Electric heating for metal surface hardening
Electrical element heats only desired area and permits precise control of temperature and cooling rate. Process serves as alternative to flame hardening for treating localized areas.
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Electrical element heats only desired area and permits precise control of temperature and cooling rate. Process serves as alternative to flame hardening for treating localized areas.
Results of the device characterization program to identify components of the Mariner Jupiter/Saturn spacecraft in need of radiation hardening to meet a total dose requirement of 5 trillion e/sq cm are presented. The parts to be tested, including bipolar transistors, JFETs, SCRs, CMOS devices, linear integrated circuits, Zener diodes and other radiation-sensitive parts, were identified by a worst case circuit analysis of the 20 major subsystems. The test samples were exposed to several levels of irradiation from a Dynamitron electron accelerator capable of producing a steady stream of electrons at energies up to 2.5 eV. The electrical parameters of the devices were measured immediately following irradiation to prevent annealing. CMOS devices and linear devices showed the most severe degradation in a moderate radiation environment, and significant degradation was produced at low current in bipolar transistors. Three methods used for screening a number of devices determined by circuit and shielding analyses to be unacceptable radiation-sensitive are described: diffusion and metallization lot screening; wafer lot screening; and irradiation-anneal screening.
The tangent stiffness and pseudo force forms of the equations of motion are first derived within the context of a total Lagrangian formulation. After a brief discussion of available incremental theory plasticity models, the small strain formulations and computational procedures of the mechanical sublayer model and combined kinematic-isotropic hardening as used in the general purpose structural analysis program AGGIE I are presented. Several sample problems are then presented along with recommended guidelines for use of the two plasticity models.
Damage occurs again and again in practice in the form of transmissions with surface hardened gears which break after a very long operating time (explained by seldom occurring jerky loads). Gear drives are frequently exposed to jerky stresses which are greater than their fatigue limit. These stresses are considered in gear calculations, first, by shock factors when the transmission is to be designed as high endurance with regard to overloads and, second, in the form of operating ratios when the design is to be time enduring with regard to overloads. The size of the operating ratio depends not only on torque characteristics, drive and processing machine, but also on the material and heat treatment.
The resistance of the martensitic precipitation hardening stainless steels PH13-8Mo, 15-5PH, and 17-4PH to stress corrosion cracking was investigated. Round tensile and c-ring type specimens taken from several heats of the three alloys were stressed up to 100 percent of their yield strengths and exposed to alternate immersion in salt water, to salt spray, and to a seacoast environment. The results indicate that 15-5PH is highly resistant to stress corrosion cracking in conditions H1000 and H1050 and is moderately resistant in condition H900. The stress corrosion cracking resistance of PH13-8Mo and 17-4PH stainless steels in conditions H1000 and H1050 was sensitive to mill heats and ranged from low to high among the several heats included in the tests. Based on a comparison with data from seacoast environmental tests, it is apparent that alternate immersion in 3.5 percent salt water is not a suitable medium for accelerated stress corrosion testing of these pH stainless steels.
Measurements of hardness, thermal emf, and electrical resistance were used to study the effects of Co, Mo, Ti and Al contents on aging and hardening processes in Fe 20%Ni steel. It is shown that the effects of these alloying elements differ substantially. Anomalies which arise in the temperature dependence of physical properties due to the presence of cobalt and molybdenum are reduced by the inclusion of titanium and aluminum (and vice versa).
An advanced, second generation, bulk, Si-gate CMOS process is described. This process is capable of producing LSI and VLSI parts that are latch-up free and hardened to total dose levels in excess of 2 x 10 to the 5th rad-Si for applications in space and weapons radiation environments. Two memories designed to use this process are also described. Both circuits are 4096-bit, static CMOS RAMs.
A radiation hardened version of the C2L process has been developed that utilizes all-low-temperature processes subsequent to channel oxidation. This process has been used on 1K RAMS. The RAMs functioned reliably at a dose of 200,000 rads (Si) and failed at a dose of 500,000 rads (Si). The 1K RAM is capable of operating from 7.5 to 12 volts and has an access time from address change of 160 nsec at 10 volts
Elastic constants of three maraging steels were determined by measuring ultrasonic velocities. Annealed steels show slightly lower bulk moduli and considerably lower shear moduli than hardened steels. All the elastic constants (Young's modulus, shear modulus, bulk modulus and Poisson's ratio) show regular temperature behavior between 76 and 400 K. Young's modulus and the shear modulus increase with increasing yield strength, but the bulk modulus and Poisson's ratio are relatively unchanged. Elastic anisotropy is quite small.
Experimental evidence of thermomechanical history dependence on the cyclic hardening behavior of a representative combustor liner material Hastelloy-X is presented, along with a discussion about the relevant concept of thermomechanical path dependence. Based on the experimental results, a discussion is given on the inadequacy of formulating nonisothermal constitutive equations solely on the basis of isothermal testing. Finally, the essence of a mathematical representation of thermoviscoplasticity is presented that qualitatively accounts for the observed hereditary behavior. This is achieved by formulating the scaler evolutionary equation in an established viscoplastic theory to reflect thermomechanical path dependence. Although the necessary nonisothermal tests for further quantifying the thermoviscoplastic model have been identified, such data are not yet available.
