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At least 109 records · Page 6

Thermoelectric microdevice fabricated by a MEMS-like electrochemical process

Microelectromechanical systems (MEMS) are the basis of many rapidly growing technologies, because they combine miniature sensors and actuators with communications and electronics at low cost. Commercial MEMS fabrication processes are limited to silicon-based materials or two-dimensional structures. Here we show an inexpensive, electrochemical technique to build MEMS-like structures that contain several different metals and semiconductors with three-dimensional bridging structures. We demonstrate this technique by building a working microthermoelectric device. Using repeated exposure and development of multiple photoresist layers, several different metals and thermoelectric materials are fabricated in a three-dimensional structure. A device containing 126 n-type and p-type (Bi, Sb)2Te3 thermoelectric elements, 20 microm tall and 60 microm in diameter with bridging metal interconnects, was fabricated and cooling demonstrated. Such a device should be of technological importance for precise thermal control when operating as a cooler, and for portable power when operating as a micro power generator.

Evaluation Studies↗

A miniaturized neuroprosthesis suitable for implantation into the brain

This paper presents current research on a miniaturized neuroprosthesis suitable for implantation into the brain. The prosthesis is a heterogeneous integration of a 100-element microelectromechanical system (MEMS) electrode array, front-end complementary metal-oxide-semiconductor (CMOS) integrated circuit for neural signal preamplification, filtering, multiplexing and analog-to-digital conversion, and a second CMOS integrated circuit for wireless transmission of neural data and conditioning of wireless power. The prosthesis is intended for applications where neural signals are processed and decoded to permit the control of artificial or paralyzed limbs. This research, if successful, will allow implantation of the electronics into the brain, or subcutaneously on the skull, and eliminate all external signal and power wiring. The neuroprosthetic system design has strict size and power constraints with each of the front-end preamplifier channels fitting within the 400 x 400-microm pitch of the 100-element MEMS electrode array and power dissipation resulting in less than a 1 degree C temperature rise for the surrounding brain tissue. We describe the measured performance of initial micropower low-noise CMOS preamplifiers for the neuroprosthetic.

Action Potentials/physiology↗

Synchrotron X-ray Microdiffraction Analysis of Proton Irradiated Polycrystalline Diamond Films

X-ray microdiffraction is a non-destructive technique that allows for depth-resolved, strain measurements with sub-micron spatial resolution. These capabilities make this technique promising for understanding the mechanical properties of MicroElectroMechanical Systems (MEMS). This investigation examined the local strain induced by irradiating a polycrystalline diamond thin film with a dose of 2x10(exp 17) H(+)per square centimeter protons. Preliminary results indicate that a measurable strain, on the order of 10(exp -3), was introduced into the film near the End of Range (EOR) region of the protons.

Newton, R. I.↗

Development of Testing Methodologies for the Mechanical Properties of MEMS

This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.

Ekwaro-Osire, Stephen↗

Development of Probabilistic Life Prediction Methodologies and Testing Strategies for MEMS and CMC's

This effort is to investigate probabilistic life prediction methodologies for ceramic matrix composites and MicroElectroMechanical Systems (MEMS) and to analyze designs that determine stochastic properties of MEMS. For CMC's this includes a brief literature survey regarding lifing methodologies. Also of interest for MEMS is the design of a proper test for the Weibull size effect in thin film (bulge test) specimens. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. A main objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures/Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads. A second set of objectives is to determine the applicability/suitability of the CARES/Life methodology for CMC analysis, what changes would be needed to the methodology and software, and if feasible, run a demonstration problem. Also important is an evaluation of CARES/Life coupled to the ANSYS Probabilistic Design System (PDS) and the potential of coupling transient reliability analysis to the ANSYS PDS.

Jadaan, Osama↗

Study of Vacuum Energy Physics for Breakthrough Propulsion

This report summarizes the accomplishments during a three year research project to investigate the use of surfaces, particularly in microelectromechanical systems (MEMS), to exploit quantum vacuum forces. During this project, we developed AFM instrumentation to repeatably measure Casimir forces in the nanoNewton range at 10 6 torr, designed an experiment to measure attractive and repulsive quantum vacuum forces, developed a QED based theory of Casimir forces that includes non-ideal material properties for rectangular cavities and for multilayer slabs, developed theoretical models for a variety of microdevices utilizing vacuum forces, applied vacuum physics to a gedanken spacecraft, and investigated a new material with a negative index of refraction.

