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At least 109 records · Page 6

Carbon and carbon-coated electrodes for multistage depressed collectors for electron-beam devices - A technology review

Various aspects of carbon and carbon-coated multistaged depressed collector (MDC) electrode technology are reviewed. The physical properties of untreated graphite electrodes, ion-textured graphite electrodes, and textured, carbon-coated copper electrodes, and surface treatment procedures for these electrodes are described. The secondary electron emissions of the three electrode types are analyzed. MDC fabrication methods are discussed. The performances of MDCs fabricated with untreated graphite electrodes, ion-textured graphite electrodes, and textured, carbon-coated copper electrodes are evaluated. MDC and TWT efficiency levels for tubes fabricated with the three materials are measured.

Curren, Arthur N.↗

Friction and transfer of copper, silver, and gold to iron in the presence of various adsorbed surface films

Sliding friction experiments were conducted with the noble metals copper, silver, and gold and two binary alloys of these metals contacting iron in the presence of various adsorbates including, oxygen, methyl mercaptan, and methyl chloride. A pin on disk specimen configuration was used with a load of 100 grams, sliding velocity of 60 mm/min; at 25 C with the surfaces saturated with the adsorbates. Auger emission spectroscopy was used to monitor surface films. Results of the experiments indicate that friction and transfer characteristics are highly specific with respect to both the noble metal and surface film present. With all three metals and films transfer of the noble metal to iron occurred very rapidly. With all metals and films transfer of the noble metal to iron continuously increased with repeated passes except for silver and copper sliding on iron sulfide.

Buckley, D. H.↗

Interfacial Effects on the Thermal and Mechanical Properties of Graphite/Copper Composites

Graphite surfaces are not wet by pure copper. This lack of wetting has been responsible for a debonding phenomenon that has been found in continuous graphite fiber reinforced copper matrix composites subjected to elevated temperatures. By suitably alloying copper, its ability to wet graphite surfaces can be enhanced. Information obtained during sessile drop testing has led to the development of a copper-chromium alloy that suitably wets graphite. Unidirectionally reinforced graphite/copper composites have been fabricated using a pressure infiltration casting procedure. P100 pitch-based fibers have been used to reinforce copper and copper-chromium alloys. X-ray radiography and optical microscopy have been used to assess the fiber distribution in the cast composites. Scanning electron microscopy and Auger electron spectroscopy analyses were conducted to study the distribution and continuity of the chromium carbide reaction phase that forms at the fiber/matrix interface in the alloyed matrix composites. The effects of the chromium in the copper matrix on the mechanical and thermal properties of P100Gr/Cu composites have been evaluated through tensile testing, three-point bend testing, thermal cycling and thermal conductivity calculations. The addition of chromium has resulted in an increased shear modulus and essentially zero thermal expansion in the P100Gr/Cu-xCr composites through enhanced fiber/matrix bonding. The composites have longitudinal tensile strengths in excess of 700 MPa with elastic moduli of 393 GPa. After 100 hr at 760 deg C 84 percent of the as-cast strength is retained in the alloyed matrix composites. The elastic moduli are unchanged by the thermal exposure. It has been found that problems with spreading of the fiber tows strongly affect the long transverse tensile properties and the short transverse thermal conductivity of the P100Gr/Cu-xCr composites. The long transverse tensile strength is limited by rows of touching fibers which are paths of easy crack propagation under low tensile loads. The short transverse thermal conductivity is dictated by the fiber/matrix interface. Conduction across this interface has been estimated to be two orders of magnitude lower than that across the composite. This is due to the mechanical, and not chemical, nature of Gr/Cu bond.

