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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1987

Solar dynamic heat rejection technology. Task 1: System concept development

The results are presented of a concept development study of heat rejection systems for Space Station solar dynamic power systems. The heat rejection concepts are based on recent developments in high thermal transport capacity heat pipe radiators. The thermal performance and weights of each of the heat rejection subsystems is addressed in detail, and critical technologies which require development tests and evaluation for successful demonstration are assessed and identified. Baseline and several alternate heat rejection system configurations and optimum designs are developed for both Brayton and Rankine cycles. The thermal performance, mass properties, assembly requirements, reliability, maintenance requirements and life cycle cost are determined for each configuration. A specific design was then selected for each configuration which represents an optimum design for that configuration. The final recommendations of heat rejection system configuration for either the Brayton or Rankine cycles depend on the priorities established for the evaluation criteria.

Gustafson, Eric↗
NASA NTRS1996

Lower-Thermal-Conductivity Tapes For Tape Automated Bonding

Foils of manganin substituted for copper foils ordinarily serving as electrical conductors on tapes used in tape automated bonding (TAB) in electronic circuits. Modification makes possible to apply TAB technology to circuits in which substantial gradients of temperature exist under design operating conditions. Other advantages include high reliability, automated assembly, and automated testing.

Young, Erick T.↗
NASA NTRS2000

Challenges of Packaging Photonic Devices

Presently used photonic packaging methods are labor intensive and often unreliable. Studies have shown laser welding to be the superior fastening technology but it must be used in combination with a compatible positioning technology. The right combination of positioning technology and fastening technology which will result in low cost, reliable photonic assemblies is yet to be developed.

Lutes, George↗
NASA NTRS2011

Rad-Hard, Miniaturized, Scalable, High-Voltage Switching Module for Power Applications Rad-Hard, Miniaturized

A paper discusses the successful development of a miniaturized radiation hardened high-voltage switching module operating at 2.5 kV suitable for space application. The high-voltage architecture was designed, fabricated, and tested using a commercial process that uses a unique combination of 0.25 micrometer CMOS (complementary metal oxide semiconductor) transistors and high-voltage lateral DMOS (diffusion metal oxide semiconductor) device with high breakdown voltage (greater than 650 V). The high-voltage requirements are achieved by stacking a number of DMOS devices within one module, while two modules can be placed in series to achieve higher voltages. Besides the high-voltage requirements, a second generation prototype is currently being developed to provide improved switching capabilities (rise time and fall time for full range of target voltages and currents), the ability to scale the output voltage to a desired value with good accuracy (few percent) up to 10 kV, to cover a wide range of high-voltage applications. In addition, to ensure miniaturization, long life, and high reliability, the assemblies will require intensive high-voltage electrostatic modeling (optimized E-field distribution throughout the module) to complete the proposed packaging approach and test the applicability of using advanced materials in a space-like environment (temperature and pressure) to help prevent potential arcing and corona due to high field regions. Finally, a single-event effect evaluation would have to be performed and single-event mitigation methods implemented at the design and system level or developed to ensure complete radiation hardness of the module.

Adell, Philippe C.↗
DOE OSTI2022

Augmented DNA Nanoarchitectures: A Structural Library of 3D Self-Assembling Tensegrity Triangle Variants

The DNA tensegrity triangle is known to reliably self-assemble into a 3D rhombohedral crystalline lattice via sticky-end cohesion. Here, in this study, the library of accessible motifs is expanded through covalent extensions of intertriangle regions and sticky-end-coordinated linkages of adjacent triangles with double helical segments using both geometrically symmetric and asymmetric configurations. The molecular structures of 18 self-assembled architectures at resolutions of 3.32–9.32 Å are reported; the observed cell dimensions, cavity sizes, and cross-sectional areas agree with theoretical expectations. These data demonstrate that fine control over triclinic and rhombohedral crystal parameters and the customizability of more complex 3D DNA lattices are attainable via rational design. It is anticipated that augmented DNA architectures may be fine-tuned for the self-assembly of designer nanocages, guest–host complexes, and proscriptive 3D nanomaterials, as originally envisioned. Finally, designer asymmetric crystalline building blocks can be seen as a first step toward controlling and encoding information in three dimensions.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS1986

Reliability models applicable to space telescope solar array assembly system

A complex system may consist of a number of subsystems with several components in series, parallel, or combination of both series and parallel. In order to predict how well the system will perform, it is necessary to know the reliabilities of the subsystems and the reliability of the whole system. The objective of the present study is to develop mathematical models of the reliability which are applicable to complex systems. The models are determined by assuming k failures out of n components in a subsystem. By taking k = 1 and k = n, these models reduce to parallel and series models; hence, the models can be specialized to parallel, series combination systems. The models are developed by assuming the failure rates of the components as functions of time and as such, can be applied to processes with or without aging effects. The reliability models are further specialized to Space Telescope Solar Arrray (STSA) System. The STSA consists of 20 identical solar panel assemblies (SPA's). The reliabilities of the SPA's are determined by the reliabilities of solar cell strings, interconnects, and diodes. The estimates of the reliability of the system for one to five years are calculated by using the reliability estimates of solar cells and interconnects given n ESA documents. Aging effects in relation to breaks in interconnects are discussed.

