Search NASASearch

SEARCH · Search NASA

Results for “electronics packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 109 records · Page 6

HTESP (High-throughput electronic structure package): A package for high-throughput ab initio calculations

High-throughput ab initio calculations are the indispensable parts of data-driven discovery of new materials with desirable properties, as reflected in the establishment of several online material databases. The accumulation of extensive theoretical data through computations enables data-driven discovery by constructing machine learning and artificial intelligence models to predict novel compounds and forecast their properties. Efficient usage and extraction of data from these existing online material databases can accelerate the next stage materials discovery that targets different and more advanced properties, such as electron–phonon coupling for phonon-mediated superconductivity. However, extracting data from these databases, generating tailored input files for different ab initio calculations, performing such calculations, and analyzing new results can be demanding tasks. Here, in this work, we introduce a software package named “HTESP” (High-Throughput Electronic Structure Package) written in Python and Bash languages, which automates the entire workflow including data extraction, input file generation, calculation submission, result collection and plotting. Our HTESP will help speed up future computational materials discovery processes.

36 MATERIALS SCIENCE

The spacecraft structure and thermal design considerations

This paper covers the general structural and thermal design considerations of the Telstar satellite. The basic objectives were to maintain the electronic components in a near room temperature environment and to protect the electronics packge from high-frequency vibration excitation. These objectives were realized by dividing satellite into two lumped masses, the shell and the centrally located electronics package, and by utilizing nylon lacing for support of the electronics package. The package was provided with an active temperature control, regulating radiative heat flow between the skin and the package. Results of on-the-ground experimental evaluation and of telemetry data are given.

STRUCTURAL DESIGN

Bolometric detectors for the high frequency instrument on the Planck surveyor

The High Frequency Instrument (HFI) on Planck will obtain all-sky images of the Cosmic Microwave Background (CMB) and other astrophysical sources of emission with resolution of 9 arcniin at 100 GHz, 7 arcmin at 143 GHz and 5 arcniin at 217, 353, 545 and 857 GHz. The HFI focal plane will contain 48 silicon nitride micromesh bolometric detectors operating from a 100 mK heat sink. Four detectors in each of the 6 bands will detect the sum of the power in both linear polarizations. An additional 4 pair of detectors will provide sensitivity to linear polarization of emission at 143, 217 and 353 GHz. We report on the development of these detectors, which are being produced at the JPL Micro Devices Laboratory, packaged at JPL Electronics Packaging, characterized at 100 mK before delivery to our HFI consortium partners at the UWCC, UK.

Planck CMB bolometer

A Review of Chip Scale Package Assembled Reliability

NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.

Chip Scale Packaging Microspacecraft

Thermal Management for Planar Package Power Electronics (CRADA Final Report)

The National Renewable Energy Laboratory (NREL) and John Deere Electronic Solutions (JDES) collaborated to develop and evaluate computer models and simulations related to the thermal performance of semiconductor device packaging for an inverter of an off-road vehicle ("Semiconductor Packaging"). The objective of the research was for NREL and JDES to develop a two or three-dimensional computer-aided design model of the Semiconductor Packaging ("Computer Model") for thermal performance evaluation in a simulation. The project developed computer models of a Semiconductor Package of silicon-carbide semiconductor devices with appropriate thermal dissipation via one or more of the following thermal features: a double-sided planar cooling configuration, an air-cooled configuration, a liquid-cooled configuration for off-road inverter applications in a relevant simulated operating environment. It is noted that surface area and prototype product embodiment consisting of air-cooled and liquid-cooled configurations may and may not be in direct contact with power semiconductor chips. The idea was to explore and develop packaging and thermal management technology for power semiconductors that was most effective in the performance yet had least burden in overall product cost for a given application.