Millis, Marc G.↗

MEMS Using SOI Substrate

At NASA, the focus for smaller, less costly missions has given impetus for the development of microspacecraft. MicroElectroMechanical System (MEMS) technology advances in the area of sensor, propulsion systems, and instruments, make the notion of a specialized microspacecraft feasible in the immediate future. Similar to the micro-electronics revolution,the emerging MEMS technology offers the integration of recent advances in micromachining and nanofabrication techniques with microelectronics in a mass-producible format,is viewed as the next step in device and instrument miniaturization. MEMS technology offers the potential of enabling or enhancing NASA missions in a variety of ways. This new technology allows the miniaturization of components and systems, where the primary benefit is a reduction in size, mass and power. MEMS technology also provides new capabilities and enhanced performance, where the most significant impact is in performance, regardless of system size. Finally,with the availability of mass-produced, miniature MEMS instrumentation comes the opportunity to rethink our fundamental measurement paradigms. It is now possible to expand our horizons from a single instrument perspective to one involving multi-node distributed systems. In the distributed systems and missions, a new system in which the functionality is enabled through a multiplicity of elements. Further in the future, the integration of electronics, photonics, and micromechanical functionalities into "instruments-on-a-chip" will provide the ultimate size, cost, function, and performance advantage. In this presentation, I will discuss recent development, requirement, and applications of various MEMS technologies and devices for space applications.

Tang, Tony K.↗

Chapter 9: MEMS Applications in Spacecraft Thermal Control and Chapter 13: Handling and Contamination Control Considerations for Critical Space Applications

Thermal control systems (TCS) are an integral part of all spacecraft and instruments. To operate properly all spacecraft components must be maintained within a specified temperature band, which in some instances can be quite tight (less than 1 degree C). Traditionally this is accomplished by "passive" designs, but with modem spacecraft and instruments it is increasingly necessary to use active thermal control technologies. Microelectromechanical System (MEMS) can be useful in developing an active TCS, and may be especially useful for small spacecraft. As the MEMS knowledge matures, the applications of MEMS in spacecraft thermal control emerges as a viable technology for thermal engineers. Potential applications include specialized thermal control coatings, thermal switches, and specialized filters for instruments. Although MEMS technology demonstrates benefits, it also poses challenges for thermal en,oineers due to the lack of in-flight MEMS data. As a consequence, in order to design a MEMS thermal control device and receive the full advantage, it is important to understand the potential impact of the space environment on MEMS devices and the design/operational constraints imposed in their use. An entire chapter is devoted to handling and contamination controls for Micro Electro Mechanical Systems (MEMS) in space applications due to the importance of the topic area to final mission success. Handling and contamination control is discussed relative to the full life cycle from the very basic wafer level processing up through on orbit deployment. MEMS packaging will drive the need to tailor the Handling and Contamination Control Plan in order to assure adequacy of the overall program on a program by program basis. Plan elements are discussed at length to assist the user in preparing and implementing effective plans for both handling and contamination control to prevent deleterious effects.

Osiander, Robert↗

Diagnostic Techniques Used to Study Chemical-Vapor-Deposited Diamond Films

The advantages and utility of chemical-vapor-deposited (CVD) diamond as an industrial ceramic can only be realized if the price and quality are right. Until recently, this technology was of interest only to the academic and basic research community. However, interest has grown because of advances made by leading CVD diamond suppliers: 1) Reduction of the cost of CVD polycrystalline diamond deposition below $5/carat ($8/sq cm); 2) Installation of production capacity; 3) Epitaxial growth of CVD single-crystal diamond. Thus, CVD diamond applications and business are an industrial reality. At present, CVD diamond is produced in the form of coatings or wafers. CVD diamond film technology offers a broader technological potential than do natural and high-pressure synthetic diamonds because size, geometry, and eventually cost will not be as limiting. Now that they are cost effective, diamond coatings - with their extreme properties - can be used in a variety of applications. Diamond coatings can improve many of the surface properties of engineering substrate materials, including erosion, corrosion, and wear resistance. Examples of actual and potential applications, from microelectromechanical systems to the wear parts of diamond coatings and related superhard coatings are described. For example, diamond coatings can be used as a chemical and mechanical barrier for the space shuttles check valves, particularly on the guide pins and seat assemblies.