Devincent, Sandra Marie↗

Modeling of life limiting phenomena in the discharge chamber of an electron bombardment ion thruster

An experimental facility to study the low energy sputtering of metal surfaces with ions produced by an ion gun is described. The energy of the ions ranged from 10 to 500 eV. Cesium ions with energies from 100 to 500 eV were used initially to characterize the operation of the ion gun. Next, argon and xenon ions were used to measure the sputtering yields of cobalt (Co), Cadmium (Cd), and Chromium (Cr) at an operating temperature of 2x10(exp -5) Torr. The ion current ranged from 0.0135 micro-A at 500 eV. The targets were electroplated on a copper substrate. The surface density of the electroplated material was approx. 50 micro-g/sq cm. The sputtered atoms were collected on an aluminum foil surrounding the target. Radioactive tracers were used to measure the sputtering yields. The sputtering yields of Cr were found to be much higher than those of Co and Cd. The yields of Co and Cd were comparable, with Co providing the higher yields. Co and Cd targets were observed to sputter at energies as low as 10 eV for both argon and xenon ions. The Cr yields could not be measured below 20 eV for argon ions and 15 eV for xenon ions. On a linear scale the yield energy curves near the threshold energies exhibit a concave nature.

Handoo, Arvind K.↗

Critical Heat Flux in Pool Boiling on Metal-Graphite Composite Surfaces

A study is conducted on high heat-flux pool boiling of pentane on micro-configured composite surfaces. The boiling surfaces are copper-graphite (Cu-Gr) and aluminum-graphite (Al-Gr) composites with a fiber volume concentration of 50%. The micro-graphite fibers embedded in the matrix contribute to a substantial enhancement in boiling heat-transfer performance. Correlation equations are obtained for both the isolated and coalesced bubble regimes, utilizing a mathematical model based on a metal-graphite, two-tier configuration with the aid of experimental data. A new model to predict the critical heat flux (CHF) on the composites is proposed to explain the fundamental aspects of the boiling phenomena. Three different factors affecting the CHF are considered in the model. Two of them are expected to become the main agents driving vapor volume detachment under microgravity conditions, using the metal-graphite composite surfaces as the heating surface and using liquids with an unusual Marangoni effect as the working fluid.

Zhang, Nengli↗

Boiling on Microconfigured Composite Surfaces Enhanced

Boiling heat transfer is one of the key technologies for the two-phase active thermal-control system used on space platforms, as well as for the dynamic power systems aboard the International Space Station. Because it is an effective heat transfer mode, boiling is integral to many space applications, such as heat exchangers and other cooling devices. Nucleate boiling near the critical heat flux (CHF) can transport very large thermal loads with a much smaller device and much lower pumping power than for single-phase heat exchangers. However, boiling performance sharply deteriorates in a reduced-gravity environment, and operation in the CHF regime is somewhat perilous because of the risk of burnout to the device surface. New materials called microconfigured metal-graphite composites can enhance boiling. The photomicrograph shows the microconfiguration (x3000) of the copper-graphite (Cu-Gr) surface as viewed by scanning electronic microscope. The graphite fiber tips appear as plateaus with rugged surfaces embedded in the copper matrix. It has been experimentally demonstrated that this type of material manifests excellent boiling heat transfer performance characteristics and an increased CHF. Nonisothermal surfaces were less sensitive to variations of wall superheat in the CHF regime. Because of the great difference in conductivity between the copper base and the graphite fiber, the composite surfaces have a nonisothermal surface characteristic and, therefore, will have a much larger "safe" operating region in the CHF regime. In addition, the thermocapillary forces induced by the temperature differences between the fiber tips and the metal matrix play an important role in bubble detachment, and may not be adversely affected in a reduced-gravity environment. All these factors indicate that microconfigured composites may improve the reliability and economy (dominant factors in all space applications) of various thermal components found on spacecraft during future missions.

Chao, David F.↗

Controlled etching of printed-circuit boards

Ferric chloride in an aqueous medium etches copper from the surface of printed-circuit boards. Ferric ions are reduced to ferrous ions resulting in a reduced etching rate.