Patil, S. A.↗
DOE OSTI2015

FAITH – Fast Assembly Inhibitor Test for HIV

Due to the high number of drug-resistant HIV-1 mutants generated by highly active antiretroviral therapy (HAART), there is continuing demand for new types of inhibitors. Both the assembly of the Gag polyprotein into immature and mature HIV-1 particles are attractive candidates for the blocking of the retroviral life cycle. Currently, no therapeutically-used assembly inhibitor is available. One possible explanation is the lack of a reliable and simple assembly inhibitor screening method. To identify compounds potentially inhibiting the formation of both types of HIV-1 particles, we developed a new fluorescent high-throughput screening assay. This assay is based on the quantification of the assembly efficiency in vitro in a 96-well plate format. The key components of the assay are HIV-1 Gag-derived proteins and a dual-labelled oligonucleotide, which emits fluorescence only when the assembly of retroviral particles is inhibited. The method was validated using three (CAI, BM2, PF74) reported assembly inhibitors. - Highlights: • Allows screening of assembly inhibitors of both mature and immature HIV-1 particles. • Based on Gag-derived proteins with CA in mature or immature conformation. • Simple and sensitive method suitable for high-throughput screening of inhibitors. • Unlike in other HIV assembly methods, works under physiological conditions. • No washing steps are necessary.

60 APPLIED LIFE SCIENCES↗
NASA NTRS1993

A dual output pressure, high reliability, long storage life gas delivery vessel assembly

A Gas Vessel Assembly has been developed that delivers purified, very low moisture content gas at two different output pressures. High pressure gas is delivered at up to 6,700 psi, and low pressure gas regulated to 130 psi is also delivered via a second outlet over a wide range of flow rates. The device is extremely lightweight (less than 1 lb) and compact, affords maximum mechanical integrity, high reliability (0.9999 at 95 percent confidence level), and offers extremely long storage life. Specialized design and fabrication techniques are employed that guarantee gas purity and negligible leakage for more than 20 years, in widely varying conditions of storage temperature, humidity, altitude, and vibration environments. The technology offers unique advantages in fast, high pressure discharge applications. For example, when combined with a cryostat, cryogenic temperatures can be achieved such as those used in missile seeker technology. The technology has many additional applications such as: emergency power sources for safety devices such as those needed in nuclear power plants, refineries, collision cushioning devices, superconductor cooling devices, emergency egress systems, miniature mechanical devices that employ gas bearings, and other areas where long storage, extremely high reliability and/or high energy density sources are required.

Maya, Isaac↗
NASA NTRS2014

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗
NASA NTRS2009

Evaluation methodology guidance for stack packages

This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight.

Gerke, David↗
NASA NTRS2008

Probabilistic Analysis of Space Shuttle Body Flap Actuator Ball Bearings

A probabilistic analysis, using the 2-parameter Weibull-Johnson method, was performed on experimental life test data from space shuttle actuator bearings. Experiments were performed on a test rig under simulated conditions to determine the life and failure mechanism of the grease lubricated bearings that support the input shaft of the space shuttle body flap actuators. The failure mechanism was wear that can cause loss of bearing preload. These tests established life and reliability data for both shuttle flight and ground operation. Test data were used to estimate the failure rate and reliability as a function of the number of shuttle missions flown. The Weibull analysis of the test data for the four actuators on one shuttle, each with a 2-bearing shaft assembly, established a reliability level of 96.9 percent for a life of 12 missions. A probabilistic system analysis for four shuttles, each of which has four actuators, predicts a single bearing failure in one actuator of one shuttle after 22 missions (a total of 88 missions for a 4-shuttle fleet). This prediction is comparable with actual shuttle flight history in which a single actuator bearing was found to have failed by wear at 20 missions.

Oswald, Fred B.↗
NASA NTRS1973

Fabrication of capsule assemblies, phase 3

Thirteen capsule assemblies were fabricated for evaluation of fuel pin design concepts for a fast spectrum lithium cooled compact space power reactor. These instrumented assemblies were designed for real time test of prototype fuel pins. Uranium mononitride fuel pins were encased in AISI 304L stainless steel capsules. Fabrication procedures were fully qualified by process development and assembly qualification tests. Instrumentation reliability was achieved utilizing specially processed and closely controlled thermocouple hot zone fabrication and by thermal screening tests. Overall capsule reliability was achieved with an all electron beam welded assembly.

Keeton, A. R.↗
NASA NTRS2002

Characterization of the Twelve Channel 100/140 Micron Optical Fiber, Ribbon Cable and MTP Array Connector Assembly for Space Flight Environments

Presented here is the second set of testing conducted by the Technology Validation Laboratory for Photonics at NASA Goddard Space Flight Center on the 12 optical fiber ribbon cable with MTP array connector for space flight environments. In the first set of testing the commercial 62.5/125 cable assembly was characterized using space flight parameters. The testing showed that the cable assembly would survive a typical space flight mission with the exception of a vacuum environment. Two enhancements were conducted to the existing technology to better suit the vacuum environment as well as the existing optoelectronics and increase the reliability of the assembly during vibration. The MTP assembly characterized here has a 100/140 optical commercial fiber and non outgassing connector and cable components. The characterization for this enhanced fiber optic cable assembly involved vibration, thermal and radiation testing. The data and results of this characterization study are presented which include optical in-situ testing.

