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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗
NASA NTRS2023

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗
NASA NTRS2015

Multifunctional Electroactive Nanocomposites Based on Piezoelectric Boron Nitride Nanotubes

Space exploration missions require sensors and devices capable of stable operation in harsh environments such as those that include high thermal fluctuation, atomic oxygen, and high-energy ionizing radiation. However, conventional or state-of-the-art electroactive materials like lead zirconate titanate, poly(vinylidene fluoride), and carbon nanotube (CNT)-doped polyimides have limitations on use in those extreme applications. Theoretical studies have shown that boron nitride nanotubes (BNNTs) have strength-to-weight ratios comparable to those of CNTs, excellent high-temperature stability (to 800 C in air), large electroactive characteristics, and excellent neutron radiation shielding capability. In this study, we demonstrated the experimental electroactive characteristics of BNNTs in novel multifunctional electroactive nanocomposites. Upon application of an external electric field, the 2 wt % BNNT/polyimide composite was found to exhibit electroactive strain composed of a superposition of linear piezoelectric and nonlinear electrostrictive components. When the BNNTs were aligned by stretching the 2 wt % BNNT/polyimide composite, electroactive characteristics increased by about 460% compared to the nonstretched sample. An all-nanotube actuator consisting of a BNNT buckypaper layer between two single-walled carbon nanotube buck-paper electrode layers was found to have much larger electroactive properties. The additional neutron radiation shielding properties and ultraviolet/visible/near-infrared optical properties of the BNNT composites make them excellent candidates for use in the extreme environments of space missions. utilizing the unique characteristics of BNNTs.

Kang, Jin Ho↗
NASA NTRS2016

Heatshield for Extreme Entry Environment Technology (HEEET) Development and Maturation Status for NF Missions

This poster provides an overview of the requirements, design, development and testing of the 3D Woven TPS being developed under NASA's Heatshield for Extreme Entry Environment Technology (HEEET) project. Under this current program, NASA is working to develop a Thermal Protection System (TPS) capable of surviving entry into Saturn. A primary goal of the project is to build and test an Engineering Test Unit (ETU) to establish a Technical Readiness Level (TRL) of 6 for this technology by 2017.

Extreme Entry Environment↗
NASA NTRS2012

High Temperature Piezoelectric Drill

Venus is one of the planets in the solar systems that are considered for potential future exploration missions. It has extreme environment where the average temperature is 460 deg C and its ambient pressure is about 90 atm. Since the existing actuation technology cannot maintain functionality under the harsh conditions of Venus, it is a challenge to perform sampling and other tasks that require the use of moving parts. Specifically, the currently available electromagnetic actuators are limited in their ability to produce sufficiently high stroke, torque, or force. In contrast, advances in developing electro-mechanical materials (such as piezoelectric and electrostrictive) have enabled potential actuation capabilities that can be used to support such missions. Taking advantage of these materials, we developed a piezoelectric actuated drill that operates at the temperature range up to 500 deg C and the mechanism is based on the Ultrasonic/Sonic Drill/Corer (USDC) configuration. The detailed results of our study are presented in this paper

Rock sampling↗
NASA NTRS2019

Thermal Protection System Technology Maturation and Sustainment in Support of In-situ Science Missions: HEEET and PICA

Among the challenges faced by the Entry Descent and Landing (EDL) community have been: the lack of a matured forebody heatshield thermal protection system (TPS) capable of meeting the demanding entry environments for the high priority in-situ science missions identified in the decadal survey at Venus, Saturn and the Ice Giants, and the continued sustainment of thermal protection systems/materials. In response to the identified shortfall in TPS technologies capable of extreme entry environments NASA's Space Technology Mission Directorate (STMD) and Science Mission Directorate (SMD) initiated the Heatshield for Extreme Entry Environment Technology (HEEET) project which has matured a 3D-Woven TPS to Technology Readiness Level 6 and which is ready for infusion into these high priority missions. During the development of HEEET long term sustainability was a key consideration. However existing TPS also continue to face sustainability issues. Phenolic Impregnated Carbon Ablator (PICA) has been/is being utilized by many SMD Missions (Stardust, Mars Science Laboratory, OSIRIS-Rex, Mars 2020, Dragonfly) and is under consideration for others including Mars Sample Return, so maintaining PICA for the long term is a priority for NASA. This presentation will discuss raw material sustainability challenges faced by PICA and the efforts by NASA to work with Fiber Materials Inc (FMI) to resolve these challenges with a more sustainable supply chain. In addition, NASA is working with FMI to increase the manufacturing scale for single piece PICA heatshields and to expand the aerothermal performance envelop maturing PICA for larger sized heatshield and more aggressive entry environments. This presentation will also identify challenges and limitations with these systems, particularly around understanding failure modes in these materials and systems and how understanding these may allow use of these systems in environments that are difficult to achieve in ground based testing.

