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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Structures and Materials Research at NASA Langley Research Center

NASA explores the unknown in air and space, innovates for the benefit of humanity, and inspires the world through discovery. The Structures and Materials discipline at NASA Langley Research Center supports this mission through advanced materials and manufacturing approaches applied to innovative structural concepts. We start with synthesizing novel material systems and applying tools and methods to predict and validate their static, dynamic, durability and damage tolerance behavior. We mature materials from test tube to test flight by developing manufacturing techniques that enable the advancement of aerospace structures from concept to reality. We develop advanced measurement techniques for health management and nondestructive evaluation. We draw on our structures and materials core capabilities to enable safe, reliable lightweight aerospace structures for application in all environments. You will find the results of our work in the assembly of large structures in space and on other planets, vehicles that carry crew into space, vehicles that operate at high speeds and in extreme environments, and technology for passenger and crew safety in commercial aviation. This presentation will provide an overview of Langley Research Center’s role within the agency, then focus on how current Structures and Materials research areas support a variety of NASA missions in space operations, exploration, and aeronautics.

Structures↗
NASA NTRSDate not supplied

Rocket Lab Venus - Enabling Low-Cost Interplanetary Missions

Rocket Lab’s mission to Venus, launching in January 2025, aims to demonstrate that small launch vehicles, such as Electron, and high-energy small spacecraft, such as Photon, can enable a new paradigm of regular, low-cost interplanetary missions. The primary science mission involves a small ~20 kg direct entry probe that will sample the Venusian cloud layers with an autofluorescing nephelomoeter. The entry probe thermal protection system (TPS) is even more critical than usual due to the selected entry trajectory and the lack of suitable heritage TPS materials. NASA’s newly developed 3D Woven Carbon Phenolic, a derivative of the Heatshield for Extreme Entry Environment Technology (HEEET) material, is an enabling technology for this mission, and it will comprise the probe forebody heat shield. The work that led to the selection of 3D Woven Carbon Phenolic, the TPS cost-reduction approaches taken, and the future possibilities of such an approach to probe development are presented.

Lyle Campbell↗
NASA NTRSDate not supplied

Parametric Analysis of Entry Vehicles for Giant Planet Missions

The Planetary Science Decadal Survey has identified Uranus and Saturn as high priori-ty destinations for a flagship and New Frontier missions respectively in the decade 2023-2032. The pro-posed presentation will focus on the entry and descent aspects of the entry vehicles design, considered as part of Giant Planet probe mission concepts, and associated trades for viable trajectory options. Giant Planet Entry Vehicle Parametric Study: Launch vehicle capabilities are evolving and provide an opportunity to increase instrumented probe dimensions. To assess the impact of larger aeroshell designs, a parametric study was conducted to understand the impact on aerothermal environments, TPS options, and TPS mass over a range of 1.0m to 2.0m aeroshell diameters for Uranus and Saturn probe concept missions. The 45° sphere-cone geometry is a legacy configuration that has demonstrated static stability and been used successfully in missions to Venus (Pioneer-Venus) and Jupiter (Galileo). A nose radius of 0.4 m was considered primarily to reduce the heat flux at the stagnation point compared to the smaller radii used in the Venus and Jupiter missions. Representative inertial velocities are chosen from a prior NASA Ames study. Viable entry trajectories to meet concept mission and science objectives were developed using the tool POST2. The newly developed thermal protection material called HEEET (Heatshield for Extreme Entry Environment Technology) was considered in the study. This material, which is at a technology readiness level (TRL) of 6, is highly customizable and available in two varieties: (i) a dual-layer version consisting of recession layer on top of an insulative layer, and (ii) a single-layer version consisting of the insulative layer alone, termed 3- dimensional Mid-Density Carbon Phenolic (3MDCP). Both options were considered for the forward heatshield (the sphere-cone part) in the pre-sent study.