Miyoshi, Kazuhisa↗

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗

Hydrogen Sensors Demonstrated on the Shuttle

Microelectromechanical-systems- (MEMS-) based hydrogen sensor technology developed by the NASA Glenn Research Center at Lewis Field and Case Western Reserve University was demonstrated on shuttle missions STS-95 (Senator Glenn s mission) and STS-96. These smart sensors, commercialized by Makel Engineering Inc., were part of an "Integrated Vehicle Health Monitoring HEDS Technology Demonstration" series conducted at the NASA Kennedy Space Center. The experiments were designed to demonstrate the effect of technological upgrades on shuttle performance. The hydrogen sensors were micro-fabricated for minimal size, weight, and power consumption. A temperature detector and heater were included on the sensor for temperature control. Two palladium chrome (PdCr) hydrogen detection devices were included in each sensor package: a Schottky diode for low concentrations and a resistor for high concentrations. These sensor designs allow operation in inert environments. "Smart" electronics developed by Makel Engineering were integrated with the sensors to control the sensor temperature and process the output of the various sensors. This complete hydrogen detection system (two sensors on a chip with smart electronics) flew on STS-95 (launched October 1998) and STS-96 (launched May 1999). It was installed in the aft compartment of the shuttle and used to monitor the hydrogen concentration in that region. Up to this time, a mass spectrometer had monitored the hydrogen concentration in the aft compartment before launch, and "grab" bottles had been used after launch. The inside of these bottles is at vacuum. During flight, the grab bottles are pyrotechnically opened for a brief period, and the gas in the aft compartment is captured in the bottle. Several of these bottles are opened at different times during takeoff, and their contents are used to determine the time profile of the gases in the aft chamber. However, this information is not available until after the flight. On the launch pad, results from the new sensor technology paralleled the responses of the mass spectrometer with, in some cases, a quicker response time. In flight, data from the new sensors agreed with those derived from analyzing the contents of the grab bottles. Moreover, this microsensor can monitor the aft compartment continuously and, in principle, could monitor the health of the vehicle in real time during flight.

Hunter, Gary W.↗

Ultrasonic Waves in Water Visualized With Schlieren Imaging

The Acoustic Liquid Manipulation project at the NASA Glenn Research Center at Lewis Field is working with high-intensity ultrasound waves to produce acoustic radiation pressure and acoustic streaming. These effects can be used to propel liquid flows to manipulate floating objects and liquid surfaces. Interest in acoustic liquid manipulation has been shown in acoustically enhanced circuit board electroplating, microelectromechanical systems (MEMS), and microgravity space experiments. The current areas of work on this project include phased-array ultrasonic beam steering, acoustic intensity measurements, and schlieren imaging of the ultrasonic waves.

Juergens, Jeffrey R.↗

MEMS Device Being Developed for Active Cooling and Temperature Control

High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) is currently under development at the NASA Glenn Research Center to meet this need. It uses a thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface. The device can be used strictly in the cooling mode, or it can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly are accomplished by wet etching and wafer bonding techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces and limited failure modes, and minimal induced vibration.

Moran, Matthew E.↗

Microscale Particulate Classifiers (MiPAC) Being Developed

The NASA Glenn Research Center is developing microscale sensors to characterize atmospheric-borne particulates. The devices are fabricated using MEMS (microelectromechanical systems) technologies. These technologies are derived from those originally developed in support of the semiconductor processing industry. The resulting microsensors can characterize a wide range of particles and are, therefore, suitable to a broad range of applications. This project is supported under a collaborative program called the Glennan Microsystems Initiative. The initiative comprises members of NASA Glenn Research Center, various university affiliates from the State of Ohio, and a number of participating industrial partners. Funding is jointly provided by NASA, the State of Ohio, and industrial members. The work described here is a collaborative arrangement between researchers at Glenn, the University of Minnesota, The National Institute of Standards and Technology (NIST), and the Cleveland State University. Actual device fabrication is conducted at Glenn and at the laboratories of Case Western Reserve University. Case Western is also located in Cleveland, Ohio, and is a participating member of the initiative. The principal investigator for this project is Paul S. Greenberg of Glenn. Two basic types of devices are being developed, and target different ranges of particle sizes. The first class of devices, which is used to measure nanoparticles (i.e., particles in the range of 0.002 to 1 mm), is based on the technique of Electrical Mobility Classification. This technique also affords the valuable ability of measuring the electrical charge state of the particles. Such information is important in the understanding of agglomeration mechanisms and is useful in the development of methods for particle repulsion. The second type of device being developed, which utilizes optical scattering, is suitable for particles larger than 1 mm. This technique also provides information on particle shape and composition. Applications for these sensors include fundamental planetary climatology, monitoring and filtration in spacecraft, human habitation modules and related systems, characterization of particulate emissions from propulsion and power systems, and as early warning sensors for both space-based and ter-restrial fire detection. These devices are also suitable for characterizing biological compounds such as allergens, infectious agents, and biotoxic agents.

