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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Total temperature probes for high-temperature hypersonic boundary-layer measurements

The design and test results of two types of total temperature probes that were used for hypersonic boundary-layer measurements are presented. The intent of each design was to minimize the total error and to maintain minimal size for measurements in boundary layers 1.0 in. thick and less. A single platinum-20-percent-rhodium shield was used in both designs to minimize radiation heat transfer losses during exposure to the high-temperature test stream. The shield of the smaller design was flattened at the flow entrance to an interior height of 0.02 in., compared with 0.03 in. for the larger design. The resulting vent-to-inlet area ratios were 60 and 50 percent. A stainless steel structural support sleeve that was used in the larger design was excluded from the smaller design, which resulted in an outer diameter of 0.059 in., to allow closer placement of the probes to each other and to the wall. These small design changes to improve resolution did not affect probe performance. Tests were conducted at boundary-layer-edge Mach numbers of 5.0 and 6.2. The nominal free-stream total temperatures were 2600 degrees and 3200 degrees R. The probes demonstrated extremely good reliability. The best performance in terms of recovery factor occurred when the wire-based Nusselt number was at least 0.04. Recommendations for future probe designs are included.

Albertson, Cindy W.↗

Bayesian calibration of irradiated graphite property models under high temperatures

Graphite under high temperatures and irradiation is central to advanced reactors. We develop a Bayesian calibration framework for graphite property models that explicitly represents model-data mismatch via a Gaussian-process discrepancy. The approach propagates uncertainty from parameters, experimental noise, and model form, with a hierarchical variance structure to capture group and cross-group noise. Using two predictive models across five grades (IG-110, NBG-18, PCEA, NBG-17, 2114) and four properties-irradiation-induced dimension change, creep, Young’s modulus change ratio, and coefficient of thermal expansion change ratio-we obtain average predictive-error reductions of 54%, 65%, 17%, and 17% when discrepancy is included. We illustrate engineering impact with a multiphysics model of a very-high-temperature reactor prismatic reflector brick, analyzing stresses under high fluence and temperature. Accounting for model discrepancy markedly improves predictive accuracy and provides a robust basis for reliable graphite component design in advanced reactors.

36 - MATERIALS SCIENCE↗

Development of high temperature strain gages

High temperature electric resistance wire strain gages were developed and evaluated for use at temperatures exceeding 922 K (1200 F). A special high temperature strain gage alloy (Fe-25Cr-7.5A1), designated BCL-3, was used to fabricate the gages. Pertinent gage characteristics were determined at temperatures up to 1255 K (1800 F). The results of the evaluation were reported in graphical and tabular form. It was concluded that the gages will perform satisfactorily at temperatures to at least 1089 K (1500 F) for at least one hour.

Lemcoe, M. M.↗

Temperature and heat flux measurements: Challenges for high temperature aerospace application

The measurement of high temperatures and the influence of heat transfer data is not strictly a problem of either the high temperatures involved or the level of the heating rates to be measured at those high temperatures. It is a problem of duration during which measurements are made and the nature of the materials in which the measurements are made. Thermal measurement techniques for each application must respect and work with the unique features of that application. Six challenges in the development of measurement technology are discussed: (1) to capture the character and localized peak values within highly nonuniform heating regions; (2) to manage large volumes of thermal instrumentation in order to efficiently derive critical information; (3) to accommodate thermal sensors into practical flight structures; (4) to broaden the capabilities of thermal survey techniques to replace discrete gages in flight and on the ground; (5) to provide supporting instrumentation conduits which connect the measurement points to the thermally controlled data acquisition system; and (6) to develop a class of 'vehicle tending' thermal sensors to assure the integrity of flight vehicles in an efficient manner.

Neumann, Richard D.↗

Carbon-13 Labeling Used to Probe Cure and Degradation Reactions of High- Temperature Polymers

High-temperature, crosslinked polyimides are typically insoluble, intractible materials. Consequently, in these systems it has been difficult to follow high-temperature curing or long-term degradation reactions on a molecular level. Selective labeling of the polymers with carbon-13, coupled with solid nuclear magnetic resonance spectrometry (NMR), enables these reactions to be followed. We successfully employed this technique to provide insight into both curing and degradation reactions of PMR-15, a polymer matrix resin used extensively in aircraft engine applications.

Meador, Mary Ann B.↗

Motor for High Temperature Applications

A high temperature motor has a stator with poles formed by wire windings, and a rotor with magnetic poles on a rotor shaft positioned coaxially within the stator. The stator and rotor are built up from stacks of magnetic-alloy laminations. The stator windings are made of high temperature magnet wire insulated with a vitreous enamel film, and the wire windings are bonded together with ceramic binder. A thin-walled cylinder is positioned coaxially between the rotor and the stator to prevent debris from the stator windings from reaching the rotor. The stator windings are wound on wire spools made of ceramic, thereby avoiding need for mica insulation and epoxy/adhesive. The stator and rotor are encased in a stator housing with rear and front end caps, and rear and front bearings for the rotor shaft are mounted on external sides of the end caps to keep debris from the motor migrating into the bearings' races.

Roopnarine↗

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗

Substitution of ceramics for high temperature alloys

The high temperature capability of ceramics such as silicon nitride and silicon carbide can result in turbine engines of improved efficiency. Other advantages when compared to the nickel and cobalt alloys in current use are raw material availability, lower weight, erosion/corrosion resistance, and potentially lower cost. The use of ceramics in three different sizes of gas turbine is considered; these are the large utility turbines, advanced aircraft turbines, and small automotive turbines. Special consideration, unique to each of these applications, arise when one considers substituting ceramics for high temperature alloys. The effects of material substitutions are reviewed in terms of engine performance, operating economy, and secondary effects.

Probst, H. B.↗

Silicon Carbide High-Temperature Power Rectifiers Fabricated and Characterized

The High Temperature Integrated Electronics and Sensors (HTIES) team at the NASA Lewis Research Center is developing silicon carbide (SiC) for use in harsh conditions where silicon, the semiconductor used in nearly all of today's electronics, cannot function. Silicon carbide's demonstrated ability to function under extreme high-temperature, high power, and/or high-radiation conditions will enable significant improvements to a far ranging variety of applications and systems. These improvements range from improved high-voltage switching for energy savings in public electric power distribution and electric vehicles, to more powerful microwave electronics for radar and cellular communications, to sensors and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines. In the case of jet engines, uncooled operation of 300 to 600 C SiC power actuator electronics mounted in key high-temperature areas would greatly enhance system performance and reliability. Because silicon cannot function at these elevated temperatures, the semiconductor device circuit components must be made of SiC. Lewis' HTIES group recently fabricated and characterized high-temperature SiC rectifier diodes whose record-breaking characteristics represent significant progress toward the realization of advanced high-temperature actuator control circuits. The first figure illustrates the 600 C probe-testing of a Lewis SiC pn-junction rectifier diode sitting on top of a glowing red-hot heating element. The second figure shows the current-versus voltage rectifying characteristics recorded at 600 C. At this high temperature, the diodes were able to "turn-on" to conduct 4 A of current when forward biased, and yet block the flow of current ($quot;turn-off") when reverse biases as high as 150 V were applied. This device represents a new record for semiconductor device operation, in that no previous semiconductor electronic device has ever simultaneously demonstrated 600 C functionality, and 4-A turn-on and 150-V rectification. The high operating current was achieved despite severe device size limitations imposed by present-day SiC wafer defect densities. Further substantial increases in device performance can be expected when SiC wafer defect densities decrease as SiC wafer production technology matures.

