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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗
NASA NTRS2023

Thermal Management System Modeling in the Heat Transport System Simulation (HeaTSSPy) Package

This paper describes the development of a thermal management system (TMS) concept design and analysis software package called Heat Transport System Simulation (HeaTSSPy). Built within Python using the OpenMDAO framework, HeaTSSPy can be used to size and optimize an active (using liquid/air heat exchangers) or passive (using finned heat sinks) TMS. The package makes use of modular TMS elements that allow for the creation of different system architectures and includes components such as heat sinks, heat exchangers, liquid pumps, fans, ducts, air inlets, air nozzles, and liquid pipes. Modeling methods for these components include a combination of physics-based analytical and empirical equations that relate component sizing criteria to system performance. The HeatSSPy heat sink methods are fully detailed within this paper, while the heat exchanger methods are described and referenced from previous work. This paper also uses high-fidelity simulation to validate two different methods of calculating thermal resistance using CFD results. Once the methods are fully described, the code is exercised to compare an active TMS with that of a passive TMS. Design criteria for this study include rejected heat, system altitude, Mach number, and ambient temperature. These criteria are used to develop a TMS system with estimated performance metrics such as weight, drag, and operational power. Results of this paper show the crossover point when a passive system begins to weigh more than an active system for a given heat rejection.

Thermal management system↗
NASA NTRS1984

Performance of the GPS package on Landsat-5

The Landsat-5 spacecraft, launched in March 1984, carries an experimental Global Positioning System Package (GPSPAC) as did Landsat-4 in 1982. The primary objective of this experiment was to characterize and improve the performance of GPSPAC as an onboard navigation tool. In order to validate the accuracy of GPSPAC orbit solutions, definitive Landsat-5 ephemerides, derived from ground based tracking data, were generated and compared with GPSPAC estimates. This paper presents the results of such analysis as well as a summary of GPSPAC operation on Landsat-5. A description of the Landsat-5 spacecraft, GPSPAC and its navigation algorithms are also included.

Heuberger, H.↗
NASA NTRS1972

Isotope Brayton electric power system for the 500 to 2500 watt range.

An extensive study was conducted at the Lewis Research Center to evaluate an isotope Brayton electric power system for use in the 500 to 2500 W power range. The study emphasized overall system simplicity in order to reduce parasitic power losses and improve system reliability. The study included detailed parametric cycle analysis, conceptual component designs, and evaluation of system packaging. The study has resulted in the selection of a single-loop system (gas) with six major components including one rotating unit. Calculated net system efficiency varies from 23 to 28% over the power range. The use of the Pu-238 heat source being developed for the Multi-Hundred-Watt Radioisotope Thermoelectric Generator program was assumed.

Macosko, R. P.↗
NASA NTRS1992

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

Shalkhauser, K. A.↗
NASA NTRS2010

Constant-Differential-Pressure Two-Fluid Accumulator

A two-fluid accumulator has been designed, built, and demonstrated to provide an acceptably close approximation to constant differential static pressure between two fluids over the full ranges of (1) accumulator stroke, (2) rates of flow of the fluids, and (3) common static pressure applied to the fluids. Prior differential- pressure two-fluid accumulators are generally not capable of maintaining acceptably close approximations to constant differential pressures. The inadequacies of a typical prior differential-pressure two-fluid accumulator can be summarized as follows: The static differential pressure is governed by the intrinsic spring rate (essentially, the stiffness) of an accumulator tank. The spring rate can be tailored through selection of the tank-wall thickness, selection of the number and/or shape of accumulator convolutions, and/or selection of accumulator material(s). Reliance on the intrinsic spring rate of the tank results in three severe limitations: (1) The spring rate and the expulsion efficiency tend to be inversely proportional to each other: that is to say, as the stiffness (and thus the differential pressure) is increased, the range of motion of the accumulator is reduced. (2) As the applied common static pressure increases, the differential pressure tends to decrease. An additional disadvantage, which may or may not be considered limiting, depending on the specific application, is that an increase in stiffness entails an increase in weight. (3) The additional weight required by a low expulsion efficiency accumulator eliminates the advantage given to such gas storage systems. The high expulsion efficiency provided by this two-fluid accumulator allows for a lightweight, tightly packaged system, which can be used in conjunction with a fuel cell-based system.