Greenberg, Paul S.↗

High-Temperature Gas Sensor Array (Electronic Nose) Demonstrated

The ability to measure emissions from aeronautic engines and in commercial applications such as automotive emission control and chemical process monitoring is a necessary first step if one is going to actively control those emissions. One single sensor will not give all the information necessary to determine the chemical composition of a high-temperature, harsh environment. Rather, an array of gas sensor arrays--in effect, a high-temperature electronic "nose"--is necessary to characterize the chemical constituents of a diverse, high-temperature environment, such as an emissions stream. The signals produced by this nose could be analyzed to determine the constituents of the emission stream. Although commercial electronic noses for near-room temperature applications exist, they often depend significantly on lower temperature materials or only one sensor type. A separate development effort necessary for a high-temperature electronic nose is being undertaken by the NASA Glenn Research Center, Case Western Reserve University, Ohio State University, and Makel Engineering, Inc. The sensors are specially designed for hightemperature environments. A first-generation high-temperature electronic nose has been demonstrated on a modified automotive engine. This nose sensor array was composed of sensors designed for hightemperature environments fabricated using microelectromechanical-systems- (MEMS-) based technology. The array included a tin-oxide-based sensor doped for nitrogen oxide (NOx) sensitivity, a SiC-based hydrocarbon (CxHy) sensor, and an oxygen sensor (O2). These sensors operate on different principles--resistor, diode, and electrochemical cell, respectively--and each sensor has very different responses to the individual gases in the environment. A picture showing the sensor head for the array is shown in the photograph on the left and the sensors installed in the engine are shown in the photograph on the right. Electronics are interfaced with the sensors for temperature control and signal conditioning, and packaging designed for high temperatures is necessary for the array to survive the engine environment.

Hunter, Gary W.↗

CARES/Life Used for Probabilistic Characterization of MEMS Pressure Sensor Membranes

Microelectromechanical systems (MEMS) devices are typically made from brittle materials such as silicon using traditional semiconductor manufacturing techniques. They can be etched (or micromachined) from larger structures or can be built up with material deposition processes. Maintaining dimensional control and consistent mechanical properties is considerably more difficult for MEMS because feature size is on the micrometer scale. Therefore, the application of probabilistic design methodology becomes necessary for MEMS. This was demonstrated at the NASA Glenn Research Center and Case Western Reserve University in an investigation that used the NASA-developed CARES/Life brittle material design program to study the probabilistic fracture strength behavior of single-crystal SiC, polycrystalline SiC, and amorphous Si3N4 pressurized 1-mm-square thin-film diaphragms. These materials are of interest because of their superior high-temperature characteristics, which are desirable for harsh environment applications such as turbine engine and rocket propulsion system hot sections.

Nemeth, Noel N.↗

Advanced Microgravity Acceleration Measurement Systems Being Developed

The Advanced Microgravity Acceleration Measurement Systems (AMAMS) project at the NASA Glenn Research Center is part of the Instrument Technology Development program to develop advanced sensor systems. The primary focus of the AMAMS project is to develop microelectromechanical (MEMS) acceleration sensor systems to replace existing electromechanical-sensor-based systems presently used to assess relative gravity levels aboard spacecraft. These systems are used in characterizing both vehicle and payload responses to low-gravity vibroacoustic environments. The collection of microgravity acceleration data has cross-disciplinary utility to the microgravity life and physical sciences and the structural dynamics communities. The inherent advantages of semiconductor-based systems are reduced size, mass, and power consumption, while providing enhanced stability.

Sicker, Ronald J.↗

High Temperature MEMS for Turbine Engine Applications

The presentation will discuss Microelectromechanical Systems (MEMS) research and development activities and technologies being conducted at NASA Glenn Research Center to address the needs of harsh environment applications. The focus will be on silicon carbide based h4EMS for high temperature, high power and high radiation environment as well as high temperature sensor technologies which are made possible by MEMS processing techniques. These technologies can enable new measurements and capabilities for future turbine engines. All the presentation materials are publicly available and have been presented/published before.

Hunter, Gary W.↗