Thermal Protection System↗
NASA NTRSDate not supplied

Rocket Lab Venus - Enabling Low-Cost Interplanetary Missions

Rocket Lab’s mission to Venus [1], launching in January 2025, aims to demonstrate that small launch vehicles, such as Electron, and high-energy small spacecraft, such as Photon, can enable a new paradigm of regular, low-cost interplanetary missions. The Electron launch vehicle will deliver the Photon spacecraft carrying the entry probe into low earth orbit, at which point Photon will take over and put both itself and the attached probe on an Earth-Venus transfer trajectory, with assistance from a Lunar flyby. The primary science objective of the mission is to sample the Venusian cloud layers between atitudes of 45 and 60 km above the surface with an autofluorescing nephelometer. The ~1kg scientific instrument will be carried by a small ~17 kg direct entry probe which will separate from the Photon spacecraft approximately 30 minutes prior to atmospheric entry. The probe outer mould line is a scaled down version of the Deep Space 2 probes [2]. NASA’s newly developed 3D Woven Carbon Phenolic, a derivative of the Heatshield for Extreme Entry Environment Technology (HEEET) material [3], is an enabling technology for this mission, and it will comprise the probe forebody heat shield.The probe will communicate directly back to the Earth during its descent via a small on-board radio frequency (RF) antenna. The hyperbolic Venus encounter will see the probe enter the Venusia atmosphere at approximately 11 km/s with an entry flight path angle (EFPA) of about 10°. This relatively low entry angle was selected to increase the duration of the descent phase, reduce the peak deceleration, and reduce the sensitivity of the nominal entry environments to navigational errors. For reference, the Pioneer Venus probes entered at EFPAs varying from about 25° to 70°, resulting in peak decelerations between around 220 and 450 g’s and peak stagnation point heat fluxes ranging from about 40 to 75 MW/m2 [4]. In comparison, the Rocket Lab Venus probe will experience a lower preak deceleration of around 60 g’s and a lower peak stagnation point heat flux of about 15 MW/m2, at the cost of a greater total heat load and correspondingly higher thermal protection system (TPS) mass fraction. This paper recounts the development history of the TPS for the Rocket Lab Venus probe, with a focus on the unique requirements of the mission. In particular, the effect on the TPS design of the mission’s tight budget, short development timeline, slim mass and RF link margins, and mild but long duration entry heating. Rocket Lab’s initial investigations into a ‘hybrid’ TPS [5] based on a scaled version of the Pioneer Venus full-density carbon phenolic forebody shield, and the abandonment of this approach in favour of NASA’s 3D Woven Carbon Phenolic is presented. Additionally, the leveraging of previous testing under the HEEET project at higher conditions and the associated TPS margining strategy that was adopted to avoid the need for extensive mission-specific arc jet testing is discussed. Finally, this paper concludes with a brief consideration of the feasibility of a future low-cost aerocapture technology demonstrator mission based on the 2025 Rocket Lab Venus mission and entry probe.

Lyle Campbell↗
NASA NTRSDate not supplied

3D Woven Mid-Density Carbon Phenolic (3MDCP) Full-Scale Heatshield Development for Mars Sample Return (MSR) Earth Entry System (EES)

The Mars Sample Return (MSR) mission will be returning samples of Martian soil to Earth. The samples will be returned in the Earth Entry System (EES). The EES capsule is protected by a new thermal protection system; the 3-Dimensionally Woven, Mid-Density, Carbon Phenolic (3MDCP) material which is derived from the Heatshield for Extreme Entry Environment Technology (HEEET). The baseline 3MDCP design is a single piece thermal protection system that avoids the manufacturing and certification challenges associated with a tiled configuration. A 3MDCP heatshield begins as a flat woven preform that is formed to the final heatshield shape and then infused with phenolic resin. A NASA Ames lead team, in collaboration with Spirit Textiles (formerly TEAM Inc.), Fiber Materials Inc. (FMI, a Spirit AeroSystems Company), and Kratos SRE, has been developing and demonstrating the processes to fabricate the 3MDCP heatshield and characterize the resulting properties. The process of forming the flat woven preform into the final heatshield shape, a sphere-cone geometry with a 52.5° cone angle, involves local but substantial movement of the yarns in the weave. This results in continuous fibers across the single piece heatshield, albeit with property variations between different regions of the heatshield. This presentation will provide a high-level status of 3MDCP development for the MSR EES heatshield. This will include an overview of the manufacturing processes with an emphasis on the impact of forming on fiber orientation, material properties, and performance. Results comparing preliminary formed and flat materials will be shown. Additionally, the presentation will layout the broader plan for property testing and tie-in to aerothermal performance.

