Search NASA⌕ Search

SEARCH · Search NASA

Results for “high reliability”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1971

Design study for a high reliability five-year spacecraft tape transport

Following the establishment of the overall transport concept, a study of all of the life limiting constraints associated with the transport were analyzed using modeling techniques. These design techniques included: (1) a response analysis from which the performance of the transport could be determined under operating conditions for a variety of conceptual variations both in a new and aged condition; (2) an analysis of a double cone guidance technique which yielded an optimum design for maximum guidance with minimum tape degradation; (3) an analysis of the tape pack design to eliminate spoking caused by negative tangential stress within the pack; (4) an evaluation of the stress levels experienced by the magnetic tape throughout the system; (5) a general review of the bearing and lubrication technology as applied to satellite recorders and hence the recommendation for using standard load carrying antifriction ball bearings; and (6) a kinetic analysis to determine the change in kinetic properties of the transport during operation.

Benn, G. S. L.↗
NASA NTRS1974

New standoffs provide high-reliability component mounting for printed wiring boards

Designs provide such advantages as inspectable solder joints from both sides of boards; stress relief in lead wires; low-impedance thermal paths; matched coefficients of lead wire thermal expansion; minimum webbing of conformal coatings to lead wires; positive mounting of part bodies to boards; and conductive mass for transient heat sink requirements.

Mccandliss, W. H.↗
NASA NTRS1973

Effects of nuclear radiation on a high-reliability silicon power diode. 4: Analysis of reverse bias characteristics

The effects of nuclear radiation on the reverse bias electrical characteristics of one hundred silicon power diodes were investigated. On a percentage basis, the changes in reverse currents were large but, due to very low initial values, this electrical characteristic was not the limiting factor in use of these diodes. These changes were interpreted in terms of decreasing minority carrier lifetimes as related to generation-recombination currents. The magnitudes of reverse voltage breakdown were unaffected by irradiation.

Been, J. F.↗
NASA NTRS1973

Highly reliable processor system for space application.

Description of a redundant processor organization which can be implemented with off-the-shelf processors for fault-tolerant operation. Reconfiguration can be performed automatically in a transientless manner. To support this system configuration and redundancy management concept, an operating system referred to as a synchronous executive has been designed. This system is directed at real-time closed-loop space applications where minimum response time, no degradation of software solution, and system simplicity are of importance. The system is based on a multicomputer organization with each machine solving the same problem based on a common set of inputs. Processor status is fed to a higher-level device which selects a controlling processor for controlling outputs and monitoring computers for fault detection.

Tsou, H. S. E.↗
NASA NTRS1973

The development and test of a long-life, high reliability solar array drive actuator

To meet the life and reliability requirements of five to ten year space missions, a new solar array drive mechanism for 3-axis stabilized vehicles has been developed and is undergoing life testing. The drive employs a redundant lubrication system to increase its reliability. An overrunning clutch mechanism is used to permit block redundant application of two or more drives to a common array drive shaft. Two prototype actuator and clutch assemblies, in continuous vacuum life test under load at 10 to the minus 8th power torr for more than sixteen months, have each accumulated more than 34,000 output revolutions without anomaly, the equivalent of more than seven years of operation in a 1000 km orbit or nearly ninety-five years at synchronous altitude.

Kirkpatrick, D. L.↗
NASA NTRS1973

Feasibility model of a high reliability five-year tape transport, Volume 1

The development, performance, and test results for the spaceborne magnetic tape transport are discussed. An analytical model of the tape transport was used to optimize its conceptual design. Each of the subsystems was subjected to reliability analyses which included structural integrity, maintenance of system performance within acceptable bounds, and avoidance of fatigue failure. These subsystems were also compared with each other in order to evaluate reliability characteristics. The transport uses no mechanical couplings. Four drive motors, one for each reel and one for each of two capstans, are used in a differential mode. There are two hybrid, spherical, cone tapered-crown rollers for tape guidance. Storage of the magnetic tape is provided by a reel assembly which includes the reel, a reel support structure and bearings, dust seals, and a dc drive motor. A summary of transport test results on tape guidance, flutter, and skew is provided.

Eshleman, R. L.↗
NASA NTRS1974

High reliability sheathed, beryllia insulated, tungsten-rhenium alloy thermocouple assemblies; their fabrication and EMF stability

Tantalum sheathed, BeO insulated, W-3% Re/W-25% Re thermocouple assemblies were fabricated and their emf drift determined during 2059 hours of exposure at 2073 K in a gaseous helium environment. The sheathed thermocouple assemblies were constructed from aged thermoelements, specially heat-treated BeO insulators, and specially cleaned and etched tantalum sheaths. Their thermal emf drifts ranged from the equivalent of only -0.3 to -0.8 K drift per 1000 hours of exposure at 2073 K. No evidence of any gross chemical attack or degradation of the component materials was found. The emf drift and material behavior of some unsheathed, BeO insulated, W-3% Re/W-25% Re thermocouples at 2250 and 2400 K were also determined. Unsheathed thermocouples tested in an argon environment at 2250 K for 1100 hours and at 2400 K for 307 hours exhibited changes in thermal emf that typically ranged from the equivalent of a few degrees K to as much as +11 K. Post-test examinations of these thermocouples revealed some undesirable material degradation and interaction which included erosion of the BeO insulators and contamination of the thermoelements by tantalum from the tantalum blackbody enclosure in which the thermocouples were contained.

Burns, G. W.↗
NASA NTRS1975

High reliability bond program using small diameter aluminum wire

The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

Macha, M.↗
NASA NTRS1974

Magnetic tape transport for high reliability in space

Studies of tape recorder failure modes in spacecraft tape-recorder applications reveal that failures within the mechanical transport package far outnumber those of the associated electronics. It would, therefore, be desirable to simplify the transport mechanism and to separate the moving parts with a continuously fresh supply of a single inert lubricant medium. The suggestion is made to replace the ball bearings with hydrostatically pressurized fluid film bearings.

Hoffman, J. K.↗
NASA NTRS1976

High reliability cathode heaters for ion thrusters

A number of space missions were proposed which utilize 30-cm mercury bombardment ion thrusters and also require a large number of thruster restarts. A test program was carried out to determine thermal cycle life of several different cathode heater designs. Plasma/flame sprayed heaters and swaged type heaters were tested. Four of the five plasma/flame sprayed heaters tested failed in a comparatively short time. Four tantalum swaged heaters that were brazed to the tantalum cathode tube were successfully tested and met the goals that were set at the start of the test.

Mueller, L. A.↗
NASA NTRS1977

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.

Perkins, K. L.↗