Source record↗

High Temperature Protonic Conductors

High Temperature Protonic Conductors (HTPC) with the perovskite structure are envisioned for electrochemical membrane applications such as H2 separation, H2 sensors and fuel cells. Successive membrane commercialization is dependent upon addressing issues with H2 permeation rate and environmental stability with CO2 and H2O. HTPC membranes are conventionally fabricated by solid-state sintering. Grain boundaries and the presence of intergranular second phases reduce the proton mobility by orders of magnitude than the bulk crystalline grain. To enhanced protonic mobility, alternative processing routes were evaluated. A laser melt modulation (LMM) process was utilized to fabricate bulk samples, while pulsed laser deposition (PLD) was utilized to fabricate thin film membranes . Sr3Ca(1+x)Nb(2-x)O9 and SrCe(1-x)Y(x)O3 bulk samples were fabricated by LMM. Thin film BaCe(0.85)Y(0.15)O3 membranes were fabricated by PLD on porous substrates. Electron microscopy with chemical mapping was done to characterize the resultant microstructures. High temperature protonic conduction was measured by impedance spectroscopy in wet air or H2 environments. The results demonstrate the advantage of thin film membranes to thick membranes but also reveal the negative impact of defects or nanoscale domains on protonic conductivity.

Dynys, Fred↗

Application of cyclic damage accumulation life prediction model to high temperature components

A high temperature, low cycle fatigue life prediction method was developed. This method, Cyclic Damage Accumulation (CDA), was developed for use in predicting the crack initiation lifetime of gas turbine engine materials, but it can be applied to other materials as well. The method is designed to account for the effects on creep-fatigue life of complex loading such as thermomechanical fatigue, hold periods, waveshapes, mean stresses, multiaxiality, cumulative damage, coatings, and environmental attack. Several features of this model were developed to make it practical for application to actual component analysis, such as the ability to handle nonisothermal loading (including TMF), arbitrary cycle paths, and multiple damage modes. The CDA life prediction model was derived from extensive specimen tests conducted on cast nickel-base superalloy B1900 + Hf. These included both monotonic tests (tensile and creep) and strain-controlled fatigue experiments (uniaxial, biaxial, TMF, mixed creep-fatigue, and controlled mean stress). Additional specimen tests were conducted on wrought INCO 718 to verify the applicability of the final CDA model to other high-temperature alloys. The model will be available to potential users in the near future in the form of a FORTRAN-77 computer program.

Nelson, Richard S.↗

Self-propagating high-temperature synthesis of high porosity foam materials in microgravity

Ceramic and metalloceramic foam materials are important construction, building, and thermal insulation materials for space stations of the 21st century. Delivery of these materials from Earth to space using rockets is not profitable due to the low density of these materials. Production of foam materials in space using traditional methods requires large energy consumption. Using SHS in space solves this problem.

Shteinberg, Alexander S.↗

Joining Carbon-Carbon Composites and High-Temperature Materials with High Energy Electron Beams

1. Program goals addressed during this period. Experimental work was directed at formation of a low-stress bond between carbon- carbon and aluminum, with the objective of minimizing the heating of the aluminum substrate, thereby minimizing stresses resulting from the coefficient of thermal expansion (CTE) difference between the aluminum and carbon-carbon. A second objective was to form a bond between carbon-carbon and aluminum with good thermal conductivity for electronic thermal management (SEM-E) application. 2. Substrates and joining materials selected during this period. Carbon-Carbon Composite (CCC) to Aluminum. CCC (Cu coated) to Aluminum. Soldering compounds based on Sn/Pb and Sn/Ag/Cu/Bi compositions. 3. Soldering experiments performed. Conventional techniques. High Energy Electron Beam (HEEB) process.