Peter Edward Marshall↗
NASA NTRSDate not supplied

3D Woven Mid-Density Carbon Phenolic (3MDCP) Thermal Protection System Development

3-Dimensionally Woven, Mid-Density, Carbon Phenolic (3MDCP) Thermal Protection System (TPS) material is derived from the dual layer 3D woven Heatshield for Extreme Entry Environment Technology (HEEET) material. The baseline 3MDCP design is a single piece thermal protection system that avoids the manufacturing and certification challenges associated with a tiled configuration. 3MDCP is targeted for very aggressive entry environments such as high-speed sample return missions to Earth and missions to Saturn, Venus and the ice giants. A 3MDCP heatshield begins as a flat woven preform that is formed to a given heatshield shape and then infused with phenolic resin. NASA Ames, in collaboration with TEAM Inc. (weaving) and Fiber Materials Inc. (both Spirit AeroSystems Companies) have been developing and demonstrating the manufacturing processes to fabricate a 3MDCP heatshield at a diameter of 1.25 meters. The process of forming the flat woven preform into the final heatshield shape, a sphere-cone geometry, involves local movement of the yarns in the weave. This results in a single piece heatshield with continuous fibers, albeit with property variations between different regions on the heatshield. This presentation will provide a high-level status of 3MDCP development. This will include an overview of the manufacturing processes, with an emphasis on the impact of forming on fiber orientation, material properties and performance. The presentation will layout the plan for testing to assess the impact of forming on properties and review preliminary data comparing properties of flat to formed materials.

Thermal Protection System↗
NASA NTRSDate not supplied

Multiscale and Multifidelity Modeling of a 3D Woven Composite Thermal Protection System

Complex three-dimensional (3D) woven composites have been considered by multiple NASA projects in recent years as a means of offering improved mechanical and thermal performance over traditional laminated composite systems. Parallel efforts have focused on developing simulation capabilities for these systems, which have traditionally and heavily relied on experimental testing to evaluate composite performance. One system is the Heatshield for Extreme Entry Environment Technology (HEEET), which is being considered for the thermal protection system on reentry spacecraft. Optical microscopy was used to characterize the blended carbon and phenolic fiber tows. A section of HEEET insulation layer was imaged with high-resolution micro-computed tomography (microCT) and segmented to separate individual tows, porous matrix, and voids. These data were used to develop multiscale thermomechanical computational models within the NASA Multiscale Analysis Tool (NASMAT). Two NASMAT modeling approaches were considered to capture the details of the 3D woven architecture: a coarse model appropriate for inclusion in multiscale structural analyses and a high-fidelity model created by downsampling the microCT data. Both elastic and thermal properties were computed and compared. The feasibility and challenges associated with modeling complex, hybrid 3D woven composites were also addressed.

NASMAT↗
NASA NTRS2016

Silicon-Carbide Power MOSFET Performance in High Efficiency Boost Power Processing Unit for Extreme Environments

Silicon-Carbide device technology has generated much interest in recent years. With superior thermal performance, power ratings and potential switching frequencies over its Silicon counterpart, Silicon-Carbide offers a greater possibility for high powered switching applications in extreme environment. In particular, Silicon-Carbide Metal-Oxide- Semiconductor Field-Effect Transistors' (MOSFETs) maturing process technology has produced a plethora of commercially available power dense, low on-state resistance devices capable of switching at high frequencies. A novel hard-switched power processing unit (PPU) is implemented utilizing Silicon-Carbide power devices. Accelerated life data is captured and assessed in conjunction with a damage accumulation model of gate oxide and drain-source junction lifetime to evaluate potential system performance at high temperature environments.

Ikpe, Stanley A.↗
NASA NTRS2006

Extreme Temperature Electronics Using a Reconfigurable Analog Array

Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. Previous work presented a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. This work describes a new reconfigurable analog chip developed by JPL and SPAWAR that is targeted for extreme temperature and evolutionary hardware experiments. Being based on Gm-C technology, this chip can have its functionality tuned and adapted to extreme temperatures through voltage bias adjustment. This tuning process will be controlled by Evolutionary Algorithms. This paper presents details of the reconfigurable analog chip as well as a system level overview. Some early experiments are also described.

evolvable hardware↗
NASA NTRS2015

An Overview of 2014 SBIR Phase I and Phase II Materials Structures for Extreme Environments

