectiveness study report: An analytical study of system test effectiveness and reliability growth of three commercial spacecraft programs

Failure data from 16 commercial spacecraft were analyzed to evaluate failure trends, reliability growth, and effectiveness of tests. It was shown that the test programs were highly effective in ensuring a high level of in-orbit reliability. There was only a single catastrophic problem in 44 years of in-orbit operation on 12 spacecraft. The results also indicate that in-orbit failure rates are highly correlated with unit and systems test failure rates. The data suggest that test effectiveness estimates can be used to guide the content of a test program to ensure that in-orbit reliability goals are achieved.

Feldstein, J. F.

Verification Testing: Meet User Needs Figure of Merit

Verification is the process through which Modeling and Simulation(M&S) software goes to ensure that it has been rigorously tested and debugged for its intended use. Validation confirms that said software accurately models and represents the real world system. Credibility gives an assessment of the development and testing effort that the software has gone through as well as how accurate and reliable test results are. Together, these three components form Verification, Validation, and Credibility(VV&C), the process by which all NASA modeling software is to be tested to ensure that it is ready for implementation. NASA created this process following the CAIB (Columbia Accident Investigation Board) report seeking to understand the reasons the Columbia space shuttle failed during reentry. The reports conclusion was that the accident was fully avoidable, however, among other issues, the necessary data to make an informed decision was not there and the result was complete loss of the shuttle and crew. In an effort to mitigate this problem, NASA put out their Standard for Models and Simulations, currently in version NASA-STD-7009A, in which they detailed their recommendations, requirements and rationale for the different components of VV&C. They did this with the intention that it would allow for people receiving MS software to clearly understand and have data from the past development effort. This in turn would allow the people who had not worked with the MS software before to move forward with greater confidence and efficiency in their work. This particular project looks to perform Verification on several MATLAB (Registered Trademark)(The MathWorks, Inc.) scripts that will be later implemented in a website interface. It seeks to take note and define the limits of operation, the units and significance, and the expected datatype and format of the inputs and outputs of each of the scripts. This is intended to prevent the code from attempting to make incorrect or impossible calculations. Additionally, this project will look at the coding generally and note inconsistencies, redundancies, and other aspects that may become problematic or slow down the codes run time. Certain scripts lacking in documentation also will be commented and cataloged.

validation

Operationally efficient propulsion system study (OEPSS) data book: Preliminary Development Plan for an Integrated Booster Propulsion Module (BPM) - Volume 9

A preliminary development plan for an integrated propulsion module (IPM) is described. The IPM, similar to the Space Transportation Main engine (STME) engine, is applicable to the Advanced Launch System (ALS) baseline vehicle. The same STME development program ground rules and time schedule were assumed for the IPM. However, the unique advantages of testing an integrated engine element, in terms of reduced number of hardware and number of system and reliability tests, compared to single standalone engine and MPTA, are highlighted. The potential ability of the IPM to meet the ALS program goals for robustness, operability and reliability is emphasized.

DiBlasi, Angelo G.

Empirically based analysis of failures in software systems

An empirical analysis of software-system failures is used to study several specific issues in software testing, reliability analysis, and reuse. Failure data from a large software manufacturer and a NASA production environment were collected and analyzed. The systems ranged in size from 30,000 to over 100,000 lines. The results show that (1) the first 15 percent of the test cases detected 67 percent of the high-severity failures and 50 percent of all failures; (2) multiple fault-detection and testing phases may result in a significant increase in reliability or none at all; (3) composite measures of system reliability did not adequately reflect reliability at the function or component level; (4) developers were biased toward portions of systems that would be heavily tested; (5) fault-proneness of reused or modified components was 74 percent less than that of newly developed components; and (6) systems with more reused software had lower component development effort, but not lower component fault-proneness.

Selby, Richard W.

