Thermal study of interface between the Orbiter cold plate and typical Shuttle spacecraft payload flight electronics
Spacelab provides a set of Freon line plumbing and cold plates for experiment equipments which are located in the Shuttle pallet and which need active thermal control. The reported study deals with the thermal problem of attaching a Command and Data Handling module with various electronic boxes whose combined footprints on the baseplate are much larger than the cold plate. A description of two modules and the cold plate assembly in the pallet is presented and a thermal model description is provided. The method employed in modeling heat pipes-honey-comb matrix is based upon an effective conductance between the heat pipe vapor and the walls of the heat pipe. The considered thermal models and a computer program are used to perform steady-state thermal analyses. The temperature gradients in the large module baseplate attached to the small cold plate are predicted as a function of the interface plate thickness.