The anisotropy of high temperature strength of nickel-base superalloy, Alloy 454, in service for advanced jet engine turbine blades and vanes, was investigated. Crystallographic orientation dependence of tensile yield strength, creep and creep rupture strength was found to be marked at about 760C. In comparison with other single crystal data, a larger allowance in high strength off-axial orientation from the 001 axis, and relatively poor strength at near the -111 axis were noted. From transmission electron microscopy the anisotropic characteristics of this alloy were explained in terms of available slip systems and stacking geometries of gamma-prime precipitate cuboids which are well hardened by a large tantalum content. 100 cube slip was considered to be primarily responsible for the poor strength of the -111 axis orientation replacing the conventional 111 plane slip systems.
The method by which a commercial 4K CMOS PROM with polysilicon fuses was hardened and the feasibility of applying this method to a 16K PROM are presented. A description of the process and the necessary minor modifications to the original layout are given. The PROM circuit and discrete device characteristics over radiation to 1000K rad-Si are summarized. The dose rate sensitivity of the 4K PROMs is also presented.
It has been found that the fatigue crack growth rate in aluminum alloys increases significantly in the presence of moisture. This phenomenon along with a moisture effect observed in another context has been attributed to 'embrittlement' of the aluminum by absorbed hydrogen generated by the reaction of moisture with freshly exposed aluminum. A description is given of a number of age hardening experiments involving 2024 aluminum. These experiments show that a mechanism related to the segregation of absorbed hydrogen to the coherent theta-double-prime interfaces may account for the observed reduction in fatigue life. It is pointed out that this segregation promotes a loss of coherency in the hydrogen rich region at a fatigue crack tip. Subsequently, the loss of coherency causes local softening and reduces fatigue life.
Spur gear surface endurance tests were conducted to investigate CBN ground AISI 9310 spur gears for use in aircraft applications, to determine their endurance characteristics and to compare the results with the endurance of standard vitreous ground AISI 9310 spur gears. Tests were conducted with VIM-VAR AISI 9310 carburized and hardened gears that were finish ground with either CBN or vitreous grinding methods. Test conditions were an inlet oil temeprature of 320 K (116 F), an outlet oil temperature of 350 K (170 F), a maximum Hertz stress of 1.71 GPa (248 ksi), and a speed of 10,000 rpm. The CBN ground gears exhibited a surface fatigue life that was slightly better than the vitreous ground gears. The subsurface residual stress of the CBN ground gears was approximately the same as that for the standard vitreous ground gears for the CBN grinding method used.
Several technologies, including bulk and epi CMOS, CMOS/SOI-SOS (silicon-on-insulator-silicon-on-sapphire), CML (current-mode logic), ECL (emitter-coupled logic), analog bipolar (JI, single-poly DI, and SOI) and GaAs E/D (enhancement/depletion) heterojunction MESFET, are discussed. The discussion includes the direct effects of space radiation on microelectronic materials and devices, how these effects are evidenced in circuit and device design parameter variations, the particular effects of most significance to each functional class of circuit, specific techniques for hardening high-speed circuits, design examples for integrated systems, including operational amplifiers and A/D (analog/digital) converters, and the computer simulation of radiation effects on microelectronic ISs.
An investigation was conducted to determine the age-hardening response and cryogenic mechanical properties of superplastic Al-Cu-Li-Zr-In alloys. Two alloys with compositions Al-2.65Cu-2.17Li-O.13Zr (baseline) and Al-2.60Cu-2.34Li-0.16Zr-0.17In were scaled-up from 30 lb permanent mold ingots to 350 lb DC (direct chill) ingots and thermomechanically processed to 3.2 mm thick sheet. The microstructure of material which contained the indium addition was partially recrystallized compared to the baseline suggesting that indium may influence recrystallization behavior. The indium-modified alloy exhibited superior hardness and strength compared to the baseline alloy when solution-heat-treated at 555 C and aged at 160 C or 190 C. For each alloy, strength increased and toughness was unchanged or decreased when tested at - 185 C compared to ambient temperature. By using optimized heat treatments, the indium-modified alloy exhibited strength levels approaching those of the baseline alloy without deformation prior to aging. The increase in strength of these alloys in the T6 condition make them particularly attractive for superplastic forming applications where post-SPF parts cannot be cold deformed to increase strength.
A Multipurpose Hardened Spacecraft Multilayer Insulation (MLI) system was developed and implemented to meet diverse survivability and performance requirements. Within the definition and confines of a MLI assembly (blanket), the design: (1) provides environmental protection from natural and induced nuclear, thermal, and electromagnetic radiation; (2) provides adequate electrostatic discharge protection for a geosynchronous satellite; (3) provides adequate shielding to meet radiated emission needs; and (4) will survive ascent differential pressure loads between enclosed volume and space. The MLI design is described which meets these requirements and design evolution and verification is discussed. The application is for MLI blankets which closeout the area between the laser crosslink subsystem (LCS) equipment and the DSP spacecraft cabin. Ancillary needs were implemented to ease installation at launch facility and to survive ascent acoustic and vibration loads. Directional venting accommodations were also incorporated to avoid contamination of LCS telescope, spacecraft sensors, and second surface mirrors (SSMs).
Greater attention is being focused on the protection of data I/O ports since both experience and lab tests have shown that components at these locations are extremely vulnerable to electrical overstress (EOS) in the form of transient voltages. Lightning and electrostatic discharge (ESD) are the major contributors to these failures; however, these losses can be prevented. Hardening against transient voltages at both the board level and system level has a proven record of improving reliability by orders of magnitude. The EOS threats, typical failure modes, and transient voltage mitigation techniques are reviewed. Case histories are also reviewed.