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At least 109 records · Page 6

Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing

Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling losses must be low in deployed systems. Previously, we developed the subsurface controllable refractive index via beam exposure (SCRIBE) technique to write accurate 3D gradient refractive index (GRIN) profiles within a mesoporous silica scaffold. Here, we apply SCRIBE to fabricate low loss, broadband, polarization insensitive, fiber-coupled, single-mode volumetric interconnects that include waveguides traversing arbitrary 3D paths. By seamlessly integrating mode-matching subsurface lenses and GRIN waveguide tapers, calibrating for positional writing errors, implementing multipass exposure, automating alignment, and switching to antireflection coated fibers, we reduced the insertion loss for a fiber-PIC-fiber interconnect from 50 to 2.14 dB, or 1.47 dB, excluding the fiber array’s loss. Further, we establish an upper bound of 0.45 dB loss per coupler. We report quality factors of 27,000 and 77,000 and bending losses of 6 and 3 dB/cm for 15 and 30 µm radii microrings, respectively. We also demonstrate Bézier escalators, polarization-rotating and polarization-splitting interconnects, and a seven-channel 25 µm pitch volumetric interconnect. The SCRIBE platform presents a clear path toward realizing 3D PICs with unique functionality.

Optics↗

Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips

Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.

Bernson, Robert [Tyndall National Institute, Cork ↗

Integrated dispersion compensated mode-locked quantum dot laser

Quantum dot lasers are excellent on-chip light sources, offering high defect tolerance, low threshold, low temperature variation, and high feedback insensitivity. Yet a monolithic integration technique combining epitaxial quantum dot lasers with passive waveguides has not been demonstrated and is needed for complex photonic integrated circuits. We present here, for the first time to our knowledge, a monolithc offset quantum dot integration platform that permits formation of a laser cavity utilizing both the robust quantum dot active region and the versatility of passive GaAs waveguide structures. This platform is substrate agnostic and therefore compatible with the quantum dot lasers directly grown on Si. As an illustration of the potential of this platform, we designed and fabricated a 20 GHz mode-locked laser with a dispersion-engineered on-chip waveguide mirror. Due to the dispersion compensation effect of the waveguide mirror, the pulse width of the mode-locked laser is reduced by a factor of 2.8.

Zhang, Zeyu (ORCID:0000000271576272)↗

Dynamic performance and reflection sensitivity of quantum dot distributed feedback lasers with large optical mismatch

This work reports on a high-efficiency InAs/GaAs distributed feedback quantum dot laser. The large optical wavelength detuning at room temperature between the lasing peak and the gain peak causes the static, dynamic, and nonlinear intrinsic properties to all improve with temperature, including the lasing efficiency, the modulation dynamics, the linewidth enhancement factor, and consequently the reflection insensitivity. Results reported show an optimum operating temperature at 75°C, highlighting the potential of the large optical mismatch assisted single-frequency laser for the development of uncooled and isolator-free high-speed photonic integrated circuits.

Dong, Bozhang (ORCID:0000000158266723)↗

Low-Mass Planar Photonic Imaging Sensor

Continuing on the successful progress of NIAC Phase I, this report summarizes the technical progress achieved under NIAC Phase II during the performance period September 19, 2014-June 18, 2017. During this period, the research team has made the following accomplishments: designed and layout a silica photonic integrated circuit (PIC) as a two baseline interferometric imager; constructed an experiment to utilize the two baselines for complex visibility measurement on a point source and a variable width slit; analyzed and studied the testbed results. (in collaboration with Lockheed Martin); designed and layout Si3N4 PICs for the low-resolution and high-resolution SPIDER telescope; fabricated the multi-layer Si3N4 PIC for low and high resolution SPIDER telescope; characterize the optical throughput and heater response for Si3N4 PIC for low and high resolution SPIDER telescopes; carried out imaging experiments using the Si3N4 PIC low-resolution version (in collaboration with Lockheed Martin); investigated signal-to-noise (SNR) ratio of SPIDER imager compared to the conventional panchromatic imager (in collaboration with Lockheed Martin); fulfilled the SNR simulation upon SPIDER imager (in collaboration with Lockheed Martin).