Piecuch, Benjamin↗
NASA NTRS1991

Supervised autonomous rendezvous and docking system technology evaluation

Technology for manned space flight is mature and has an extensive history of the use of man-in-the-loop rendezvous and docking, but there is no history of automated rendezvous and docking. Sensors exist that can operate in the space environment. The Shuttle radar can be used for ranges down to 30 meters, Japan and France are developing laser rangers, and considerable work is going on in the U.S. However, there is a need to validate a flight qualified sensor for the range of 30 meters to contact. The number of targets and illumination patterns should be minimized to reduce operation constraints with one or more sensors integrated into a robust system for autonomous operation. To achieve system redundancy, it is worthwhile to follow a parallel development of qualifying and extending the range of the 0-12 meter MSFC sensor and to simultaneously qualify the 0-30(+) meter JPL laser ranging system as an additional sensor with overlapping capabilities. Such an approach offers a redundant sensor suite for autonomous rendezvous and docking. The development should include the optimization of integrated sensory systems, packaging, mission envelopes, and computer image processing to mimic brain perception and real-time response. The benefits of the Global Positioning System in providing real-time positioning data of high accuracy must be incorporated into the design. The use of GPS-derived attitude data should be investigated further and validated.

Marzwell, Neville I.↗
NASA NTRS1971

Study of a heat rejection system using capillary pumping

Results of an analytical study investigating the application of capillary pumping to the heat rejection loop of an advanced Rankine cycle power conversion system are presented. The feasibility of the concept of capillary pumping as an alternate to electromagnetic pumping is analytically demonstrated. Capillary pumping is shown to provide a potential for weight and electrical power saving and reliability through the use of redundant systems. A screen wick pump design with arterial feed lines was analytically developed. Advantages of this design are high thermodynamic and hydrodynamic efficiency, which provide a lightweight easily packaged system. Operational problems were identified which must be solved for successful application of capillary pumping. The most important are the development of start up and shutdown procedures, and development of a means of keeping noncondensibles from the system and of earth-bound testing procedures.

Neal, L. G.↗
NASA NTRS2020

Novel High Barrier Films for Packaging Food and Medicine

Long manned missions require food packaging to maintain food safety, nutrition, and acceptability for the length of 3-5 years1,2 while the shelf life assigned by NASA for current provisions is 18-24 months1. The focus of this design project was to make a polymer film specifically to function as a high oxygen barrier to later be included in an improved multi-layer packaging system of other specialized polymers with capabilities to allow for a 5-year shelf-life. To qualify as a high oxygen barrier film and to be a successful design for the future packaging, the resulting film is required to have an oxygen transmission rate (OTR) less than 0.06 cc/ m2/24 hr/atm, the standard for the current packaging3. This new film was designed to have a decreased permeability by increasing the “tortuous path” a gas molecule travels to permeate through a film. The increase in the “tortuous path” of a gas molecule is accomplished by introducing a 2D material additive. The additive chosen for this project was hexagonal boron nitride (h-BN) which exfoliates into boron nitride nanosheets (BNNs). Nylon 6 was chosen as the candidate for the matrix. This project is required to determine the best methods to synthesize the sample film and then to test the OTR of the film to determine if this design was successful. This project examined methods for pulverizing polymer resin pellets, h-BN exfoliation, and film fabrication using a hot press. This report includes the exfoliation and analysis of h-BN, procedural preparations for films, and a modeling study of estimated OTR of the h-BN/Nylon. The work in this report did not yield a high barrier composite film because of the laboratory closure in response to COVID -19 guidance but provides a concise method of the additive preparation and film synthesis. This gives a good starting point for future research in high barrier films by 2D additive composites.

