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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Thermal and Mechanical Design of a High-Voltage Power Electronics Package

This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal performance and reliability of the package. We found that placing the devices closer to the direct bond copper substrate as opposed to a centered approach in the proposed double-sided cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

electronic packaging↗
DOE OSTI2020

Characterization and Analysis of Insulated Metal Substrate-Based SiC Power Module for Traction Application

This paper presents the electrical characterization and drive cycle--based thermal analysis of an insulated metal substrate (IMS)--based silicon carbide power module for high-power traction inverters. The substrate was constructed using a thin layer of polymer--ceramic blend dielectric material with a thick copper core to improve transient thermal performance. The cooling performance of this module has already been validated with promising results. In this paper, an experimental test bed was set up to evaluate the dynamic and static electrical performance of the designed module under a wide range of operating conditions. The characterization results were then used to develop a drive cycle--based thermal model to validate the performance compared to the traditional direct bonded copper--based power module. The results indicate that the IMS-based power module is a suitable solution for high-power traction applications.

Chowdhury, Shajjad↗
DOE OSTI2023

PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling

Lateral gallium nitride (GaN) high-electron-mobility transistors (HEMTs) present better electrical characteristics compared to silicon or silicon carbide devices such as high switching speed and low gate charge, but also present additional challenges on the module design. Here, this paper discusses a high-density GaN power module with double-sided cooling, low inductance, on-package decoupling capacitors, and integrated gate drivers. The GaN dies as well as the gate drive are sandwiched between the printed circuit board (PCB) and direct bonded copper (DBC) substrate to achieve compact loop and double-sided cooling effect. Design considerations and thermal performance are analyzed. A module assembly procedure is presented utilizing the layer-by-layer attachment process. Finally, a 2.7 cm x 1.8 cm half-bridge GaN power module is fabricated and tested, achieving a low power-loop inductance of 1.03 nH, and the overshoot voltage of the switching waveform is less than 5% under a 400-V/25-A double-pulse test. The thermal resistance is 0.32 K/W, verified by simulation and experimental results. The design and assembly process can be generalized and applied to high power applications to achieve high power density and high performance.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

Single and Double-Sided Jet Impingement Cooling for SiC-Based Power Modules

Efficient thermal management of power electronics systems is crucial for higher reliability. With the miniaturization of systems, high-loss-density electronics require cooling systems that can extract a large amount of heat. This study explored a liquid-jet-impingement-based direct substrate cooling system for single-sided and double-sided cooling to improve heat extraction efficiency and improve the power density by reducing the volume and mass. The cooling system was implemented for a SiC-based direct bonded copper substrate. Numerical simulations were performed to determine the effects of nozzle diameter, the number of nozzles, and nozzle array orientation on single-sided cooling and thermal performance gain over double-sided cooling. A novel manifold design was proposed that reduced the volume and mass of the manifold and still achieved the target power density. The performance of the proposed design was compared with the pin-fin-based cooling system used in the BMW I3 module, and a comparative analysis was done.

Barua, Himel↗
DOE OSTI2020

Toward ultrafast, ultra-stable imaging arrays: Superlattice doping to enhance the performance of backside-illuminated 3D-hybridized silicon photodetectors

In this paper, the authors report the latest results on their development of superlattice-doped, thinned, backside-illuminated (BSI), 3D-integrated photodiode detectors—a step toward their ultimate goal of demonstrating ultrafast, ultrastable CMOS imaging arrays. As with most silicon-based photodetectors, backside-illumination and backside surface passivation are keys to achieve the highest performance capability. The two-dimensional (2D) doping technique developed at the Jet Propulsion Laboratory (JPL) has proved to result in a highly efficient, highly stable detector response when combined with a variety of detectors. Here, JPL's 2D-doping has been combined with Sandia's BSI photodetectors hybridized with custom fanout wafer via copper Direct Bond Interconnect (DBI®), a technology that is rapidly becoming industry standard for BSI CMOS imaging arrays. The prototype detectors were packaged and evaluated with respect to their response to low energy electrons. The authors find that the responsivity of 2D-doped BSI detectors is higher than devices prepared using other surface passivation techniques (i.e., ion implantation). The success of the work described herein verifies that the 2D-doping processes previously developed for Sandia's frontside-illuminated photodetectors are generally applicable to BSI detectors and demonstrates for the first time that JPL's 2D-doping process is compatible with the Cu-DBI® technology.

Jewell, April D.↗
DOE OSTI2023

Improved fabrication of scalable hybrid silicon nitride–thin-film lithium niobate electro-optic modulators

Strategies for improved fabrication of integrated thin-film lithium niobate electro-optic (EO) Mach–Zehnder modulators (MZMs) are reported using scalable processes and designs. The MZM devices utilize direct bonding of unetched and unpatterned thin-film lithium niobate to patterned and planarized silicon photonic microchips. The latter contains silicon nitride waveguide structures of various widths that are used to form hybrid modes that are suitable for high-bandwidth low-voltage EO modulators based on Pockels effect. We report that the incorporation of appropriately designed outgassing channels and certain modifications to key processing steps helped achieve a greater than 99% reduction in void density during bonding. Void reduction is critically important for these traveling-wave hybrid MZM devices in which the optical mode is controllably distributed between multiple thin layers and propagates over millimeter-scale lengths.