Goodman, Daniel↗

Development of an Improved RELAP5-3D Model for the High Temperature Test Facility

High-temperature gas-cooled reactors (HTGRs) are rapidly approaching deployment. Confidence in transient analysis of these systems for design, optimization, and licensing calculations requires modeling and simulation tools that have been validated against data relevant to HTGR conditions. The High Temperature Test Facility (HTTF) is an integral effects thermal hydraulics test facility for prismatic HTGRs. In spring and summer of 2019, HTTF was used for a series of experiments that now serve as the basis for the OECD/NEA Thermal Hydraulic Code Validation Benchmark for High Temperature Gas-Cooled Reactors using HTTF Data (HTGR T/H Benchmark). This benchmark contains problems for systems code, computational fluid dynamics (CFD), and coupled systems code/CFD modeling representing lower plenum mixing and both the depressurized and pressurized conduction cooldown (DCC and PCC respectively) transients. Benchmark problems include exercises for code-to-code and code-to-data comparisons as well as an exercise for error scaling between HTTF and the Modular High Temperature Gas-Cooled Reactor, which serves as the basis for the HTTF design. Previous analysis as part of the HTGR T/H benchmark used a RELAP5-3D model developed at Idaho National Laboratory (INL) and demonstrated an ability to reproduce trends in the measured data but difficulties reproducing experimental values within their uncertainty. These difficulties were largely attributed to assumptions made during the development of the initial RELAP5-3D model, which predated the HTTF experiments. A significant cause of difficulty reproducing the measured temperatures may be the radial nodalization of the previous RELAP5-3D model. The new model provides a finer nodalization to assess the impact of radial nodalization and allows for asymmetric heating within the core, which was a feature of multiple HTTF experiments. In this paper, we present the new RELAP5-3D model of HTTF. In addition to describing the new model, this paper compares the new and old models and provides results for a full-power steady state, a DCC, and a PCC in HTTF. These analyses are based on the code-to-code comparison exercises for the DCC and PCC problems of the HTGR T/H benchmark. We present the results of these exercises from the new model and compare them to the results of the old model.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

High Temperature Materials

Overview of high temperature metals, including component construction rules for advanced reactor designs, assessment of filler metal for Alloy 800H weldments, high-temperature crack growth rate testing, work packages and contributors for FY24, creep-fatigue damage summation evaluation, GCR metal needs, and high temperature metals from other programs.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

High-pressure high-temperature melting and recrystallization of nanolamellar high-entropy alloys

Additively manufactured (AM) High Entropy Alloys (HEAs) are notable for their exceptional high-yield strength and large tensile ductility. The nanolamellar Eutectic HEA (EHEA) AlCoCrFeNi 2.1 was fabricated by laser powder bed fusion (L-PBF) in the as-printed form (EHEA1) and subsequently annealed at 1000oC (EHEA2) and 600oC (EHEA3) to achieve a broad range of mechanical properties. EHEA2 and EHEA3 samples were studied using Scanning transmission electron microscopy (STEM), energy dispersive X-ray diffraction (EDXRD) at high-pressures and high temperatures, nanoindentation hardness and modulus measurements. According to EDXRD EHEA2 and EHEA3 are composed of B2 and L1 2 phases. High-pressure high-temperature EDXRD studies show melting for EHEA2 at 1698 ± 25 K at a pressure of 6.5 GPa and melting for EHEA3 at 1598 ± 25 K at a pressure of 5.8 GPa. Post-melt and recrystallized samples were recovered at ambient conditions, and XRD analysis showed retention of B2 and L1 2 phases, although a new σ phase appeared for both EHEA2 and EHEA3 samples due to high-pressure and high-temperature melting and recrystallization experiment. SEM analysis also demonstrated the preservation of the nanolamellar morphology. Nanoindentation studies revealed that recrystallized EHEAs retain their original mechanical property hierarchy, with EHEA3 being 47% harder than EHEA2, largely related to higher content of B2-phase and retention of nanolamellar morphology. We also present Pressure-Volume-Temperature (P-V-T) data for 3-D printed and annealed eutectic high entropy alloys and extract mechanical and thermal properties data.

36 MATERIALS SCIENCE↗