Yoo, S. J. Ben↗

Spectrally Resolved Synthetic Aperture Imaging Interferometer: Final Report of NASA Innovative Advanced Concepts - Phase 1 Study

The Spectrally Resolved Synthetic-Aperture Imaging Interferometer (SRSAII) is a system proposed to provide high-resolution and high-sensitivity measurements of astronomical objects. SRSAII uses long baseline interferometric methods to achieve the resolution and low-noise, high time-precision detection to achieve the sensitivity. The primary goal of the SRSAII study was to lay out a framework for using new optical physics technologies to directly resolve, both spatially and spectrally, the disk of an exoplanet. In addition to the ambitious goal of directly resolving an exoplanet, the SRSAII team also sought to identify science opportunities achievable with intermediate system configurations which may offer resolution significantly higher than the current state of the art, but insufficient for direct resolution of an exoplanetary disk. An operational SRSAII system can function with essentially arbitrarily large baselines, achieving correspondingly high angular resolution. The primary limitation occurs in the system sensitivity, which became the major technical focus for study. In this report, we compare the predicted performance (sensitivity in SNR (Signal-to-Noise Ratio) along with angular resolution) of three interferometric techniques: direct detection (also known as homodyne interferometry), multi-channel intensity interferometry (using the Hanbury Brown and Twiss effect), and multi-channel heterodyne interferometry (using an optical frequency comb as a local oscillator). Additionally, quantum-assisted interferometry is also explored as a prospective enhancement of established methods. This report presents a survey of the technologies that enable the SRSAII techniques - optical frequency combs, single photon detectors, and photonic integrated circuits. These technologies are the basis of methods critical to SRSAII's success: precision timing, length and frequency metrology, sensitive photodetection, fine-scale wavelength filtering, and dense multi-channel operation. Lastly, we give some notional performance metrics and propose some possible experimental observations.

High Resolultion↗

Low-Mass Planar Photonic Imaging Sensor

Continuing on the successful progress of NIAC (NASA Innovative Advanced Concepts) Phase I, this report summarizes the technical progress achieved under NIAC Phase II during the performance period September 19, 2014 to June 18, 2017. During this period, the research team has made the following accomplishments: designed and layout a silica photonic integrated circuit (PIC) as a two baselineinterferometric imager; constructed an experiment to utilize the two baselines for complex visibility measurementon a point source and a variable width slit; analyzed and studied the testbed results (in collaboration with Lockheed Martin); designed and layout Si3N4 PICs for the low-resolution and high-resolution SPIDER (Segmented Planar Imaging Detector for Electro-Optical Reconnaissance) telescope; fabricated the multi-layer Si3N4 PIC for low and high resolution SPIDER telescope; characterized the optical throughput and heater response for Si3N4 PIC for low and highresolution SPIDER telescopes; carried out imaging experiments using the Si3N4 PIC low-resolution version (in collaboration with Lockheed Martin); investigated signal-to-noise (SNR) ratio of SPIDER imager compared to the conventional panchromatic imager (in collaboration with Lockheed Martin); fulfilled the SNR simulation upon SPIDER imager (in collaboration with Lockheed Martin).