Robust Platinum Resistor Thermometer (PRT) Sensors and Reliable Bonding for Space Missions

Platinum resistance thermometers (PRTs) provide accurate temperature measurements over a wide temperature range and are used extensively on space missions due to their simplicity and linearity. A standard on spacecraft, PRTs are used to provide precision temperature control and vehicle health assessment. This paper reviews the extensive reliability testing of platinum resistor thermometer sensors (PRTs) and bonding methods used on the Mars Science Laboratory (MSL) mission and for the upcoming Soil Moisture Active Passive (SMAP) mission. During the Mars Exploration Rover (MER) mission, several key, JPL-packaged PRTs failed on those rovers prior to and within 1-Sol of landing due to thermally induced stresses. Similar failures can be traced back to other JPL missions dating back thirty years. As a result, MSL sought out a PRT more forgiving to the packaging configurations used at JPL, and extensively tested the Honeywell HRTS-5760-B-U-0-12 sensor to successfully demonstrate suitable robustness to thermal cycling. Specifically, this PRT was cycled 2,000 times, simulating three Martian winters and summers. The PRTs were bonded to six substrate materials (Aluminum 7050, treated Magnesium AZ231-B, Stainless Steel 304, Albemet, Titanium 6AL4V, and G-10), using four different aerospace adhesives--two epoxies and two silicones--that conformed to MSL's low out-gassing requirements. An additional epoxy was tested in a shorter environmental cycling test, when the need for a different temperature range adhesive was necessary for mobility and actuator hardware late in the fabrication process. All of this testing, along with electrostatic discharge (ESD) and destructive part analyses, demonstrate that this PRT is highly robust, and not subject to the failure of PRTs on previous missions. While there were two PRTs that failed during fabrication, to date there have been no in-flight PRT failures on MSL, including those on the Curiosity rover. Since MSL, the sensor has gone through a change in construction such that the manufacturer significantly restricts the minimum temperature. However, significant subsequent testing was performed with this new version of the part to show that it indeed is still robust to at least Mars minimum temperatures of -135(sup o)C. The additional completed testing will be described. This work has resulted in a successful sensor package qualification and a reliable bonding method suitable for use over large temperature extremes.

dectector

Robust Platinum Resistor Thermometer (PRT) Sensors and Reliable Bonding for Space Missions

Platinum resistance thermometers (PRTs) provide accurate temperature measurements over a wide temperature range and are used extensively on space missions due to their simplicity and linearity. A standard on spacecraft, PRTs are used to provide precision temperature control and vehicle health assessment. This paper reviews the extensive reliability testing of platinum resistor thermometer sensors (PRTs) and bonding methods used on the Mars Science Laboratory (MSL) mission and for the upcoming Soil Moisture Active Passive (SMAP) mission. During the Mars Exploration Rover (MER) mission, several key, JPL-packaged PRTs failed on those rovers prior to and within 1-Sol of landing due to thermally induced stresses. Similar failures can be traced back to other JPL missions dating back thirty years. As a result, MSL sought out a PRT more forgiving to the packaging configurations used at JPL, and extensively tested the Honeywell HRTS-5760-B-U-0-12 sensor to successfully demonstrate suitable robustness to thermal cycling. Specifically, this PRT was cycled 2,000 times, simulating three Martian winters and summers. The PRTs were bonded to six substrate materials (Aluminum 7050, treated Magnesium AZ231-B, Stainless Steel 304, Albemet, Titanium 6AL4V, and G-10), using four different aerospace adhesives--two epoxies and two silicones--that conformed to MSL's low out-gassing requirements. An additional epoxy was tested in a shorter environmental cycling test, when the need for a different temperature range adhesive was necessary for mobility and actuator hardware late in the fabrication process. All of this testing, along with electrostatic discharge (ESD) and destructive part analyses, demonstrate that this PRT is highly robust, and not subject to the failure of PRTs on previous missions. While there were two PRTs that failed during fabrication, to date there have been no in-flight PRT failures on MSL, including those on the Curiosity rover. Since MSL, the sensor has gone through a change in construction such that the manufacturer significantly restricts the minimum temperature. However, significant subsequent testing was performed with this new version of the part to show that it indeed is still robust to at least Mars minimum temperatures of -135 degrees Centigrade. The additional completed testing will be described. This work has resulted in a successful sensor package qualification and a reliable bonding method suitable for use over large temperature extremes

Platinum Resistor Thermometer (PRT)

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza

Reliability of CGA/LGA/HDI Package Board/Assembly

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of −55°C to maximum temperatures of either 100°C or 125°C with slow ramp-up rate (3°C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects’ use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza