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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Noise and Bandwidth Measurements of Diffusion-Cooled Nb Hot-Electron Bolometer Mixers at Frequencies Above the Superconductive Energy Gap

Diffusion-cooled Nb hot-electron bolometer (HEB) mixers have the potential to simultaneously achieve high intermediate frequency (IF) bandwidths and low mixer noise temperatures for operation at THz frequencies (above the superconductive gap energy). We have measured the IF signal bandwidth at 630 GHz of Nb devices with lengths L = 0.3, 0.2, and 0.1 micrometer in a quasioptical mixer configuration employing twin-slot antennas. The 3-dB EF bandwidth increased from 1.2 GHz for the 0.3 gm long device to 9.2 GHz for the 0.1 gm long device. These results demonstrate the expected 1/L squared dependence of the IF bandwidth at submillimeter wave frequencies for the first time, as well as the largest EF bandwidth obtained to date. For the 0.1 gm device, which had the largest bandwidth, the double sideband (DSB) noise temperature of the receiver was 320-470 K at 630 GHz with an absorbed LO power of 35 nW, estimated using the isothermal method. A version of this mixer with the antenna length scaled for operation at 2.5 THz has also been tested. A DSB receiver noise temperature of 1800 plus or minus 100 K was achieved, which is about 1,000 K lower than our previously reported results. These results demonstrate that large EF bandwidth and low-noise operation of a diffusion-cooled HEB mixer is possible at THz frequencies with the same device geometry.

Wyss, R. A.↗

Effects of vibrational enhancement of N2 on the cooling rate of ionospheric thermal electrons

It is shown that the cooling rate of ionospheric thermal electrons by molecular nitrogen may be reduced by more than a factor of 3 as a result of the enhanced vibrational excitation of N2 from a number of chemical sources. Furthermore, under conditions of enhanced F region electron densities (greater than 10 to the 6 per cubic centimeter), N2 may act as a small net source rather than as a sink of electron thermal energy. The object of the study is to use results of the Atmospheric Explorer program and improved laboratory reaction rate measurements to evaluate the impact of N2 vibrational on the transfer of energy between N2 and thermal electrons.

Richards, P. G.↗

Adiabatic cooling of solar wind electrons

In thermally driven winds emanating from regions in the solar corona with base electron densities of n0 not less than 10 exp 8/cu cm, a substantial fraction of the heat conductive flux from the base is transfered into flow energy by the pressure gradient force. The adiabatic cooling of the electrons causes the electron temperature profile to fall off more rapidly than in heat conduction dominated flows. Alfven waves of solar origin, accelerating the basically thermally driven solar wind, lead to an increased mass flux and enhanced adiabatic cooling. The reduction in electron temperature may be significant also in the subsonic region of the flow and lead to a moderate increase of solar wind mass flux with increasing Alfven wave amplitude. In the solar wind model presented here the Alfven wave energy flux per unit mass is larger than that in models where the temperature in the subsonic flow is not reduced by the wave, and consequently the asymptotic flow speed is higher.

Sandbaek, Ornulf↗

Stirling Cooler Designed for Venus Exploration

Venus having an average surface temperature of 460 degrees Celsius (about 860 degrees Fahrenheit) and an atmosphere 150 times denser than the Earth's atmosphere, designing a robot to merely survive on the surface to do planetary exploration is an extremely difficult task. This temperature is hundreds of degrees higher than the maximum operating temperature of currently existing microcontrollers, electronic devices, and circuit boards. To meet the challenge of Venus exploration, researchers at the NASA Glenn Research Center studied methods to keep a pressurized electronics package cooled, so that the operating temperature within the electronics enclosure would be cool enough for electronics to run, to allow a mission to operate on the surface of Venus for extended periods.

Landis, Geoffrey A.↗

The interstellar wake of the solar wind

The present work examines theoretically the cooling of the subsonic solar wind by the interstellar hydrogen gas entering the solar system. It is assumed that the interstellar hydrogen gas is distributed uniformly in the space where the solar wind is subsonic, and the solar-wind wake is represented by an idealized column flow of plasma in which the flow velocity is constant and the temperature varies along, not across, the wake. The results are therefore to be taken only in their order of magnitude. In the hot region near the shock sphere the electrons are cooled mainly through electron ionization while the protons cool through charge exchange. In the cooler regions far away from the shock, the protons are still cooled by charge exchange and the electron is cooled by collisions with protons. As the temperature of the solar wind decreases, the magnetic field becomes relatively more important. When the spin axis of the sun is parallel to the direction of the incident interstellar gas flow, the lines of force are in spiral form and the tension causes the plasma to be concentrated along the center of the wake.

Yu, G.↗

Fabrication of an Aluminum Based Hot Electron Mixer for Terahertz Applications

Aluminum based diffusion cooled hot electron bolometers (HEB) mixers, predicted to have better noise, bandwidth and to require less LO power than Nb based diffusion cooled HEBs, have been fabricated. Preliminary DC tests were performed. The bolometer elements consisted of short (0.1 to 0.3 micron), narrow (0.08 to 0. 15 micron) and thin (11 nm) aluminum wires connected to large contact pads consisting of a novel trilayer Al/Ti/Au. The patterns were defined by electron beam lithography and the metal deposition involved a double angle process, the Aluminum wires being deposited straight on and the pads being deposited at a 45 degree angle without breaking vacuum. The Al/Ti/Au trilayer was developed to provide a way of making contact between the aluminum wire and the gold antenna. The Titanium layer acts as a diffusion barrier to avoid damage of the Aluminum contact and bolometer wire and to lower the transition temperature of the pads to below that of the bolometer wire. The Au layer avoids the formation of an oxide on the Ti layer and provides good electrical contact to the IF/antenna structure. The resistance of the bolometers as a function of temperature was measured. It is clear that below the transition temperature of the wire (1.8K) but above the transition temperature of the contact pads (0.6K), the proximity effect drives most of the bolometer wire normal, causing a very broad transition. This effect should not affect the performance of the bolometers since they will be operated at a temperature below the TC of the pads. This is evident from the IV characteristics measured at 0.3K. RF characterization tests will begin shortly.

Echternach, P. M.↗

Using electron scattering to probe the environment of cluster cooling flows

The electron-scattered surface brightness profiles are calculated for a strong central source embedded in a cluster cooling flow, and the profiles are used to discuss the physical state of the gas in the flow and the behavior of the central source. The effects of temporal variations in the luminosity of the central source are calculated for a burst model and a source whose luminosity increases linearly with time. If the emission from the central AGN is polarized, the surface brightness profiles have cusps along the direction of the projection of the normal to the polarization vector on the sky. The 2D surface brightness profiles produced by beamed radiation are calculated.

Wise, Michael W.↗

Computational Fluid Dynamics (CFD) Analysis Of Optical Payload For Lasercomm Science (OPALS) sealed enclosure module

Computational Fluid Dynamics (CFD) using the commercial CFD package CFDesign has been performed at NASA Jet Propulsion Laboratory (JPL) California Institute of Technology (Caltech) in support of the Phaeton Early Career Hire Program's Optical Payload for Lasercomm Science (OPALS) mission. The OPALS project is one which involves an International Space Station payload that will be using forced convection cooling in a hermetically sealed enclosure at 1 atm of air to cool "off-the-shelf" vendor electronics. The CFD analysis was used to characterize the thermal and fluid flow environment within a complicated labyrinth of electronics boards, fans, instrumentation, harnessing, ductwork and heat exchanger fins. The paradigm of iteratively using CAD/CAE tools and CFD was followed in order to determine the optimum flow geometry and heat sink configuration to yield operational convective film coefficients and temperature survivability limits for the electronics payload. Results from this current CFD analysis and correlation of the CFD model against thermal test data will be presented. Lessons learned and coupled thermal / flow modeling strategies will be shared in this paper.

Computational Fluid Dynamics (CFD)↗

High density electronic packaging module with improved cooling assembly

Cold plate increases heat transfer within high density electronic module. Tapered pins improve heat transfer process by providing larger surface pressure with increased planar area. Cooling technique increases thermal contact where planar area is limited, interface pressure increases the heat transfer coefficient.

Martin, J. H.↗

Passive Cooling for Mercury Surface Lander Electronics

A significant barrier to operation of a mission on the surface of Mercury is the temperature. At Mercury’s perihelion distance of 0.313 AU, the solar intensity is 10.6 times the solar flux at Earth orbit, and at the subsolar point, the maximum surface temperature reaches 427°C. For a mission landing on the surface of Mercury at latitude of 40°S, we analyzed using passive thermal control to reduce the temperature of the critical electronics to within the operation temperature limits of silicon devices. The thermal control requires reducing the thermal conductance and infrared flux from the high temperature surface and surrounding spacecraft, and moderating the solar heat input using a surface coating with high solar reflectivity, and maximizing thermal cooling with high infrared emissivity. Using this approach, we find that we can passively cool an electronics box to a temperature of 393K (120°C) using a radiator-white surface with solar absorptivity 0.11 and infrared emissivity 0.91. This temperature is well under 175C target we use for the limits of high-temperature silicon integrated circuits, including RAM and microcontrollers. We could further reduce this operating temperature to as low as 321K (48°C) with an advanced thermal coating, a temperature well within the operational limits of conventional electronics.

Mercury↗

Passive Cooling for Mercury Surface Lander Electronics

A significant barrier to operation of a mission on the surface of Mercury is the temperature. At Mercury’s perihelion distance of 0.313 AU, the solar intensity is 10.6 times the solar flux at Earth orbit, and at the subsolar point, the maximum surface temperature reaches 427°C. For a mission landing on the surface of Mercury at latitude of 40°S, we analyzed using passive thermal control to reduce the temperature of the critical electronics to within the operation temperature limits of silicon devices. The thermal control requires reducing the thermal conductance and infrared flux from the high temperature surface and surrounding spacecraft, and moderating the solar heat input using a surface coating with high solar reflectivity, and maximizing thermal cooling with high infrared emissivity. Using this approach, we find that we can passively cool an electronics box to a temperature of 393K (120°C) using a radiator-white surface with solar absorptivity 0.11 and infrared emissivity 0.91. This temperature is well under 175C target we use for the limits of high-temperature silicon integrated circuits, including RAM and microcontrollers. We could further reduce this operating temperature to as low as 321K (48°C) with an advanced thermal coating, a temperature well within the operational limits of conventional electronics

Mercury↗