Heatshield for Extreme Entry Environment Technolog↗
NASA NTRS2019

Thermal Protection System Technology Maturation and Sustainment in Support of In Situ Science Missions: HEEET and PICA

Challenges faced by the Entry Descent and Landing (EDL) community include the lack of a matured forebody heatshield thermal protection system (TPS) capable of meeting the demanding entry environments for the high priority in-situ science missions identified in the decadal survey at Venus, Saturn and the Ice Giants, and the continued sustainment of thermal protection systems/materials. In response to the identified shortfall in TPS technologies capable of extreme entry environments NASA's Space Technology Mission Directorate (STMD) and Science Mission Directorate (SMD) initiated the Heatshield for Extreme Entry Environment Technology (HEEET) project which has matured a 3D-Woven TPS to Technology Readiness Level 6 and which is ready for infusion into these high priority missions. During the development of HEEET long term sustainability was a key consideration. However existing TPS also continue to face sustainability issues. Phenolic Impregnated Carbon Ablator (PICA) has been/is being utilized by many SMD Missions (Stardust, Mars Science Laboratory, OSIRIS-Rex, Mars 2020, Dragonfly) and is under consideration for others including Mars Sample Return, so maintaining PICA for the long term is a priority for NASA. This presentation will discuss raw material sustainability challenges faced by PICA and the efforts by NASA to work with Fiber Materials Inc (FMI) to resolve these challenges with a more sustainable supply chain. In addition, NASA is working with FMI to increase the manufacturing scale for single piece PICA heatshields and to expand the aerothermal performance envelop maturing PICA for larger sized heatshield and more aggressive entry environments. This presentation will also identify challenges and limitations with these systems, particularly around understanding failure modes in these materials and systems and how understanding these may allow use of these systems in environments that are difficult to achieve in ground based testing

Phenolic Impregnated Carbon Ablator (PICA)↗
NASA NTRS2011

Operation of a New Half-Bridge Gate Driver for Enhancement - Mode GaN FETs, Type LM5113, Over a Wide Temperature Range

A new commercial-off-the-shelf (COTS) gate driver designed to drive both the high-side and the low-side enhancement-mode GaN FETs, National Semiconductor's type LM5113, was evaluated for operation at temperatures beyond its recommended specified limits of -40 C to +125 C. The effects of limited thermal cycling under the extended test temperature, which ranged from -194 C to +150 C, on the operation of this chip as well as restart capability at the extreme cryogenic and hot temperatures were also investigated. The driver circuit was able to maintain good operation throughout the entire test regime between -194 C and +150 C without undergoing any major changes in its outputs signals and characteristics. The limited thermal cycling performed on the device also had no effect on its performance, and the driver chip was able to successfully restart at each of the extreme temperatures of -194 C and +150 C. The plastic packaging of this device was also not affected by either the short extreme temperature exposure or the limited thermal cycling. These preliminary results indicate that this new commercial-off-the-shelf (COTS) halfbridge eGaN FET driver integrated circuit has the potential for use in space exploration missions under extreme temperature environments. Further testing is planned under long-term cycling to assess the reliability of these parts and to determine their suitability for extended use in the harsh environments of space.

Patterson, Richard↗
NASA NTRS2019

Regolith Particle Erosion of Material in Aerospace Environments

This paper studies the effect of exposing thermal control S13GP:6N/LO-I white paint, Kapton flex cable, fiber optic cable, HEPA filter, and M55J graphite composite to high-velocity regolith environment that spacecraft landing on Mars are commonly exposed to. Due to the similarity between the Mars 2020 Rover design and Mars Science Laboratory design, it is expected that the Mars 2020 rover will be exposed to a similar high-speed regolith environment that the Mars Science Laboratory was exposed to. This environment is replicated to test the survivability of susceptible materials. The testing is performed at the University of Dayton Research Institute in Dayton, Ohio. The experiments expose different materials to basaltic–like particles ranging in size from approximately 40 μm to 2 cm, at velocities ranging from 19 m/s to 250 m/s, with varied particle fluxes (measured in mg/cm2). Depending on the size of the particle used, the particles can either embed in or erode the material. Posttest analysis shows that all materials tested will survive the expected environment observed during the Mars 2020 landing event. Some materials are tested to failure in order to better characterize material response. Materials that fail in some test scenarios include the paint, fiber optic cable, and the graphite composite. After being exposed to regolith, the α/ε ratio of the paint increased by ~37% due to particles embedding in the paint. Darkening of the paint can negatively affect thermal control of the rover. With high particle mass fluxes, the paint eventually degraded enough to expose the aluminum substrate. When impacted by a 1.5 cm particle traveling at 20 m/s, the fiber optic cable did not sever, but the impact did cause the cable to deform enough to crack the glass, which resulted in a significant increase in attenuation, rendering the cable unable to transmit data. The graphite composite also failed when exposed to high particle fluxes. All of the observed failures occurred for test cases above the expected landing environment with significant margin. Tests performed beyond the requirements help characterize how well these materials will survive in even more extreme environments for future missions.