Mere, Viphretuo↗
DOE OSTI2020

Analytic fits to atom-in-jellium shear modulus predictions

Fits to AJ shear modulus calculations from ρ0 to the limit of the corresponding AJ EOS table (usually 1000 ρ0), adjusted to reproduce STP shear modulus where possible. Fitting minimized the fractional difference, so low-pressure points would be reproduced accurately despite the wide-ranging tabulation. AJ calculations were at T=0. Isochoric variation G(T) has been small for all cases spot-tested so far, and may have either sign. The fitted equation usually matches the AJ data to within a few percent. Between numerical noise in the AJ calculation and probably-physical structure not captured by the equation, the deviation could be up to 20% in some places in most models, and 30% in a few. AJ does not capture structural phase transitions or phases stabilized by directional bonds, where the shear modulus may vary by a greater amount. Where possible, STP ρ,G were used as parameters, and low pressure AJ points were de-weighted or removed if necessary. Otherwise, such as where AJ fails to capture solid phases with a significantly different shear modulus, the AJ data were fitted as far down in pressure as possible, G0 was also fitted if necessary, and ρ0 was also adjusted if needed to keep G0>0. The resulting models are not intended for use at low pressure, though some are probably adequate for practical purposes

36 MATERIALS SCIENCE↗
DOE OSTI2020

Experimental and Computational Studies on Superhard Material Rhenium Diboride under Ultrahigh Pressures

An emerging class of superhard materials for extreme environment applications are compounds formed by heavy transition metals with light elements. In this work, ultrahigh pressure experiments on transition metal rhenium diboride (ReB 2 ) were carried out in a diamond anvil cell under isothermal and non-hydrostatic compression. Two independent high-pressure experiments were carried out on ReB 2 for the first time up to a pressure of 241 GPa (volume compression V/V 0 = 0.731 ± 0.004), with platinum as an internal pressure standard in X-ray diffraction studies. The hexagonal phase of ReB 2 was stable under highest pressure, and the anisotropy between the a-axis and c-axis compression increases with pressure to 241 GPa. The measured equation of state (EOS) above the yield stress of ReB 2 is well represented by the bulk modulus K 0 = 364 GPa and its first pressure derivative K 0 ´ = 3.53. Corresponding density-functional-theory (DFT) simulations of the EOS and elastic constants agreed well with the experimental data. DFT results indicated that ReB 2 becomes more ductile with enhanced tendency towards metallic bonding under compression. The DFT results also showed strong crystal anisotropy up to the maximum pressure under study. The pressure-enhanced electron density distribution along the Re and B bond direction renders the material highly incompressible along the c-axis. Our study helps to establish the fundamental basis for anisotropic compression of ReB 2 under ultrahigh pressures

36 MATERIALS SCIENCE↗
DOE OSTI2021

Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module

Wide-Band Gap (WBG) power devices have become a promising option for high-power applications due to the superior material properties over traditional Silicon. To not limit WBG devices’ mother nature, a rugged and high-performance power device packaging solution is necessary. This study proposes a Double-Side Cooled (DSC) 1.2 kV half-bridge power module having dual epoxy resin insulated metal substrate (eIMS) for solving convectional power module challenges and providing a cost-effective solution. The thermal performance outperforms traditional Alumina (Al2O3) Direct Bonded Copper (DBC) DSC power module due to moderate thermal conductivity (10 W/mK) and thin (120 mm) epoxy resin composite dielectric working as the IMS insulation layer. This novel organic dielectric can withstand high voltage (5 kVAC @ 120 μm) and has a Glass Transition Temperature (Tg) of 300°C, which is suitable for high-power applications. In the thermal-mechanical modeling, the organic DSC power module can pass the thermal cycling test over 1,000 cycles by optimizing the mechanical properties of the encapsulant material. In conclusion, this article not only proposes a competitive organic-based power module but also a methodology of evaluation for thermal and mechanical performance.

42 ENGINEERING↗
NASA NTRS1972

Refurbishment cost study of the thermal protection system of a space shuttle vehicle, phase 2

Labor costs and techniques associated with the refurbishment of representative TPS and their attach concepts suitable for space shuttle application have been identified on the basis of experimental tests. Ablative and reusable surface insulation TPS configurations were designed, fabricated, and tested on a full-scale mockup. The TPS attachment methods investigated included pi-strap, multiple mechanical fasteners, key/keyway, and direct bond concepts. Techniques for performing installation, inspection, repair and replacement of TPS components were studied by examining a variety of shop procedures. Major problem areas associated with these procedures and the designs to which they were applied were analyzed for several significant parameters such as handling, gaskets between joints, repair techniques, ablator plugs, etc. Results of time and motion studies of specific maintenance tasks, simulating operational procedures, were obtained. Using these data, refurbishment labor cost projections were generated for a representative Space Shuttle orbiter.

Haas, D. W.↗
NASA NTRS1974

Carbon phenolic heat shields for Jupiter/Saturn/Uranus entry probes

Carbon phenolic heat shield technology is reviewed. Heat shield results from the outer planetary probe mission studies are summarized along with results of plasma jet testing of carbon phenolic conducted in a ten megawatt facility. Missile flight data is applied to planetary entry conditions. A carbon phenolic heat shield material is utilized and tailored to accommodate each of the probe missions. An integral heat shield approach is selected over in order to eliminate a high temperature interface problem and permit direct bonding of the carbon phenolic to the structural honeycomb sandwich. The sandwich is filled with a very fine powder to minimize degradation of its insulation properties by the high conductive hydrogen/helium gases during the long atmospheric descent phase.

Mezines, S.↗
NASA NTRS1977

Simulation and display of macromolecular complexes

In association with an investigation of the interaction of proteins with DNA and RNA, an interactive computer program for building, manipulating, and displaying macromolecular complexes has been designed. The system provides perspective, planar, and stereoscopic views on the computer terminal display, as well as views for standard and nonstandard observer locations. The molecule or its parts may be rotated and/or translated in any direction; bond connections may be added or removed by the viewer. Molecular fragments may be juxtaposed in such a way that given bonds are aligned, and given planes and points coincide. Another subroutine provides for the duplication of a given unit such as a DNA or amino-acid base.

Nir, S.↗
NASA NTRS1981

A balloon strain gage

This paper describes the development of a unique strain measuring device which is intended to monitor the state of strain in thin balloon films during flight. The gate is bonded directly to the film without significantly altering the state of strain or stress in the wall of the balloon. Results of a model balloon inflation are presented which indicate the gage to measure strain in a deployed balloon.

Rand, J. L.↗
NASA NTRS1982

Graphite/polyimide technology overview and Space Shuttle Orbiter applications

The materials, production processes, testing procedures, and repair techniques for composite structures on the Orbiter are reviewed. The Orbiter currently features graphite/epoxy payload bay doors, as well as graphite/polyimide elevons, vertical tail, and aft body flap, which can withstand up to 600 F temperatures. Graphite/polyimide is also being considered for areas of the baseline aluminum structure and the thermal protection system in order to achieve a 20-30% weight reduction, i.e., over 7.5 tons. An analysis of the allowable stresses on FRC imide thermal protection system tiles bonded directly to the structure has shown satisfactory performances in high temperature and cryogenic conditions, although failure modes are yet to be determined. Ultrasonic emissions have been used for defect detection in nondestructive evaluations, together with tension, notch, shear, and compression tests. Field repairs have not been perfected, and require the evolution of high temperature adhesives that are curable under vacuum pressure and heat blankets.

Morita, W. H.↗
NASA NTRS1982

Analysis, design, and test of a graphite/polyimide Shuttle orbiter body flap segment

For future missions, increases in Space Shuttle orbiter deliverable and recoverable payload weight capability may be needed. Such increases could be obtained by reducing the inert weight of the Shuttle. The application of advanced composites in orbiter structural components would make it possible to achieve such reductions. In 1975, NASA selected the orbiter body flap as a demonstration component for the Composite for Advanced Space Transportation Systems (CASTS) program. The progress made in 1977 through 1980 was integrated into a design of a graphite/polyimide (Gr/Pi) body flap technology demonstration segment (TDS). Aspects of composite body flap design and analysis are discussed, taking into account the direct-bond fibrous refractory composite insulation (FRCI) tile on Gr/Pi structure, Gr/Pi body flap weight savings, the body flap design concept, and composite body flap analysis. Details regarding the Gr/Pi technology demonstration segment are also examined.

Graves, S. R.↗
NASA NTRS1985

Theoretical Problems in Materials Science

Interactions between theoretical physics and material sciences to identify problems of common interest in which some of the powerful theoretical approaches developed for other branches of physics may be applied to problems in materials science are presented. A unique structure was identified in rapidly quenched Al-14% Mn. The material has long-range directed bonds with icosahedral symmetry which does not form a regular structure but instead forms an amorphous-like quasiperiodic structure. Finite volume fractions of second phase material is advanced and is coupled with nucleation theory to describe the formation and structure of precipitating phases in alloys. Application of the theory of pattern formation to the problem of dendrite formation is studied.

Langer, J. S.↗
NASA NTRS1987

Ceramic Adhesive for High Temperatures

Fused-silica/magnesium-phosphate adhesive resists high temperatures and vibrations. New adhesive unaffected by extreme temperatures and vibrations. Assuring direct bonding of gap filters to tile sidewalls, adhesive obviates expensive and time-consuming task of removal, treatment, and replacement of tiles.

Stevens, Everett G.↗
NASA NTRS1990

Steel Foil Improves Performance Of Blasting Caps

Blasting caps, which commonly include deep-drawn aluminum cups, give significantly higher initiation performance by application of steel foils on output faces. Steel closures 0.005 in. (0.13 mm) thick more effective than aluminum. Caps with directly bonded steel foil produce fragment velocities of 9,300 ft/s (2.8 km/s) with large craters and unpredictable patterns to such degree that no attempts made to initiate explosions. Useful in military and aerospace applications and in specialized industries as mining and exploration for oil.

Bement, Laurence J.↗