Ott, Melanie N.↗
NASA NTRS1993

Automated assembly of large space structures using an expert system executive

NASA LaRC has developed a unique testbed for investigating the practical problems associated with the assembly of large space structures using robotic manipulators. The testbed is an interdisciplinary effort which considers the full spectrum of assembly problems from the design of mechanisms to the development of software. This paper will describe the automated structures assembly testbed and its operation, detail the expert system executive and its development, and discuss the planned system evolution. Emphasis will be placed on the expert system development of the program executive. The executive program must be capable of directing and reliably performing complex assembly tasks with the flexibility to recover from realistic system errors. By employing an expert system, information pertaining to the operation of the system was encapsulated concisely within a knowledge base. This lead to a substantial reduction in code, increased flexibility, eased software upgrades, and realized a savings in software maintenance costs.

Allen, Cheryl L.↗
NASA NTRS1993

An expert system executive for automated assembly of large space truss structures

Langley Research Center developed a unique test bed for investigating the practical problems associated with the assembly of large space truss structures using robotic manipulators. The test bed is the result of an interdisciplinary effort that encompasses the full spectrum of assembly problems - from the design of mechanisms to the development of software. The automated structures assembly test bed and its operation are described, the expert system executive and its development are detailed, and the planned system evolution is discussed. Emphasis is on the expert system implementation of the program executive. The executive program must direct and reliably perform complex assembly tasks with the flexibility to recover from realistic system errors. The employment of an expert system permits information that pertains to the operation of the system to be encapsulated concisely within a knowledge base. This consolidation substantially reduced code, increased flexibility, eased software upgrades, and realized a savings in software maintenance costs.

Allen, Cheryl L.↗
DOE OSTI2019

Hierarchical Assembly of Plasmonic Nanoparticle Heterodimer Arrays with Tunable Sub-5 nm Nanogaps

Nanoparticle assemblies have generated intense interest because of their novel optical, electronic, and magnetic properties that open up numerous opportunities in fundamental and applied nanophotonics, -electronics, and -magnetics. However, despite the great scientific and technological potential of these structures, it remains an outstanding challenge to reliably fabricate such assemblies with both nanometer-level structural control and precise spatial arrangements on a macroscopic scale. It is the combination of these two features that is key to realizing nanoparticle assemblies potential, particular for device applications. To address this challenge, we propose a hierarchical assembly approach consisting of both template-particle and particle-particle interactions, whereby the former ensures precise addressability of assemblies on a surface and the latter provides nanometer-level structural control. Template-particle interactions are harnessed via chemical-pattern-directed assembly, and the particle-particle interactions are controlled using DNA-directed self-assembly. To demonstrate the potential of this hierarchical assembly approach, we demonstrate the fabrication of a particularly fascinating assembly: the nanoparticle heterodimer, which possesses a surprisingly rich set of plasmonic properties and is a promising candidate to enable a variety of imaging and sensing applications. Each heterodimer is placed on the surface at predetermined locations, and the precise control of the nanogaps is confirmed by far-field scattering measurements of individual dimers. We further demonstrate that the gap size can be effectively tuned by varying the DNA length. By correlating measured spectra with finite-difference time-domain (FDTD) simulations, we determine the gap sizes to be 4.2 and 5.0 nm-with subnm deviation-for the two DNA lengths investigated. This is one of the best gap uniformities ever demonstrated for surface-bound nanoparticle assemblies. The estimated surface-enhanced Raman scattering (SERS) enhancement factor of these heterodimers is on the order of 10 5 -10 6 with high reproducibility and predictable polarization-dependence. This hierarchical fabrication technique-employing both template-particle and particle-particle interactions-constitutes a novel platform for the realization of functional nanoparticle assemblies on surfaces and thereby creates new opportunities to implement these structures in a variety of applications.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
NASA NTRS2008

Reliability of PWB Microvias for High Density Package Assembly

High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including Space Shuttle and Mars Rovers. NASA functional system designs are requiring more and more dense AAP packages and board space, which makes board microvia technology very attractive for effectively routing a large number of package inputs/outputs. However, the reliability of the fine feature microvias including via in pads is unknown for space applications. Understanding process and QA (quality assurance) indicators for reliability are important for low risk insertion of these newly available packages and PWBs. This paper presents literature search as well as test results for a high density board subjected to various thermal cycle and reflow profiles representative of tin-lead and lead-free solder reflow. Microvias sizes ranged from two to six mil with and without filling. Daisy chain microvias monitored during the test and PWBs were cross-sectioned to determine failure and locations. Optical and SEM photographs as well as resistance changes during cycling and Tg/Td (glass transition/decomposition temperature) characterisations are presented.

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