Polymer, Nylon, PET, boron nitride, nanocomposite↗
NASA NTRS2020

Lower Level Repair Can Easily Fail Due to High Complexity

The International Space Station (ISS) uses Orbital Replacement Units (ORU’s) to repair failures on orbit. Using ORU’s reduces the crew time required to repair failures, but several copies of each ORU must be stored on ISS to ensure system availability. A typical ORU contains many components and has significant mass, but each ORU can repair only a single component failure. A full set of the ORU internal components could repair many different failures. Lower level assembly or component repair should reduce total spares mass. Successful electronics repair experiments were conducted on ISS. However, implementing component level repair would require a significant effort. The systems must be designed so they can be repaired during a mission, considering component layout and accessibility. The repair procedures must be developed and repair facilities, tools, and diagnostic and test instruments provided. Tracing a fault to a component is much more difficult than isolating it to an ORU. Replacing a component is much more difficult than replacing an ORU. Some problems with lower level repair are discussed. The mass savings of lower level repair will not save as much launch cost as before since launch cost has recently been reduced by an order of magnitude. Most system failures are not component failures that can be fixed by replacing a component but are due to system level problems. Repair and maintenance should be planned as part of an overall maintainability design. The risk that a lower level repair will fail is considerably greater than when using ORUs. With modern high reliability packaged systems, failure diagnosis and repair has become a lost art. However, diagnosis and repair data from the 1960’s show that increasing complexity often causes much longer diagnosis and repair times and may prevent successful repair. Increasing complexity by using lower level repair directly increases system cost, failure rate, crew time for repair, and the risk of an unrepairable system failure.

Harry W Jones↗
NASA NTRS1983

Split-Stirling, linear-resonant, cryogenic refrigerators for detector cooling

For the past decade, military IR systems have preferred to see cryogenic coolers provided as split units; separating the functions of compressor and cold-end for system packaging and vibration isolation reasons. A family of split-cycle coolers designed for long MTBF and in the final stages of development is the focus of the discussion. Their technological evolution, from multi-year-MTBF satellite system Stirling coolers developed in the U.S., and the UA 7011 cooler (the first all-linear, military, production cooler) developed in Holland, is explained. Two new split-cycle machines are discussed. They provided 1/4 watt and 1 watt (nominal capacity) at 80 K and 85 K respectively. These linear-resonant, free-displacer Stirling coolers are designed for thousands of hours of service-free operation. They are designed to be compatible with standard U.S. 60 element and 120/180 element detector/dewars, respectively.

Lehrfeld, D.↗
NASA NTRS2006

Thin Film Physical Sensor Instrumentation Research and Development at NASA Glenn Research Center

A range of thin film sensor technology has been demonstrated enabling measurement of multiple parameters either individually or in sensor arrays including temperature, strain, heat flux, and flow. Multiple techniques exist for refractory thin film fabrication, fabrication and integration on complex surfaces and multilayered thin film insulation. Leveraging expertise in thin films and high temperature materials, investigations for the applications of thin film ceramic sensors has begun. The current challenges of instrumentation technology are to further develop systems packaging and component testing of specialized sensors, further develop instrumentation techniques on complex surfaces, improve sensor durability, and to address needs for extreme temperature applications. The technology research and development ongoing at NASA Glenn for applications to future launch vehicles, space vehicles, and ground systems is outlined.

Wrbanek, John D.↗
NASA NTRS2012

Dielectric Performance of High Purity HTCC Alumina at High Temperatures - A Comparison Study with Other Polycrystalline Alumina