33 ADVANCED PROPULSION SYSTEMS

The Juno Magnetic Field Investigation

The Juno Magnetic Field investigation (MAG) characterizes Jupiter's planetary magnetic field and magnetosphere, providing the first globally distributed and proximate measurements of the magnetic field of Jupiter. The magnetic field instrumentation consists of two independent magnetometer sensor suites, each consisting of a tri-axial Fluxgate Magnetometer (FGM) sensor and a pair of co-located imaging sensors mounted on an ultra-stable optical bench. The imaging system sensors are part of a subsystem that provides accurate attitude information (to approx. 20 arcsec on a spinning spacecraft) near the point of measurement of the magnetic field. The two sensor suites are accommodated at 10 and 12 m from the body of the spacecraft on a 4 m long magnetometer boom affixed to the outer end of one of 's three solar array assemblies. The magnetometer sensors are controlled by independent and functionally identical electronics boards within the magnetometer electronics package mounted inside Juno's massive radiation shielded vault. The imaging sensors are controlled by a fully hardware redundant electronics package also mounted within the radiation vault. Each magnetometer sensor measures the vector magnetic field with 100 ppm absolute vector accuracy over a wide dynamic range (to 16 Gauss = 1.6 x 10(exp. 6) nT per axis) with a resolution of approx. 0.05 nT in the most sensitive dynamic range (+/-1600 nT per axis). Both magnetometers sample the magnetic field simultaneously at an intrinsic sample rate of 64 vector samples per second. The magnetic field instrumentation may be reconfigured in flight to meet unanticipated needs and is fully hardware redundant. The attitude determination system compares images with an on-board star catalog to provide attitude solutions (quaternions) at a rate of up to 4 solutions per second, and may be configured to acquire images of selected targets for science and engineering analysis. The system tracks and catalogs objects that pass through the imager field of view and also provides a continuous record of radiation exposure. A spacecraft magnetic control program was implemented to provide a magnetically clean environment for the magnetic sensors, and residual spacecraft fields andor sensor offsets are monitored in flight taking advantage of Juno's spin (nominally 2 rpm) to separate environmental fields from those that rotate with the spacecraft.

Juno spacecraft

Applications of heat pipes to cool PWBS and hybrid microcircuits

Some of the advanced thermal management techniques used to reduce operating junction temperature under extreme environmental temperature conditions are discussed. Heat pipes in actual electronic packaging applications, and those under development, are discussed. Performance characteristics of heat pipes are given, and examples are described of how thermal problems in electronic packaging are solved through the use of heat pipes.

Sekhon, K. S.

Thermal Analysis Of The NASA Integrated Vehicle Health Monitoring Experiment Technology For X-Vehicles (NITEX)

The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.

Hegab, Hisham E.

Thermal Analysis of the NASA Integrated Vehicle Health Monitoring Experiment Technology for X-Vehicles (NITEX)

The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.

Hegab, Hisham E.

NASA Electronic Parts & Packaging (NEPP) Program

The purpose of this presentation is to familiarize the people attending the JEDEC work meetings about the NEPP Program, and recent tasks we have undertaken. There is a description of the policy and testing guidelines in development and an explanation of the Government Working Group, a collaboration of several US government space agencies that come together to discuss topics relating to the reliable use of electronics. The presentation also includes a brief description of recent NASA accomplishments such as the launching/splash down of the SpaceX Crew Dragon and the launch of the next Mars rover.

reliability

NASA Electronic Parts & Packaging (NEPP) Program

The purpose of this presentation is to familiarize the people attending the JEDEC work meetings about the NEPP Program, and recent tasks we have undertaken. There is a description of the policy and testing guidelines in development and an explanation of the Government Working Group, a collaboration of several US government space agencies that come together to discuss topics relating to the reliable use of electronics. The presentation also includes a brief description of NASA events such as the landing of the next Mars rover in Feb 2021.

reliability

3D X-ray CT for BGA/CGA Workmanship Defect Detection

Commercial-off-the-shelf (COTS) advanced microelectronic technologies in high-reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. One of the key drawbacks of advanced electronic packages with hidden solder joint interconnections, such as the column grid array (CGA), is that inspection can be challenging—whether visually or using X-rays. In general, inspection for solder joint integrity is poor, except for identifying shorts. The new, advanced X-ray systems, especially the 3D computer tomography version, may be able to provide the three-dimensional features that are extremely difficult to resolve under the 2D systems.This report presents both 2D and 3D X-ray images along with their representative optical photomicrographs for a number of advanced electronics package assemblies including 3D stack and CGA assemblies before and after thermal cycling.

Ghaffarian, Reza

Packaging for Spacecraft and Its Commercial Implications

This paper discusses aspects of electronic packaging which are critical to MEMS devices and in particular, of extreme importance to packaging devices which are intended for use aboard spacecraft.

Microeletromechanical electronic packaging MEMS

The NASA Electronic Parts and Packaging (NEPP) Program: NEPP Overview - Automotive Electronics

The results of NASAs studies into the appropriateness of using U.S. Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Council's AECQ standardization program, the second part provides a summary of the results of NASA's procurement and testing experiences and other lessons learned along with preliminary test results.

Reliability