Yoo, S. J. Ben↗

Developing a New Generation of Integrated Micro-Spec Far Infrared Spectrometers for the EXperiment for Cryogenic Large-Aperture Intensity Mapping (EXCLAIM)

The current state of far-infrared astronomy drives the need to develop compact, sensitive spectrometers for future space and ground-based instruments. Here we present details of the µ-Spec spectrometers currently in development for the far-infrared balloon mission EXCLAIM. The spectrometers are designed to cover the 555 – 714 µm range with a resolution of R = λ/∆λ = 512 at the 638 µm band center. The spectrometer design incorporates a Rowland grating spectrometer implemented in a parallel plate waveguide on a low-loss single-crystal Si chip, employing Nb microstrip planar transmission lines and thin-film Al kinetic inductance detectors (KIDs). The EXCLAIM µ-Spec design is an advancement upon a successful R = 64 µ-Spec prototype, and can be considered a sub-mm superconducting photonic integrated circuit (PIC) that combines spectral dispersion and detection. The design operates in a single M=2 grating order, allowing one spectrometer to cover the full EXCLAIM band without requiring a multi-order focal plane. The EXCLAIM instrument will fly six spectrometers, which are fabricated on a single 150 mm diameter Si wafer. Fabrication involves a flip-wafer-bonding process with patterning of the superconducting layers on both sides of the Si dielectric. The spectrometers are designed to operate at 100 mK, and will include 355 Al KID detectors targeting a goal of NEP ∼8 × 10−19 W/√( Hz). We summarize the design, fabrication, and ongoing development of these µ-Spec spectrometers for EXCLAIM.

Carolyn G. Volpert↗

Gain balanced nonlinear optical interferometer

A nonlinear fiber interferometer is disclosed suitable for fiber sensor and other applications. A first nonlinear fiber section amplifies probe and conjugate sidebands of a pump through four-wave mixing. A second section introduces a phase shift to be measured, for example from a sensor. A third nonlinear fiber section amplifies with phase-sensitive gain to increase signal-to-noise ratio. Based on phase-sensitive output power of probe and/or conjugate components, the phase shift can be measured. Superior performance can be obtained by balancing gain between the (first and third) nonlinear sections. Non-fiber, for example photonic integrated circuit, embodiments are disclosed. Differential sensing, alternative detection schemes, sensing applications, associated methods, and other variations are disclosed.

42 ENGINEERING↗

Reflective laser-based particle detector

A reflective laser-based particle detector for detecting contamination particles moving through a vacuum. Laser light is directed through a vacuum access window in the containment vessel and toward a reflective surface on an inner surface opposite the window. A photonic detector is positioned to monitor reflected laser from the opposite inner surface inside the vessel and is capable of detecting perturbations of the reflected light. The system makes use of optical interferometry techniques embodied as a photonic integrated circuit to detect the particles. The reflective laser-based system can be placed entirely outside the vacuum thereby avoiding the need for breaking the vacuum environment to check for accumulation of contaminant particles.

Xi, Wenze↗

Quantum cascade laser with monolithically integrated passive waveguide

A photonic integrated circuit device includes a passive waveguide section formed over a substrate, a quantum cascade laser (QCL) gain section formed over the substrate and adjacent to the passive waveguide section, and a taper section disposed between and in contact with each of the passive waveguide section and the QCL gain section. In some embodiments, the passive waveguide section includes a passive waveguide core layer disposed between a first cladding layer and a second cladding layer. In some examples, the QCL gain section includes a QCL active region disposed between a first confinement layer and a second confinement layer, where the QCL active region has a lower index of refraction than each of the first and second confinement layers. In some embodiments, the taper section is configured to optically couple the QCL gain section to the passive waveguide section.

Jung, Seungyong↗

Gain balanced nonlinear optical interferometer

A nonlinear fiber interferometer is disclosed suitable for fiber sensor and other applications. A first nonlinear fiber section amplifies probe and conjugate sidebands of a pump through four-wave mixing. A second section introduces a phase shift to be measured, for example from a sensor. A third nonlinear fiber section amplifies with phase-sensitive gain to increase signal-to-noise ratio. Based on phase-sensitive output power of probe and/or conjugate components, the phase shift can be measured. Superior performance can be obtained by balancing gain between the (first and third) nonlinear sections. Non-fiber, for example photonic integrated circuit, embodiments are disclosed. Differential sensing, alternative detection schemes, sensing applications, associated methods, and other variations are disclosed.