Kovell, S. P.↗

Development of a highly reliable composite board for printed circuitry for use in space environment

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

Bradbury, E. J.↗

Eutectic bonding of boron-aluminum structural components. II

Eutectic bonding is a diffusion brazing process developed for fabricating boron-aluminum components from composite monolayer. This process relies on the diffusion of a thin surface film of copper into the aluminum matrix to form a liquid phase when heated above the copper-aluminum eutectic temperature of 1018 F. This type of fabrication offers design flexibility in that skin thickness may be varied, the stiffness geometry and orientation can be varied, and local reinforcement can be added. In addition, this type of boron-aluminum structure offers high efficiency. Also, this method of construction can be cost-comparative with complex titanium shapes; simple tooling permits easy layup, bonding is a one-step operation, and little finish machining is required.

Niemann, J. T.↗

Scanning-electron-microscope study of normal-impingement erosion of ductile metals

Scanning electron microscopy was used to characterize the erosion of annealed copper and aluminum surfaces produced by both single- and multiple-particle impacts. Macroscopic 3.2 mm diameter steel balls and microscopic, brittle erodant particles were projected by a gas gun system so as to impact at normal incidence at speeds up to 140 m/sec. During the impacts by the brittle erodant particles, at lower speeds the erosion behavior was similar to that observed for the larger steel balls. At higher velocities, particle fragmentation and the subsequent cutting by the radial wash of debris created a marked change in the erosion mechanism.

Brainard, W. A.↗

Thermal conductance of pressed contacts at liquid helium temperatures

The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation Q = the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work.

Salerno, L. J.↗

Making Single Crystals of B4C

Crystals precipitate from solution in copper. Well-defined single crystals of boron carbide (B4C) grown by slowly cooling melts containing B4C and copper. Forms on surface and in interior of melt.

Feigelson, Robert S.↗

Graphite/copper alloy interfacial energies determined using the sessile drop method

Graphite surfaces are not wet by pure copper. This lack of wetting is responsible for a debonding phenomenon that was found in continuous graphite fiber/copper matrix composites materials subjected to elevated temperatures. By suitably alloying copper, its capability to wet graphite surfaces can be enhanced. In situ measurements of graphite/copper alloy wetting angles were made using the sessile drop method. Interfacial energy values were calculated based upon these measurements.

Devincent, Sandra M.↗

Method and apparatus for producing a substrate with low secondary electron emissions

The present invention is directed to a method and apparatus for producing a highly-textured surface on a copper substrate with only extremely small amounts of texture-inducing seeding or masking material. The texture-inducing seeding material is delivered to the copper substrate electrically switching the seeding material in and out of a circuit loop.

Jensen, Kenneth A.↗

Method and Apparatus for Producing a Substrate with Low Secondary Electron Emissions

The present invention is directed to a method and apparatus for producing a highly-textured surface on a copper substrate with only extremely small amounts of texture-inducing seeding of masking material. The texture-inducing seeding material is delivered to the copper substrate electrically switching the seeding material in and out of a circuit loop.

Jensen, Kenneth A.↗

Substrate With Low Secondary Emissions

The present invention is directed to a method and apparatus for producing a highly -textured surface on a copper substrate -with only extremely small amounts of texture-inducing seeding or masking material. The texture-inducing seeding material is delivered to the copper substrate electrically switching the seeding material in and out of a circuit loop.

Jensen, Kenneth A.↗

Testing of a Miniature Loop Heat Pipe Using a Thermal Electrical Cooler for Temperature Control

This paper describes the design and testing of a miniature LHP having a 7 mm O.D. evaporator with an integral CC. The vapor line and liquid line are made of 1.6mm stainless steel tubing. The evaporator and the CC are connected on the outer surface by a copper strap and a thermoelectric (TEC) is installed on the strap. The TEC is used to control the CC temperature by applying an electrical current for heating or cooling. Tests performed in ambient included start-up, power cycle, sink temperature cycle, and CC temperature control using TEC. The LHP demonstrated very robust operation in all tests where the heat load varied between 0.5W and 1OOW, and the sink temperature varied between 243K and 293K. The heat leak from the evaporator to the CC was extremely small. The TEC was able to control the CC temperature within +/-0.3K under all test conditions, and the required control heater power was less than 1W.

Ku, Jentung↗