Abid, Mohamed↗
NASA NTRSDate not supplied

Establishing Standardized Test Methods for Evaluating Space Suit Gloves

The Artemis space suit glove environmental protection garment (EPG) will be the first line of protection used to shield the crewmember’s hands from the environments encountered during extravehicular activity (EVA). As the Artemis missions will include more extreme environments than those experienced on the International Space Station, development, verification, and validation of gloves poses three key challenges. First, there are no standardized tests defined to evaluate the durability of space suit gloves for the extreme lunar environments, particularly the permanently shadowed regions. Second, there is insufficient data on state-of-the-art glove performance in a lunar environment from which to compare new designs. Third, current ISS glove Thermal Micrometeoroid Garment (TMG) fabrics are unlikely to be sufficient to meet Lunar requirements. It is therefore necessary to define tests to evaluate if gloves can meet new, challenging requirements. This paper focuses on the development of a test procedure to characterize lunar EVA glove fabrics using ASTM standardized test methods and the design and validation of a new standardized test procedure for comparing abrasion resistance between fabrics in lunar-like conditions. The results of testing on twelve candidate EVA glove fabrics are presented.

Robert J. Jones↗
NASA NTRSDate not supplied

Validation Testing and Statistical Analysis of the Rotary Tumbler Fabric Abrasion Method

The Artemis space suit glove environmental protection garment (EPG) will be the first line of protection used to shield the crewmember’s hands from the environments encountered during extravehicular activity (EVA). As the Artemis missions will include more extreme environments than those experienced on the International Space Station, development, verification, and validation of gloves requires the development of new test methods. A previous paper focused on the development of a test procedure to characterize lunar EVA glove fabrics using ASTM standardized test methods and the design and validation of a new standardized test procedure for comparing abrasion resistance between fabrics using a dust and rock filled rotary tumbler. Preliminary results of testing were presented in that paper. This paper reports on the validation testing and statistical analysis of the newly developed tumbler abrasion test method.

Robert J Jones↗
NASA NTRS2001

Evolvable Hardware for Extreme Environments: Hot or Cold

Temperature tolerant electronics and long life survivability are key capabilities required for future NASA/JPL missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques, e.g., as offered by bias cancellation circuits, have also been employed. This paper presents a novel approach, based on evolvable hardware technology, which allows adaptive in situ circuit redesign/reconfiguration during the operation in the environment. This technology would complement material/device advancements and bring closer the success of missions in harsh environments. Additional information is contained in the original extended abstract.

Stoica, A.↗
NASA NTRS2006

Extreme Temperature Electronics Using a Reconfigurable Analog Array

Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. Previous work presented a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. This work describes a new reconfigurable analog chip developed by JPL and SPAWAR that is targeted for extreme temperature and evolutionary hardware experiments. Being based on Gm-C technology, this chip can have its functionality tuned and adapted to extreme temperatures through voltage bias adjustment. This tuning process will be controlled by Evolutionary Algorithms. This paper presents details of the reconfigurable analog chip as well as a system level overview. Some early experiments are also described.

evolvable hardware↗
NASA NTRS2006

Radioisotope Power Systems for In-situ Exploration of Titan and Venus

This viewgraph presentation reviews the timeline for the robotic in situ investigation of Titan and Venus, and the use of radioisotope power systems in this exploration. The atmospheric and surface conditions of both sites are reviewed. The presentation also examines the conceptual design of the Venus Mobile Explorer and the Titan orbiter and in situ explorer. After this the presentation reviews the radioisotope power systems for each of the vehicles, with some explanation of the different requirements based on the vastly different environments that they would be investigating

mission concepts↗
NASA NTRS2013

Woven Thermal Protection System Based Heat-shield for Extreme Entry Environments Technology (HEEET)