NASA's Small Business Innovation Research (SBIR) program focuses on technological innovation by investing in development of innovative concepts and technologies to help NASA mission directorates address critical research needs for Agency programs. This report highlights nine of the innovative SBIR 2014 Phase I and Phase II projects that emphasize one of NASA Glenn Research Center's six core competencies-Materials and Structures for Extreme Environments. The technologies cover a wide spectrum of applications such as high temperature environmental barrier coating systems, deployable space structures, solid oxide fuel cells, and self-lubricating hard coatings for extreme temperatures. Each featured technology describes an innovation, technical objective, and highlights NASA commercial and industrial applications. This report provides an opportunity for NASA engineers, researchers, and program managers to learn how NASA SBIR technologies could help their programs and projects, and lead to collaborations and partnerships between the small SBIR companies and NASA that would benefit both.

barrier coating system; deployable space structure↗
NASA NTRS2001

Electronics for Extreme Environments

Most of the NASA missions involve extreme environments comprising radiation and low or high temperatures. Current practice of providing friendly ambient operating environment to electronics costs considerable power and mass (for shielding). Immediate missions such as the Europa orbiter and lander and Mars landers require the electronics to perform reliably in extreme conditions during the most critical part of the mission. Some other missions planned in the future also involve substantial surface activity in terms of measurements, sample collection, penetration through ice and crust and the analysis of samples. Thus it is extremely critical to develop electronics that could reliably operate under extreme space environments. Silicon On Insulator (SOI) technology is an extremely attractive candidate for NASA's future low power and high speed electronic systems because it offers increased transconductance, decreased sub-threshold slope, reduced short channel effects, elimination of kink effect, enhanced low field mobility, and immunity from radiation induced latch-up. A common belief that semiconductor devices function better at low temperatures is generally true for bulk devices but it does not hold true for deep sub-micron SOI CMOS devices with microscopic device features of 0.25 micrometers and smaller. Various temperature sensitive device parameters and device characteristics have recently been reported in the literature. Behavior of state of the art technology devices under such conditions needs to be evaluated in order to determine possible modifications in the device design for better performance and survivability under extreme environments. Here, we present a unique approach of developing electronics for extreme environments to benefit future NASA missions as described above. This will also benefit other long transit/life time missions such as the solar sail and planetary outposts in which electronics is out open in the unshielded space at the ambient space temperatures and always exposed to radiation. Additional information is contained in the original extended abstract.

Patel, J. U.↗
NASA NTRS1999

Future X Pathfinder: Quick, Low Cost Flight Testing for Tomorrow's Launch Vehicles

The DC-X and DC-XA Single Stage Technology flight program demonstrated the value of low cost rapid prototyping and flight testing of launch vehicle technology testbeds. NASA is continuing this important legacy through a program referred to as Future-X Pathfinder. This program is designed to field flight vehicle projects that cost around $100M each, with a new vehicle flying about every two years. Each vehicle project will develop and extensively flight test a launch vehicle technology testbed that will advance the state of the art in technologies directly relevant to future space transportation systems. There are currently two experimental, or "X" vehicle projects in the Pathfinder program, with additional projects expected to follow in the near future. The first Pathfinder project is X-34. X-34 is a suborbital rocket plane capable of flights to Mach 8 and 75 kilometers altitude. There are a number of reusable launch vehicle technologies embedded in the X-34 vehicle design, such as composite structures and propellant tanks, and advanced reusable thermal protection systems. In addition, X-34 is designed to carry experiments applicable to both the launch vehicle and hypersonic aeronautics community. X-34 is scheduled to fly later this year. The second Pathfinder project is the X-37. X-37 is an orbital space plane that is carried into orbit either by the Space Shuttle or by an expendable launch vehicle. X-37 provides NASA access to the orbital and orbital reentry flight regimes with an experimental testbed vehicle. The vehicle will expose embedded and carry-on advanced space transportation technologies to the extreme environments of orbit and reentry. Early atmospheric approach and landing tests of an unpowered version of the X-37 will begin next year, with orbital flights beginning in late 2001. Future-X Pathfinder is charting a course for the future with its growing fleet of low-cost X- vehicles. X-34 and X-37 are leading the assault on high launch costs and enabling the flight testing of technologies that will lead to affordable access to space.

London, John, III↗
NASA NTRSDate not supplied

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗
NASA NTRSDate not supplied

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗
NASA NTRS2023

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