Lukens, Joseph M.↗

Heterogeneous integration of an electro-optical platform

A hybrid photonic integrated circuit and a method of its manufacture are provided. A SiP functional layer is fabricated on an SOI wafer. A lithium niobate thin film is bonded to the SiP functional layer. The silicon handle layer is removed from the SOI wafer to expose buried oxide, and at least one III-V die is bonded to the exposed buried oxide. In embodiments, at least one waveguiding component is fabricated in the SiP functional layer. In embodiments, the SiP functional layer comprises a top waveguiding layer.

Kodigala, Ashok↗

Gain balanced nonlinear optical interferometer

A nonlinear fiber interferometer is disclosed suitable for fiber sensor and other applications. A first nonlinear fiber section amplifies probe and conjugate sidebands of a pump through four-wave mixing. A second section introduces a phase shift to be measured, for example from a sensor. A third nonlinear fiber section amplifies with phase-sensitive gain to increase signal-to-noise ratio. Based on phase-sensitive output power of probe and/or conjugate components, the phase shift can be measured. Superior performance can be obtained by balancing gain between the (first and third) nonlinear sections. Non-fiber, for example photonic integrated circuit, embodiments are disclosed. Differential sensing, alternative detection schemes, sensing applications, associated methods, and other variations are disclosed.

Lukens, Joseph M.↗

Chemical, Biological, Radiological, Nuclear, and Explosives (CBRNE) Sensing XXI

This volume contains 12 sessions, 28 papers and 26 presentations on the following topics: Photonic Integrated Circuits and Plasmonic Sensing; Advancs in CBE Signature Modeling and Sensor Algorithms I; Standoff Sensing of CBRNE Hazards I; Standoff Sensing of CBRNE Hazards II; Advances in CBE Signature Modeling and Sensor Algorithms II; Biological Hazard Sensing; Chemical Hazard Sensing; Joint Session with Conferences 11390 and 11416: Spectroscopy for CBRNE Detection and Warning; Radiological and Nuclear Sensing; Explosive Material Sensing; Poster Session.

47 OTHER INSTRUMENTATION↗

Monolithic integration of optical waveguides with metal routing layers

A photonic integrated circuit and a method for its manufacture are provided. In an embodiment, an intermetal dielectric layer, for example, a silicon oxide layer, is contiguous between an upper metal layer and a lower metal layer on a substrate. One or more waveguides having top and bottom faces are formed in respective waveguide layers within the intermetal dielectric layer between the upper and lower metal layers. There is a distance of at least 600 nm from the upper metal layer to the top face of the uppermost of the several waveguides. There is a distance of at least 600 nm from the lower metal layer to the bottom face of the lowermost of the several waveguides. The waveguides are formed of silicon nitride for longer wavelengths and alumina for shorter wavelengths. These dimensions and materials are favorable for CMOS processing, among other things.

Gehl, Michael↗

Photonic integration for UV to IR applications

Photonic integration opens the potential to reduce size, power, and cost of applications normally relegated to table- and rack-sized systems. Today, a wide range of precision, high-end, ultra-sensitive, communication and computation, and measurement and scientific applications, including atomic clocks, quantum communications, processing, and high resolution spectroscopy, are ready to make the leap from the lab to the chip. However, many of these applications operate at wavelengths not accessible to the silicon on insulator-based silicon photonics integration platform due to absorption, power handling, unwanted nonlinearities, and other factors. Next generation photonic integration will require ultra-wideband photonic circuit platforms that scale from the ultraviolet to the infrared and that offer a rich set of linear and nonlinear circuit functions as well as low loss and high power handling capabilities. This article provides an assessment of the field in ultra-wideband photonic waveguides to bring power efficient, ultra-high performance systems to the chip-scale and enable compact transformative precision measurement, signal processing, computation, and communication techniques.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