NASA's future robotic missions utilizing an entry system into Venus and the outer planets, namely, Saturn, Uranus, Neptune, result in extremely high entry conditions that exceed the capabilities of state of the art low to mid density ablators such as PICA or Avcoat. Therefore mission planners typically assume the use of a fully dense carbon phenolic heat shield similar to what was flown on Pioneer Venus and Galileo. Carbon phenolic is a robust TPS material however its high density and relatively high thermal conductivity constrain mission planners to steep entries, with high heat fluxes and pressures and short entry durations, in order for CP to be feasible from a mass perspective. The high entry conditions pose challenges for certification in existing ground based test facilities and the longer‐term sustainability of CP will continue to pose challenges. In 2012 the Game Changing Development Program (GCDP) in NASA's Space Technology Mission Directorate funded NASA ARC to investigate the feasibility of a Woven Thermal Protection System (WTPS) to meet the needs of NASA's most challenging entry missions. This project was highly successful demonstrating that a Woven TPS solution compares favorably to CP in performance in simulated reentry environments and provides the opportunity to manufacture graded materials that should result in overall reduced mass solutions and enable a much broader set of missions than does CP. Building off the success of the WTPS project GCDP has funded a follow on project to further mature and scale up the WTPS concept for insertion into future NASA robotic missions. The matured WTPS will address the CP concerns associated with ground based test limitations and sustainability. This presentation will briefly discuss results from the WTPS Project and the plans for WTPS maturation into a heat‐shield for extreme entry environment.

Ellerby, Donald↗
NASA NTRS2013

Woven Thermal Protection System Based Heat-shield for Extreme Entry Environments Technology (HEEET)

NASA's future robotic missions utilizing an entry system into Venus and the outer planets, namely, Saturn, Uranus, Neptune, result in extremely severe entry conditions that exceed the capabilities of state of the art low to mid density ablators such as PICA or Avcoat. Therefore mission planners typically assume the use of a fully dense carbon phenolic heat shield similar to what was flown on Pioneer Venus and Galileo. Carbon phenolic (CP) is a robust TPS material however its high density and relatively high thermal conductivity constrain mission planners to steep entries, with high heat fluxes and pressures and short entry durations, in order for CP to be feasible from a mass perspective. The high entry conditions pose challenges for certification in existing ground based test facilities and the longer-­‐term sustainability of CP will continue to pose challenges. In 2012 the Game Changing Development Program (GCDP) in NASA's Space Technology Mission Directorate funded NASA ARC to investigate the feasibility of a Woven Thermal Protection System (WTPS) to meet the needs of NASA's most challenging entry missions. This project was highly successful demonstrating that a Woven TPS solution compares favorably to CP in performance in simulated reentry environments and provides the opportunity to manufacture graded materials that should result in overall reduced mass solutions and enable a much broader set of missions than does CP. Building off the success of the WTPS project GCDP has funded a follow on project to further mature and scale up the WTPS concept for insertion into future NASA robotic missions. The matured WTPS will address the CP concerns associated with ground based test limitations and sustainability. This presentation will briefly discuss results from the WTPS Project and the plans for WTPS maturation into a heat-­‐shield for extreme entry environment.

Chinnapongse, Ronald↗
NASA NTRS2008

Extreme High and Low Temperature Operation of the Silicon-On-Insulator Type CHT-OPA Operational Amplifier

A new operational amplifier chip based on silicon-on-insulator technology was evaluated for potential use in extreme temperature environments. The CHT-OPA device is a low power, precision operational amplifier with rail-to-rail output swing capability, and it is rated for operation between -55 C and +225 C. A unity gain inverting circuit was constructed utilizing the CHT-OPA chip and a few passive components. The circuit was evaluated in the temperature range from -190 C to +200 C in terms of signal gain and phase shift, and supply current. The investigations were carried out to determine suitability of this device for use in space exploration missions and aeronautic applications under wide temperature incursion. Re-restart capability at extreme temperatures, i.e. power switched on while the device was soaked at extreme temperatures, was also investigated. In addition, the effects of thermal cycling under a wide temperature range on the operation of this high performance amplifier were determined. The results from this work indicate that this silicon-on-insulator amplifier chip maintained very good operation between +200 C and -190 C. The limited thermal cycling had no effect on the performance of the amplifier, and it was able to re-start at both -190 C and +200 C. In addition, no physical degradation or packaging damage was introduced due to either extreme temperature exposure or thermal cycling. The good performance demonstrated by this silicon-on-insulator operational amplifier renders it a potential candidate for use in space exploration missions or other environments under extreme temperatures. Additional and more comprehensive characterization is, however, required to establish the reliability and suitability of such devices for long term use in extreme temperature applications.

Patterson, Richard↗
NASA NTRS2019

Heatshield for Extreme Entry Environment Technology (HEEET) Thermal Protection System (TPS)

Over the last 5 years, the Heatshield for Extreme Entry Environment Technology (HEEET) project has been working to mature a 3-D Woven Thermal Protection System (TPS) to Technical Readiness Level (TRL) 6 to support future NASA missions to destinations with extreme entry environments such as Venus, Saturn, Uranus, Neptune and high speed sample return missions to Earth. A key aspect of the project has been the building and testing of a 1-meter base diameter Engineering Test Unit (ETU) representative of what could be used for a Saturn probe. This paper provides a high level overview of the HEEET project including manufacturing and testing of the ETU which has been subjected to mission relevant thermal and mechanical loads, to verify structural models, establish system capability and verify manufacturing workmanship.

TPS↗