A very high purity (99.99+) high temperature co-fired ceramic (HTCC) alumina has recently become commercially available. The raw material of this HTCC alumina is very different from conventional HTCC alumina, and more importantly there is no glass additive in this co-fired material. Previously, selected HTCC and LTCC (low temperature co-fired ceramic) alumina materials were evaluated at high temperatures as dielectric and compared to a regularly sintered 96 polycrystalline alumina (96 Al2O3), where 96 alumina was used as the benchmark. A prototype packaging system based on regular 96 alumina with Au thick-film metallization successfully facilitated long term testing of high temperature silicon carbide (SiC) electronic devices for over 10,000 hours at 500C. In order to evaluate this new HTCC alumina for possible high temperature packaging applications, the dielectric properties of this HTCC alumina substrate were measured and compared with those of 96 alumina and a LTCC alumina from room temperature to 550C at frequencies of 120 Hz, 1 KHz, 10 KHz, 100 KHz, and 1 MHz. A parallel-plate capacitive device with dielectric of the HTCC alumina and precious metal electrodes were used for measurements of the dielectric constant and dielectric loss of the co-fired alumina material in the temperature and frequency ranges. The capacitance and AC parallel conductance of the capacitive device were directly measured by an AC impedance meter, and the dielectric constant and parallel AC conductivity of the dielectric were calculated from the capacitance and conductance measurement results. The temperature and frequency dependent dielectric constant, AC conductivity, and dissipation factor of the HTCC alumina substrate are presented and compared to those of 96 alumina. Other technical advantages of this new co-fired material for possible high packaging applications are also discussed.

High temperature↗
NASA NTRS2014

Dielectric Performance of a High Purity HTCC Alumina at High Temperatures - a Comparison Study with Other Polycrystalline Alumina

A very high purity (99.99+%) high temperature co-fired ceramic (HTCC) alumina has recently become commercially available. The raw material of this HTCC alumina is very different from conventional HTCC alumina, and more importantly there is no glass additive in this alumina material for co-firing processing. Previously, selected HTCC and LTCC (low temperature co-fired ceramic) alumina materials were evaluated at high temperatures as dielectric and compared to a regularly sintered 96% polycrystalline alumina (96% Al2O3), where 96% alumina was used as the benchmark. A prototype packaging system based on regular 96% alumina with Au thickfilm metallization successfully facilitated long term testing of high temperature silicon carbide (SiC) electronic devices for over 10,000 hours at 500 C. In order to evaluate this new high purity HTCC alumina for possible high temperature packaging applications, the dielectric properties of this HTCC alumina substrate were measured and compared with those of 96% alumina and a previously tested LTCC alumina from room temperature to 550 C at frequencies of 120 Hz, 1 KHz, 10 KHz, 100 KHz, and 1 MHz. A parallel-plate capacitive device with dielectric of the HTCC alumina and precious metal electrodes were used for measurements of the dielectric constant and dielectric loss of the co-fired alumina material in the temperature and frequency ranges. The capacitance and AC parallel conductance of the capacitive device were directly measured by an AC impedance meter, and the dielectric constant and parallel AC conductivity of the dielectric were calculated from the capacitance and conductance measurement results. The temperature and frequency dependent dielectric constant, AC conductivity, and dissipation factor of the HTCC alumina substrate are presented and compared to those of 96% alumina and a selected LTCC alumina. Other technical advantages of this new co-fired material for possible high packaging applications are also discussed.

Electronic packaging↗
NASA NTRS1994

Data assimilation and model evaluation experiment datasets

The Institute for Naval Oceanography, in cooperation with Naval Research Laboratories and universities, executed the Data Assimilation and Model Evaluation Experiment (DAMEE) for the Gulf Stream region during fiscal years 1991-1993. Enormous effort has gone into the preparation of several high-quality and consistent datasets for model initialization and verification. This paper describes the preparation process, the temporal and spatial scopes, the contents, the structure, etc., of these datasets. The goal of DAMEE and the need of data for the four phases of experiment are briefly stated. The preparation of DAMEE datasets consisted of a series of processes: (1) collection of observational data; (2) analysis and interpretation; (3) interpolation using the Optimum Thermal Interpolation System package; (4) quality control and re-analysis; and (5) data archiving and software documentation. The data products from these processes included a time series of 3D fields of temperature and salinity, 2D fields of surface dynamic height and mixed-layer depth, analysis of the Gulf Stream and rings system, and bathythermograph profiles. To date, these are the most detailed and high-quality data for mesoscale ocean modeling, data assimilation, and forecasting research. Feedback from ocean modeling groups who tested this data was incorporated into its refinement. Suggestions for DAMEE data usages include (1) ocean modeling and data assimilation studies, (2) diagnosis and theoretical studies, and (3) comparisons with locally detailed observations.

Lai, Chung-Cheng A.↗